KR102492394B1 - Application processing device, application processing method, and optical film forming device - Google Patents

Abstract

The coating processing apparatus 10 includes substrate moving parts 12 and 13 that hold a substrate and move it in one horizontal direction, and stretch the substrate in a direction orthogonal to the moving direction of the substrate moving part to move the substrate held by the substrate moving part. By controlling the elongated coating nozzle 14 for discharging the coating liquid, the coating nozzle moving unit 16 for moving the coating nozzle in the extending direction of the coating nozzle, and the movement speed of the substrate moving unit and the coating nozzle moving unit, It has a controller 18 that controls the direction of application to the substrate held in the substrate moving unit.

Description

Application processing device, application processing method, and optical film forming device

The present invention relates to a coating apparatus for applying a coating liquid containing an optical material to a substrate, a coating method using the coating apparatus, and an optical film forming apparatus using the coating apparatus.

For example, in an organic light emitting diode (OLED), a circularly polarizing plate is used to prevent reflection of external light. A circularly polarizing plate is manufactured by laminating a linear polarizing plate and a wave plate (retardation plate) such that their polarization axes intersect at 45 degrees. In addition, these linear polarizing plates and wave plates are also used in a liquid crystal display (LCD: Liquid Crystal Display) in order to control optical rotation and birefringence in display.

Further, for example, there are cases in which only the wave plate is formed so that its polarization axis is tilted at 15 degrees or 75 degrees. Therefore, it is necessary to form a polarizing plate or a wave plate at an arbitrary angle. Further, in order to intersect the polarization axes of the polarizers and waveplates at an arbitrary angle, it is also necessary to form these polarizers or waveplates individually.

Conventionally, such a polarizing plate or wave plate is produced using, for example, a stretched film. A stretched film is one in which molecules in the material are oriented in one direction by stretching the film in one direction and adhering the film.

By the way, with the recent thinning of OLEDs or LCDs, thinning of polarizing plates or wavelength plates is also required. However, in the case of using a stretched film as in the prior art in producing a polarizing plate or a wave plate, there is a limit to thinning the film thickness of the stretched film itself, and a sufficient thin film cannot be obtained.

Therefore, thinning is achieved by applying a coating liquid having a predetermined material on a substrate and forming a polarizing plate or a wave plate having a required film thickness. Specifically, for example, a coating liquid having liquid crystal as a predetermined material is applied to the substrate, and cast/orientated. The liquid crystal compound forms supramolecular aggregates in the coating liquid, and when the coating liquid flows while applying shear stress, the long axis direction of the supramolecular aggregates is oriented in the flow direction.

In order to be able to apply the coating liquid to the substrate in this way, various devices have been conventionally proposed.

For example, the polarizing film printing apparatus described in Patent Literature 1 includes a table for holding a substrate and a slot die for discharging an ink liquid onto the substrate. The table has a configuration in which a surface plate is inserted into a frame plate with a surface plate portion cut out, and thereby the height of the surface plate periphery is set to the same height as the surface of the substrate fixed to the surface plate. The slot die is extended so as to cover at least the surface plate. Then, the substrate is fixed with the surface plate disposed in the printing direction, the surface plate is further rotated, the substrate is tilted at a predetermined angle with respect to the printing direction, and then the slot die is moved in the printing direction to apply an ink liquid to the substrate.

Further, for example, in the coating device described in Patent Document 2, a coating liquid is supplied to an coating head equipped with a band-shaped slit that opens upward and extends in a horizontal direction, and the coating liquid is discharged from the slit to form beads. and relatively moves the upper side of the coating head obliquely upward along one diagonal direction of the substrate to be coated, which has a rectangular planar shape, and moves from the bead formed between the coating head and the substrate to be coated to the coated surface of the substrate to be coated. The coating liquid is attached.

Japanese Unexamined Patent Publication No. 2005-62502 Japanese Unexamined Patent Publication No. Hei 10-5677

However, in the case of using the polarizing film printing device described in Patent Document 1, since the slot die is stretched so as to cover at least the surface plate, when applying the ink liquid to the substrate, the ink liquid is discharged to the substrate fixed to the surface plate, and the surface plate The ink liquid is also ejected and attached to the surrounding frame plate. For this reason, it is necessary to clean the frame plate sheet by sheet every time the substrate coating process takes time.

In addition, in the polarizing film printing apparatus of Patent Document 1, the surface plate on which the substrate is fixed is rotated, but the rotation of this surface plate is for receiving the substrate at a predetermined position (position parallel to the printing direction), and controlling the coating direction. It's not about doing it. In other words, the direction of application of the ink liquid to the substrate is fixed, and the direction of application cannot be freely controlled.

In the case of using the coating device described in Patent Literature 2, the coating liquid is applied to the substrate using surface tension. In such a case, it is necessary to adjust the application conditions such as the discharge pressure of the coating liquid from the coating head according to the area where the coating liquid adheres to the substrate, that is, according to the angle at which the coating liquid is applied, making the control complicated. .

Here, the shear stress (shear rate) during coating is a value obtained by dividing the coating speed by the distance (gap) between the substrate and the coating head. However, in the coating device of Patent Document 2, since surface tension is used, there is a limit to increasing the coating speed of the coating liquid to the substrate. For this reason, there is a possibility that sufficient shear stress cannot be obtained.

The present invention has been made in view of such a point, and an object of the present invention is to appropriately apply a coating liquid containing an optical material at an arbitrary angle with respect to a substrate.

In order to achieve the above object, the present invention is a coating treatment apparatus for applying a coating liquid containing an optical material to a substrate, comprising: a substrate moving unit for holding and moving the substrate in one horizontal direction; movement of the substrate moving unit an elongated coating nozzle that extends in a direction perpendicular to the direction and discharges the coating liquid to the substrate held by the substrate moving unit; and a coating nozzle moving unit that moves the coating nozzle in the extending direction of the coating nozzle and a controller for controlling the direction of application to the substrate held by the substrate moving unit by controlling the moving speed of the substrate moving unit and the coating nozzle moving unit.

The present invention according to another aspect is a coating treatment method for applying a coating liquid containing an optical material to a substrate, comprising: a first step of arranging an application nozzle extending into a long picture on one end of the substrate; A second step of discharging the coating liquid, and coating treatment on the substrate by moving the substrate in a direction orthogonal to the stretching direction while moving the coating nozzle discharging the coating liquid in the extending direction of the coating nozzle. 3rd process of performing is included.

In addition, the present invention according to another aspect is an optical film forming apparatus for forming an optical film on a substrate, the above-described coating treatment apparatus, a drying treatment apparatus for drying the optical film made of the coating liquid applied by the coating treatment apparatus, , a film fixing device for applying a fixing material of the optical film to a predetermined area of the optical film, and a film removing device for removing the optical film in an area where the fixing material is not applied.

According to the present invention, a coating liquid containing an optical material can be appropriately and efficiently applied at an arbitrary angle with respect to a substrate. Further, according to the present invention, an optical film can be appropriately formed on a substrate.

1 is a plan view schematically illustrating the configuration of an optical film forming apparatus according to the present embodiment.
Fig. 2 is a cross-sectional view schematically illustrating the configuration of the coating apparatus according to the present embodiment.
Fig. 3 is a longitudinal sectional view schematically illustrating the configuration of the coating apparatus according to the present embodiment.
4A is an explanatory view showing the operation of the glass substrate and the coating nozzle in step S1.
4B is an explanatory diagram showing the operation of the glass substrate and the coating nozzle in step S1.
4C : is explanatory drawing which shows the operation|movement of a glass substrate and an application|coating nozzle in process S1.
5A is an explanatory diagram showing the operation of the glass substrate and the coating nozzle in step S1.
5B is an explanatory diagram showing the operation of the glass substrate and the coating nozzle in step S1.
6A is an explanatory diagram showing the operation of the glass substrate and the coating nozzle in step S6.
6B is an explanatory diagram showing the operation of the glass substrate and the coating nozzle in step S6.
6C is an explanatory diagram showing the operation of the glass substrate and the coating nozzle in step S6.
Fig. 7 is a cross-sectional view schematically illustrating the configuration of a coating apparatus according to another embodiment.
Fig. 8 is a longitudinal sectional view schematically illustrating the configuration of a coating apparatus according to another embodiment.
Fig. 9 is a longitudinal sectional view schematically illustrating a cleaning processing unit in a coating processing apparatus according to another embodiment.
Fig. 10 is a longitudinal sectional view schematically illustrating the configuration of the vacuum drying apparatus according to the present embodiment.
Fig. 11 is a longitudinal sectional view schematically illustrating the configuration of the heat treatment apparatus according to the present embodiment.
Fig. 12 is a longitudinal sectional view schematically illustrating the configuration of the film fixing device according to the present embodiment.
Fig. 13 is a longitudinal sectional view schematically illustrating the configuration of the film removal device according to the present embodiment.
14 is a flowchart showing an example of main steps of the optical film forming process according to the present embodiment.
Fig. 15A is an explanatory view showing how the linear polarizing film is fixed by applying a fixing material in step S4.
Fig. 15B is an explanatory view showing how the linear polarizing film is fixed by applying a fixing material in step S4.
Fig. 16A is an explanatory diagram showing a state in which the linear polarizing film that has not been fixed in step S5 is removed.
Fig. 16B is an explanatory view showing the state in which the linear polarizing film that has not been fixed in step S5 is removed.
Fig. 17A is an explanatory diagram showing how a λ/4 wavelength film is fixed by applying a fixing material in step S9.
FIG. 17B is an explanatory diagram showing how a λ/4 wavelength film is fixed by applying a fixing material in step S9.
Fig. 18A is an explanatory diagram showing how the unfixed λ/4 wavelength film is removed in step S10.
Fig. 18B is an explanatory diagram showing how the unfixed λ/4 wavelength film is removed in step S10.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described.

First, the configuration of the optical film forming apparatus in this embodiment will be described. In the present embodiment, in the case of manufacturing a circular polarizing plate used for OLED, a linear polarizing film (linear polarizing plate) and a λ/4 wavelength film (λ/4 wave plate) are used as an optical film on a rectangular glass substrate (hereinafter, a substrate (G)) will be described as an example. Further, on the substrate before the linear polarizing film and the λ/4 wavelength film are formed, for example, a plurality of organic films (not shown) or the like are laminated and formed.

As shown in FIG. 1 , the optical film forming apparatus 1 includes a coating treatment apparatus 10, a vacuum drying apparatus 100, a heat treatment apparatus 300, a film fixing apparatus 400, and a film removal apparatus 500. have In addition, the optical film forming apparatus 1 has a substrate conveying unit (not shown) for conveying the substrate, and includes a coating apparatus 10, a vacuum drying apparatus 100, a heat treatment apparatus 300, and a film fixing apparatus 400. ) and the film removal device 500 in order.

In addition, the optical film forming apparatus 1 has a control unit 18, and the operation of the optical film forming apparatus 1 is controlled by the control unit 18. The control unit 18 includes, for example, the coating processing device 10, the vacuum drying device 100, the heat processing device 300, the film fixing device 400, the film removal device 500, and a substrate transfer unit not shown. control the action

<Coating processing device>

Next, the configuration of the application processing device 10 will be described. In the coating processing apparatus 10, the coating liquid is applied to the upper surface of the substrate G. 2 is a cross-sectional view showing an outline of the configuration of the application processing device 10. As shown in FIG. 3 is a longitudinal sectional view showing an outline of the configuration of the application processing device 10. As shown in FIG.

The application processing device 10 has a processing container 11 . On the side surface of the processing container 11, a loading/unloading port for the substrate G (not shown) is formed.

Inside the processing container 11, a stage 12 as a holding part holding the substrate G is installed. The stage 12 holds the surface of the substrate G on which the coating liquid is applied facing upward. Moreover, the stage 12 has a shape smaller than the board|substrate G in planar view (XY plane).

The application processing apparatus 10 has a stage driving unit 13 for moving the stage 12 in the X-axis direction, and the stage 12 is configured to be reciprocally movable in the X-axis direction by the stage driving unit 13. there is. The stage 12 moves between an end on the negative X-axis direction side (one end, substrate position A1) and an end on the positive X-axis direction side (other end, substrate position A2). In addition, the stage 12 is configured to be able to move a distance longer than the length of two sheets of the substrate G, and the substrate G at the substrate position A1 and the substrate G at the substrate position A2 , there is no overlapping part when viewed in plan. Further, the stage 12 and the stage driving unit 13 correspond to a substrate moving unit that holds the substrate G and moves it horizontally and linearly.

Above the stage 12, an application nozzle 14 for applying a coating liquid to the substrate G held on the stage 12 is provided. The application nozzle 14 is a long slit nozzle that extends in the Y-axis direction, which is a direction orthogonal to the moving direction (X-axis direction) of the substrate G held on the stage 12 . A discharge port 15 for discharging the coating liquid to the substrate G is formed on the lower end surface of the coating nozzle 14 . As shown in FIG. 2 , the discharge port 15 is a slit-shaped discharge port extending longer than the width of the substrate G in the Y-axis direction in the longitudinal direction (Y-axis direction) of the coating nozzle 14 .

The application processing apparatus 10 has a nozzle driving unit 16 (corresponding to an application nozzle moving unit) for moving the application nozzle 14 in the extending direction (Y-axis direction) of the application nozzle 14 . By means of the nozzle drive unit 16, the application nozzle 14 is configured to be reciprocally movable in the extending direction (Y-axis direction) of the application nozzle 14. The application nozzle 14 moves between the end (one end, nozzle position B1) on the Y-axis negative direction side and the end (other end, nozzle position B2) on the Y-axis positive direction side.

As described above, the stage 12 is movable in the X-axis direction and the application nozzle 14 is movable in the Y-axis direction, respectively, and the moving directions of the stage 12 and the application nozzle 14 are orthogonal. Then, the coating liquid can be applied onto the substrate G held on the stage 12 by relatively moving the coating nozzle 14 and the stage 12 while discharging the coating liquid from the coating nozzle 14. there is. Further, by controlling the moving speed of the stage 12 and the moving speed of the coating nozzle 14, the coating direction of the coating liquid applied to the substrate G (relative movement direction of the stage 12 and the coating nozzle 14) can be arbitrarily controlled.

In addition, the coating liquid discharged from the discharge port 15 is a coating liquid containing an optical material. Specifically, it is a coating liquid for a polarizing film for forming a linear polarizing film and a coating liquid for a wavelength film for forming a λ/4 wavelength film. included

Below the stage 12 and the application nozzle 14, a recovery unit 17 for recovering the coating liquid is provided. The coating liquid discharged from the coating nozzle 14 and not applied to the substrate G is recovered in the recovery unit 17 and reused for the next substrate G processed thereafter.

The operation of the application processing device 10 is controlled by the control unit 18 described above. The control unit 18 is, for example, a computer having a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), an input/output port, etc., and reads a program stored in a ROM (program storage unit) to By executing, the application process in the application processing apparatus 10 is controlled. This program is recorded on a computer-readable storage medium such as a computer-readable hard disk (HD), flexible disk (FD), compact disk (CD), magnet optical disk (MO), memory card, etc. It may be installed in the control unit 18 from a medium.

Next, a coating method of an optical film performed using the coating apparatus 10 will be described.

<Coating step (step S1)>

First, application of the linear polarizing film will be described. 4A to 5B are explanatory diagrams showing the operation of the substrate G and the coating nozzle 14 in step S1, which is a step of applying the linear polarizing film.

As shown in Fig. 4A, the stage 12 is positioned at the substrate position A1, and the substrate G is transferred to the stage 12. Next, the application nozzle 14 is positioned at the nozzle position B1. At this time, the application nozzle 14 is located at one end of the substrate (G). When arranging the application nozzle 14 at the nozzle position B1, the application nozzle 14 is arranged at a height corresponding to the target film thickness of the coating liquid P1 described later.

Subsequently, as shown in FIGS. 4B and 5A, the coating liquid P1 is discharged from the discharge port 15, and the substrate G is moved in the positive X-axis direction. The substrate G moves from the substrate position A1 toward the substrate position A2. At this time, the position of the application nozzle 14 is maintained as the nozzle position B1. Then, the coating liquid P1 is applied to the upper surface of the substrate G. The coating liquid P1 in this case is a coating liquid for a polarizing film for forming a linear polarizing film.

Subsequently, as shown in FIGS. 4C and 5B , when the substrate G is moved to the substrate position A2, the entire upper surface of the substrate G is coated with the coating liquid P1.

At this time, the coating liquid P1 is applied while shear stress (white arrows in FIGS. 4B and 4C) is applied. Since the application nozzle 14 does not move and the substrate G moves in the positive X-axis direction, shear stress is applied in the negative X-axis direction.

As described above, the shear stress (shear rate) is a value obtained by dividing the coating speed by the distance (gap) between the substrate G and the discharge port 15 of the coating nozzle 14. Regarding the gap, since the application nozzle 14 can be brought sufficiently close to the substrate G without damaging the substrate G by using a slit nozzle for the application nozzle 14, the gap can be reduced. And, sufficient shear stress can be applied to the coating liquid P1 by controlling the moving speed (= coating speed) of the substrate G. Furthermore, as a result, molecules in the coating liquid P1 can be oriented in one direction (X-axis direction).

Moreover, although nozzles other than a slit nozzle can also be used for the application|coating nozzle 14, a slit nozzle is suitable from a viewpoint that a gap can be made as small as possible as mentioned above. Moreover, since the film thickness of the coating liquid P1 applied to the board|substrate G is thin (for example, about 1-5 micrometers), a slit nozzle is suitable also from this viewpoint.

Among the coating liquids P1 discharged from the coating nozzle 14, the coating liquid P1 that has not been applied to the substrate G is recovered by the recovery unit 17. The collect|recovered coating liquid P1 is reused for the board|substrate G processed next time or later. Further, since the stage 12 is smaller than the substrate G, the coating liquid P1 does not adhere to the stage 12 either. Therefore, cleaning of the stage 12 for each substrate G can be suppressed.

<Coating step (step S6)>

Next, application of the λ/4 wavelength film will be described. 6A to 6C are explanatory diagrams showing the operation of the substrate G and the coating nozzle 14 in step S6, which is a step of applying the λ/4 wavelength film.

In step S6, a coating liquid is applied to the upper surface of the substrate G on which the linear polarizing film is formed in step S1. The coating liquid at this time is a coating liquid for a wavelength film for forming a λ/4 wavelength film.

As shown in Fig. 6A, at the substrate position A1, the substrate G on which the linear polarizing film has already been formed is transferred to the stage 12. Next, the application nozzle 14 is positioned at the nozzle position B1. At this time, the application nozzle 14 is located at one end of the substrate (G). When arranging the application nozzle 14 at the nozzle position B1, the application nozzle 14 is arranged at a height corresponding to the target film thickness of the coating liquid Q1 described later.

Subsequently, as shown in FIG. 6B, the coating liquid Q1 is discharged from the coating nozzle 14, and the substrate G is moved from the substrate position A1 to the substrate position A2 in the positive X-axis direction. . In addition, the application nozzle 14 is moved in the positive Y-axis direction from the nozzle position B1 toward the nozzle position B2.

Subsequently, as shown in FIG. 6C, the substrate G is moved to the substrate position A2 while discharging the coating liquid Q1 from the coating nozzle 14. In addition, the application nozzle 14 is moved to the nozzle position B2. In doing so, the coating liquid Q1 is applied to the entire upper surface of the substrate G.

In this way, the substrate G is moved from the substrate position A1 to the substrate position A2, and the application nozzle 14 is moved from the nozzle position B1 to the nozzle position B2. And the moving speed of the board|substrate G and the moving speed of the coating nozzle 14 are each controlled to predetermined speed.

Then, the coating liquid Q1 is applied while shear stress (white arrows in Figs. 6B and 6C) is applied. By controlling the moving speed of the substrate G and the moving speed of the coating nozzle 14 at predetermined speeds, respectively, shear stress is applied in the direction of, for example, an inclination of 45 degrees from the positive Y-axis direction and the positive X-axis direction.

In addition, sufficient shear stress can be applied to the coating liquid Q1 by controlling the moving speed of the substrate G and the moving speed of the coating nozzle 14 . As a result, the molecules in the coating liquid Q1 can be oriented in one direction (the aforementioned 45-degree direction).

In this way, in the coating apparatus 10, the coating liquid Q1 is applied on the substrate G, and the λ/4 wavelength film is applied.

By the above coating method, the direction of the molecules of the λ/4 wavelength film is arranged in an oblique direction in the XY plane with respect to the direction (alignment direction) of the molecules of the linear polarizing film. Then, the application direction of the coating liquid P1 and the application direction of the coating liquid Q1 are crossed in an oblique direction, for example, at 45 degrees, and the linear polarizing film P1 and the λ/4 wavelength film Q1 are formed, and the polarization axis is set at 45 degrees. It can be formed to cross the road.

Also, the intersection angle of the polarization axes of the linear polarizing film P1 and the λ/4 wavelength film Q1 is not limited to 45 degrees, and the linear polarizing film and the λ/4 wavelength film may be coated so as to intersect at different angles.

<Other Embodiments of Coating Processing Device>

Next, another embodiment of the application processing device 10 will be described. 7 is a cross-sectional view schematically illustrating the configuration of another embodiment of the application processing device 10 . 8 is a longitudinal sectional view schematically illustrating the configuration of another embodiment of the application processing device 10 .

The application processing apparatus 10 further has a second recovery unit 20 that recovers the coating liquid as shown in FIGS. 7 and 8 .

The second recovery part 20 collects the coating liquid discharged from the coating nozzle 14 to the outside of the substrate G and not applied to the substrate G. As shown in FIG. 7 , each second recovery unit 20 is an area other than the area through which the substrate G passes, specifically, one end side of the elongated coating nozzle 14, when viewed from above. For example, they are disposed near the nozzle position B1 and the other end side of the application nozzle 14, for example, near the nozzle position B2. Like the application nozzle 14, the second recovery unit 20 has a shape extending in the Y-axis direction. Then, the second recovery unit 20 is disposed at a position capable of recovering the coating liquid discharged from the coating nozzle 14 to the outside of the substrate G at the nozzle position B1 and the nozzle position B2. . Also, as shown in FIG. 8 , the second recovery unit 20 is located below the application nozzle 14 .

Then, the second recovery unit 20 recovers the coating liquid discharged from the coating nozzle 14 to the outside of the substrate G, and the coating liquid recovered by the second recovery unit 20 is processed next time or later. It is reused for the substrate (G) to be.

In addition, the coating processing apparatus 10 further has a substrate periphery processing unit that performs a predetermined process on the circumferential portion of the substrate G. Here, as an example of the substrate circumferential processing unit, the cleaning processing unit 21 for cleaning the circumferential edge of the substrate G is used for description.

For example, there is a possibility that the coating liquid discharged from the coating nozzle 14 circulates around the peripheral edge of the back surface of the substrate G and adheres thereto. Therefore, as shown in FIG. 7 and FIG. 8, the cleaning process part 21 is installed and the coating liquid adhering to the circumferential edge of the back surface of the board|substrate G is removed.

The cleaning processing part 21 is respectively arrange|positioned at the position which can clean the periphery part of two sides parallel to the advancing direction (X-axis direction) of the rectangular board|substrate G, and its vicinity.

In this embodiment, the cleaning processing part 21 is arrange|positioned in the periphery of the position downstream from the application nozzle 14 in the traveling direction of the board|substrate G (positive X-axis direction side) and where two sides parallel to the X-axis pass.

9 is a longitudinal sectional view showing an outline of the cleaning processing unit 21 . The cleaning processing unit 21 has a cleaning liquid discharge unit 22 for discharging the cleaning liquid to the periphery of the upper and lower surfaces of the substrate G, and a cleaning liquid collecting unit 23 for sucking and recovering the cleaning liquid after cleaning.

The cleaning liquid discharge unit 22 is directed from the top and bottom of the substrate G in a direction orthogonal to the front and back surfaces of the substrate G or in a direction inclined toward the outside of the substrate G with respect to the circumferential edge of the front and back surfaces of the substrate G. can eject. In addition, the washing liquid recovery unit 23 is located on the side of the substrate G, and can suction and recover the used washing liquid by negative pressure.

Next, the cleaning process of the circumferential edge of the substrate G using the cleaning processing unit 21 will be described. A coating liquid is applied to the upper surface of the substrate G while moving the substrate G from the substrate position A1 to the substrate position A2. At that time, there is also a possibility that the coating liquid discharged from the coating nozzle 14 circulates on the back surface of the peripheral edge of the substrate G. Therefore, when the two sides of the substrate G undergoing the coating process pass through the cleaning processing unit 21, the cleaning liquid is discharged from the cleaning liquid discharge unit 22 to clean the circumferential edge of the substrate G, and the used cleaning liquid is transferred to the cleaning liquid collection unit. It collects by suction from (23).

In this way, by arranging the cleaning processing unit 21, it is possible to simultaneously perform the cleaning processing of the peripheral edge of the substrate G while performing the coating processing with respect to the substrate G, and thus the peripheral edge of the substrate G Excess coating liquid adhering to the surface can be removed.

In addition, the configuration of the cleaning processing unit 21 is not limited to the above-described embodiment, and various modifications are possible. The position of the cleaning processing unit 21 is an example, and may be disposed in another position. In addition, although an example of cleaning by discharging the cleaning liquid to the circumferential edges of the front and back surfaces of the substrate G has been shown, only the cleaning liquid discharge unit 22 on the lower side of the substrate G is used to discharge the cleaning liquid only to the circumferential edges of the back surface of the substrate G. may be discharged to clean the back surface of the periphery of the substrate G.

Further, in order to dry the surplus cleaning liquid adhering to the substrate G, a gas spraying nozzle (not shown) for spraying gas to the circumferential edge of the substrate G may be further added to, for example, the cleaning processing unit 21 .

As an example of the substrate periphery processing unit, the processing of cleaning the circumferential edge of the substrate G using the cleaning processing unit 21 has been described. However, the processing in the substrate peripheral processing unit is not limited to cleaning processing, and may be, for example, peripheral film thickness adjustment processing for adjusting the film thickness of the coating film on the peripheral edge of the substrate G.

As the peripheral film thickness adjusting unit (not shown) for performing the peripheral film thickness adjusting process, for example, a nozzle for discharging the coating liquid or the solvent of the coating liquid or the solvent atmosphere of the coating liquid only to the peripheral edge of the substrate G can be considered. there is. In addition, as another example of the peripheral film thickness adjusting unit, any configuration capable of adjusting the thickness of the coating film, such as a heating unit capable of heating only the peripheral edge of the substrate or a cooling unit capable of cooling only the peripheral edge of the substrate, is dedicated (transfer). use) is possible.

Compared with other regions of the substrate G, the periphery of the substrate G may become a singularity in film thickness, such as thick or thin film thickness of the coating film. Therefore, by using the above-described circumferential film thickness adjusting unit, the film thickness of the circumferential edge of the substrate G is adjusted during the coating process so that the film thickness of the circumferential edge of the substrate G is equal to that of the other regions of the substrate G. may be adjusted

Further, as the substrate edge processing unit, either the cleaning processing unit 21 or the peripheral film thickness adjusting unit may be disposed. Further, the processing performed by the substrate periphery processing unit is not limited to cleaning processing or film thickness adjustment processing, and may be other processing. A processing unit for performing other processing may be disposed at the same position as the cleaning processing unit 21, and another processing may be performed on the periphery of the substrate G.

In this embodiment, as shown in FIG. 7 or FIG. 8 , the coating processing apparatus 10 has a configuration in which the cleaning processing unit 21 (=substrate edge processing unit) can be easily disposed. Further, by providing the substrate periphery treatment unit, in addition to the coating treatment, the substrate periphery treatment can be simultaneously performed with respect to the periphery of the substrate G under coating treatment.

In addition, as long as the substrate G moves from the substrate position A1 to the substrate position A2, the present invention can be applied without being limited to the configuration of the coating apparatus 10 described above. For example, in the coating processing apparatus described in Japanese Patent Laid-Open No. 2006-199483 or the like, which performs coating processing while floating the substrate G, the coating nozzle 14 of the present invention, the second recovery unit 20, and the cleaning processing unit ( 21) can also be applied.

In addition, although the first recovery unit 17 and the second recovery unit 20 are provided, the first recovery unit 17 may be omitted.

In this way, the linear polarizing film and the λ/4 wavelength film can be applied on the substrate G using the coating apparatus 10 .

Next, the remaining devices except for the coating processing device 10 in the optical film forming device 1 will be described.

<Decompression Drying Device>

Fig. 10 is a longitudinal sectional view schematically illustrating the configuration of a vacuum drying device serving as a first drying device. In the reduced pressure drying apparatus 100 shown in FIG. 10 , the optical films (linear polarizing film and λ/4 wavelength film) applied to the substrate G are dried under reduced pressure.

The reduced pressure drying device 100 has a processing container 101 . The processing container 101 has a cover body 102 and a main body 103 . The cover body 102 is configured to be able to be moved up and down by a lifting mechanism not shown. When the substrate G is carried in and out of the processing container 101, the cover body 102 is separated upward from the main body 103, and when the vacuum drying process is performed inside the processing container 101, the cover body ( 102) and the main body 103 are integrated to form an enclosed space.

Inside the processing container 101, a placement table 110 for placing the substrate G is installed. The placement table 110 places the substrate G so that the surface on which the optical film is formed faces upward. A gas supply unit 120 and an exhaust unit 121 are installed at the bottom of the processing vessel 101 . The gas supply unit 120 and the exhaust unit 121 are disposed to face each other with the placing table 110 interposed therebetween. By supplying an inert gas from the gas supply unit 120 , an air flow of the inert gas may be passed on the substrate G in an air flow direction parallel to the substrate G (X-axis direction). In addition, by exhausting from the exhaust unit 121, the inside of the processing container 101 can be made into a reduced pressure atmosphere.

In addition, the structure of the reduced-pressure drying apparatus is not limited to the structure of the reduced-pressure drying apparatus 100 of this embodiment, The structure of a well-known reduced-pressure drying apparatus may be sufficient.

<Heating device>

Fig. 11 is a longitudinal sectional view schematically illustrating the configuration of a heat treatment device serving as a second drying device. In the heat treatment apparatus 300, the optical film (linear polarization film and λ/4 wavelength film) applied to the substrate G is heated and dried.

The heat processing device 300 has a processing container 301 . The processing container 301 has a cover body 302 and a main body 303 . The cover body 302 is configured to be able to move up and down by a lifting mechanism not shown. When the substrate G is carried in and out of the processing container 301, the cover body 302 is separated upward from the main body 303, and when heat treatment is performed inside the processing container 301, the cover body 302 ) and the main body 303 are integrated to form an enclosed space. An exhaust unit 304 is provided at the center of the upper surface of the cover body 302 . The inside of the processing vessel 301 is exhausted from an exhaust unit 304 .

Inside the processing container 301, a hot plate 310 for placing and heating the substrate G is installed. The hot plate 310 arranges the substrate G so that the surface on which the optical film is formed faces upward. In the hot plate 310, a heater 311 that generates heat by power supply is incorporated.

Note that the configuration of the heat processing device is not limited to the configuration of the heat processing device 300 of the present embodiment, and may be a configuration of a known heat processing device.

<Fixing device>

Fig. 12 is a longitudinal sectional view schematically illustrating the configuration of the film fixing device. In the film fixing device 400, the fixing material is selectively applied to a predetermined area, a pixel area of the substrate G in this embodiment, by an inkjet method.

The film fixing device 400 has a processing container 401 . A loading/unloading port (not shown) of the substrate G is formed on the side surface of the processing container 401, and an opening/closing shutter (not shown) is provided at the loading/unloading port.

Inside the processing container 401, a stage 410 holding the substrate G is installed. The stage 410 adsorbs and holds the back surface of the substrate G so that the surface on which the fixing material is applied faces upward.

The stage 410 is installed on the lower surface side of the stage 410 and is attached to a pair of rails 411 and 411 extending in the X-axis direction. The rail 411 is installed on a table 412 extending in the X-axis direction. The stage 410 is configured to be movable along the rails 411 and 411 .

Moreover, the rail 411 extends in the X-axis direction at least two sheets of the board|substrate G or more with the application|coating nozzle 420 mentioned later interposed therebetween. As a result, the substrate G (solid line in the drawing, substrate position C1) in the case where the stage 410 is located at the end in one direction of the X axis, and the stage 410 is located at the end in the positive X axis direction. The substrate G in the case (dotted line in the drawing, substrate position C2) does not overlap in plan view.

Above the stage 410, an application nozzle 420 for applying a fixing material to the substrate G held on the stage 410 is installed. The application nozzle 420 is, for example, an inkjet nozzle, and can selectively apply a fixing material to a predetermined area of the substrate G. In addition, the application nozzle 420 is configured to be movable also in the vertical direction by a moving mechanism (not shown).

In addition, as the fixing material discharged from the coating nozzle 420, any material can be used as long as it fixes the optical film to a predetermined area of the substrate G. For example, the functional group at the end of the optical film may be substituted or polymerized by causing a contraction reaction to inactivate (insolubilize) the optical film and fix it. Alternatively, the optical film may be hardened and fixed.

Further, the configuration of the film-fixing device is not limited to that of the film-fixing device 400 of the present embodiment, and may be a known inkjet type device. Further, the method of selectively applying the fixing material in the film fixing device is not limited to the inkjet method, and other methods may be used. As another method, for example, the fixing material may be selectively applied only to the predetermined area by installing a mask on an area other than the predetermined area and discharging the fixing material thereon.

<Membrane removal device>

Fig. 13 is a longitudinal sectional view schematically illustrating the configuration of the film removal device. In the film removing device 500, a cleaning solution is supplied to the substrate G to remove the optical film (in this embodiment, the optical film in the area other than the pixel area) that has not been fixed in the film fixing device 400.

The film removal device 500 has a processing container 501 . A loading/unloading port (not shown) of the substrate G is formed on the side surface of the processing container 501, and an opening/closing shutter (not shown) is provided at the loading/unloading port.

Inside the processing chamber 501, a spin chuck 510 holding and rotating the substrate G is installed. The spin chuck 510 adsorbs and holds the back surface of the substrate G so that the surface on which the cleaning liquid is supplied faces upward. In addition, the spin chuck 510 may be rotated at a predetermined speed by a chuck driving unit 511 such as a motor.

Around the spin chuck 510, a cup 520 is installed to catch and collect the cleaning liquid splashing or falling from the substrate G. A discharge pipe 521 for discharging the recovered fixing material and an exhaust pipe 522 for exhausting the inside of the cup 520 are connected to the lower surface of the cup 520 .

On the upper side of the spin chuck 510, a cleaning nozzle 530 for supplying a cleaning liquid to the substrate G held in the spin chuck 510 is installed. The cleaning nozzle 530 is configured to be movable in horizontal and vertical directions by a moving mechanism 531 .

In addition, as the cleaning solution supplied from the cleaning nozzle 530, a material corresponding to the solvent of the fixing material applied by the film fixing device 400 is used. For example, if the solvent of the fixing material is water, water is used for the cleaning liquid, and if the solvent of the fixing material is an organic solvent, an organic solvent is used for the cleaning liquid.

Note that the structure of the film removal device is not limited to that of the film removal device 500 of the present embodiment, and may be a structure of a well-known spin coating system. In addition, the method of selectively removing the optical film in the film removal device is not limited to the spin coating method, and other methods may be used. As another method, the optical film may be selectively removed by immersing the substrate G in a cleaning tank storing cleaning liquid, for example. Further, laser ablation may be performed to selectively remove the optical film, or photolithography and etching may be performed to selectively remove the optical film.

Next, an optical film forming method performed using the optical film forming apparatus 1 structured as described above will be described. 14 is a flowchart showing an example of the main steps of such an optical film formation process.

In this embodiment, as described above, the linear polarizing film and the λ/4 wavelength film are formed by laminating them on the substrate G so that their polarization axes intersect at 45 degrees as optical films. Steps S1 to S5 are steps of forming a linear polarizing film, and steps S6 to S10 are steps of forming a λ/4 wavelength film.

<Process S1>

As described above, in the coating apparatus 10, the coating liquid for the polarizing film for forming the linear polarizing film P1 is applied to the entire surface of the substrate G (step S1).

<Process S2>

Next, in the reduced pressure drying apparatus 100, the linear polarizing film P1 of the substrate G is dried under reduced pressure. Specifically, the substrate G is placed on the mounting table 110 and the lid 102 is closed to form a sealed space inside the processing container 101 . Thereafter, the inert gas is supplied from the gas supply unit 120 and the inside of the processing container 101 is exhausted from the exhaust unit 121 to set the inside of the processing container 101 to a reduced pressure atmosphere. Then, the linear polarizing film P1 is dried.

When the linear polarizing film P1 is dried, the solvent in the film is removed. In step S1 described above, the molecules are oriented in one direction by applying shear stress, but if left as is, the orientation of the molecules may return to the original state and become disturbed. For this reason, by removing the solvent in the film in step S2, the molecular alignment state is properly maintained.

Further, from the viewpoint of appropriately maintaining the orientation of the molecules, the substrate G is transported between the coating apparatus 10 and the vacuum drying apparatus 100 in a windless state without downflow, for example. There is no fear of disturbing the alignment state of the molecules of the linear polarizing film P1 by downflow, and the substrate G is transferred from the coating device 10 to the vacuum drying device 100 in a state in which the molecules are oriented in one direction. this is returned

<Process S3>

Next, in the heating apparatus 300, the linear polarizing film P1 of the substrate G is heated and dried. Specifically, the substrate G is placed on the hot plate 310 and the lid 302 is closed to form a sealed space inside the processing container 301 . Then, the linear polarizing film P1 is heated to a predetermined temperature, for example, 50° C. by the heater 311 of the hot plate 310 .

For example, even if the linear polarizing film P1 is dried under reduced pressure in step S2, the solvent may not be completely removed from the film. The heating of the linear polarizing film P1 in step S3 reliably removes the solvent remaining in the film in this way. In addition, when the solvent in the film can be completely removed in step S2, step S3 may be omitted.

<Process S4>

Next, in the film fixing device 400, a fixing material is applied to a predetermined area of the substrate G, a pixel area in the present embodiment.

In the film fixing apparatus 400, the substrate G is held on the stage 410 at the substrate position C1. Then, the substrate G is moved from the substrate position C1 to the substrate position C2.

While the substrate G is moving, the fixing material F is applied from the application nozzle 420 to the linear polarizing film P1 formed in the pixel region of the substrate G, as shown in FIG. 15A. At this time, since the film fixing device 400 employs an inkjet method, the fixing material F can be accurately applied to the linear polarizing film P1 in the pixel area.

The fixing material F inactivates (insolubilizes) the linear polarizing film P1. Specifically, a water-soluble end such as an OH group in the linear polarizing film P1 is substituted with another functional group. Then, the inactivated linear polarizing film P1 is fixed on the substrate G. Hereinafter, the linear polarizing film to which the fixing material F is applied and fixed is described as P2. That is, in regions other than the pixel region of the substrate G, the linear polarizing film P1 was not inactivated and did not settle. Meanwhile, in the pixel area, the linear polarizing film P2 was inactivated and settled.

Then, as shown in Figs. 15A and 15B, an inactivated linear polarizing film P2 can be formed in all pixel regions of the substrate G. For convenience of illustration, the case where the number of pixel regions of the substrate G, that is, the linear polarizing film P2 is 20 is exemplified, but the number of pixel regions is not limited to this. In reality, there are about 100 pixel areas with respect to one substrate G.

<Process S5>

Next, in the film removing device 500, a cleaning solution is supplied to the substrate G to selectively remove the linear polarizing film P1 that has not been fixed in step S4.

In the film removal device 500, the substrate G is adsorbed and held by the spin chuck 510. Thereafter, the cleaning solution is supplied from the cleaning nozzle 530 to the center of the substrate G while rotating the substrate G held by the spin chuck 510 . The supplied cleaning liquid is spread on the substrate G by centrifugal force. At this time, since the linear polarizing film P2 to which the fixing material F is applied is fixed, it is not removed by the cleaning liquid. On the other hand, the linear polarizing film P1 to which the fixing material F is not applied is removed by the cleaning solution because it is not fixed. In this way, as shown in Figs. 16A and 16B, only the linear polarizing film P1 is selectively removed, and only the linear polarizing film P2 is formed in the pixel region on the substrate G.

<Process S6>

After the linear polarizing film P2 is formed on the substrate G as described above, a λ/4 wavelength film is further formed on the substrate G. As described above, the coating liquid is applied to the upper surface of the substrate G on which the linear polarizing film P2 is formed by the coating apparatus 10 . The coating liquid in this case is a coating liquid for a wavelength film for forming a λ/4 wavelength film.

<Process S7>

Next, in the vacuum drying apparatus 100, the λ/4 wavelength film Q1 of the substrate G is dried under reduced pressure. Since the specific reduced-pressure drying process is the same as step S2, description is abbreviate|omitted. Then, the solvent of the λ/4 wavelength film Q1 is removed, and the orientation state of the molecules in the film is properly maintained.

<Process S8>

Next, in the heat treatment apparatus 300, the λ/4 wavelength film Q1 of the substrate G is heated and dried. Since the specific heat treatment is the same as step S3, description is omitted. Then, the solvent of the λ/4 wavelength film Q1 is completely removed. In addition, when the solvent in the film can be completely removed in step S7, step S8 may be omitted.

<Process S9>

Next, in the film fixing device 400, as shown in FIGS. 17A and 17B , a fixing material ( F) is applied selectively. Since the selective coating treatment of the specific fixing material F is the same as step S4, description thereof is omitted.

The fixing material F inactivates (insolubilizes) the λ/4 wavelength film Q1, and the inactivated λ/4 wavelength film Q1 is fixed to the substrate G. Hereinafter, the λ/4 wavelength film on which the fixing material F is applied and fixed is described as Q2. That is, in the area except for the pixel area of the substrate G, the λ/4 wavelength film Q1 was not inactivated and did not settle. On the other hand, in the pixel region (linear polarization film P2), the λ/4 wavelength film Q2 was inactivated and settled.

<Process S10>

Next, in the film removal device 500, a cleaning solution is supplied to the substrate G to selectively remove the λ/4 wavelength film Q1 that has not been fixed in step S9. Since the selective removal process of the specific λ/4 wavelength film Q1 is the same as that of step S5, description thereof is omitted. And, as shown in FIGS. 18A and 18B , a λ/4 wavelength film Q2 is formed in the pixel region on the substrate G. In this way, the linear polarizing film P2 and the λ/4 wavelength film Q2 are laminated and formed in the pixel region on the substrate G.

According to the above embodiment, in the coating device 10, the application direction of the coating liquid P1 in step S1 and the application direction of the coating liquid Q1 in step S6 are crossed at 45 degrees, and the linear polarizing film ( P1) and the λ/4 wavelength film Q1 may be formed so that their polarization axes intersect at 45 degrees.

In addition, since the linear polarizing film P1 is dried under reduced pressure in step S2, the alignment state of the molecules in the linear polarizing film P1 can be appropriately maintained. Similarly, since the λ/4 wavelength film Q1 is dried under reduced pressure in step S7, the orientation state of the molecules in the λ/4 wavelength film Q1 can be appropriately maintained.

Steps S2 and S7 are not limited to drying under reduced pressure as long as the linear polarizing film P1 and the λ/4 wavelength film Q1 are dried. For example, each of the linear polarizing film P1 and the λ/4 wavelength film Q1 may be dried naturally, may be dried by heat treatment, or may be dried by spraying a gas.

However, reduced pressure drying is more preferable because it can be performed in a shorter time than natural drying. Further, in the case of, for example, heat treatment or gas spraying, convection of the solvent in the film may disturb the orientation of the molecules in the film. However, vacuum drying is more preferable because convection of the solvent in the membrane can be suppressed.

Further, in step S4, the fixing material F is selectively applied to the linear polarizing film P1 in the pixel area, and in step S5, the linear polarizing film P1 that is not fixed because the fixing material F is not applied is selectively applied. Since it is removed, the linear polarizing film P2 is formed only in the pixel region. Similarly, the λ/4 wavelength film Q2 is formed only in the pixel region by performing steps S9 and S10.

Here, for example, in the case of manufacturing a circular polarizing plate, the linear polarizing film and the λ/4 wavelength film need only be formed in the pixel region. If a film is formed in an area other than the pixel area, there is a risk that terminals and the like provided around the pixel area may not function properly. In this embodiment, since the film is formed only in the pixel area, the functions of the linear polarizing film P2 and the λ/4 wavelength film Q2 in the pixel area can be exhibited, while the functions of the parts around the pixel area can also be exhibited. there is.

Further, in steps S1 and S6, the coating liquids P1 and Q1 are applied while applying shear stress, respectively, but it is difficult to apply the coating liquids P1 and Q1 only to the pixel region at this time. Therefore, it is useful to selectively form the linear polarizing film P2 and the λ/4 wavelength film Q2 in the pixel region by performing steps S4, S5, S9, and S10.

In addition, for example, in the case where the linear polarizing film P1 is formed by applying the coating liquid P1 to the substrate G in step S1, and the selective application of the fixing material F in step S4 is omitted, the subsequent steps When the coating liquid Q1 is applied to the substrate G in step S6, the linear polarizing film P1 melts in the coating liquid Q1, and there is a possibility that the melted linear polarizing film P1 may mix with the coating liquid Q1. . In this regard, mixing of the linear polarizing film P2 and the coating liquid Q1 can be suppressed by forming the insolubilized linear polarizing film P2 by performing step S4 as in the present embodiment. As a result, the linear polarizing film P2 and the λ/4 wavelength film Q2 can be appropriately formed.

In addition, it is not necessarily essential to perform these steps S4, S5, S9, and S10. When the substrate G has a plurality of pixel regions as in the present embodiment, it is useful to perform the steps S4, S5, S9, and S10. For example, a linear polarizing film and a λ/4 wavelength film are formed on the entire surface of the substrate G. In this case, steps S4, S5, S9, and S10 may be omitted.

Further, in step S4 and step S9, in the film fixing device 400, the linear polarizing film and the λ/4 wavelength film are fixed by applying a fixing material, but other methods may be used. As another method, for example, if a material reacting with light is added to the linear polarizing film and the λ/4 wavelength film in advance, crystals of the linear polarizing film and the λ/4 wavelength film are polymerized by light irradiation, and the linear polarizing film and the λ/4 wavelength film are polymerized. The 4-wavelength film can be insolubilized and fixed.

In the above embodiment, the case where a linear polarizing film (linear polarizing plate) and a λ/4 wavelength film (λ/4 wave plate) are formed as optical films on a glass substrate is taken as an example in the case of manufacturing a circular polarizing plate used in OLED. Although described above, the present invention can be applied to others. For example, the present invention can be applied to a polarizing plate or a wave plate used in an LCD. In addition, the wave plate is not limited to the λ/4 wavelength film, and the present invention can be applied to other wave plates such as a λ/2 wavelength film, for example.

As mentioned above, although preferred embodiment of this invention was described referring an accompanying drawing, this invention is not limited to these examples, and various modified examples also belong to the technical scope of this invention.

1: Optical film forming device
10: application processing device
12: stage (substrate moving part)
13: stage driving unit (substrate moving unit)
14: application nozzle
15: discharge port
16: Nozzle driving unit (application nozzle moving unit)
17: recovery unit
18: control unit
20: second recovery unit (recovery unit)
21: cleaning processing unit (substrate circumferential edge processing unit)
100: reduced pressure drying device (first drying device)
300: heat treatment device (second drying device)
400: membrane anchoring device
500: membrane removal device
G: glass substrate
P1: Linear polarizing film (coating liquid)
P2: linear polarizing film
Q1: λ/4 wavelength film (coating liquid)
Q2: λ/4 wavelength film

Claims (8)

In the coating processing apparatus for applying a coating liquid containing an optical material to a substrate,
a substrate moving unit for holding and moving the substrate in one horizontal direction;
a long coating nozzle extending in a direction orthogonal to the moving direction of the substrate moving unit and discharging the coating liquid to the substrate held by the substrate moving unit;
an application nozzle moving unit for moving the application nozzle in an extension direction of the application nozzle;
A control unit for controlling the coating direction with respect to the substrate held by the substrate moving unit by controlling the moving speed of the substrate moving unit and the application nozzle moving unit.
have
A length of the application nozzle in the orthogonal direction is longer than a width of the substrate in the orthogonal direction. The coating processing apparatus according to claim 1, further comprising a collecting unit disposed below the coating nozzle and recovering the coating liquid discharged from the coating nozzle to the outside of the substrate held in the substrate moving unit. The method of claim 2, wherein the recovery unit,
An application processing device that is separately disposed below one end and the other end of the elongated application nozzle. The coating processing apparatus according to any one of claims 1 to 3, further comprising a substrate periphery processing unit that performs a predetermined treatment on the circumferential edge of the substrate under coating processing. The method of claim 4, wherein the substrate peripheral edge processing unit,
An application processing apparatus which is a cleaning processing unit that cleans a periphery of the substrate during application processing. The method of claim 4, wherein the substrate peripheral edge processing unit,
An application processing apparatus which is a peripheral film thickness adjustment unit that adjusts the film thickness of a coating film at the peripheral edge of the substrate during application processing. In the coating treatment method of applying a coating liquid containing an optical material to a substrate,
A first step of disposing an elongated coating nozzle extending longer than the width of the substrate at one end of the substrate;
A second step of discharging the coating liquid from the coating nozzle;
A third step of applying a coating treatment to the substrate by moving the substrate in a direction orthogonal to the stretching direction while moving the coating nozzle discharging the coating liquid in the stretching direction of the coating nozzle.
Including, the coating treatment method. In the optical film forming apparatus for forming an optical film on a substrate,
An application processing device for applying a coating liquid containing an optical material to the substrate;
a drying treatment device for drying the optical film made of the coating liquid applied by the coating treatment device;
a film fixing device for applying a fixing material of the optical film to a predetermined area of the optical film;
A film removal device for removing the optical film in an area where the fixing material is not applied.
have
The coating treatment device,
a substrate moving unit for holding and moving the substrate in one horizontal direction;
a long coating nozzle extending in a direction orthogonal to the moving direction of the substrate moving unit and discharging the coating liquid to the substrate held by the substrate moving unit;
an application nozzle moving unit for moving the application nozzle in an extension direction of the application nozzle;
Having a control unit for controlling the coating direction for the substrate held by the substrate moving unit by controlling the moving speed of the substrate moving unit and the application nozzle moving unit,
Optical film forming device.

Images