KR102927901B1 - 순구리판 - Google Patents

순구리판

Info

Publication number
KR102927901B1
KR102927901B1 KR1020227031104A KR20227031104A KR102927901B1 KR 102927901 B1 KR102927901 B1 KR 102927901B1 KR 1020227031104 A KR1020227031104 A KR 1020227031104A KR 20227031104 A KR20227031104 A KR 20227031104A KR 102927901 B1 KR102927901 B1 KR 102927901B1
Authority
KR
South Korea
Prior art keywords
less
massppm
copper plate
pure copper
heat treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227031104A
Other languages
English (en)
Korean (ko)
Other versions
KR20220149682A (ko
Inventor
히로타카 마츠나가
유키 이토
히로유키 모리
노리히사 이이다
모토히로 히타카
Original Assignee
미쓰비시 마테리알 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰비시 마테리알 가부시키가이샤 filed Critical 미쓰비시 마테리알 가부시키가이샤
Publication of KR20220149682A publication Critical patent/KR20220149682A/ko
Application granted granted Critical
Publication of KR102927901B1 publication Critical patent/KR102927901B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
KR1020227031104A 2020-03-06 2021-03-08 순구리판 Active KR102927901B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-038770 2020-03-06
JP2020038770 2020-03-06
PCT/JP2021/008945 WO2021177469A1 (ja) 2020-03-06 2021-03-08 純銅板

Publications (2)

Publication Number Publication Date
KR20220149682A KR20220149682A (ko) 2022-11-08
KR102927901B1 true KR102927901B1 (ko) 2026-02-13

Family

ID=77614079

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227031104A Active KR102927901B1 (ko) 2020-03-06 2021-03-08 순구리판

Country Status (7)

Country Link
US (1) US12331386B2 (https=)
EP (1) EP4116448A4 (https=)
JP (1) JP7342956B2 (https=)
KR (1) KR102927901B1 (https=)
CN (1) CN115210394B (https=)
TW (1) TWI870562B (https=)
WO (1) WO2021177469A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7342957B2 (ja) * 2020-03-06 2023-09-12 三菱マテリアル株式会社 純銅板、銅／セラミックス接合体、絶縁回路基板
JP2023134291A (ja) * 2022-03-14 2023-09-27 Ｄｏｗａメタルテック株式会社 銅－セラミックス接合基板およびその製造方法
WO2024024909A1 (ja) * 2022-07-29 2024-02-01 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
WO2024024899A1 (ja) * 2022-07-29 2024-02-01 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
JP7473066B2 (ja) * 2022-07-29 2024-04-23 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
JP7444323B2 (ja) * 2022-07-29 2024-03-06 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
WO2024024898A1 (ja) * 2022-07-29 2024-02-01 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
JP7444324B2 (ja) * 2022-07-29 2024-03-06 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
PL449757A1 (pl) * 2024-09-09 2026-03-16 Sieć Badawcza Łukasiewicz - Instytut Metali Nieżelaznych Stop Cu-Mg-Te do zastosowań zwłaszcza w przemyśle elektrycznym i elektrotechnicznym
CN120519734A (zh) * 2025-06-30 2025-08-22 宁波金田电材有限公司 一种高耐热高导电铜合金及其制备方法与应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016125093A (ja) 2014-12-26 2016-07-11 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用部品、端子及びバスバー
JP2018024930A (ja) 2016-08-12 2018-02-15 株式会社Ｓｈカッパープロダクツ 無酸素銅板、無酸素銅板の製造方法およびセラミック配線基板

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62282797A (ja) * 1986-05-29 1987-12-08 Dowa Mining Co Ltd セラミツクス−銅直接接合用銅材
JPH062058A (ja) 1992-06-23 1994-01-11 Furukawa Electric Co Ltd:The 結晶粒成長抑制無酸素銅
JP3856581B2 (ja) * 1999-01-18 2006-12-13 日鉱金属株式会社 フレキシブルプリント回路基板用圧延銅箔およびその製造方法
CN201139707Y (zh) * 2007-12-29 2008-10-29 张爱华 婴幼儿监护治疗床
KR101290856B1 (ko) 2008-09-30 2013-07-29 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 고순도 구리 또는 고순도 구리 합금 스퍼터링 타겟 및 동 스퍼터링 타겟의 제조 방법
CN102165080B (zh) * 2009-01-09 2013-08-21 三菱伸铜株式会社 高强度高导电铜合金轧制板及其制造方法
JP2010282797A (ja) 2009-06-03 2010-12-16 Honda Motor Co Ltd 燃料電池システムの制御方法
JP4516154B1 (ja) * 2009-12-23 2010-08-04 三菱伸銅株式会社 Ｃｕ−Ｍｇ−Ｐ系銅合金条材及びその製造方法
JP4792116B2 (ja) 2010-02-09 2011-10-12 三菱伸銅株式会社 純銅板の製造方法及び純銅板
JP4869415B2 (ja) 2010-02-09 2012-02-08 三菱伸銅株式会社 純銅板の製造方法及び純銅板
JP2016020516A (ja) 2012-09-27 2016-02-04 株式会社日立製作所 回転電機
JP6661951B2 (ja) 2015-10-08 2020-03-11 三菱マテリアル株式会社 高純度銅スパッタリングターゲット材
WO2017033694A1 (ja) 2015-08-24 2017-03-02 三菱マテリアル株式会社 高純度銅スパッタリングターゲット材
JP6680041B2 (ja) 2016-03-30 2020-04-15 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品、端子、及び、バスバー
KR102326618B1 (ko) * 2017-03-31 2021-11-16 후루카와 덴키 고교 가부시키가이샤 구리판 부착 절연 기판용 구리판재 및 그 제조 방법
JP7121883B2 (ja) * 2018-04-09 2022-08-19 三菱マテリアル株式会社 スパッタリングターゲット材
JP7182251B2 (ja) 2018-09-03 2022-12-02 国立大学法人東京工業大学 二次電池及びそれを用いた充放電方法
CN110284025B (zh) * 2019-07-29 2020-12-25 江西省鹰潭铜产业工程技术研究中心 一种铝青铜材料及其制备方法
EP4067517A4 (en) 2019-11-29 2023-11-22 Mitsubishi Materials Corporation Copper alloy, copper alloy plastic-processed material, component for electronic and electric devices, terminal, bus bar, and heat dissipation substrate
KR102927900B1 (ko) * 2020-03-06 2026-02-13 미쓰비시 마테리알 가부시키가이샤 순구리판
JP7342957B2 (ja) * 2020-03-06 2023-09-12 三菱マテリアル株式会社 純銅板、銅／セラミックス接合体、絶縁回路基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016125093A (ja) 2014-12-26 2016-07-11 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用部品、端子及びバスバー
JP2018024930A (ja) 2016-08-12 2018-02-15 株式会社Ｓｈカッパープロダクツ 無酸素銅板、無酸素銅板の製造方法およびセラミック配線基板

Also Published As

Publication number Publication date
JP7342956B2 (ja) 2023-09-12
CN115210394A (zh) 2022-10-18
CN115210394B (zh) 2023-12-22
US12331386B2 (en) 2025-06-17
US20230112081A1 (en) 2023-04-13
TW202138575A (zh) 2021-10-16
KR20220149682A (ko) 2022-11-08
JPWO2021177469A1 (https=) 2021-09-10
WO2021177469A1 (ja) 2021-09-10
TWI870562B (zh) 2025-01-21
EP4116448A4 (en) 2024-03-27
EP4116448A1 (en) 2023-01-11

Similar Documents

Publication Publication Date Title
KR102927901B1 (ko) 순구리판
KR102927900B1 (ko) 순구리판
KR102872450B1 (ko) 순구리판
JP7342957B2 (ja) 純銅板、銅／セラミックス接合体、絶縁回路基板
JPWO2021060023A1 (ja) 純銅板
JP6984799B1 (ja) 純銅板、銅／セラミックス接合体、絶縁回路基板
JP7473066B2 (ja) 純銅材、絶縁基板、電子デバイス
KR102800567B1 (ko) 순구리재, 절연 기판, 전자 디바이스
US12286698B2 (en) Pure copper material, insulating substrate, and electronic device

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13 Pre-grant limitation requested

Free format text: ST27 STATUS EVENT CODE: A-2-3-E10-E13-LIM-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

D22 Grant of ip right intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D22-EXM-PE0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

F11 Ip right granted following substantive examination

Free format text: ST27 STATUS EVENT CODE: A-2-4-F10-F11-EXM-PR0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

U12 Designation fee paid

Free format text: ST27 STATUS EVENT CODE: A-2-2-U10-U12-OTH-PR1002 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

Q13 Ip right document published

Free format text: ST27 STATUS EVENT CODE: A-4-4-Q10-Q13-NAP-PG1601 (AS PROVIDED BY THE NATIONAL OFFICE)