KR102863239B1 - 진단 장치, 진단 방법, 반도체 제조 장치 시스템 및 반도체 장치 제조 시스템 - Google Patents

진단 장치, 진단 방법, 반도체 제조 장치 시스템 및 반도체 장치 제조 시스템

Info

Publication number
KR102863239B1
KR102863239B1 KR1020237005510A KR20237005510A KR102863239B1 KR 102863239 B1 KR102863239 B1 KR 102863239B1 KR 1020237005510 A KR1020237005510 A KR 1020237005510A KR 20237005510 A KR20237005510 A KR 20237005510A KR 102863239 B1 KR102863239 B1 KR 102863239B1
Authority
KR
South Korea
Prior art keywords
deterioration
component
components
sensor waveform
semiconductor manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020237005510A
Other languages
English (en)
Korean (ko)
Other versions
KR20230120121A (ko
Inventor
쇼타 우메다
마사히로 스미야
료지 아사쿠라
Original Assignee
주식회사 히타치하이테크
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 히타치하이테크 filed Critical 주식회사 히타치하이테크
Publication of KR20230120121A publication Critical patent/KR20230120121A/ko
Application granted granted Critical
Publication of KR102863239B1 publication Critical patent/KR102863239B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3288—Maintenance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32926—Software, data control or modelling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Drying Of Semiconductors (AREA)
  • Testing And Monitoring For Control Systems (AREA)
KR1020237005510A 2022-02-07 2022-02-07 진단 장치, 진단 방법, 반도체 제조 장치 시스템 및 반도체 장치 제조 시스템 Active KR102863239B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/004679 WO2023148967A1 (ja) 2022-02-07 2022-02-07 診断装置、診断方法、半導体製造装置システム及び半導体装置製造システム

Publications (2)

Publication Number Publication Date
KR20230120121A KR20230120121A (ko) 2023-08-16
KR102863239B1 true KR102863239B1 (ko) 2025-09-22

Family

ID=87552003

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237005510A Active KR102863239B1 (ko) 2022-02-07 2022-02-07 진단 장치, 진단 방법, 반도체 제조 장치 시스템 및 반도체 장치 제조 시스템

Country Status (6)

Country Link
US (1) US20240395518A1 (https=)
JP (1) JP7442013B2 (https=)
KR (1) KR102863239B1 (https=)
CN (1) CN116897411A (https=)
TW (1) TWI854452B (https=)
WO (1) WO2023148967A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250040892A (ko) * 2023-09-15 2025-03-25 주식회사 히타치하이테크 프로세스 처리 장치의 진단 장치, 진단 시스템, 및 진단 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012532461A (ja) * 2009-06-30 2012-12-13 ラム リサーチ コーポレーション 処理チャンバの予測予防保全のための方法と装置
WO2018061842A1 (ja) * 2016-09-27 2018-04-05 東京エレクトロン株式会社 異常検知プログラム、異常検知方法および異常検知装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6421457B1 (en) * 1999-02-12 2002-07-16 Applied Materials, Inc. Process inspection using full and segment waveform matching
US7413672B1 (en) * 2006-04-04 2008-08-19 Lam Research Corporation Controlling plasma processing using parameters derived through the use of a planar ion flux probing arrangement
EP2254112B1 (en) * 2008-03-21 2017-12-20 Tokyo University Of Science Educational Foundation Administrative Organization Noise suppression devices and noise suppression methods
US20100076729A1 (en) * 2008-09-19 2010-03-25 Applied Materials, Inc. Self-diagnostic semiconductor equipment
JP2010283000A (ja) 2009-06-02 2010-12-16 Renesas Electronics Corp 半導体製造における装置異常の予兆検知方法
JP5259797B2 (ja) 2011-09-05 2013-08-07 株式会社東芝 学習型プロセス異常診断装置、およびオペレータ判断推測結果収集装置
US9200950B2 (en) * 2014-02-25 2015-12-01 Applied Materials, Inc. Pulsed plasma monitoring using optical sensor and a signal analyzer forming a mean waveform
KR102425936B1 (ko) 2019-07-30 2022-07-28 주식회사 히타치하이테크 장치 진단 장치, 플라스마 처리 장치 및 장치 진단 방법
EP3796362A1 (en) * 2019-09-23 2021-03-24 TRUMPF Huettinger Sp. Z o. o. Method of plasma processing a substrate in a plasma chamber and plasma processing system

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012532461A (ja) * 2009-06-30 2012-12-13 ラム リサーチ コーポレーション 処理チャンバの予測予防保全のための方法と装置
WO2018061842A1 (ja) * 2016-09-27 2018-04-05 東京エレクトロン株式会社 異常検知プログラム、異常検知方法および異常検知装置

Also Published As

Publication number Publication date
US20240395518A1 (en) 2024-11-28
KR20230120121A (ko) 2023-08-16
TW202333073A (zh) 2023-08-16
TWI854452B (zh) 2024-09-01
CN116897411A (zh) 2023-10-17
WO2023148967A1 (ja) 2023-08-10
JP7442013B2 (ja) 2024-03-01
JPWO2023148967A1 (https=) 2023-08-10

Similar Documents

Publication Publication Date Title
US20240255533A1 (en) Methods and apparatus for predicting and preventing failure of in vitro diagnostic instruments
KR102073810B1 (ko) 머신러닝을 이용하여 함정 추진 장비의 고장을 예측하는 방법 및 시스템
US7308385B2 (en) Diagnostic systems and methods for predictive condition monitoring
JP2017097712A (ja) 機器診断装置及びシステム及び方法
KR102303406B1 (ko) 산업설비의 이상유무 진단장치 및 방법
JP6948197B2 (ja) プロセス監視装置
US20230252348A1 (en) Automated model building and updating environment
CN116034326B (zh) 用于异常检测的监测设备和方法
CN110008247B (zh) 异常来源确定方法、装置、设备及计算机可读存储介质
KR102863239B1 (ko) 진단 장치, 진단 방법, 반도체 제조 장치 시스템 및 반도체 장치 제조 시스템
CN116186479A (zh) 用于泵车工况数据的处理方法、处理器、装置及存储介质
CN117927535A (zh) 伺服液压系统故障确定方法、装置及设备
KR20180126311A (ko) 대상 시스템의 상태 진단 및 원인 분석 시스템 및 방법
JPWO2020152889A1 (ja) 装置診断装置、プラズマ処理装置及び装置診断方法
JP2010039733A (ja) 製造プロセスの監視方法、監視プログラム、監視システムおよび製品の製造方法
KR102797798B1 (ko) 진단 장치 및 진단 방법 그리고 플라스마 처리 장치 및 반도체 장치 제조 시스템
CN112288126A (zh) 一种采样数据异常变化在线监测与诊断方法
JP2005033090A (ja) 製造プロセスにおける装置状態判別システム及び製造プロセス安定化システム
CN119163805B (zh) 压力扫描阀状态监测方法、装置以及设备
CN119294275B (zh) 机械密封故障预警方法、装置、电子设备及程序产品
JP7850617B2 (ja) 設備の劣化診断装置及び方法
JP6749219B2 (ja) プラント運転データ解析システム
CN120019342A (zh) 工艺处理装置的诊断装置、诊断系统以及诊断方法
WO2024261955A1 (ja) データ取扱装置、および、データ取扱方法
KR101863198B1 (ko) 이상 검출 장치 및 방법

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

F11 Ip right granted following substantive examination

Free format text: ST27 STATUS EVENT CODE: A-2-4-F10-F11-EXM-PR0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

U12 Designation fee paid

Free format text: ST27 STATUS EVENT CODE: A-2-2-U10-U12-OTH-PR1002 (AS PROVIDED BY THE NATIONAL OFFICE)

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

Q13 Ip right document published

Free format text: ST27 STATUS EVENT CODE: A-4-4-Q10-Q13-NAP-PG1601 (AS PROVIDED BY THE NATIONAL OFFICE)