KR102500678B1 - Gas supplier of shower head for protection of parasitic plasma - Google Patents

Abstract

Provided is a shower head gas supplying device for preventing parasitic plasma capable of not generating the unwanted parasitic plasma in another place other than a space in which plasma is formed to be induced by a shower head; and solving problems such as chamber contamination caused by particles by the parasitic plasma and quality deterioration of a microelectronic device. The device comprises: an insulating block and a metal block. In a gas supplying unit for supplying reaction gas to the shower head, the insulating block includes: a block body; and a first block wing and a second block wing which protrude to the outside of the block body, are formed in a ring shape to cover the circumference of the block body, and provide a separating space (c) having a space depth (D) and a space height (H).

Description

Shower head gas supply device for preventing parasitic plasma {Gas supplier of shower head for protection of parasitic plasma}

The present invention relates to a showerhead gas supply device, and more particularly, to a device for supplying gas while preventing an unwanted parasitic plasma phenomenon by improving a structure for supplying gas to a showerhead.

A showerhead is applied to deposition, etching, cleaning, etc. in the manufacture of microelectronic devices using wafers. For example, in the case of deposition, a constant amount of reaction gas is sprayed by appropriately arranging the diameter and spacing of each spray hole of the showerhead so that a thin film having a uniform thickness is formed on the surface of the wafer. A method of supplying gas to the showerhead is variously improved and applied as in Korean Patent Publication No. 2003-0066118. However, in the conventional apparatus, unwanted parasitic plasma is generated in a space other than a space in which plasma to be induced by the showerhead is formed. The parasitic plasma causes unnecessary deposition and generates particles, which cause problems such as chamber contamination and quality degradation of microelectronic devices.

1 is a diagram for explaining a conventional gas supply device (PS). Referring to FIG. 1 , a conventional supply device PS includes a shower head unit 100, a gas supply unit 110, and a supply pipe 120. In the shower head unit 100, the shower head 102 is located inside the head support 101, and the block plate 103 and the chamber lid 104 are located above the shower head 102. The gas supply unit 110 includes an insulating block 111, a metal block 112, and a flange 113, and the fastening part 114 passes through the insulating block 111, the metal block 112, and the flange 113. Thus, the gas supply unit 110 is fixed to the chamber lid 104. Fastening part 114 is typically made of metal. The inside of the gas supply unit 110 is provided with a gas passage (a) through which the reaction gas flows, and the reaction gas flows through the gas passage (a), the diffusion hole 103a of the block plate 103, the buffer space 105 and It is supplied into the chamber through the spray hole 102a of the shower head 102.

However, in the conventional gas supply device PS, undesirable parasitic plasma is generated in a space other than a space where plasma to be induced by the showerhead 102 is formed. 2 are photographs showing examples of parasitic plasma generated in a supply pipe (a) and a block plate (b) of a conventional gas supply device (PS). As shown. A phenomenon caused by parasitic plasma occurs in a part (P1) of the supply pipe 120 and a part (P2) of the block plate 103. For example, as shown in the drawing, deposition by parasitic plasma occurred on a part P2 of the block plate 103 . The parasitic plasma generates particles, and the generated particles cause problems such as chamber contamination and quality degradation of microelectronic devices.

The problem to be solved by the present invention is to prevent unwanted parasitic plasma from being generated in a space other than the space where the plasma to be induced by the showerhead is formed, thereby reducing chamber contamination by particles caused by parasitic plasma and deteriorating the quality of microelectronic devices It is an object of the present invention to provide a showerhead gas supply device for preventing parasitic plasma that solves such problems.

In order to solve the problem of the present invention, a showerhead gas supply device for preventing parasitic plasma includes an insulating block and a metal block, and a gas supply unit for supplying a reactive gas to the showerhead, wherein the insulating block includes a block body and the block body It protrudes outward, has a ring shape surrounding the circumference of the block body, and includes a first block wing and a second block wing providing a separation space (c) having a space depth (D) and a space height (H) .

In the device of the present invention, the first block wing may be composed of a first insulating ring and a first metal ring, and the second block wing may be composed of a second insulating ring and a second metal ring. The first insulating ring and the second insulating ring extend from the block body and may be made of the same material as the block body. The first metal ring and the second metal ring may provide the separation space (c). The first block wing is fastened by a first fastening part, and the second block wing is fastened by a second fastening part. The block body and the metal block are sealed by a second O-ring. The metal block is fixed to the flange, and includes a gas passage through which the reaction gas flows inside the insulation block, the metal block, and the flange. An inner wall of the metal block may include a flow groove for smooth flow of the reaction gas.

According to the showerhead gas supply device for preventing parasitic plasma of the present invention, by fastening the gas supply part to be spaced apart, unwanted parasitic plasma is not generated in a space other than the space where the plasma to be induced by the showerhead is formed. , chamber contamination by particles from parasitic plasma, and quality degradation of microelectronic devices.

1 is a diagram for explaining a conventional gas supply device.
2 are photographs showing examples of parasitic plasma generated in a supply pipe and a block plate of a conventional gas supply device.
3 is a view for explaining a gas supply device according to the present invention.
4 are photographs showing the supply pipe and block plate of the gas supply device according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments described below may be modified in many different forms, and the scope of the present invention is not limited to the embodiments described below. The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. In the drawings, it is exaggeratedly expressed for convenience of description. On the other hand, terms indicating positions such as top, bottom, front, etc. are only related to those shown in the drawings. In practice, the feeder can be used in any selective orientation, and in actual use the spatial orientation changes with orientation and rotation of the feeder.

In an embodiment of the present invention, by fastening the gas supply unit to be spaced apart, unwanted parasitic plasma is not generated in a space other than the space where the plasma to be induced by the showerhead is formed, thereby preventing chamber contamination by particles caused by the parasitic plasma. , a shower head gas supply device that solves problems such as quality degradation of microelectronic devices. To this end, a gas supply device having a spaced fastening structure will be studied in detail, and a process in which parasitic plasma is prevented by the spaced fastening structure will be described in detail. A gas supply device according to an embodiment of the present invention supplies a reaction gas to a showerhead applied to deposition, etching, cleaning, etc. in the manufacture of microelectronic devices using wafers.

3 is a diagram for explaining a gas supply device VS according to an embodiment of the present invention. However, it is not a drawing in a strict sense, and there may be components not shown in the drawing for convenience of description. For convenience of explanation, the gas supply device VS is partially cut and expressed.

According to FIG. 3 , the gas supply device VS of the present invention includes a shower head unit 10 , a gas supply unit 30 and a supply pipe 40 . The shower head unit 10 includes a head support 11 and a shower head 12 . A shower head (12) including a block plate (13) and a chamber lid (14). The block plate 13 and the chamber lid 14 are installed inside the head support 11. The shower head 12 includes a plurality of spray holes 12a for spraying the reaction gas, and the block plate 13 includes diffusion holes 13a for dispersing and flowing the reaction gas. The reaction gas moves to the block plate 13, diffuses through the diffusion hole 13a, and moves to the shower head 12. Preferably, the diffusion hole 13a may be disposed to correspond to the spray hole 12a. The spray holes 12a are uniformly arranged in diameter and spacing so that the reaction gas is sprayed in a constant amount.

A buffer space 17 exists between the shower head 12 and the block plate 13 to smoothly supply the reaction gas to the front surface of the shower head 12 . The chamber lid 14 has a refrigerant passage 15 recessed from the upper surface and disposed along the circumference, and the refrigerant passage 15 is closed or sealed by a passage cover 16 so that the refrigerant flowing through the refrigerant passage 15 is discharged to the outside. to prevent leakage. The refrigerant circulates through the refrigerant passage 15 to cool the shower head 10 to a set temperature or less, and the refrigerant is cooled through a chiller installed outside. The refrigerant prevents the shower head unit 10 from overheating and can control the shower head unit 10 to a set temperature or less.

In the drawings, only one example of the shower head unit 10 is presented, and various modifications may be made within the scope of the present invention. For example, the chamber lid 14 to which the RF potential is applied may have a thickness greater than that shown in the drawing, so as to have the same height as the first block wing 22 . The generator generating the RF potential may be a single RF generator or a plurality of RF generators capable of generating high, medium or low frequencies. For example, for high frequencies, the RF generator may generate frequencies in the range of 2 to 100 MHz, preferably 13.56 MHz or 27 MHz. For low frequencies, the range is 50 kHz to 2 MHz, and preferably 350 to 600 kHz.

The gas supply unit 30 includes an insulating block 20, a metal block 26 and a flange 27. The insulating block 20 blocks the RF potential applied to the shower head unit 10 so that the RF potential does not leak into the gas supply unit 30 . The insulating block 20 is made of a ceramic material such as silicon carbide or alumina for insulation, and the insulating block 20 is composed of a block body 21 and first and second block wings 22 and 23. The first and second block wings 22 and 23 protrude outward from the block body 21 and surround the block body 21 in a ring shape. The first and second block wings 22 and 23 protrude from the block body 21 to provide a separation space c. The separation space (c) exists in a recessed form along the circumference of the block body 21, and has a space depth (D) and a space height (H). The separation space (c) serves to block the RF potential applied to the shower head unit 10 so that the RF potential does not leak into the gas supply unit 30.

The first block wing 22 is composed of a first insulating ring 22a and a first metal ring 22b, and the second block wing 23 includes a second insulating ring 23a and a second metal ring 23b. consists of The first and second insulating rings 22a and 23a extend from the block body 21 and are made of the same material as the block body 21 . The first insulating ring 22a is attached to the chamber lid 14, and the second insulating ring 23a is attached to the metal block 26. The first metal ring 22b is in close contact with the first insulating ring 22a, the second metal ring 23b is in close contact with the second insulating ring 23a, and the first and second metal rings 22b and 23b Each provides a separation space (c). The first block wing 22 is fixed to the chamber lid 14 by a first fastening part 24 such as a bolt, and the second block wing 23 is metal by a second fastening part 25 such as a bolt. It is fixed to block 26 and flange 27. That is, the first and second fastening parts 24 and 25 are separated from each other by the space c.

The first metal ring 22b prevents the first insulating ring 22a from being damaged when the first block wing 22 is fastened to the first fastening part 24. The second metal ring 23b prevents the second insulating ring 23a from being damaged when the second block wing 23 is fastened to the second fastening part 25. Because, when the first and second insulating rings 22a and 23a are fastened to the first and second fastening parts 24 and 25 without the first and second metal rings 22b and 23b, the ceramic material The first and second insulating rings 22a and 23a may be damaged. At this time, the metal block 26 and the first and second metal rings 22b and 23b are made of a metal material such as aluminum. The inside of the gas supply unit 30 is provided with a gas passage (b) through which the reaction gas flows, and the reaction gas flows through the gas passage (b), the diffusion hole 13a of the block plate 13, the buffer space 17 and It is supplied into the chamber through the spray hole 12a of the shower head 12.

The chamber lid 14 and the block body 21 are sealed by the first O-ring 31, the block body 21 and the metal block 26 are sealed by the second O-ring 32, and the metal block 26 ) and the flange 27 can be sealed by the third O-ring 33. In addition, the inner wall of the metal block 26 has a flow groove 26a for smooth flow of the reaction gas. The inner shape of the metal block 26 can be any known one, and one example is presented here. The metal block 26 is fixed by a flange 27.

The separation space (c) according to the embodiment of the present invention prevents parasitic plasma from being generated. 4 are photographs showing a supply pipe (a) and a block plate (b) of a gas supply device (VS) according to an embodiment of the present invention. At this time, the gas supply device VS will be described with reference to FIG. 3 and compared to the conventional gas supply device PS.

According to FIG. 4 , the parasitic plasma phenomenon does not occur in the part (P1) of the supply pipe 40 of the present invention, unlike the part (P1) of the conventional supply pipe 120. In the present invention, the parasitic plasma phenomenon does not occur not only in a portion (P1) of the supply pipe 40 but also in the entire supply pipe 40. In addition, unlike the conventional block plate 103, a parasitic plasma phenomenon does not occur in the part P2 of the block plate 13 of the present invention. Although deposition by parasitic plasma was applied to a part P2 of the conventional block plate 103, the block plate 103 of the present invention did not have deposition as a whole. That is, according to the gas supply device VS of the present invention, since the parasitic plasma does not occur, unwanted deposition is prevented and generation of particles is fundamentally blocked, chamber contamination by the conventional particles, quality of microelectronic devices Problems such as deterioration have been resolved.

The blocking of the parasitic plasma phenomenon is realized by the separation space c separating the first and second fastening parts 24 and 25 . Specifically, the separation space (c) blocks RF leaking from the first fastening part 24 from leaking to the second fastening part 25, thereby fundamentally preventing the parasitic plasma phenomenon. In contrast, parasitic plasma is generated by the fastening part 114 penetrating the insulating block 111, the metal block 112, and the flange 113 in the related art. Since the conventional fastening part 114 is not separated from the shower head part 100, leakage of RF applied to the shower head part 100 cannot be prevented. In addition, the conventional fastening part 114 serves as an electrode for generating parasitic plasma. In contrast, the first fastening part 24 of the present invention is small in size and does not serve as an electrode for generating parasitic plasma. The space depth D and the space height H of the separation space c may be appropriately adjusted to meet the purpose of stably coupling the gas supply unit 30 and sufficiently blocking parasitic plasma.

In the above, the present invention has been described in detail with preferred embodiments, but the present invention is not limited to the above embodiments, and various modifications may be made by those skilled in the art within the scope of the technical idea of the present invention. possible.

10; shower head unit 11; head support
12; shower head 12a; injection hole
13; block plate 13a; diffusion hole
14; chamber lead 15; refrigerant flow
16; Euro cover 17; buffer space
20; Insulation block 21; block body
22, 23; 1st and 2nd block wing
22a, 23a; First and second insulating rings
22b, 23b; First and second metal rings
24, 25; First and second fastening parts
26; metal block 27; flange
30; gas supply
31, 32, 33; First to third O-rings
40; supply piping

Claims (8)

In the gas supply unit including an insulating block and a metal block and supplying a reactive gas to the shower head,
The insulating block,
block body;
A first block wing and a second block wing that protrude outward from the block body, have a ring shape surrounding the circumference of the block body, and provide a separation space (c) having a space depth (D) and a space height (H) including,
The first block wing is composed of a first insulating ring and a first metal ring, and the second block wing is composed of a second insulating ring and a second metal ring. Device. delete The showerhead gas supply device for preventing parasitic plasma according to claim 1, wherein the first insulating ring and the second insulating ring extend from the block body and are made of the same material as the block body. The showerhead gas supply device for preventing parasitic plasma according to claim 1, wherein the first metal ring and the second metal ring provide the separation space (c). The showerhead gas supply device for preventing parasitic plasma according to claim 1, wherein the first block wing is fastened by a first fastening part, and the second block wing is fastened by a second fastening part. The showerhead gas supply device for preventing parasitic plasma according to claim 1, wherein the block body and the metal block are sealed by a second O-ring. The showerhead for preventing parasitic plasma of claim 1, wherein the metal block is fixed to the flange, and a gas passage through which the reaction gas flows is included inside the insulation block, the metal block, and the flange. gas supply. The showerhead gas supply device for preventing parasitic plasma of claim 1 , wherein an inner wall of the metal block includes a flow groove for smooth flow of the reaction gas.

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