KR19990002632U - Computer heat sink - Google Patents

Computer heat sink Download PDF

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Publication number
KR19990002632U
KR19990002632U KR2019970016208U KR19970016208U KR19990002632U KR 19990002632 U KR19990002632 U KR 19990002632U KR 2019970016208 U KR2019970016208 U KR 2019970016208U KR 19970016208 U KR19970016208 U KR 19970016208U KR 19990002632 U KR19990002632 U KR 19990002632U
Authority
KR
South Korea
Prior art keywords
heat
heat sink
computer
heat dissipation
cpu module
Prior art date
Application number
KR2019970016208U
Other languages
Korean (ko)
Inventor
신용석
Original Assignee
윤종용
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 윤종용, 삼성전자 주식회사 filed Critical 윤종용
Priority to KR2019970016208U priority Critical patent/KR19990002632U/en
Publication of KR19990002632U publication Critical patent/KR19990002632U/en

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Abstract

The present invention relates to a heat dissipation device of a computer, and includes a heat sink mounted on an outer surface of a heat generating component such as a CPU or a CPU module, and a fan motor installed and driven inside the housing to introduce external air into the housing. In the heat dissipation device of the computer, the heat sink is formed in a form that can wrap the outer peripheral surface of the heat generating component mounted on the circuit board of the computer, it is configured to be coupled to the heat generating component by a separate fastening member.
According to this configuration, the heat sink is enclosed around the entire outer circumference of the heat generating parts such as the CPU module, and the heat dissipation area is remarkably increased because the heat sink has a structure in which a plurality of heat dissipation fins are protruded. The heat dissipation efficiency is remarkable because the heat generated from the CPU module is instantaneously transferred to the heat sink, and is cooled in a short time by the external air introduced by the action of the fan motor which is driven by the rotation of the computer. Is improved.

Description

RADIIATING APPARATUS OF COMPUTER

The present invention relates to a heat dissipation device of a computer, and in particular, to improve the structure of the heat sink in the heat dissipation device applied to a computer that is used on a desk or used while carrying a portable device, the heat dissipation area is increased and heat transfer properties are improved. It relates to a heat dissipation device of a computer to maximize the heat dissipation efficiency per unit time.

In general, electronic products that generate a large amount of heat during operation, in particular, personal computers used for work, as shown in Figure 1, the computer on the circuit board 12 mounted on the inner bottom surface of the chassis 10 The CPU or CPU module 14 for controlling all functions of the controller is provided.

On the other hand, in such a computer, a large amount of heat is generated from the CPU or CPU module 14 installed inside the chassis 10 during operation, and if the heat generated from such heat generating parts is not released to the outside in a timely manner, As a result of excessive increase in the temperature inside the chassis 10 as well as the heat generating parts, various components installed inside the chassis 10 and various elements vulnerable to heat mounted on the circuit board 12 are deteriorated. There is a serious problem that it is not functioning properly or its lifespan is shortened, and as a result, it is a major cause of computer failure.

2 is a perspective view showing one embodiment of a heat dissipation device in a conventional computer, and FIG. 3 is a perspective view showing two embodiments of a heat dissipation device in a conventional computer.

Referring to this, as shown in FIG. 2, a heat sink 20 in which a plurality of heat sink fins 18 are formed on an upper portion of a CPU 14 ′ installed on a circuit board 12 in the chassis 10. Or a computer in which the CPU module 14 is installed, the heat sink 20 'is attached to the side of the CPU module 14 as shown in FIG. 3, and the fan is installed at a predetermined position inside the chassis 10. Air generated by the motor 22 and the heat generated from the CPU 14 'or the CPU module 14 and conducted to the heat sinks 20 and 20' according to the driving of the fan motor 22. By the flow of cooling and forced to discharge to the outside.

However, in the case of applying such a conventional heat dissipation device, a certain heat dissipation effect is expected in the initial operation of the computer, but the heat dissipation effect is remarkably inferior when the heat sinks 20, 20 'are overheated due to a long operation time. Has a problem.

In order to improve such a problem, the heat dissipation area of the heat sinks 20 and 20 'mounted on the heat generating parts is increased, and the heat sinks 20 are formed from heat generating parts such as the CPU 14' or the CPU module 14 '. Heat transfer to 20 'is required to be rapid.

The present invention is to solve such a conventional problem, and to meet the above requirements, the purpose is to maximize the heat dissipation efficiency per unit time by increasing the heat dissipation area of the heat sink and heat transfer in the heat dissipation device applied to computers, etc. To provide a new type of heat dissipation for a computer.

1 is a perspective view showing the internal structure of a general personal computer,

2 is a perspective view showing an embodiment of a heat dissipation device in a conventional computer;

3 is a perspective view showing an embodiment of a heat dissipation device in a conventional computer;

Figure 4 is an exploded perspective view showing a heat radiating device of the computer according to the present invention,

5 is a perspective view illustrating a coupled state and an operating state of FIG. 4.

Explanation of symbols on the main parts of the drawings

50: CPU module 60: heat sink

62: heat dissipation fin 64: screw fitting hole

70: fastening member 80: fan motor.

In order to achieve the above object, the present invention includes a heat sink mounted on an outer surface of a heat generating component such as a CPU or a CPU module, and a fan motor for introducing external air into the housing while being installed and driven inside the housing. In the heat dissipation device of the computer, the heat sink is formed in a form that can surround the outer peripheral surface of the heat generating component mounted on the circuit board of the computer, and has a feature configured to be coupled to the heat generating component by a separate fastening member.

In the present invention, the heat sink is formed of a cube having a predetermined length having a 'U'-shaped cross-section having open front and rear surfaces and a bottom surface thereof, and a plurality of heat sink fins are protruded at regular intervals on the outer surface thereof. .

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

Figure 4 is an exploded perspective view showing a heat radiation device of a computer according to the present invention.

Referring to this, the CPU module 50 for controlling all functions of the computer is mounted on the circuit board 40 inside the housing, and the front and rear and bottom surfaces of the CPU module 50 are opened. 'It has a cross-sectional structure of the shape, the outer circumferential surface is configured to be coupled by a separate fastening member 70 in a state in which the heat sink 60 is covered with a plurality of heat dissipation fins 62 protruded at regular intervals.

In the embodiment of the present invention, the fastening member 70 and the screw 72 is inserted through to the opposite side from one side of the heat sink 60 mounted to be wrapped around the outer periphery of the CPU module 40 and , Consisting of a nut 74 screwed to the opposite side of the screw 72.

Accordingly, the screw fitting holes 64 are formed at positions opposite to each other at the lower ends of both sides of the heat sink 60, and on the circumferential surface of the CPU module 50 corresponding to the position corresponding to the screw fitting holes 64. The through hole 52 is formed.

On the other hand, the front or the upper of the CPU module 50 is rotated in accordance with the operation of the computer while the fan motor 80 for introducing the outside air into the housing is installed, the outside of the heat sink 60 The planar heat dissipation fins 62 preferably protrude in the same direction as the flow direction of the external air introduced into the chassis as the fan motor 80 is driven.

Referring to the coupling state and the action of the present invention made as described above are as follows.

FIG. 5 is a perspective view illustrating an engaged state and an operating state of FIG. 4. FIG.

Referring to this, when the heat sink 60 according to the present invention is to be mounted on the outer circumference of the CPU module 50 constituting the computer, the heat sink 60 is covered from the upper side of the CPU module 50. When it is covered, the CPU module 50 is housed inside the bottom opening of the heat sink 60.

In this state, the screw fitting holes 64 formed on both sides of the heat sink 60 and the through holes 52 formed on the circumferential surface of the CPU module 50 coincide with each other, and then from one side of the heat sink 60. The screw 72 is inserted through the screw fitting hole 64, and the nut 74 is fastened to the end of the screw 72 protruding to the opposite side, so that the heat sink 60 with respect to the CPU module 50 can be Mounting is complete.

When the user operates the computer in a state in which the heat sink 60 is mounted as described above, heat is generated while the CPU module 50 is driven, and the heat generated in this way is formed on the outer surface of the CPU module 50. It is delivered to the mounted heat sink 60, and is discharged to the outside while being cooled by the flow of external air introduced by the action of the fan motor 80 that is rotated at the same time as the operation of the computer.

When the present invention is applied, the heat sink is enclosed in the form of a heat sink wrapped around the entire outer circumference of a heat generating component such as a CPU module. The heat dissipation efficiency is considerably wider, and thus heat generated from the CPU module is transferred to the heat sink instantaneously and is cooled in a short time by the external air introduced by the action of the fan motor which is rotated at the same time as the operation of the computer. Significantly improved.

Claims (2)

  1. A computer comprising a heat sink 60 mounted on an outer surface of a heat generating component such as a CPU or a CPU module 50, and a fan motor 80 installed and driven inside the housing to introduce external air into the housing. In the radiator,
    The heat sink 60 is formed in a form that can wrap the outer peripheral surface of the heating component mounted on the circuit board of the computer, characterized in that configured to be coupled by a fastening member 70 separate from the heating component Radiator.
  2. The method of claim 1,
    The heat sink 60 is formed of a hexahedron having a predetermined length having a 'U'-shaped cross-section of the front and rear and the bottom is opened, the outer surface has a plurality of heat dissipation fins 62 protruding at regular intervals. Radiating device of a computer, characterized in that made.
KR2019970016208U 1997-06-28 1997-06-28 Computer heat sink KR19990002632U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019970016208U KR19990002632U (en) 1997-06-28 1997-06-28 Computer heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019970016208U KR19990002632U (en) 1997-06-28 1997-06-28 Computer heat sink

Publications (1)

Publication Number Publication Date
KR19990002632U true KR19990002632U (en) 1999-01-25

Family

ID=69674660

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019970016208U KR19990002632U (en) 1997-06-28 1997-06-28 Computer heat sink

Country Status (1)

Country Link
KR (1) KR19990002632U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100624092B1 (en) * 2004-09-16 2006-09-18 잘만테크 주식회사 Computer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100624092B1 (en) * 2004-09-16 2006-09-18 잘만테크 주식회사 Computer

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