KR102548018B1 - 공급 장치 및 공급 방법 - Google Patents

공급 장치 및 공급 방법 Download PDF

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Publication number
KR102548018B1
KR102548018B1 KR1020160111300A KR20160111300A KR102548018B1 KR 102548018 B1 KR102548018 B1 KR 102548018B1 KR 1020160111300 A KR1020160111300 A KR 1020160111300A KR 20160111300 A KR20160111300 A KR 20160111300A KR 102548018 B1 KR102548018 B1 KR 102548018B1
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KR
South Korea
Prior art keywords
accommodating
accommodating means
conveyed object
take
conveyed
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KR1020160111300A
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English (en)
Korean (ko)
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KR20170028846A (ko
Inventor
유타 구로사와
Original Assignee
린텍 가부시키가이샤
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Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20170028846A publication Critical patent/KR20170028846A/ko
Application granted granted Critical
Publication of KR102548018B1 publication Critical patent/KR102548018B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
KR1020160111300A 2015-09-04 2016-08-31 공급 장치 및 공급 방법 KR102548018B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015174974A JP6607744B2 (ja) 2015-09-04 2015-09-04 供給装置および供給方法
JPJP-P-2015-174974 2015-09-04

Publications (2)

Publication Number Publication Date
KR20170028846A KR20170028846A (ko) 2017-03-14
KR102548018B1 true KR102548018B1 (ko) 2023-06-26

Family

ID=58280933

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160111300A KR102548018B1 (ko) 2015-09-04 2016-08-31 공급 장치 및 공급 방법

Country Status (4)

Country Link
JP (1) JP6607744B2 (zh)
KR (1) KR102548018B1 (zh)
CN (1) CN106505024B (zh)
TW (1) TWI701205B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6906674B1 (ja) * 2020-12-11 2021-07-21 リンテック株式会社 フレーム収容装置およびフレーム収容方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004063644A (ja) 2002-07-26 2004-02-26 Renesas Technology Corp 半導体ウェハの保護シート着脱方法及び半導体ウェハの保護シート着脱装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3778532B2 (ja) * 1997-04-10 2006-05-24 富士写真フイルム株式会社 ラベル貼付方法及び装置
JPH10321693A (ja) * 1997-05-22 1998-12-04 Daikin Ind Ltd ワーク取り扱い装置
TWI232509B (en) * 2001-07-25 2005-05-11 Tokyo Electron Ltd Processing apparatus and processing method
US7107125B2 (en) * 2003-10-29 2006-09-12 Applied Materials, Inc. Method and apparatus for monitoring the position of a semiconductor processing robot
JP2007221031A (ja) * 2006-02-20 2007-08-30 Lintec Corp 搬送装置及び搬送方法
JP4807579B2 (ja) * 2006-09-13 2011-11-02 株式会社ダイフク 基板収納設備及び基板処理設備
CN101511709B (zh) * 2006-10-03 2013-03-20 株式会社Ihi 基板输送系统
JP4767896B2 (ja) * 2007-03-29 2011-09-07 東京エレクトロン株式会社 被検査体の搬送装置及び検査装置
US9048274B2 (en) * 2008-12-08 2015-06-02 Taiwan Semiconductor Manufacturing Co., Ltd. Portable stocker and method of using same
JP4973675B2 (ja) * 2009-02-26 2012-07-11 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5223778B2 (ja) * 2009-05-28 2013-06-26 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
US9004788B2 (en) * 2010-06-08 2015-04-14 Tokyo Electron Limited Substrate processing apparatus, substrate processing method, and storage medium
CN102064126B (zh) * 2010-11-04 2013-04-17 友达光电股份有限公司 基板运输处理方法
JP5978937B2 (ja) * 2012-11-13 2016-08-24 旭硝子株式会社 基板搬送用ハンド及び基板搬送方法
JP6199199B2 (ja) * 2014-02-20 2017-09-20 東京エレクトロン株式会社 基板処理装置、位置ずれ補正方法及び記憶媒体
CN204303786U (zh) * 2015-01-14 2015-04-29 中芯国际集成电路制造(北京)有限公司 晶圆运送系统以及晶圆处理系统

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004063644A (ja) 2002-07-26 2004-02-26 Renesas Technology Corp 半導体ウェハの保護シート着脱方法及び半導体ウェハの保護シート着脱装置

Also Published As

Publication number Publication date
JP6607744B2 (ja) 2019-11-20
CN106505024B (zh) 2021-11-02
KR20170028846A (ko) 2017-03-14
CN106505024A (zh) 2017-03-15
TW201710168A (zh) 2017-03-16
TWI701205B (zh) 2020-08-11
JP2017050504A (ja) 2017-03-09

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