KR102916226B1 - Laser reflow apparatus capable of fine horizontal alignment of pressing part - Google Patents

Abstract

The present invention relates to a laser reflow device capable of fine horizontal alignment of a pressurizing portion, wherein, according to one embodiment, a laser reflow device pressurizes a plurality of electronic components arranged on a substrate with a light-transmitting pressurizing member and simultaneously irradiates a laser beam through the light-transmitting pressurizing member to bond the electronic components to the substrate, the laser reflow device comprising: a laser pressurizing head assembly in which the light-transmitting pressurizing member is replaceably mounted and moves up and down in the Z-axis direction to selectively pressurize the substrate, and in a state in which the substrate is pressed, irradiates a laser beam to the electronic components through the light-transmitting pressurizing member; a stage provided below the laser pressurizing head assembly and moving in the X and Y-axis directions with a substrate replaceably mounted thereon; a horizontal measuring means provided on one side of the laser pressurizing head assembly or the stage and measuring an inclination of a central axis of an upper surface of the substrate and a central axis of a lower surface of the light-transmitting pressurizing member, respectively; And it is characterized by including a gyro tilting unit which is added to the laser pressure head assembly and aligns the horizontality of the transparent pressure member so that the two opposing surfaces are horizontal by making the central axis of the upper surface of the substrate measured by the horizontal measuring means and the central axis of the lower surface of the transparent pressure member coincide.

Description

Laser reflow apparatus capable of fine horizontal alignment of pressing part

The present invention relates to a laser reflow device capable of fine horizontal alignment of a pressurized portion, and more specifically, to a laser reflow device capable of fine horizontal alignment of a pressurized portion, in which a gyro tilting unit capable of fine horizontal alignment is applied to a light-transmitting pressurized portion, thereby evenly transmitting the same pressure and heat energy to a plurality of electronic components arranged on a substrate when performing a laser reflow process while pressing the light-transmitting pressurized portion, thereby drastically reducing the bonding defect rate.

Micro laser processing is an application that achieves precision at the micron (㎛) level in industrial laser processing, and is widely used in the semiconductor, display, printed circuit board (PCB) and smartphone industries. Memory chips used in all electronic devices have been developed to minimize circuit spacing to achieve integration, performance and ultra-high communication speeds. However, it is now difficult to achieve the required level of technology by simply reducing the circuit line width and line spacing, so memory chips have been stacked vertically. TSMC has already developed stacking technology for up to 128 layers, and Samsung Electronics, SK Hynix, and others are applying stacking technology for up to 72 layers for mass production.

In addition, technologies to mount memory chips, microprocessor chips, graphic processor chips, wireless processor chips, sensor processor chips, etc. in a single package are being researched and developed fiercely, and a considerable level of technologies are already being applied in practice.

However, during the development of the aforementioned technologies, as more and more electrons were required to participate in signal processing within ultra-high-speed, ultra-high-capacity semiconductor chips, power consumption increased, raising the issue of cooling to prevent heat generation. Furthermore, to achieve the requirements of ultra-high-speed and ultra-high-frequency signal processing for a greater number of signals, the need for high-speed transmission of a large number of electrical signals emerged as a technical challenge. In addition, as the number of signal lines increases, the signal interface lines to the outside of the semiconductor chip can no longer be processed with a one-dimensional lead line method, and the ball grid array (BGA) method (called Fan-In BGA or Fan-in Wafer-Level-Package (FIWLP)) that processes them two-dimensionally under the semiconductor chip, and the method (called Fan-Out BGA or Fan-Out Wafer-Level-Package (FOWLP) or Fan-Out Panel-Level-Package) that places a signal layout redistribution layer under an ultra-fine BGA layer at the bottom of the chip and installs a second fine BGA layer under it are being applied in practice.

Recently, semiconductor chips have been introduced with a thickness of less than 200㎛, including an EMC (Epoxy-Mold Compound) layer. In order to attach these ultra-thin semiconductor chips, which are only a few hundred microns thick, to ultra-thin PCBs, mass reflow (MR) processes, such as thermal reflow oven technology, which is a standard process for conventional surface-mount technology (SMT), are applied. As the semiconductor chips are exposed to an air temperature environment of 100 to 300 degrees Celsius (℃) for several hundred seconds, various types of soldering bonding failures, such as chip-boundary warpage, PCB-boundary warpage, and random bonding failure by thermal shock, may occur due to differences in the coefficient of thermal expansion (CTE).

Accordingly, if we look at the configuration of the laser reflow device that has been in the spotlight recently, the laser head module presses the bonding target (semiconductor chip or integrated circuit IC) for several seconds while irradiating the laser to perform bonding, and the bonding is performed by irradiating the laser in the form of a surface light source corresponding to the size of the semiconductor chip or integrated circuit (IC).

For this pressurized laser head module, refer to Korean Patent Publication No. 2018-0137887 (hereinafter referred to as “prior document”). The laser pressurized head configuration mentioned in the patent generally mentions that bonding processing is possible by having the pressurized head pressurize multiple flip chips simultaneously, the laser head horizontally move, and sequentially irradiate each flip chip with a laser one by one, or by having a single laser head irradiate multiple flip chips with a laser simultaneously.

However, according to the conventional laser pressurization head configuration of the above-described prior art document, it is expected that there will be many technical difficulties in irradiating a homogenized laser beam to a plurality of flip chips arranged on a substrate and reflowing the plurality of flip chips without defects.

Therefore, in the past, the total working time was bound to increase because a single flip chip was sequentially pressurized and reflow-processed one by one, and even if a single laser beam was simultaneously irradiated on multiple flip chips horizontally arranged on various substrate sizes for multiple processing, it was practically difficult to evenly transmit the same pressure energy and heat energy to each flip chip, so there still remained a problem that it was difficult to improve the bonding defect rate.

Accordingly, the present invention has been invented to solve the above-mentioned problems, and the present invention provides a laser reflow device capable of fine horizontal alignment of a pressurizing member, in which the same pressure and heat energy are evenly transmitted to a plurality of electronic components arranged on a substrate when performing a laser reflow process while pressing the light-transmitting pressurizing member by applying a gyro tilting unit capable of fine horizontal alignment to the light-transmitting pressurizing member, thereby drastically reducing the bonding defect rate.

In order to achieve the above object, according to one embodiment of the present invention, there is provided a laser reflow device for bonding electronic components to a substrate by pressing a plurality of electronic components arranged on a substrate with a light-transmitting press member while simultaneously irradiating a laser beam through the light-transmitting press member, the device comprising: a laser press head assembly in which the light-transmitting press member is replaceably mounted and moves up and down in the Z-axis direction to selectively press the substrate, and in a state in which the substrate is pressed, irradiates a laser beam to the electronic components through the light-transmitting press member; a stage provided below the laser press head assembly and moving in the X and Y-axis directions while a substrate is replaceably mounted thereon; a horizontal measuring means provided on one side of the laser press head assembly or the stage and measuring an inclination of a central axis of an upper surface of the substrate and a central axis of a lower surface of the light-transmitting press member, respectively; And it is configured to include a gyro tilting unit that is added to the laser pressure head assembly and aligns the horizontality of the transparent pressure member so that the two opposing surfaces are horizontal by making the central axis of the upper surface of the substrate measured by the horizontal measuring means and the central axis of the lower surface of the transparent pressure member coincide.

In addition, according to one embodiment, the horizontal measuring means includes first and second contact displacement sensors respectively provided on one side of the laser pressure head assembly and the stage, wherein the first contact displacement sensor is provided on one side of the laser pressure head assembly facing downward to face the substrate and is moved up and down in the Z-axis direction together with the laser pressure head assembly, and the second contact displacement sensor is provided on one side of the stage facing upward to face the light-transmitting pressure member and is moved in the X- and Y-axis directions together with the stage.

In addition, according to one embodiment, the first and second contact-type displacement sensors are characterized in that they sequentially contact three or more edges of the upper surface of the substrate and the lower surface of the light-transmitting pressure member, and derive coordinates on the X, Y, and Z axes of the contacted points.

Additionally, according to one embodiment, the first contact displacement sensor is characterized in that the height thereof is selectively adjustable so that the lower contact point is located at a higher or lower position relative to the bottom surface of the light-transmitting pressure member.

In addition, according to one embodiment, the laser pressurizing head assembly includes: a transparent pressurizing member; a support frame on which the transparent pressurizing member is mounted on a bottom surface; an elevation unit that raises and lowers the support frame in the Z-axis direction; and a laser optics module that irradiates a laser beam through an opening of the support frame.

In addition, according to one embodiment, the gyro tilting unit includes a holder frame on which a light-transmitting pressure member is replaceably mounted; a base frame coupled to an upper portion of the holder frame; a spherical bearing coupled to three or more points on an edge of an upper surface of the base frame and accommodating an alignment movement in which a central axis of the light-transmitting pressure member mounted on the holder frame is tilted; a linear movement block having a lower end coupled to an upper end of the spherical bearing and an upper end coupled to a bottom surface of a support frame, and guiding an alignment movement in which a central axis of the light-transmitting pressure member mounted on the holder frame is linearly moved or tilted; and an actuator coupled to one side of the linear movement block and moving the linear movement block in a specific direction to align the central axis of the light-transmitting pressure member so as to be horizontal and in line with the central axis of the substrate.

In addition, according to one embodiment, the linear movement block includes an inclined movement block which is respectively coupled to an upper end of a spherical bearing and guides an alignment movement of the light-transmitting press member in an upwardly inclined direction toward a central axis of the light-transmitting press member; a central movement block which is coupled to an upper end of the inclined movement block and guides an alignment movement of the light-transmitting press member in a central direction (hd) toward the central axis of the light-transmitting press member on a plane; and a vertical movement block which is coupled to the inclined movement block or the central movement block and guides an alignment movement of the light-transmitting press member in a direction perpendicular to the central direction on a plane.

Also, according to one embodiment, the linear movement block includes a first linear movement block composed of only a pair of inclined movement blocks; a second linear movement block composed of a pair of inclined movement blocks and one central movement block; and a third linear movement block composed of a pair of inclined movement blocks, one central movement block, and one vertical movement block.

In addition, according to one embodiment, a cross roller bearing is provided at a boundary of the inclined moving block, the central moving block, or the vertical moving block.

As described above, the present invention has the effect of significantly improving productivity through mass reflow processing by enabling a plurality of electronic components arranged on a substrate to be pressed with uniform pressure while simultaneously irradiating a laser beam.

In addition, since the horizontal alignment between the substrate and the light-transmitting pressurizing member can be precisely performed, there is an effect of significantly improving the bonding defect rate caused by the non-uniform pressure distribution in the conventional pressurizing laser reflow process, minimizing the load deviation caused by the non-uniform pressure distribution when pressing multiple electronic components in a pressurizing method requiring high precision.

Figure 1 is a schematic diagram showing the configuration of a laser reflow device capable of fine horizontal alignment of a pressurized portion according to the present invention.
Figure 2 is a side view of the main part of Figure 1.
Figure 3 is a drawing showing a process of measuring upper and lower horizontality using a horizontal measuring means according to the present invention.
Figure 4 is an enlarged perspective view of the gyro tilting unit according to the present invention.
Figure 5 is an enlarged view of the main part of Figure 4.
Figure 6 is a drawing showing a fine horizontal alignment process of a pressurized portion according to the present invention.

The terminology used herein is merely used to describe specific embodiments and is not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this specification, it should be understood that the terms "comprises" or "has" or "has" or "has" indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in this specification, but do not exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

Unless otherwise defined herein, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs.

Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an idealized or overly formal sense unless expressly defined herein.

Hereinafter, the configuration and operational relationship of the reflow device according to the present invention will be specifically examined with reference to the attached drawings 1 to 6.

Fig. 1 is a schematic diagram showing the configuration of a laser reflow device capable of fine horizontal alignment of a pressurized portion according to the present invention, and Fig. 2 is a side view of a main part of Fig. 1.

Referring to the above drawings 1 and 2, first, the pressurizing unit according to the present invention, i.e., the laser pressurizing head assembly (1000), is moved up and down in the Z-axis direction while a transparent pressurizing member (TP) is replaceably mounted thereon, and selectively pressurizes the substrate (S), which is a bonding target of the present invention, and while the substrate is pressed, a laser beam is irradiated onto electronic components (not shown) on the substrate (S) through the transparent pressurizing member (TP), thereby bonding the electronic components on the substrate (S) by the heat energy of the laser beam.

According to one embodiment, the laser pressurization head assembly (1000) comprises: a transparent pressurization member (TP); a support frame (1100) on which the transparent pressurization member is mounted on a bottom surface; a raising/lowering unit (1200) that raises/lowers the support frame in the Z-axis direction; and a laser optics module (1300) that irradiates a laser beam through an opening (1100a) of the support frame (1100).

In addition, a stage (2000) is provided at the bottom of the laser pressurizing head assembly (1000), and a substrate (S) is placed on the upper surface of the stage (2000) in a replaceable manner, and the substrate (S) is transferred in the X and Y-axis directions by a substrate transfer unit (2100).

Specifically, the laser pressurization head assembly (1000) includes at least one laser optic module (1300) that irradiates a laser in the form of a surface light source onto a substrate (S) that is supported and transported on a stage (2000) having a porous material having a structure capable of applying heat to a lower portion or having vacuum holes formed therein, and a transparent pressurization member (TP) that is installed independently and separately from the laser optic module (1300) and transmits the laser in the form of a surface light source.

The above laser optics module (1300) converts a laser generated from a laser generator (laser source) and transmitted through an optical fiber into a surface light source and irradiates the laser onto a substrate (S), which is a bonding target of the present invention. The laser optics module (1300) may be implemented by including a beam shaper (not shown) that converts a spot-shaped laser into a surface light source, and an optical unit (not shown) that is disposed below the beam shaper and has a plurality of lens modules spaced apart from each other at an appropriate interval inside the barrel so that the surface light source emitted from the beam shaper is irradiated onto the irradiation area of the substrate (S).

Additionally, the laser optics module (1300) can be raised or lowered along the Z-axis, moved left or right along the X-axis, or moved along the Y-axis for alignment with the substrate (S).

That is, the laser pressurizing head assembly (1000) of the laser reflow device according to the present invention can be formed by independently separating a light-transmitting pressurizing member (TP) that presses a substrate (S) and a laser optics module (1300) that irradiates a laser in the form of a surface light source onto the substrate (S).

Accordingly, by moving the laser optic module (1300) to multiple irradiation positions on the substrate (S) and then driving it while pressing the substrate (S) with the light-transmitting pressurizing member (TP), it is possible to shorten the tact time for one substrate (S) and to speed up the bonding operation for all of the multiple substrates (S). At this time, the light-transmitting pressurizing member (TP) is connected to a flat support frame (1100) and is waiting for the laser reflow process.

In addition, although not shown in the drawing, the laser pressure head assembly (1000) of the laser reflow device according to the present invention preferably further includes a control unit (not shown) to control the Z-axis direction elevation and lowering operation of the light-transmitting pressure member (TP) using data input from a pressure detection sensor (not shown) and a height sensor (not shown), and to control the X- and Y-axis direction movement of the substrate transfer unit (2100) provided on the stage (2000). The pressure detection sensor and the height sensor may be installed on the stage (2000) that supports the substrate (S), and the pressure detection sensor may be implemented with at least one load cell, for example, and the height sensor may be implemented with a linear encoder.

For example, the control unit (not shown) may receive data from a pressure sensor and control a light-transmitting pressurizing member (TP) so that the pressure reaches a target value, and may also receive data from a height sensor and control the light-transmitting pressurizing member (TP) so that the height reaches a target value.

That is, by adjusting the pressure applied to the substrate (S) through the pressure detection sensor, in the case of a large area, the same pressure can be transmitted to the substrate (S) through the lifting/lowering unit (1200) and a plurality of pressure detection sensors (not shown), and also, through one or more or a plurality of height sensors, the height position value at the moment when the substrate (S) is bonded can be confirmed or technical data for finding a more accurate bonding height value can be provided, and when a process that requires maintaining a certain height interval is performed, the function of controlling the accurate height is performed.

In addition, the above-described transparent pressure member (TP) may be implemented as a base material that transmits the laser output from the laser optics module (1300). The base material of the above-described transparent pressure member (TP) may be implemented as any beam-transmitting material. For example, the base material of the above-described transparent pressure member (TP) may be implemented as quartz from which impurities have been removed, and more specifically, may be implemented as quartz containing fused silica.

For example, when irradiated with a 980 nm laser, the transmittance of a light-transmitting pressurizing member (TP) made of quartz is 85% to 99%, and the temperature measured at the substrate (S) is 100°C, whereas the transmittance of a light-transmitting pressurizing member (TP) made of sapphire is 80% to 90%, and the temperature measured at the substrate (S) is 60°C. In other words, quartz shows superior performance to sapphire in terms of light transmittance and heat loss required for bonding.

In addition, a horizontal measuring means is provided on one side of the laser pressure head assembly (1000) or stage (2000), and the inclination of the central axis of the upper surface of the substrate (S), i.e., the substrate, and the central axis of the lower surface of the light-transmitting pressure member (TP) are measured using the horizontal measuring means.

According to one embodiment, the horizontal measuring means may be first and second contact displacement sensors (3100) (3200) respectively provided on one side of the laser pressure head assembly (1000) and the stage (2000).

According to one embodiment, the first contact displacement sensor (3100) is mounted facing downward on one side of the laser pressure head assembly (1000) to face the substrate (S) and is moved up and down in the Z-axis direction together with the laser pressure head assembly (1000), and the second contact displacement sensor (3200) is mounted facing upward on one side of the stage (2000) to face the light-transmitting pressure member (TP) and is moved in the X and Y-axis directions together with the stage (2000).

Figure 3 is a drawing showing a process of measuring upper and lower horizontality using a horizontal measuring means according to the present invention.

Referring to FIG. 3, the first and second contact-type displacement sensors (3100) (3200) sequentially contact three or more edge points among the upper surface of the substrate (S) and the lower surface of the light-transmitting pressure member (TP) (e.g., P1, P2, P3), and derive spatial coordinates on the X, Y, and Z axes of the contacted points. For example, by connecting the three spatial coordinates, a triangular surface can be obtained, and a central axis penetrating the center of the triangular surface and an inclination of the central axis can be obtained. The process of obtaining the central axis and inclination of the polygonal surface is based on general geometric operations, and a detailed description thereof will be omitted.

Meanwhile, the first contact displacement sensor (3100) is configured to be selectively height-adjustable so that the lower contact point is at a higher or lower position relative to the bottom surface of the light-transmitting pressure member (TP).

Fig. 4 is an enlarged perspective view of a main part of a gyro tilting unit according to the present invention, and Fig. 5 is an enlarged view of a main part of Fig. 4.

Referring to FIGS. 4 and 5, the laser pressurization head assembly (1000) is equipped with a gyro tilting unit (1500).

That is, the gyro tilting unit (1500) is added to the laser pressure head assembly (1000), and as previously described, the central axis of the upper surface of the substrate (S) measured by the first and second contact displacement sensors (3100) (3200) and the central axis of the lower surface of the light-transmitting pressure member (TP) are aligned, thereby performing alignment so that the two opposing surfaces, i.e., the upper surface of the substrate (S) and the lower surface of the light-transmitting pressure member (TP), are perfectly horizontal.

Therefore, as described above, when the upper surface of the substrate (S) and the lower surface of the light-transmitting pressurizing member (TP) are completely horizontal, the light-transmitting pressurizing member (TP) is lowered to pressurize the substrate (S), so that a uniform pressure is transmitted to the upper surface of the substrate (S), and since the laser beam is irradiated in this state, the bonding defect rate is significantly reduced during the laser reflow process. The alignment process will be examined in more detail in Fig. 6.

The above gyro tilting unit (1500) comprises: a holder frame (1510) on which a transparent pressure member (TP) is replaceably mounted; a base frame (1520) coupled to the upper portion of the holder frame; a spherical bearing (1530) coupled to three or more edge points on the upper surface of the base frame and accommodating an alignment movement in which the central axis of the transparent pressure member (TP) mounted on the holder frame (1510) tilts; a linear movement block (1540) having a lower end coupled to the upper end of the spherical bearing and an upper end coupled to the lower surface of the support frame (1100) and guiding an alignment movement in which the central axis of the transparent pressure member (TP) mounted on the holder frame (1510) linearly moves or tilts; And an actuator (1550) coupled to one side of the linear movement block and moving the linear movement block (1540) in a specific direction to align the central axis of the light-transmitting pressure member (TP) to be horizontal and in line with the central axis of the substrate (S).

According to one embodiment, the linear movement block (1540) includes an inclined movement block (1541) which is respectively coupled to the upper end of the spherical bearing (1530) and guides the alignment movement of the light-transmitting pressure member (TP) in an upwardly inclined direction (sd) toward the central axis of the light-transmitting pressure member (TP); a central movement block (1542) which is coupled to the upper end of the inclined movement block (1541) and guides the alignment movement of the light-transmitting pressure member (TP) in a central direction (hd) toward the central axis of the light-transmitting pressure member (TP) on a plane; and a vertical movement block (1543) which is coupled to the inclined movement block (1541) or the central movement block (1542) and guides the alignment movement of the light-transmitting pressure member in a direction (vd) perpendicular to the central direction (hd) on a plane.

Specifically, as previously discussed, the linear movement block (1540) performs horizontal alignment of the substrate (S) and the light-transmitting pressurizing member (TP) according to the spatial coordinates on the X, Y, and Z axes of the three contact points (P1, P2, and P3) obtained by the first and second contact displacement sensors (3100) (3200).

That is, the spherical coordinate system (r, θ,) shown in Figures 5 and 6 ), the inclined direction movement block (1541) guides the alignment movement of the light-transmitting pressure member (TP) along the inclined direction (sd) by an arbitrary θ value (e.g., aligns the distance (r) from the origin of P1, P2, and P3), the central direction movement block (1542) guides the alignment movement of the light-transmitting pressure member (TP) in the horizontal direction (hd) toward the central axis (Z-axis) on the XY plane (e.g., aligns the X-axis distance of P1, P2, and P3), and the vertical direction movement block (1543) guides the alignment movement of the light-transmitting pressure member in the vertical direction (vd) on the XY plane (e.g., aligns the Y-axis distance of P1, P2, and P3).

At this time, each of the linear movement blocks (1540) corresponds to points P1, P2, and P3. The values form an equilateral triangle at 120 degrees (the above θ values and (The value does not change) and move simultaneously by linking together with one alignment movement.

Additionally, according to one embodiment, the linear movement blocks (1540) may be arranged one at each of the vertex positions of an equilateral triangle, for a total of three, and the three linear movement blocks (1540) may each have a different combination of configurations.

That is, as illustrated in FIG. 5, the three linear movement blocks (1540) may be configured differently, including a first linear movement block (1540-1) composed of only a pair of inclined movement blocks (1541); a second linear movement block (1540-2) composed of a pair of inclined movement blocks (1541) and one central movement block (1542); and a third linear movement block (1540-3) composed of a pair of inclined movement blocks (1541), one central movement block (1542), and one vertical movement block (1543).

In addition, a cross roller bearing (CRB, see Fig. 5) may be further provided at the boundary of the inclined movement block (1541), the central movement block (1542), or the vertical movement block (1543). Accordingly, the linear movement of the inclined movement block (1541), the central movement block (1542), or the vertical movement block (1543) can be guided more smoothly by the roller by the cross roller bearing (CRB).

Figure 6 is a drawing showing a fine horizontal alignment process of a pressurized portion according to the present invention.

First, referring to FIGS. 1 and 6, a vision unit (4000) is provided between the transparent pressure member (TP) and the stage (2000). For example, the vision unit (4000) may be a two-way camera module, and the position of the transparent pressure member (TP) and the substrate (S) and the position of the central axis can be checked in real time by the two-way camera module.

Below, the fine horizontal alignment process of the pressurized part is examined in more detail.

First, when the vision unit (4000) confirms that the substrate (S) is positioned for the process, the first contact displacement sensor (3100) contacts three edge points (P1, P2, P3) on the upper surface of the substrate, thereby confirming the spatial coordinates (x, y, z) of the three points and the inclination of the central axis of the triangular surface connecting the three points. This will be described below with reference to FIG. 6.

(1) Next, the second contact displacement sensor (3200) is driven to check the inclination of the central axis of the permeable pressure member (TP), and the gyro tilting unit (1500) is driven to match the confirmed central axis of the permeable pressure member (TP) with the previously confirmed inclination of the central axis of the substrate (S) (to align the horizontality of the substrate and the permeable pressure member). That is, in order to align the horizontality of the substrate and the permeable pressure member, one actuator (1550) of the gyro tilting unit (1500) is driven to push the linear movement block (1540) in any specific direction among the inclined, horizontal, or vertical directions by an arbitrary amount.

(2) Continuing, when one linear movement block (1540) is pushed by the operation (1) above, the other linear movement blocks (1540) are coupled to each other by the spherical bearing (1530) and the base frame (1520), and thus linearly move or tilt (hereinafter referred to as “gyro tilting”) by an arbitrary amount in a specific direction among the inclined, horizontal, or vertical directions in conjunction therewith. By this “gyro tilting” operation, the horizontal is aligned so that the inclination of the central axis of the permeable pressure member (TP) matches the inclination of the central axis of the substrate (S).

(3) At this time, as shown in Fig. 6, when the ‘gyro tilting’ is performed, the permeable pressure member (TP) is tilted to the right by a certain angle, and the spatial coordinates where the central axis of the permeable pressure member (TP) is located are also moved slightly to the right (-X axis direction) by a certain amount.

(4) Finally, the vision unit (4000) checks the X-axis displacement amount by which the center axis of the permeable pressure member (TP) has moved, and the control unit (not shown) compensates by moving the substrate (S) to the right (-X-axis direction) by the amount of the X-axis displacement of the permeable pressure member (TP), thereby completing the fine horizontal alignment of the pressure member in the X-axis direction.

Above, referring to FIG. 6, the above-described process assumes that the horizontal alignment of the light-transmitting pressurizing member is completed by pushing the linear movement block (1540) only in the X-axis direction, but it is not limited thereto, and it is specified that the linear movement block (1540) can also be horizontally aligned in the Y-axis direction by using the actuator (1550) of the gyro tilting unit (1500).

Therefore, as examined above, the present invention aligns the horizontal and central axes of two contact surfaces of a light-transmitting pressurizing member (TP) having a certain area precisely to the substrate (S), and then pressurization and laser beam irradiation are performed, so that the precision of the laser reflow process and the bonding defect rate are drastically reduced compared to the conventional method that did not perform the fine horizontal alignment.

In addition, the present invention is not limited to the above-described embodiment, and the same effect can be created even when the detailed configuration, number, and arrangement structure of the device are changed. Therefore, it is stated that a person having ordinary skill in the art can add, delete, and modify various configurations within the scope of the technical idea of the present invention.

1000: Laser pressurized head assembly
1100: Support frame
1200: Lifting and lowering unit
1300: Laser Optics Module
1500: Gyro tilting unit
1510: Holder Frame
1520: Base Frame
1530: Spherical bearing
1540: Linear movement block
1541, 1542, 1543: Inclined movement block, center movement block, vertical movement block
2000: Stage
2100: Substrate transfer unit
3100, 3200: 1st and 2nd contact displacement sensors
4000: Vision Unit
S: substrate
TP: Permeable pressure member

Claims (9)

In a laser reflow device that bonds electronic components to a substrate by pressing a plurality of electronic components arranged on a substrate with a light-transmitting pressurizing member and simultaneously irradiating a laser beam through the light-transmitting pressurizing member,
A laser pressurizing head assembly that is moved up and down in the Z-axis direction while the above-mentioned transparent pressurizing member is replaceably mounted to selectively pressurize a substrate, and irradiates a laser beam to an electronic component through the above-mentioned transparent pressurizing member while the substrate is pressed;
A stage provided at the bottom of the laser pressure head assembly and moved in the X and Y axes directions while a substrate is replaceably mounted thereon;
A horizontal measuring means provided on one side of the laser pressure head assembly or stage, and measuring the inclination of the central axis of the upper surface of the substrate and the central axis of the lower surface of the light-transmitting pressure member; and
A gyro tilting unit is added to the laser pressure head assembly and aligns the horizontality of the transparent pressure member so that the two opposing surfaces are horizontal by aligning the central axis of the upper surface of the substrate measured by the horizontal measuring means with the central axis of the lower surface of the transparent pressure member;
The above horizontal measuring means,
Including first and second contact displacement sensors respectively provided on one side of the laser pressurizing head assembly and the stage,
The above first contact displacement sensor is installed facing downward on one side of the laser pressure head assembly so as to face the substrate and is raised and lowered in the Z-axis direction together with the laser pressure head assembly.
The second contact displacement sensor is characterized in that it is provided facing upwards so as to face a light-transmitting pressure member on one side of the stage and moves in the X and Y-axis directions together with the stage.
Laser reflow device capable of fine horizontal alignment of the pressurized part. delete In the first paragraph,
The above first and second contact-type displacement sensors are characterized in that they sequentially contact three or more edges of the upper surface of the substrate and the lower surface of the light-transmitting pressure member, and derive coordinates on the X, Y, and Z axes of the contacted points.
Laser reflow device capable of fine horizontal alignment of the pressurized part. In the first paragraph,
The above first contact displacement sensor is characterized in that the height can be selectively adjusted so that the lower contact point is at a higher or lower position relative to the bottom surface of the light-transmitting pressure member.
Laser reflow device capable of fine horizontal alignment of the pressurized part. In the first paragraph,
The above laser pressurizing head assembly,
Permeable pressure member;
A support frame on which the above-mentioned permeable pressure member is mounted on the bottom;
A lifting unit that raises and lowers the above support frame in the Z-axis direction; and
A laser optics module for irradiating a laser beam through an opening of the above support frame;
Laser reflow device capable of fine horizontal alignment of the pressurized part. In paragraph 5,
The above gyro tilting unit,
A holder frame on which a transparent pressure member is replaceably mounted;
A base frame coupled to the upper portion of the holder frame;
A spherical bearing that accommodates an alignment movement in which the central axis of a light-transmitting pressurizing member mounted on the holder frame is tilted and is coupled to three or more points on the edge of the upper surface of the base frame;
A linear movement block that guides an alignment movement in which the center axis of a light-transmitting pressurizing member mounted on the holder frame is linearly moved or tilted, the upper end being coupled to the lower end of the support frame while the lower end is coupled to the upper end of the spherical bearing; and
An actuator, which is coupled to one side of the linear movement block and moves the linear movement block in a specific direction to align the central axis of the light-transmitting pressure member so that it is horizontal and coincides with the central axis of the substrate;
Laser reflow device capable of fine horizontal alignment of the pressurized part. In paragraph 6,
The above linear movement block is,
An inclined movement block, each coupled to the upper end of the spherical bearing, guides the alignment movement of the light-transmitting press member in an upwardly inclined direction toward the central axis of the light-transmitting press member;
A central movement block coupled to the upper end of the above-mentioned inclined movement block and guiding the alignment movement of the light-transmitting pressure member in a central direction toward the central axis of the light-transmitting pressure member on a plane; and
A vertical movement block coupled to the inclined movement block or the central movement block and guiding the alignment movement of the light-transmitting pressure member in a direction perpendicular to the central direction on a plane;
Laser reflow device capable of fine horizontal alignment of the pressurized part. In paragraph 7,
The above linear movement block is,
A first linear movement block consisting of only a pair of inclined movement blocks;
A second linear movement block comprising a pair of inclined movement blocks and one central movement block; and
a third linear movement block comprising a pair of inclined movement blocks, one central movement block and one vertical movement block;
Laser reflow device capable of fine horizontal alignment of the pressurized part. In paragraph 7,
A cross roller bearing is provided at the boundary of the inclined moving block, the central moving block or the vertical moving block.
Laser reflow device capable of fine horizontal alignment of the pressurized part.