KR102586088B1 - 접착제 조성물 및 구조체 - Google Patents

접착제 조성물 및 구조체 Download PDF

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Publication number
KR102586088B1
KR102586088B1 KR1020187014965A KR20187014965A KR102586088B1 KR 102586088 B1 KR102586088 B1 KR 102586088B1 KR 1020187014965 A KR1020187014965 A KR 1020187014965A KR 20187014965 A KR20187014965 A KR 20187014965A KR 102586088 B1 KR102586088 B1 KR 102586088B1
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KR
South Korea
Prior art keywords
group
mass
adhesive composition
component
circuit
Prior art date
Application number
KR1020187014965A
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English (en)
Korean (ko)
Other versions
KR20180079371A (ko
Inventor
도모키 모리지리
히로유키 이자와
사토루 모리
아키코 이와이
고타로 세키
Original Assignee
가부시끼가이샤 레조낙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 가부시끼가이샤 레조낙 filed Critical 가부시끼가이샤 레조낙
Publication of KR20180079371A publication Critical patent/KR20180079371A/ko
Application granted granted Critical
Publication of KR102586088B1 publication Critical patent/KR102586088B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
KR1020187014965A 2015-11-04 2016-11-04 접착제 조성물 및 구조체 KR102586088B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2015-216516 2015-11-04
JP2015216516 2015-11-04
JPJP-P-2015-248787 2015-12-21
JP2015248787 2015-12-21
PCT/JP2016/082851 WO2017078157A1 (ja) 2015-11-04 2016-11-04 接着剤組成物及び構造体

Publications (2)

Publication Number Publication Date
KR20180079371A KR20180079371A (ko) 2018-07-10
KR102586088B1 true KR102586088B1 (ko) 2023-10-10

Family

ID=58662811

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187014965A KR102586088B1 (ko) 2015-11-04 2016-11-04 접착제 조성물 및 구조체

Country Status (5)

Country Link
JP (1) JP7000857B2 (zh)
KR (1) KR102586088B1 (zh)
CN (2) CN108350341B (zh)
TW (2) TWI771856B (zh)
WO (1) WO2017078157A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019054333A1 (ja) * 2017-09-12 2019-03-21 横浜ゴム株式会社 ウレタン系接着剤組成物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001072936A (ja) * 1999-07-06 2001-03-21 Kuraray Co Ltd 接着性組成物
WO2015141347A1 (ja) * 2014-03-17 2015-09-24 ナミックス株式会社 樹脂組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100080628A (ko) 2007-11-12 2010-07-09 히다치 가세고교 가부시끼가이샤 회로 접속 재료, 및 회로 부재의 접속 구조
JP2009256581A (ja) * 2008-03-28 2009-11-05 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤及びそれを用いた接続体
JP5934528B2 (ja) 2012-03-12 2016-06-15 デクセリアルズ株式会社 回路接続材料、及びそれを用いた実装体の製造方法
CN106029786A (zh) * 2013-12-26 2016-10-12 株式会社钟化 固化性组合物及其固化物
US9464214B2 (en) * 2014-02-25 2016-10-11 The Boeing Company Thermally conductive flexible adhesive for aerospace applications
KR102149235B1 (ko) * 2014-03-26 2020-08-28 동우 화인켐 주식회사 점착제 조성물 및 이를 포함하는 편광판
JP6700653B2 (ja) 2014-10-10 2020-05-27 京セラ株式会社 半導体接着用樹脂組成物及び半導体装置
WO2016116959A1 (ja) 2015-01-19 2016-07-28 京セラケミカル株式会社 導電性樹脂組成物および半導体装置
JP6536882B2 (ja) 2015-03-26 2019-07-03 Dic株式会社 樹脂組成物、硬化物及び熱伝導性材料

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001072936A (ja) * 1999-07-06 2001-03-21 Kuraray Co Ltd 接着性組成物
WO2015141347A1 (ja) * 2014-03-17 2015-09-24 ナミックス株式会社 樹脂組成物

Also Published As

Publication number Publication date
TW201720895A (zh) 2017-06-16
CN111995975B (zh) 2022-12-02
TWI718199B (zh) 2021-02-11
JP7000857B2 (ja) 2022-01-19
TW202126773A (zh) 2021-07-16
TWI771856B (zh) 2022-07-21
CN108350341B (zh) 2020-09-04
WO2017078157A1 (ja) 2017-05-11
JPWO2017078157A1 (ja) 2018-09-27
CN111995975A (zh) 2020-11-27
CN108350341A (zh) 2018-07-31
KR20180079371A (ko) 2018-07-10

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