KR102884989B1 - 기판 처리 장치, 기판 처리 방법, 및 기판 처리 방법을 기판 처리 장치의 컴퓨터에 실행시키기 위한 프로그램을 저장한 기억 매체 - Google Patents

기판 처리 장치, 기판 처리 방법, 및 기판 처리 방법을 기판 처리 장치의 컴퓨터에 실행시키기 위한 프로그램을 저장한 기억 매체

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Publication number
KR102884989B1
KR102884989B1 KR1020210081369A KR20210081369A KR102884989B1 KR 102884989 B1 KR102884989 B1 KR 102884989B1 KR 1020210081369 A KR1020210081369 A KR 1020210081369A KR 20210081369 A KR20210081369 A KR 20210081369A KR 102884989 B1 KR102884989 B1 KR 102884989B1
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KR
South Korea
Prior art keywords
substrate
polishing
polishing head
slip
detector
Prior art date
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Application number
KR1020210081369A
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English (en)
Korean (ko)
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KR20220001477A (ko
Inventor
다카시 미츠야
아사기 마츠구
아유무 사이토
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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Publication of KR20220001477A publication Critical patent/KR20220001477A/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0053—Control means for lapping machines or devices detecting loss or breakage of a workpiece during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/08—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • H01L21/67092—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020210081369A 2020-06-29 2021-06-23 기판 처리 장치, 기판 처리 방법, 및 기판 처리 방법을 기판 처리 장치의 컴퓨터에 실행시키기 위한 프로그램을 저장한 기억 매체 Active KR102884989B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020111535A JP7443169B2 (ja) 2020-06-29 2020-06-29 基板処理装置、基板処理方法、および基板処理方法を基板処理装置のコンピュータに実行させるためのプログラムを格納した記憶媒体
JPJP-P-2020-111535 2020-06-29

Publications (2)

Publication Number Publication Date
KR20220001477A KR20220001477A (ko) 2022-01-05
KR102884989B1 true KR102884989B1 (ko) 2025-11-12

Family

ID=76641617

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020210081369A Active KR102884989B1 (ko) 2020-06-29 2021-06-23 기판 처리 장치, 기판 처리 방법, 및 기판 처리 방법을 기판 처리 장치의 컴퓨터에 실행시키기 위한 프로그램을 저장한 기억 매체

Country Status (6)

Country Link
US (1) US11911868B2 (https=)
EP (1) EP3932615B1 (https=)
JP (1) JP7443169B2 (https=)
KR (1) KR102884989B1 (https=)
CN (1) CN114102426B (https=)
TW (1) TWI897976B (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025136592A (ja) * 2024-03-07 2025-09-19 株式会社荏原製作所 基板研磨装置、基板処理装置、基板研磨方法、およびプログラム

Citations (7)

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JP2001000964A (ja) 1999-06-22 2001-01-09 Japan Atom Energy Res Inst 超音波により水相から有機溶媒を除去する方法
US20030134571A1 (en) * 2002-01-12 2003-07-17 Taiwan Semiconductor Manufacturing Co., Ltd. Dual wafer-loss sensor and water-resistant sensor holder
US20120129433A1 (en) 2009-07-22 2012-05-24 Jtekt Corporation Method and device for preventing slip of work piece
US20150117755A1 (en) 2013-10-24 2015-04-30 International Business Machines Corporation Wafer slip detection during cmp processing
US20150266159A1 (en) 2014-03-20 2015-09-24 Ebara Corporation Polishing apparatus and polishing method
US20170173756A1 (en) 2015-12-18 2017-06-22 Ebara Corporation Polishing apparatus, control method and recording medium
JP2019001627A (ja) 2017-06-16 2019-01-10 山九株式会社 重量物横移動用のリフト

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JPH10214806A (ja) * 1997-01-31 1998-08-11 Hitachi Chem Co Ltd 半導体基板の研磨方法
JP3705670B2 (ja) 1997-02-19 2005-10-12 株式会社荏原製作所 ポリッシング装置及び方法
JP2977543B2 (ja) * 1997-09-02 1999-11-15 松下電子工業株式会社 化学的機械研磨装置及び化学的機械研磨方法
JP3572917B2 (ja) * 1997-12-09 2004-10-06 信越半導体株式会社 半導体ウエーハの両面研磨方法及びその装置
JP2001096455A (ja) 1999-09-28 2001-04-10 Ebara Corp 研磨装置
JP3922887B2 (ja) 2001-03-16 2007-05-30 株式会社荏原製作所 ドレッサ及びポリッシング装置
JP4102081B2 (ja) * 2002-02-28 2008-06-18 株式会社荏原製作所 研磨装置及び研磨面の異物検出方法
JP2004106123A (ja) * 2002-09-19 2004-04-08 Toshiba Corp 研磨方法、ｃｍｐ装置及び膜厚測定装置
US6946397B2 (en) * 2003-11-17 2005-09-20 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical polishing process with reduced defects in a copper process
JP2005251924A (ja) * 2004-03-03 2005-09-15 Nikon Corp ウエハの保持部材からの飛び出し検出方法、ウエハ部分割れ検出方法、及びｃｍｐ装置におけるウエハの飛び出し検出方法、ｃｍｐ装置におけるウエハの部分割れ検出方法、及びウエハの保持部材からの一部飛び出し検出方法
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TWI572441B (zh) * 2008-08-05 2017-03-01 荏原製作所股份有限公司 硏磨方法及裝置
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JP6887371B2 (ja) * 2017-12-20 2021-06-16 株式会社荏原製作所 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
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Publication number Priority date Publication date Assignee Title
JP2001000964A (ja) 1999-06-22 2001-01-09 Japan Atom Energy Res Inst 超音波により水相から有機溶媒を除去する方法
US20030134571A1 (en) * 2002-01-12 2003-07-17 Taiwan Semiconductor Manufacturing Co., Ltd. Dual wafer-loss sensor and water-resistant sensor holder
US20120129433A1 (en) 2009-07-22 2012-05-24 Jtekt Corporation Method and device for preventing slip of work piece
US20150117755A1 (en) 2013-10-24 2015-04-30 International Business Machines Corporation Wafer slip detection during cmp processing
US20150266159A1 (en) 2014-03-20 2015-09-24 Ebara Corporation Polishing apparatus and polishing method
US20170173756A1 (en) 2015-12-18 2017-06-22 Ebara Corporation Polishing apparatus, control method and recording medium
JP2019001627A (ja) 2017-06-16 2019-01-10 山九株式会社 重量物横移動用のリフト

Also Published As

Publication number Publication date
EP3932615A1 (en) 2022-01-05
JP7443169B2 (ja) 2024-03-05
EP3932615B1 (en) 2023-08-16
US20210402548A1 (en) 2021-12-30
TWI897976B (zh) 2025-09-21
US11911868B2 (en) 2024-02-27
JP2022010795A (ja) 2022-01-17
CN114102426A (zh) 2022-03-01
KR20220001477A (ko) 2022-01-05
CN114102426B (zh) 2026-03-06
TW202218805A (zh) 2022-05-16

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