KR102790704B1 - 자외선 소결성 분자 잉크 및 광범위 스펙트럼의 자외선을 사용하는 분자 잉크의 처리 방법 - Google Patents
자외선 소결성 분자 잉크 및 광범위 스펙트럼의 자외선을 사용하는 분자 잉크의 처리 방법 Download PDFInfo
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- KR102790704B1 KR102790704B1 KR1020217006583A KR20217006583A KR102790704B1 KR 102790704 B1 KR102790704 B1 KR 102790704B1 KR 1020217006583 A KR1020217006583 A KR 1020217006583A KR 20217006583 A KR20217006583 A KR 20217006583A KR 102790704 B1 KR102790704 B1 KR 102790704B1
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- Prior art keywords
- ink
- silver
- traces
- substrate
- copper
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- 239000000203 mixture Substances 0.000 claims description 37
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- 239000003607 modifier Substances 0.000 claims description 22
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Methods (AREA)
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| US201862714363P | 2018-08-03 | 2018-08-03 | |
| US62/714,363 | 2018-08-03 | ||
| PCT/IB2019/056612 WO2020026207A1 (en) | 2018-08-03 | 2019-08-02 | Uv-sinterable molecular ink and processing thereof using broad spectrum uv light |
Publications (2)
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| KR20210042937A KR20210042937A (ko) | 2021-04-20 |
| KR102790704B1 true KR102790704B1 (ko) | 2025-04-02 |
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| EP (1) | EP3830200A4 (https=) |
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| CN (1) | CN112789331B (https=) |
| CA (1) | CA3108631A1 (https=) |
| TW (1) | TWI825140B (https=) |
| WO (1) | WO2020026207A1 (https=) |
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| TWI853828B (zh) | 2018-08-07 | 2024-09-01 | 加拿大國家研究委員會 | 包覆成型的印刷電子零件和其製造方法 |
| US11043729B2 (en) * | 2019-02-05 | 2021-06-22 | Best Medical Canada Ltd. | Flexible antenna for a wireless radiation dosimeter |
| US11741329B2 (en) | 2019-09-26 | 2023-08-29 | Best Theratronics, Ltd. | Low power non-volatile non-charge-based variable supply RFID tag memory |
| EP3882038A1 (en) * | 2020-03-18 | 2021-09-22 | Heraeus Deutschland GmbH & Co. KG | Assembly for an inkjet printer, inkjet printer and method for printing a functional layer on a surface of a three-dimensional electronic device |
| CN116013890A (zh) * | 2023-01-05 | 2023-04-25 | 哈尔滨理工大学 | 一种半导体封装用低温烧结铜浆料及其制备方法 |
| CN116321774A (zh) * | 2023-02-17 | 2023-06-23 | 潍坊东大电子材料有限公司 | 一种基于无颗粒墨水制备超细导电线路的工艺 |
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| WO2018018136A1 (en) * | 2016-07-28 | 2018-02-01 | National Research Council Of Canada | Copper ink and conductive solderable copper traces produced therefrom |
| JP2018069187A (ja) * | 2016-10-31 | 2018-05-10 | トッパン・フォームズ株式会社 | 積層体及びその製造方法 |
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| US4088801A (en) | 1976-04-29 | 1978-05-09 | General Electric Company | U.V. Radiation curable electrically conductive ink and circuit boards made therewith |
| US5527627A (en) * | 1993-03-29 | 1996-06-18 | Delco Electronics Corp. | Ink composition for an ultra-thick thick film for thermal management of a hybrid circuit |
| US20060000172A1 (en) | 2001-06-22 | 2006-01-05 | Amazon Forms One, Inc. | Lightweight concrete composite blocks |
| US7629017B2 (en) * | 2001-10-05 | 2009-12-08 | Cabot Corporation | Methods for the deposition of conductive electronic features |
| US7141104B2 (en) | 2003-06-05 | 2006-11-28 | Agfa-Gevaert | UV-absorbing ink composition for ink-jet printing |
| WO2007043664A1 (ja) | 2005-10-14 | 2007-04-19 | Toyo Ink Mfg. Co., Ltd. | 金属微粒子分散体の製造方法、該方法で製造された金属微粒子分散体を用いた導電性インキ、および導電性被膜 |
| JP2007194175A (ja) * | 2006-01-23 | 2007-08-02 | Seiko Epson Corp | 導体パターン用インク、導体パターン、配線基板及び電気光学装置並びに電子機器 |
| US20090148600A1 (en) | 2007-12-05 | 2009-06-11 | Xerox Corporation | Metal Nanoparticles Stabilized With a Carboxylic Acid-Organoamine Complex |
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| WO2013096664A1 (en) * | 2011-12-23 | 2013-06-27 | The Board Of Trustees Of The University Of Illinois | Ink composition for making a conductive silver structure |
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2019
- 2019-08-02 EP EP19844170.1A patent/EP3830200A4/en active Pending
- 2019-08-02 KR KR1020217006583A patent/KR102790704B1/ko active Active
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018018136A1 (en) * | 2016-07-28 | 2018-02-01 | National Research Council Of Canada | Copper ink and conductive solderable copper traces produced therefrom |
| JP2018069187A (ja) * | 2016-10-31 | 2018-05-10 | トッパン・フォームズ株式会社 | 積層体及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20210042937A (ko) | 2021-04-20 |
| JP7374177B2 (ja) | 2023-11-06 |
| TW202016228A (zh) | 2020-05-01 |
| CA3108631A1 (en) | 2020-02-06 |
| CN112789331A (zh) | 2021-05-11 |
| US11873413B2 (en) | 2024-01-16 |
| TWI825140B (zh) | 2023-12-11 |
| EP3830200A1 (en) | 2021-06-09 |
| EP3830200A4 (en) | 2022-07-27 |
| JP2021533229A (ja) | 2021-12-02 |
| CN112789331B (zh) | 2024-05-28 |
| US20210301166A1 (en) | 2021-09-30 |
| WO2020026207A1 (en) | 2020-02-06 |
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