KR102919596B1 - 이온 밀링 장치 - Google Patents

이온 밀링 장치

Info

Publication number
KR102919596B1
KR102919596B1 KR1020247010458A KR20247010458A KR102919596B1 KR 102919596 B1 KR102919596 B1 KR 102919596B1 KR 1020247010458 A KR1020247010458 A KR 1020247010458A KR 20247010458 A KR20247010458 A KR 20247010458A KR 102919596 B1 KR102919596 B1 KR 102919596B1
Authority
KR
South Korea
Prior art keywords
rod
ion
source
electrode
ion source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020247010458A
Other languages
English (en)
Korean (ko)
Other versions
KR20240046301A (ko
Inventor
쇼타 아이다
히사유키 다카스
아츠시 가미노
Original Assignee
주식회사 히타치하이테크
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 히타치하이테크 filed Critical 주식회사 히타치하이테크
Publication of KR20240046301A publication Critical patent/KR20240046301A/ko
Application granted granted Critical
Publication of KR102919596B1 publication Critical patent/KR102919596B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/08—Ion sources; Ion guns
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/32—Polishing; Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
    • H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
    • H01J37/3056—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching for microworking, e. g. etching of gratings or trimming of electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/31749—Focused ion beam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Engineering & Computer Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Sampling And Sample Adjustment (AREA)
KR1020247010458A 2021-10-01 2021-10-01 이온 밀링 장치 Active KR102919596B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/036376 WO2023053437A1 (ja) 2021-10-01 2021-10-01 イオンミリング装置

Publications (2)

Publication Number Publication Date
KR20240046301A KR20240046301A (ko) 2024-04-08
KR102919596B1 true KR102919596B1 (ko) 2026-01-29

Family

ID=85782043

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247010458A Active KR102919596B1 (ko) 2021-10-01 2021-10-01 이온 밀링 장치

Country Status (4)

Country Link
US (1) US20250003841A1 (https=)
JP (1) JP7672500B2 (https=)
KR (1) KR102919596B1 (https=)
WO (1) WO2023053437A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140158885A1 (en) 2003-04-22 2014-06-12 Ebara Corporation Testing apparatus using charged particles and device manufacturing method using the testing apparatus
WO2016189614A1 (ja) 2015-05-25 2016-12-01 株式会社日立ハイテクノロジーズ イオンミリング装置、及びイオンミリング方法
CN210207978U (zh) 2019-06-17 2020-03-31 德淮半导体有限公司 清洁装置及离子植入设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02148647A (ja) * 1988-11-30 1990-06-07 Nec Yamagata Ltd イオン注入装置のイオンソース洗浄治具及び洗浄方法
JP2708903B2 (ja) * 1989-07-31 1998-02-04 松下電器産業株式会社 イオンソースハウジング内壁のクリーニング方法およびクリーニング用治具
CN202142496U (zh) * 2011-07-25 2012-02-08 中芯国际集成电路制造(上海)有限公司 离子注入机的分析器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140158885A1 (en) 2003-04-22 2014-06-12 Ebara Corporation Testing apparatus using charged particles and device manufacturing method using the testing apparatus
WO2016189614A1 (ja) 2015-05-25 2016-12-01 株式会社日立ハイテクノロジーズ イオンミリング装置、及びイオンミリング方法
CN210207978U (zh) 2019-06-17 2020-03-31 德淮半导体有限公司 清洁装置及离子植入设备

Also Published As

Publication number Publication date
KR20240046301A (ko) 2024-04-08
US20250003841A1 (en) 2025-01-02
WO2023053437A1 (ja) 2023-04-06
JP7672500B2 (ja) 2025-05-07
JPWO2023053437A1 (https=) 2023-04-06

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