KR19980015470A - Manufacturing process of magnetic head used in hard disk drive - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing process of a magnetic head used in a hard disk drive, and more particularly, to a manufacturing process of a magnetic head having improved corrosion resistance and chemical resistance by improving adhesion between an upper core and a silicon dioxide layer.

In the magnetic head manufacturing process according to the present invention, at least the sputtering process is performed in the process of forming the silicon dioxide layer.

Therefore, it has an advantage that the reliability of the magnetic head can be secured.

Description

Manufacturing process of magnetic head used in hard disk drive

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a manufacturing process of a magnetic head used in a hard disk drive, and more particularly, to a manufacturing process of a magnetic head in which corrosion resistance and chemical resistance are improved by improving adhesion between an upper core and a silicon dioxide layer .

A conventional chemical vapor deposition (CVD) process was used to form the conventional silicon dioxide layer. The silicon dioxide layer formed by such a method has a weak adhesive force with the upper core, and the layers are separated from each other in the mechanical polishing step, which is performed after the deposition step,

A minute gap is likely to be formed.

These gaps easily react due to chemical atmosphere and pollution and cause corrosion. Therefore, the magnetic head becomes impossible to operate normally due to such corrosion.

It is an object of the present invention to provide a manufacturing process of a magnetic head in which the manufacturing process of a silicon dioxide layer is improved to increase corrosion resistance and chemical resistance.

FIGS. 1A to 1E are a manufacturing process diagram of a bottom pole of a magnetic head according to the present invention,

FIGS. 2A and 2B are views showing a process of manufacturing a pillar and a coil pattern of a magnetic head according to the present invention,

3A to 3G are manufacturing process diagrams from an upper yoke to a pole piece of a magnetic head according to the present invention.

Description of the Related Art [0002]

10: substrate

11: oxide film

12: permalloy

13: Insulating film

21: pillar

23: coil pattern

According to an aspect of the present invention, there is provided a method of manufacturing a magnetic head having a core on a floating surface, the method comprising: forming a silicon dioxide layer on an upper core by at least a sputtering method; .

Hereinafter, preferred embodiments of a manufacturing process of a magnetic head according to the present invention will be described in detail with reference to the accompanying drawings.

The first embodiment is a process of manufacturing a bottom pole, the second process is a process of manufacturing a PILLAR and a coil pattern, the third process is a process of manufacturing an upper yoke ) To pole piece (POLE PIECE).

First, a first process will be described with reference to FIGS. 1A to 1E. An oxide film 11 is formed on a silicon substrate 10. Subsequently, photoresist is applied to a predetermined portion except the portion to be etched (etching), and etching is performed.

After this etching process, nickel-iron alloy permalloy 12 is plated. Then, an insulating film 13 made of silicon dioxide (Sio2) is deposited.

2A to 2D, a second process which is a manufacturing process of the pillar 21 and the coil pattern 23 will be described. In the first process, the remaining portions except the portion to be etched are photoresist After the covering, etching is performed, and the permalloy 12 is plated again.

Subsequently, the etching for the coil pattern is performed, and the same photoresist film as described above is applied to a predetermined portion, and then etching is performed. The coil is wound around the etched portion formed by such etching to complete the coil pattern 23.

Here, the pillar and coil pattern processes in which the same process is repeated are omitted.

3A to 3G show a manufacturing process from the upper yoke to the pole piece of the magnetic head according to the present invention. In the resultant magnetic head in the above-described process, the silicon dioxide layer as the insulating layer is coated, The photoresist film is coated on the remaining portions except for the predetermined portion, and then etching is performed.

After the etching process, the surface is again plated with permalloy, and then a silicon dioxide layer is coated. Here, the partial process is performed using the photomask, but it goes without saying that the present invention may be performed at one time by the sputtering process, which is the process of forming the silicon dioxide layer 33 to be sought. Finally, the silicon dioxide layer as the insulating layer 34 is finally coated.

On the other hand, in the description of the above-described embodiments, the planarization process performed after the usual plating process is a process that is naturally required, and thus is not described here.

In addition, the silicon dioxide layer 33 may be formed only by the sputtering process. Alternatively, the silicon dioxide layer 33 may be sputtered by a predetermined thickness, and the remaining portion may be suitably arranged by a CVD process.

Further, the above-described silicon dioxide layer forming step may be performed in place of aluminum oxide (AL2O3).

As described above, in the manufacturing process of the magnetic head according to the present invention, the sputtering process is performed in the step of forming the silicon dioxide layer or the aluminum oxide layer, thereby improving the adhesion between silicon dioxide and the upper core containing nickel and iron And has an advantage of preventing the upper core of the head from being corroded.

Claims (3)

In a magnetic head manufacturing process in which a core is provided on a floating surface, Wherein the step of forming the silicon dioxide layer on the upper core is performed by at least a sputtering method. The method according to claim 1, Wherein a sputtering process is performed to a predetermined thickness, and then a chemical vapor deposition process is continuously performed. The method according to claim 1, Aluminum oxide (AL2O3). ≪ / RTI >