KR102877569B1 - 저온땜납, 저온땜납의 제조방법 및 저온땜납 피복 리드선 - Google Patents

저온땜납, 저온땜납의 제조방법 및 저온땜납 피복 리드선

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Publication number
KR102877569B1
KR102877569B1 KR1020237014375A KR20237014375A KR102877569B1 KR 102877569 B1 KR102877569 B1 KR 102877569B1 KR 1020237014375 A KR1020237014375 A KR 1020237014375A KR 20237014375 A KR20237014375 A KR 20237014375A KR 102877569 B1 KR102877569 B1 KR 102877569B1
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KR
South Korea
Prior art keywords
low
soldering
temperature
temperature solder
melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020237014375A
Other languages
English (en)
Korean (ko)
Other versions
KR20230075504A (ko
Inventor
모리히로 오카다
다카시 아라이
가쓰야 아라이
히로아키 아라이
미에코 스가와라
겐이치 고바야시
히데토시 고미야
쇼고 마쓰이
준 니시고리
나오히사 모리
료 도쿠다
Original Assignee
아토비무 가부시키가이샤
모리히로 오카다
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Publication date
Application filed by 아토비무 가부시키가이샤, 모리히로 오카다 filed Critical 아토비무 가부시키가이샤
Publication of KR20230075504A publication Critical patent/KR20230075504A/ko
Application granted granted Critical
Publication of KR102877569B1 publication Critical patent/KR102877569B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
KR1020237014375A 2020-10-01 2021-09-15 저온땜납, 저온땜납의 제조방법 및 저온땜납 피복 리드선 Active KR102877569B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020166977 2020-10-01
JPJP-P-2020-166977 2020-10-01
JP2020219193 2020-12-28
JPJP-P-2020-219193 2020-12-28
PCT/JP2021/033865 WO2022070910A1 (ja) 2020-10-01 2021-09-15 低温半田、低温半田の製造方法、および低温半田被覆リード線

Publications (2)

Publication Number Publication Date
KR20230075504A KR20230075504A (ko) 2023-05-31
KR102877569B1 true KR102877569B1 (ko) 2025-10-27

Family

ID=80951440

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237014375A Active KR102877569B1 (ko) 2020-10-01 2021-09-15 저온땜납, 저온땜납의 제조방법 및 저온땜납 피복 리드선

Country Status (5)

Country Link
JP (2) JP7576805B2 (https=)
KR (1) KR102877569B1 (https=)
CN (1) CN116324001A (https=)
TW (2) TW202344326A (https=)
WO (1) WO2022070910A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116324001A (zh) * 2020-10-01 2023-06-23 亚特比目有限会社 低温焊料、低温焊料的制造方法及低温焊料包覆导线
US11832386B2 (en) * 2021-12-16 2023-11-28 Dell Products L.P. Solder composition for use in solder joints of printed circuit boards

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016026884A (ja) * 2014-07-02 2016-02-18 住友金属鉱山株式会社 中低温用のＢｉ−Ｓｎ−Ａｌ系はんだ合金及びはんだペースト

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09155587A (ja) * 1995-11-30 1997-06-17 Mitsui Mining & Smelting Co Ltd 錫−亜鉛系無鉛半田合金
JP4135268B2 (ja) 1998-09-04 2008-08-20 株式会社豊田中央研究所 無鉛はんだ合金
JP2005296983A (ja) 2004-04-09 2005-10-27 Hitachi Metals Ltd はんだ合金およびはんだボール
JP2007292901A (ja) 2006-04-24 2007-11-08 Optrex Corp 表示モジュール
US9279176B2 (en) 2008-11-27 2016-03-08 Hitachi Metals, Ltd. Lead wire for solar cell, manufacturing method and storage method thereof, and solar cell
JP5169871B2 (ja) * 2009-01-26 2013-03-27 富士通株式会社 はんだ、はんだ付け方法及び半導体装置
JP2013248664A (ja) * 2012-06-04 2013-12-12 Nippon Genma:Kk 鉛フリーはんだ合金およびはんだペースト
US20150037087A1 (en) * 2013-08-05 2015-02-05 Senju Metal Industry Co., Ltd. Lead-Free Solder Alloy
CN106216872B (zh) * 2016-08-11 2019-03-12 北京康普锡威科技有限公司 一种SnBiSb系低温无铅焊料及其制备方法
TWI714127B (zh) * 2018-06-26 2020-12-21 日商亞特比目有限公司 太陽能電池及太陽能電池的製造方法
CN108971793B (zh) * 2018-08-24 2021-04-23 云南科威液态金属谷研发有限公司 一种低温无铅焊料
TW202206614A (zh) 2019-07-12 2022-02-16 日商亞特比目有限公司 ＳｎＺｎ焊料及其製造方法
CN116324001A (zh) 2020-10-01 2023-06-23 亚特比目有限会社 低温焊料、低温焊料的制造方法及低温焊料包覆导线

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016026884A (ja) * 2014-07-02 2016-02-18 住友金属鉱山株式会社 中低温用のＢｉ−Ｓｎ−Ａｌ系はんだ合金及びはんだペースト

Also Published As

Publication number Publication date
CN116324001A (zh) 2023-06-23
JP7576805B2 (ja) 2024-11-01
KR20230075504A (ko) 2023-05-31
JP2024113075A (ja) 2024-08-21
JPWO2022070910A1 (https=) 2022-04-07
WO2022070910A1 (ja) 2022-04-07
TW202219286A (zh) 2022-05-16
TW202344326A (zh) 2023-11-16
JP7770637B2 (ja) 2025-11-17

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