KR102654923B1 - Display apparatus, apparatus and method for manufacturing display apparatus - Google Patents

Abstract

The present invention discloses a display device, a display device manufacturing device, and a display device manufacturing method. The present invention includes a first substrate, a light emitting unit formed on the first substrate and having an intermediate layer, and an encapsulation unit coupled to the first substrate to seal the light emitting unit, wherein the intermediate layer has a saturated gas pressure. It includes at least two organic substances having a phase transition temperature difference of 5 degrees or less at any saturated gas pressure in the range of 5x10 ^-4 Torr to 3x10 ^-2 Torr.

Description

Display apparatus, apparatus for manufacturing display apparatus, and method for manufacturing display apparatus {Display apparatus, apparatus and method for manufacturing display apparatus}

Embodiments of the present invention relate to devices and methods, and more particularly, to display devices, display device manufacturing devices, and display device manufacturing methods.

Electronic devices based on mobility are widely used. In addition to small electronic devices such as mobile phones, tablet PCs have recently been widely used as mobile electronic devices.

Such mobile electronic devices include a display unit to support various functions and provide visual information such as images or videos to the user. Recently, as other components for driving the display unit have become smaller, the proportion of the display unit in electronic devices is gradually increasing, and structures that can be bent to a predetermined angle in a flat state are also being developed.

Embodiments of the present invention provide a display device, a display device manufacturing apparatus, and a display device manufacturing method.

One embodiment of the present invention includes a first substrate, a light emitting unit formed on the first substrate and having an intermediate layer including at least one layer, and an encapsulation unit coupled to the first substrate to seal the light emitting unit. and one of the intermediate layers is mixed with each other and stored in the same deposition source to form one layer of the intermediate layer on the first substrate, and the saturated gas pressure is 5x10 ^-4 Torr to 3x10 ^- Disclosed is a display device comprising at least two organic materials having a phase transition temperature difference of 5 degrees Celsius or less at any saturated gas pressure in the ² Torr range.

In this embodiment, at least one of the at least two organic substances may be an evaporation type material that vaporizes from a liquid to a gas.

In this embodiment, at least one of the at least two organic substances may be a sublimation material that sublimates from a solid to a gas.

In this embodiment, the intermediate layer may include an organic light-emitting layer.

In this embodiment, the intermediate layer may further include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.

Another embodiment of the present invention includes a chamber in which a substrate is placed, a deposition source disposed to face the substrate, at least two types of organic materials stored therein, and supplying the at least two types of organic materials to the first substrate. Included, the at least two organic substances may have a phase transition temperature difference of 5 degrees Celsius or less at any saturated gas pressure in the range of 5x10 ^-4 Torr to 3x10 ^-2 Torr.

In this embodiment, at least one of the at least two organic substances may be an evaporation type material that vaporizes from a liquid to a gas.

In this embodiment, at least one of the at least two organic substances may be a sublimation material that sublimates from a solid to a gas.

In this embodiment, at least one of the first substrate and the deposition source may move linearly.

Another embodiment of the present invention includes the steps of loading a first substrate into a chamber, and applying heat to a deposition source containing a mixture of at least two organic materials to supply the at least two organic materials into the chamber. and depositing the organic material on the first substrate to form one layer of an intermediate layer including at least one layer, wherein the at least two organic materials have a saturated gas pressure of 5x10 ^-4 torr to 3x10 ^- The phase transition temperature difference may be less than 5 degrees Celsius at any saturated gas pressure in the ² Torr range.

In this embodiment, at least one of the at least two organic substances may be an evaporation type material that vaporizes from a liquid to a gas.

In this embodiment, at least one of the at least two organic substances may be a sublimation material that sublimates from a solid to a gas.

In this embodiment, at least one of the first substrate and the deposition source may move linearly.

In this embodiment, the concentration of one of the at least two organic substances may be 0.1% by mass to 50% by mass.

In this embodiment, the intermediate layer may include an organic light-emitting layer.

In this embodiment, the intermediate layer may further include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.

Other aspects, features and advantages in addition to those described above will become apparent from the following drawings, claims and detailed description of the invention.

These general and specific aspects may be practiced using any system, method, computer program, or combination of any system, method, or computer program.

The display device, the display device manufacturing apparatus, and the display device manufacturing method according to the embodiments of the present invention can implement precise images of the display device.

1 is a conceptual diagram showing a manufacturing apparatus for a display device according to an embodiment of the present invention.
FIG. 2 is a graph showing the phase transition temperature and saturated gas pressure of organic materials used in the manufacturing apparatus of the display device shown in FIG. 1.
Figure 3 is a graph showing an enlarged portion of part A of Figure 2.
FIG. 4 is a cross-sectional view showing a portion of a display device manufactured by the display device manufacturing apparatus shown in FIG. 1 .

Since the present invention can be modified in various ways and can have various embodiments, specific embodiments will be illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various forms.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing with reference to the drawings, identical or corresponding components will be assigned the same reference numerals and redundant description thereof will be omitted. .

In the following embodiments, terms such as first and second are used not in a limiting sense but for the purpose of distinguishing one component from another component.

In the following examples, singular terms include plural terms unless the context clearly dictates otherwise.

In the following embodiments, terms such as include or have mean that the features or components described in the specification exist, and do not exclude in advance the possibility of adding one or more other features or components.

In the following embodiments, when a part of a film, region, component, etc. is said to be on or on another part, it is not only the case where it is directly on top of the other part, but also when another film, region, component, etc. is interposed between them. Also includes cases where there are.

In the drawings, the sizes of components may be exaggerated or reduced for convenience of explanation. For example, the size and thickness of each component shown in the drawings are shown arbitrarily for convenience of explanation, so the present invention is not necessarily limited to what is shown.

In the following embodiments, the x-axis, y-axis, and z-axis are not limited to the three axes in the Cartesian coordinate system, but can be interpreted in a broad sense including these. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may also refer to different directions that are not orthogonal to each other.

In cases where an embodiment can be implemented differently, a specific process sequence may be performed differently from the described sequence. For example, two processes described in succession may be performed substantially at the same time, or may be performed in an order opposite to that in which they are described.

1 is a conceptual diagram showing a manufacturing apparatus for a display device according to an embodiment of the present invention. FIG. 2 is a graph showing the phase transition temperature and saturated gas pressure of organic materials used in the manufacturing apparatus of the display device shown in FIG. 1. Figure 3 is a graph showing an enlarged portion of part A of Figure 2. FIG. 4 is a cross-sectional view showing a portion of a display device manufactured by the display device manufacturing apparatus shown in FIG. 1 .

Referring to FIGS. 1 to 4 , the display device manufacturing apparatus 100 includes a chamber 110, a substrate support unit 170, a vision unit 120, a support unit 130, a mask assembly 140, and a deposition source 150. ) and a pressure control unit 160.

The chamber 110 may be formed to be partially open, and a gate valve 110a, etc. may be installed in the open portion to selectively open and close the chamber 110 .

The substrate support 170 may be formed in various shapes. For example, in one embodiment, the substrate support part 170 may be formed in a shuttle shape and can be moved from the outside of the chamber 110 to the inside of the chamber 110. In another embodiment, the substrate support 170 may be formed in the form of a frame that is installed to be fixed inside the chamber 110. As another embodiment, the substrate support part 170 may be formed in the form of an electrostatic chuck installed inside the chamber 110. The substrate supporter 170 is not limited to the above and may include all devices and all structures that support the first substrate 11 or fix the first substrate 11 within the chamber 110. However, for convenience of explanation, hereinafter, the substrate support 170 will be described in detail focusing on the case where it is in the form of a frame installed to be fixed inside the chamber 110.

The vision unit 120 may be installed in the chamber 110. At this time, the vision unit 120 is formed in the form of a camera and can photograph at least one of the first substrate 11 and the mask assembly 140.

The mask assembly 140 may be seated on the support portion 130. At this time, the support unit 130 may move the position of the mask assembly 140 after the mask assembly 140 is seated. For example, the support unit 130 may include an aligner (not shown) that moves the mask assembly 140 in three different directions.

The mask assembly 140 may or may not be used depending on the layer deposited on the substrate 11. However, for convenience of explanation, hereinafter, the detailed description will focus on the case where deposition is performed using the mask assembly 140.

Mask assembly 140 may be seated on support 130 . At this time, as an example, the mask assembly 140 may include a mask frame 141. At this time, the mask frame 141 may be formed so that the central portion is open, and only one mask frame 141 may be used. As another embodiment, the mask assembly 140 may include a mask frame 141 and a mask sheet 142. Additionally, the mask assembly 140 may include a reinforcing member (not shown) installed on the mask frame 141. Hereinafter, for convenience of explanation, a detailed description will be given focusing on the case where the mask assembly 140 includes the mask frame 141, the mask sheet 142, and the reinforcing member.

The mask frame 141 may have a space formed inside it and may be formed similar to a window frame. Additionally, the mask sheet 142 may include openings (not shown) that form a pattern. At this time, the mask sheet 142 may be formed in a plate or stick shape and installed in a tensioned state on the mask frame 141.

The reinforcing member may be formed in various shapes. For example, the reinforcing member may be formed in the form of a bar or plate and installed on the mask frame 141. At this time, a plurality of reinforcing members may be provided, and some of the plurality of reinforcing members may be installed to cross the internal space of the mask frame 141 to reinforce the strength of the mask frame 141. Additionally, other portions of the plurality of reinforcing members may be installed on the mask frame 141 to install the mask sheet 142.

As another embodiment, the mask assembly 140 may include a mask frame 141, a mask sheet 142, and a blocking mask (not shown) installed on the mask frame 141. At this time, the mask frame 141 and the mask sheet 142 may be the same or similar to those described above. The blocking mask may be installed on the mask frame 141. At this time, the blocking mask may be formed in a grid shape. Additionally, the mask sheet 142 may be installed on the blocking mask in a tensioned state. However, for convenience of explanation, the following will focus on the case where the mask assembly 140 includes a mask frame 141 and a mask sheet 142, and the mask sheet 142 is installed directly on the mask frame 141. Let me explain in detail.

The deposition source 150 may be disposed to face the mask assembly 140 . At this time, the deposition source 150 may be placed in various locations depending on the type of organic material. For example, the deposition source 150 may be placed at the top of the chamber 110 or at the bottom of the chamber 110. Additionally, the deposition source 150 may be placed on the side of the chamber 110. However, for convenience of explanation, hereinafter, the detailed description will focus on the case where the deposition source 150 is disposed at the lower part of the chamber 110.

The deposition source 150 may have a storage space inside which organic materials are stored. Additionally, the deposition source 150 may include a heater (not shown) that heats the organic material. The deposition source 150 can sublimate or vaporize organic materials by heating them. The organic material vaporized as described above may pass through the mask assembly 140 and be deposited on the first substrate 11. At this time, deposition may be performed while the deposition source 150 and the first substrate 11 are stopped. In another embodiment, at least one of the deposition source 150 and the first substrate 11 may move linearly. For example, when the deposition source 150 moves linearly in one direction, the first substrate 11 may be in a stationary state. As another example, when the first substrate 11 moves linearly (or reciprocates) in one direction, the deposition source 150 may be stationary. In another embodiment, the deposition source 150 and the first substrate 11 may each be in a state of reciprocating motion. Hereinafter, for convenience of explanation, a detailed description will be given focusing on the case where deposition is performed while the deposition source 150 reciprocates in one direction.

The organic matter may include various substances. The organic material may be deposited on the substrate to form the intermediate layer 18b. Specifically, at least two organic substances may be mixed and stored in the deposition source 150. At this time, at least two organic substances may be mixed and stored in one deposition source 150. Additionally, the concentration of one of the at least branches of organic matter may range from 0.1 mass% to 50 mass%. Hereinafter, for convenience of explanation, a detailed description will be given focusing on the case where there are two types of organic substances stored in the deposition source 150. In addition, for convenience of explanation, the above two organic substances will be described in detail focusing on the case where they include different first organic substances and second organic substances.

The pressure regulator 160 may include a connection pipe 161 connected to the chamber 110 and a pump 162 installed in the connection pipe 161. At this time, the pressure inside the chamber 110 may be adjusted according to the operation of the pump 162. For example, the pump 162 may maintain the pressure inside the chamber 110 to be close to vacuum while deposition is performed. Additionally, the pump 162 can adjust the pressure inside the chamber 110 to be equal to atmospheric pressure when the first substrate 11 and the mask assembly 140 enter the chamber 110.

Meanwhile, looking at the operation of the display device manufacturing apparatus 100 as described above, the gate valve 110a may be opened while the pump 162 maintains the pressure inside the chamber 110 equal to atmospheric pressure. At this time, the first substrate 11 and the mask assembly 140 may be charged into the chamber 110 . In this case, a robot arm or shuttle, etc. may be placed inside or outside the chamber 110 to move the first substrate 11 and the mask assembly 140 into the chamber 110. Hereinafter, for convenience of explanation, a detailed description will be given focusing on the case where a robot arm is placed outside the chamber 110 to move the first substrate 11 and the mask assembly 140 into the chamber 110.

The robot arm can load the first substrate 11 into the chamber 110 and then seat the first substrate 11 on the substrate supporter 170. Additionally, the robot arm can insert the mask assembly 140 into the chamber 110 and then seat it on the support portion 130.

When seating of the first substrate 11 and the mask assembly 140 is completed, the vision unit 120 can photograph the first substrate 11 and the mask assembly 140. At this time, alignment marks may be formed on the first substrate 11 and the mask assembly 140, respectively.

The image captured by the vision unit 120 is transmitted to a control unit (not shown), and the control unit can determine whether the positions of the first substrate 11 and the mask assembly 140 correspond to preset positions. Additionally, the control unit may determine whether the relative positions of the first substrate 11 and the mask assembly 140 are accurately aligned. At this time, the control unit may be formed in various forms, such as an electronic circuit or an external terminal such as a computer.

If the control unit compares the positions of the first substrate 11 and the mask assembly 140 and determines that they are not aligned, the control unit may operate the support unit 130 to adjust the position of the mask assembly 140.

If the control unit determines that the positions of the first substrate 11 and the mask assembly 140 match each other, the control unit may operate the deposition source 150 to deposit the organic material on the first substrate 11. At this time, the pump 162 may maintain the pressure inside the chamber 110 in a form similar to a vacuum.

Specifically, when the deposition source 150 operates, the first organic material and the second organic material inside the deposition source 150 may be vaporized or sublimated. At this time, at least one of the first organic material and the second organic material may include an evaporation type material that evaporates by changing phase from a liquid state to a gas state. In addition, at least one of the first organic material and the second organic material may include a sublimation material that sublimates by changing phase from a solid state to a gas state. However, for convenience of explanation, hereinafter, the case where both the first organic material and the second organic material include a sublimable material will be described in detail.

The first organic material and the second organic material as described above are not limited to the above and may be selected in various ways. In particular, the first organic material and the second organic material may include all materials forming the intermediate layer 18b. At this time, the first organic material and the second organic material may be organic materials with a phase transition temperature difference of 5 degrees Celsius or less at any saturated gas pressure in the range of 5x10 ^-4 Torr to 3x10 ^-2 Torr. .

For example, one of the first organic material or the second organic material may be an organic material having the molecular structure of Formula 1 below. Additionally, the other of the first organic material or the second organic material may be an organic material having the molecular structure of Formula 2 below. Hereinafter, for convenience of explanation, a detailed description will be given focusing on the case where the first organic material is an organic material having the molecular structure of Formula 1 below, and the second organic material is an organic material having the molecular structure of Formula 2 below.

[Formula 1]

[Formula 2]

The first organic material and the second organic material may have phase transition temperatures of a first temperature and a second temperature, respectively, at a specific saturated gas pressure. For example, at a saturated gas pressure of 3X10 ^-3 Torr, the first temperature is about 324.2 degrees Celsius and the second temperature is about 329 degrees Celsius. Therefore, the temperature difference between the first temperature and the second temperature, which is the phase transition temperature difference between the first organic material and the second organic material, may be about 4.8 degrees Celsius. Additionally, when the saturated gas pressure is 1x10 ^-2 Torr, the first temperature may be approximately 341 degrees Celsius and the second temperature may be approximately 343 degrees Celsius. Therefore, the temperature difference between the first temperature and the second temperature, which is the phase transition temperature difference between the first organic material and the second organic material, may be about 2 degrees Celsius. At this time, when the phase transition temperature difference between the first organic material and the second organic material is 5 degrees Celsius or less, the concentration ratio of the first organic material and the second organic material can be maintained almost constant. Specifically, Table 1 below compares the concentration of the first organic material and the concentration of the second organic material when deposition is performed using the first organic material and the second organic material whose phase transition temperature difference is 5 degrees Celsius or less. At this time, the concentration of the first organic material may be calculated by dividing the mass of the first organic material by the total mass (or the sum of the masses of the first organic material and the mass of the second organic material). Additionally, the concentration of the second organic material may be calculated by dividing the mass of the second organic material by the total mass. The concentration of the first organic material and the concentration of the second organic material may be converted to mass% and displayed.

ingredient Concentration before vaporization (or sublimation) (mass %) Deposited film concentration (mass%) after 200 hours of deposition Remaining concentration after 200 hours of deposition (mass%) first organic matter 20 21.5 21.6 secondary organic matter 80 78.5 78.4

Looking at the above results, the concentrations of the first organic material and the second organic material stored in the initial deposition source 150 may be 20% by mass and 80% by mass, respectively. Thereafter, the concentrations of the first organic material and the second organic material in the deposition layer (or intermediate layer 18b) deposited on the first substrate 11 are initially 21.5% and 78.5%, respectively, in the deposition source 150. It can be confirmed that the concentration of the first organic material stored is almost similar to the concentration of the second organic material. In particular, in this case, the concentration of the first organic material initially stored in the deposition source 150 and the concentration of the first organic material in the deposition window are 2% by mass or less, which is within the error range designed in the display device manufacturing apparatus 100. You can.

As described above, when the display device manufacturing apparatus 100 is continuously used to deposit the first organic material and the second organic material on the plurality of first substrates 11, the concentration of the first organic material after time elapses And the concentration of the second organic material may be similar to the initial concentration of the first organic material and the concentration of the second organic material. Specifically, the first organic material and the second organic material present in the deposition source 150 were measured after operating the display device manufacturing apparatus 100 for 200 hours to deposit the first organic material and the second organic material on the plurality of first substrates 11. The organic matter concentration and the second organic matter concentration were 21.6 mass% and 78.4 mass%, respectively, as shown in Table 1 above. These result values may be almost similar to the initial concentration of the first organic material and the concentration of the second organic material, and the error range may be around 2% by mass. Therefore, even when the organic material is continuously deposited on the first substrate 11, the display device manufacturing apparatus 100 deposits the organic material on the first substrate 11 while maintaining the concentration ratio of the first organic material and the second organic material almost constant. It is possible to do so.

On ^the other hand, when the saturated gas pressure is ¹ The phase transition temperature difference can exceed 5 degrees Celsius. In this case, while deposition is in progress, a large difference in concentration of the first organic material and the second organic material occurs, which causes the concentration of the first organic material and the second organic material inside the intermediate layer 18b deposited on the first substrate 11. The concentration may vary over time. In this case, the brightness, resolution, etc. of the manufactured display device 10 may change over time, which may increase the probability of defects occurring. Therefore ^, the first organic material and the second organic material having the same molecular structure as the above chemical formula can be used at a saturated gas pressure in the range of 3X10 ^-3 Torr to 1X10 ^-2 Torr. At this time, the embodiments of the present invention are not limited to the above, and the first organic material and the second organic material have a saturated gas pressure in the range of 5x10 ^-4 Torr to 3x10 ^-2 Torr as described above. Any material can be used as long as the phase transition temperature difference is less than 5 degrees Celsius.

Specifically, a method of confirming whether evaporation is possible from a single deposition source 150 by mixing the first organic material and the second organic material as described above is as follows.

First, each of the first organic substances can be inserted into a thermogravimetric analyzer (TGA), and then the temperature change per hour (for example, temperature rise at 10°C/min) can be determined in the thermogravimetric analyzer. At this time, the thermogravimetric analyzer includes a crucible in which the sample is stored, a weight measuring unit that measures the weight of the crucible, a heater installed to surround the periphery of the crucible to apply heat to the crucible, a chamber installed outside the crucible, and a chamber connected to the chamber and inside the chamber. It may be provided with a suction unit that can maintain the pressure in a nearly vacuum state (for example, about 1x10 ^-4 Torr or less).

The thermogravimetric analyzer as described above can initially set the temperature change per hour to 5 degrees in the thermogravimetric analyzer. At this time, the thermogravimetric analyzer can measure the initial mass of the first organic material and can measure the change in mass of the first organic material according to the temperature change per hour. That is, the thermogravimetric analyzer can calculate the mass change rate, which is the change in mass over time, from the change in mass of the first organic material as shown in the equation below.

Here, W is the mass of the organic matter, t is time, and T may be the temperature of the thermogravimetric analyzer. At this time, in Equation 1 above, the temperature change per hour is Can be initially set as described above. also, can be calculated through values measured from a thermogravimetric analyzer and already known equations.

Based on the above mass change rate, the evaporation rate per unit area can be calculated from the following equation.

Here, m is the evaporation rate per unit area, and U may be the area of the crucible of the thermogravimetric analyzer (for example, the area of the opening of the crucible).

The relationship between the evaporation rate per unit area and the saturated vapor pressure of organic matter can be calculated as the following equation from the already known Langmuir equation.

At this time, a is an evaporation constant having a value of 1 or less, M may be the molecular weight of an organic material, and R may be a gas constant of 8.3145 J/Kmol.

The value of a as described above may be determined depending on the evaporation pressure and whether other substances are mixed. However, when only one organic substance is evaporated in a thermogravimetric analyzer as described above, a can be assumed to be 1 because the pressure inside the chamber is close to vacuum and other substances are not mixed. In particular, even for the same material, a is a function of pressure, so a is equal to 1 when the pressure is less than 10 ^-4 Torr, so only the saturated gas pressure and phase transition temperature curves when this condition is satisfied should be compared.

If a is assumed to be 1 as above, the evaporation rate per unit area of organic matter can be calculated through a thermogravimetric analyzer. Thereafter, based on the above results, the relationship between temperature and the loss mass of organic matter can be calculated from Equation 1.

Based on the above results, the relationship between the saturated gas pressure and temperature of each organic material can be calculated using Equation 1, Equation 2, and Equation 3, and this relationship is as shown in Figures 2 and 3. You can.

Looking at FIGS. 2 and 3 based on the above results, organic material 1 and organic material 2 may have a certain relationship with saturated gas pressure within the range of 5x10 ^-4 Torr to 3x10 ^-2 Torr, respectively. In other words, it can be confirmed that a constant relationship between the saturated gas pressure and temperature cannot be calculated when the saturated gas pressure is less than 5x10 ^-4 Torr or exceeds 3x10 ^-2 Torr, respectively. This relationship is not only true for organic material 1 and organic material 2, but most organic materials used during deposition may exhibit the above tendency. In particular, looking at the graph of FIG. 2 as above, it can be seen that for organic material 1, an inflection point occurs around 360 degrees Celsius, and for organic material 2, an inflection point occurs around 370 degrees Celsius. This inflection point can be thought of as occurring due to thermal decomposition of organic substances. In this case, it can be confirmed that the saturated gas pressure in Figures 2 and 3 is within the range of 5x10 ^-4 Torr to 3x10 ^-2 Torr, respectively, as described above, in the section where phase change occurs in Organic Material 1 and Organic Material 2 in the same way as the actual molecules. You can.

When at least two organic substances are mixed within the saturated gas pressure range as described above, and the phase transition temperature difference is less than 5 degrees Celsius as described above, even if they are mixed and deposited, at least two organic substances remain for a long time as described above. The mixing ratio can remain the same.

For example, looking at the case of mixing two organic substances other than the first organic substance and the second organic substance as described above, the results are shown in Table 2 below. Table 2 below shows the concentration change when the third organic material and the fourth organic material are mixed in one deposition source 150 and then deposited on the first substrate 11. At this time, the phase transition temperature difference between the third organic material and the fourth organic material at a saturated vapor pressure of 3x10 ^-3 Torr may be 3.4 degrees Celsius. Additionally, the third organic material may be a green host containing 5p-type molecules, and the fourth organic material may be a green host containing 5n-type molecules.

ingredient Concentration before vaporization (or sublimation) (mass %) Remaining concentration after 200 hours of deposition (mass%) organic matter 3 50 49.6 organic matter 4 50 50.4

Based on the above results, it can be seen that when the phase-to-phase temperature difference is less than 5 degrees Celsius under the same saturated vapor pressure, the remaining amount remains almost similar even after deposition.

In addition to the above cases, it is possible to use various organic materials. For example, two different organic materials (or two organic materials used as green hosts) with a phase transition temperature difference of 0.5 degrees Celsius at the saturated vapor pressure described above have a concentration of 69.9% by mass and 30.1% by mass before deposition. In this case, after 200 hours, the concentration of each organic material may be 69.8 mass% and 30.2 mass%.

Therefore, through the method described above, the relationship between the saturated gas pressure and the phase transition temperature of each of the at least two organic materials is confirmed through a thermogravimetric analyzer, and from this, the saturated gas pressure of both of the at least two organic materials is 5x10 ^-4 torr. It can be selected and used for actual deposition if the phase transition temperature difference within the 3x10 ^-2 Torr range is less than 5 degrees Celsius. In particular, at least two organic materials selected as above can be simultaneously deposited on the first substrate 11 while inserted into one deposition source 150.

When deposition on the first substrate 11 is completed, the pump 162 operates to maintain the pressure inside the chamber 110 at atmospheric pressure. Additionally, when the gate valve 110a operates to open the chamber 110, the robot arm can carry out the first substrate 11 to the outside.

Therefore, the display device manufacturing apparatus 100 and the display device manufacturing method maintain the concentration of each organic material within the error range even when at least two organic materials are continuously mixed and simultaneously deposited on the first substrate 11. possible.

In addition, the display device manufacturing apparatus 100 and the display device manufacturing method enable the formation of a uniform intermediate layer 18b even when continuous deposition is performed for a long time, thereby improving quality and minimizing the defect rate. .

Meanwhile, the display device manufacturing apparatus 100 may form the intermediate layer 18b as described above. Thereafter, the display device 10 can be manufactured by forming the opposing electrode 18c on the intermediate layer 18b and then forming an encapsulation portion (not shown) on the opposing electrode 18c. At this time, the encapsulation part may include a thin film encapsulation layer (E) or a second substrate (not shown).

Specifically, the display device 10 as described above may include a first substrate 11 and a light emitting unit (D). Additionally, the display device 10 may include a thin film encapsulation layer (E) formed on the light emitting portion (D) or the second substrate. At this time, since the second substrate is the same or similar to that used in a general display device, detailed description will be omitted. In addition, for convenience of explanation, hereinafter, a detailed description will be given focusing on the case where the display device 10 includes the thin film encapsulation layer (E).

The light emitting unit (D) is provided with a thin film transistor (TFT), a passivation film 17 is formed to cover them, and an organic light emitting device 18 can be formed on the passivation film 17.

The first substrate 11 may be made of glass, but is not necessarily limited to this. Plastic materials may be used, and metal materials such as SUS or Ti may also be used. Additionally, the first substrate 11 may be made of polyimide (PI). Hereinafter, for convenience of explanation, a detailed description will be given focusing on the case where the first substrate 11 is formed of a glass material.

A buffer layer 12 made of an organic compound and/or an inorganic compound is further formed on the upper surface of the first substrate 11, and may be formed of SiOx (x≥1) or SiNx (x≥1).

After the active layer 13 arranged in a predetermined pattern is formed on the buffer layer 12, the active layer 13 is buried by the gate insulating layer 14. The active layer 13 has a source region 13a and a drain region 13c, and further includes a channel region 13b between them.

This active layer 13 may be formed to contain various materials. For example, the active layer 13 may contain an inorganic semiconductor material such as amorphous silicon or crystalline silicon. As another example, the active layer 13 may contain an oxide semiconductor. As another example, active layer 13 may contain an organic semiconductor material. However, for convenience of explanation, hereinafter, the detailed description will focus on the case where the active layer 13 is formed of amorphous silicon.

The active layer 13 can be formed by forming an amorphous silicon film on the buffer layer 12, crystallizing it to form a polycrystalline silicon film, and patterning the polycrystalline silicon film. The source region 13a and drain region 13c of the active layer 13 are doped with impurities depending on the type of TFT, such as a driving TFT (not shown) or a switching TFT (not shown).

A gate electrode 15 corresponding to the active layer 13 and an interlayer insulating layer 16 burying the active layer 13 are formed on the upper surface of the gate insulating layer 14.

Then, after forming the contact hole H1 in the interlayer insulating layer 16 and the gate insulating layer 14, the source electrode 17a and the drain electrode 17b are respectively formed on the interlayer insulating layer 16 in the source region ( 13a) and the drain region 13c.

A passivation film 17 is formed on the top of the thin film transistor formed in this way, and the pixel electrode 18a of the organic light emitting device 18 (OLED) is formed on the passivation film 17. This pixel electrode 18a is contacted to the drain electrode 17b of the TFT by a via hole H2 formed in the passivation film 17. The passivation film 17 may be formed of an inorganic and/or organic material, a single layer, or two or more layers, and may be formed as a flattening film so that the upper surface is flat regardless of the curvature of the lower film. It can be formed to curve along. And, this passivation film 17 is preferably formed of a transparent insulator so as to achieve a resonance effect.

After forming the pixel electrode 18a on the passivation film 17, a pixel defining film 19 is formed of an organic material and/or an inorganic material to cover the pixel electrode 18a and the passivation film 17, and the pixel It opens to expose the electrode 18a.

Then, an intermediate layer 18b and an opposing electrode 18c are formed on at least the pixel electrode 18a.

The pixel electrode 18a functions as an anode electrode, and the counter electrode 18c functions as a cathode electrode. Of course, the polarities of the pixel electrode 18a and the counter electrode 18c may be reversed.

The pixel electrode 18a and the opposing electrode 18c are insulated from each other by the intermediate layer 18b, and voltages of different polarities are applied to the intermediate layer 18b to cause light emission from the organic light emitting layer.

The middle layer 18b may include an organic light-emitting layer. As another optional example, the intermediate layer 18b includes an organic emission layer, and in addition, a common layer (not shown) includes a hole injection layer, a hole transport layer, and an electron transport layer ( It may further include at least one of an electron transport layer and an electron injection layer.

At this time, each layer of the middle layer 18b may be a mixture of at least two organic substances, such as the first organic substance and the second organic substance. At this time, the at least two organic substances may have a phase transition temperature difference of 5 degrees or less at any saturated gas pressure in the range of 5x10 ^-4 Torr to 3x10 ^-2 Torr, as described above. Specifically, at least one of the organic light-emitting layer and the common layer may be a mixture of at least two types of organic materials. For example, the organic light-emitting layer alone may be a mixture of at least two types of organic materials. Additionally, only the common layer may be a mixture of at least two types of organic substances. At this time, at least one of the common layers may be a mixture of at least two types of organic materials. As another example, it is possible that the organic light-emitting layer and the common layer are each a mixture of at least two types of organic materials. However, for convenience of explanation, hereinafter, the detailed description will focus on the case where the organic light-emitting layer includes the first organic material and the second organic material. One unit pixel is made up of a plurality of subpixels, and the plurality of subpixels can emit light of various colors. For example, the plurality of subpixels may include subpixels that emit red, green, and blue light, respectively, and may include subpixels that emit red, green, blue, and white light.

Meanwhile, the thin film encapsulation layer (E) as described above may include a plurality of inorganic layers or may include an inorganic layer and an organic layer.

The organic layer of the thin film encapsulation layer (E) is formed of a polymer, and may preferably be a single film or a laminated film formed of any one of polyethylene terephthalate, polyimide, polycarbonate, epoxy, polyethylene, and polyacrylate. More preferably, the organic layer may be formed of polyacrylate, and specifically, may include a polymerized monomer composition containing a diacrylate-based monomer and a triacrylate-based monomer. The monomer composition may further include a monoacrylate-based monomer. In addition, the monomer composition may further include a known photoinitiator such as 2,4,6-trimethylbenzoylphosphine oxide (TPO), but is not limited thereto.

The inorganic layer of the thin film encapsulation layer (E) may be a single film or a stacked film containing metal oxide or metal nitride. Specifically, the inorganic layer may include any one of SiNx, Al2O3, SiO2, and TiO2.

The externally exposed top layer of the thin film encapsulation layer (E) may be formed as an inorganic layer to prevent moisture penetration into the organic light emitting device.

The thin film encapsulation layer (E) may include at least one sandwich structure in which at least one organic layer is inserted between at least two inorganic layers. As another example, the thin film encapsulation layer (E) may include at least one sandwich structure in which at least one inorganic layer is inserted between at least two organic layers. As another example, the thin film encapsulation layer (E) may include a sandwich structure in which at least one organic layer is inserted between at least two inorganic layers and a sandwich structure in which at least one inorganic layer is inserted between at least two organic layers. .

The thin film encapsulation layer E may sequentially include a first inorganic layer, a first organic layer, and a second inorganic layer from the top of the organic light emitting device 18 (OLED).

As another example, the thin film encapsulation layer (E) may sequentially include a first inorganic layer, a first organic layer, a second inorganic layer, a second organic layer, and a third inorganic layer from the top of the organic light-emitting device (18, OLED). there is.

As another example, the thin film encapsulation layer (E) is sequentially formed from the top of the organic light-emitting device (18, OLED): a first inorganic layer, a first organic layer, a second inorganic layer, the second organic layer, a third inorganic layer, It may include a third organic layer and a fourth inorganic layer.

A halogenated metal layer containing LiF may be additionally included between the organic light emitting device 18 (OLED) and the first inorganic layer. The halogenated metal layer can prevent the organic light emitting device 18 (OLED) from being damaged when the first inorganic layer is formed by sputtering.

The first organic layer may have a smaller area than the second inorganic layer, and the second organic layer may also have a smaller area than the third inorganic layer.

Therefore, the display device 10 can always maintain uniform quality. In addition, the display device 10 can achieve optimal luminous efficiency by always including the intermediate layer 18b with a designed organic concentration ratio.

As such, the present invention has been described with reference to an embodiment shown in the drawings, but this is merely an example, and those skilled in the art will understand that various modifications and variations of the embodiment are possible therefrom. Therefore, the true scope of technical protection of the present invention should be determined by the technical spirit of the appended claims.

10: display device
11: first substrate
18b: middle layer
100: Manufacturing device of display device
110: chamber
120: Vision Department
130: support part
140: Mask assembly
150: deposition source
160: Pressure control unit

Claims (16)

first substrate;
a light emitting unit formed on the first substrate and having an intermediate layer including at least one layer; and
It includes a sealing part that combines with the first substrate to seal the light emitting unit,
One of the intermediate layers is,
They are mixed together and stored in the same deposition source to form one layer of the intermediate layer on the first substrate, and the saturated gas pressure is any saturated gas in the range of 5x10 ^-4 Torr to 3x10 ^-2 Torr. A display device containing at least two organic substances whose phase transition temperature difference under pressure is 5 degrees Celsius or less. According to claim 1,
A display device wherein at least one of the at least two organic substances is an evaporation type material that vaporizes from a liquid to a gas. According to claim 1,
A display device wherein at least one of the at least two organic substances is a sublimation material that sublimates from a solid to a gas. According to claim 1,
A display device wherein the intermediate layer includes an organic light emitting layer. According to claim 4,
The intermediate layer further includes at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. A chamber in which a substrate is placed;
a deposition source disposed to face the substrate, containing at least two organic materials therein, and supplying the at least two organic materials to the substrate;
An apparatus for manufacturing a display device in which the at least two organic materials have a phase transition temperature difference of 5 degrees Celsius or less at any saturated gas pressure in the range of 5x10 ^-4 Torr to 3x10 ^-2 Torr. According to claim 6,
An apparatus for manufacturing a display device, wherein at least one of the at least two organic substances is an evaporation type material that vaporizes from a liquid to a gas. According to claim 6,
An apparatus for manufacturing a display device, wherein at least one of the at least two organic substances is a sublimation material that sublimates from a solid to a gas. According to claim 6,
An apparatus for manufacturing a display device in which at least one of the substrate and the deposition source moves linearly. Loading the first substrate into the chamber;
Applying heat to a deposition source containing a mixture of at least two organic substances to supply the at least two organic substances into the chamber;
Depositing the organic material on the first substrate to form one layer of an intermediate layer including at least one layer,
A method of manufacturing a display device in which the at least two organic materials have a phase transition temperature difference of 5 degrees Celsius or less at any saturated gas pressure in the range of 5x10 ^-4 Torr to 3x10 ^-2 Torr. According to claim 10,
A method of manufacturing a display device wherein at least one of the at least two organic substances is an evaporation type material that vaporizes from a liquid to a gas. According to claim 10,
A method of manufacturing a display device wherein at least one of the at least two organic substances is a sublimation material that sublimates from a solid to a gas. According to claim 11,
A method of manufacturing a display device in which at least one of the first substrate and the deposition source moves linearly. According to claim 10,
A method of manufacturing a display device, wherein the concentration of one of the at least two organic substances is 0.1% by mass to 50% by mass. According to claim 10,
A method of manufacturing a display device wherein the intermediate layer includes an organic light emitting layer. According to claim 15,
The intermediate layer further includes at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.

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