KR102440287B1 - Loading Apparatus Of Electronic Components And Test Apparatus - Google Patents

Abstract

The present invention relates to an electronic component attachment/detachment apparatus, wherein the electronic component test apparatus includes a first substrate on which an electronic component for testing is embedded, and a second substrate on which the first substrate is mounted. A detachable device for attaching and detaching from a second substrate, comprising: a locking means coupled to the first substrate; and an electronic component attaching/detaching means for contacting and interfacing with the first substrate, wherein the electronic component detaching means is the 'L' It is configured in the shape of a child, an up/down cylinder is installed on a flat part, and a locking/unlocking means having a locking means receiving/unlocking means into which the locking means of the first substrate is inserted and released in the vertical part, The locking means accommodating/releasing means includes an up/down unit installed inside the locking/unlocking means and a steel ball for locking installed in a side groove formed in the up/down unit.
Therefore, according to the device for attaching and detaching electronic components according to the present invention, the structure for holding the device under test is simple, and it is possible to secure a sense of stability, so that it is possible to test while attaching and detaching the device and components easily and conveniently compared to the prior art. do.

Description

Electronic component detachment device and test device using the same

The present invention relates to a device for attaching and detaching electronic components, and more specifically, the structure for holding the device under test is simple, and it is possible to secure a sense of stability. It can test, and when testing the device under test, the straightness is improved compared to the prior art, so the error rate is lowered, so the test effect can be improved, and it has the advantage of easy post-maintenance compared to the existing test device (A/S is It relates to an electronic component attachment/detachment device that can contribute to the localization of semiconductor-related components.

In the electronic component testing apparatus, a plurality of ICs accommodated in a tray are transferred into a handler, and each IC is electrically contacted with a socket provided in a high-fix of a test head, and a test is performed by a tester. Then, each IC after the end of the test is sorted into a corresponding customer tray based on the category of the test result.

A high-fix (interface device) that relays the electrical connection between the IC under test on the handler side and the test head is mounted on the upper part of the test head, and DSA (Device Specific Adapter: type correspondence) is mounted on the upper part of the high-fix. adapter) is installed. The DSA has a socket board, etc. on which sockets to which the input/output terminals of the IC under test are electrically contacted are mounted. The DSA is manufactured for each type according to the type of the IC chip under test, and needs to be replaced according to the type exchange of the IC chip. For this reason, a DSA attachment/detachment device for attaching and detaching the DSA from the high-fix main body is provided in the high-fix main body.

However, in the conventional device for testing electronic components, the structure of the coupling means, the actuator for supplying the driving force, and the transmission means for transmitting the driving force are complicated, and the structure of the holding device for holding the device under test is also complicated, and the stability is poor. There was a problem that an error would occur in the test of the device under test.

[Prior art literature]

Laid-Open Patent Publication No. 10-2008-0082997 (2008.09.12) (Title of the invention: detachable device, test head and electronic component testing device)

An object of the present invention is to provide a new type of electronic component attachment/detachment device that has a simple structure for holding a device under test and is capable of securing stability.

According to the present invention, when testing a device under test, straightness is improved compared to the prior art to provide an electronic component attachment/detachment device capable of improving the test effect by lowering the error rate.

In addition, according to the present invention, there is an advantage of easy post-maintenance compared to the existing test apparatus (simple after-sales service), and to provide an electronic component attachment and detachment device having an effect that can contribute to the localization of semiconductor-related components.

This object of the present invention is

An electronic component testing apparatus comprising a first substrate having a built-in test electronic component and a second substrate on which the first substrate is mounted, comprising: a detachable device for detaching the first substrate from the second substrate,

a locking means coupled to the first substrate;

and an electronic component attachment/detachment means for interviewing the first substrate in contact with each other,

The electronic component attachment and detachment means

It is composed of an 'L' shape, and up/down cylinders are installed on the flat part,

The vertical portion includes locking/unlocking means having locking means receiving/unlocking means into which the locking means of the first substrate are inserted and released,

The locking means receiving/releasing means includes an up/down unit installed inside the locking/unlocking means and a steel ball for locking installed in a side groove formed in the up/down unit,
When the locking/unlocking means is vertically moved, the internal up/down unit is also vertically moved, and a gap is created between the two components,
The steel ball is pushed down by the up/down unit to a slightly wider part at the lower end while simultaneously moving up and down the locking/unlocking means.
When pushed up by the locking means, a part is inserted into the side groove of the locking means and moved upward along the inner surface of the locking/unlocking means,
While the steel ball is interviewed on the inner surface of the locking/unlocking means with the side grooves of the locking means, there is provided an electronic component attachment/detachment device, characterized in that the contact performance is improved and the test performance is improved.

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In addition, the first substrate is a probe card or a stiffener, and the second substrate is a test head body.

According to another aspect of the present invention, there is provided an electronic component testing apparatus for testing the electrical characteristics of an electronic component under test,

The electronic component attachment/detachment means according to claim 1 electrically connected to the electronic component under test;

There is provided an electronic component testing apparatus characterized by inputting and operating a test signal to the electronic component under test through the electronic component attaching/detaching means, and inspecting the response signal.

As described above, according to the electronic component attachment and detachment device according to the present invention, the structure for holding the device under test is simple compared to the conventional rider, and there is an effect of ensuring a sense of stability.

In addition, according to the present invention, when testing the device under test, the straightness is improved compared to the prior art, and the error rate is lowered, so that the test effect can be improved.

In addition, according to the present invention, there is an advantage of easy post-maintenance compared to the existing test apparatus (easy after-sales service), and there is an effect that can contribute to the localization of semiconductor-related parts.

1 is a perspective view schematically showing an electronic component detaching device according to an embodiment of the present invention;
Figure 2 is a side cross-sectional view of the lock (LOCK) state of the electronic component attachment and detachment device according to an embodiment of the present invention;
3 is a plan view of FIG. 2
Figure 4 is a side cross-sectional view of the unlock (UNLOCK) state of the electronic component attachment and detachment device according to an embodiment of the present invention;
5 is a plan view of FIG. 4
6 is a perspective view schematically illustrating an electronic component detaching device according to another embodiment of the present invention;
7 is a side view of FIG. 6
8 is a detailed view showing the locked (LOCK) and unlocked (UNLOCK) state of the electronic component attachment and detachment device of FIG.
9 is a side view showing examples of a state in which a lock bar is mounted;
10 is a side view schematically showing a state in which the electronic component attachment/detachment device according to the present invention is combined with the product under test in the semiconductor test apparatus installed;
11 is a side view schematically illustrating a state in which the product under test is disassembled in the semiconductor test apparatus in which the electronic component attachment and detachment device according to the present invention is installed;
12 and 13 are perspective views schematically illustrating a probe card and a stiffener tested in a semiconductor test apparatus in which an electronic component attachment/detachment device according to the present invention is installed;

In an electronic component testing apparatus having a first substrate on which an electronic component for testing is built-in and a second substrate on which the first substrate is mounted, the electronic component attachment and detachment apparatus according to the present invention for achieving the above object, A detachable device for attaching and detaching the first substrate from the second substrate,

a locking means coupled to the first substrate;

and an electronic component attachment/detachment means for interviewing the first substrate in contact with each other.

1 is a perspective view schematically showing an electronic component attaching and detaching device according to an embodiment of the present invention, FIG. 2 is a side cross-sectional view of a locked state of an electronic component attaching and detaching device according to an embodiment of the present invention, FIG. 3 is 2 is a plan view, FIG. 4 is a side cross-sectional view of the unlocking (UNLOCK) state of the electronic component attachment and detachment device according to an embodiment of the present invention, FIG. 5 is a plan view of FIG.

1 to 5 , an electronic component attachment/detachment device according to an embodiment of the present invention is illustrated.

1 to 5, the electronic component detaching device 100 according to the present invention is an up-down cylinder 10, an up-down cylinder block 20, a lock/unlock cylinder 30, a lock/unlock unit (lock/unlock means) 40 , an up-down unit 50 , a locking block (locking means) 60 , and a steel ball 70 .

1 to 5 , in the electronic component testing apparatus including a first substrate on which an electronic component for testing is embedded, and a second substrate on which the first substrate is mounted, the first substrate is disposed on the first substrate. As a detachable device for attaching and detaching from two substrates,

a locking means (60) coupled to the first substrate;

and an electronic component attachment/detachment means for interviewing the first substrate in contact with each other,

The electronic component attachment and detachment means

It is composed of an 'L' shape, and the up/down cylinder 10 is installed on the flat part,

The vertical portion includes a locking/unlocking means 40 having a locking means receiving/unlocking means into which the locking means 60 of the first substrate is inserted and released,

The locking means accommodating/unlocking means includes an up/down unit installed inside the locking/unlocking means and a locking steel ball 70 installed in a side groove formed in the up/down unit.

The first substrate may be a probe card or a stiffener, and the second substrate may be a test head body.

Meanwhile, when the lock/unlock means 40 is vertically moved, the internal up/down unit 50 is also moved up and down, and a gap is created between the two components (see FIGS. 2 and 4 ). In addition, the steel ball 70 is pushed down by the up/down unit 50 up to a slightly wider part at the lower end while being pushed down at the same time as the locking/unlocking means 40 is up and down. Of course, when pushed up by the locking means 60, a part is inserted into the side groove of the locking means 60, and the lock/unlock means 40 moves upward along the inner surface. As a result, the steel ball 70 is interviewed with the side groove of the locking means 60 and the inner surface of the lock/unlock means 40 to improve contact performance and test performance.

Although not shown, the electronic component attachment/detachment device according to an embodiment of the present invention moves up and down in the vertical direction by receiving power, as can be seen through an embodiment to be described later. At this time, as the locking means 60 is inserted/unlocked into the locking/unlocking means 40, an electrical signal is transmitted from the device under test to the test device, through which the electronic component under test is tested and unlocked and detached after the test This is repeated.

In the following embodiments, a process for testing a semiconductor component will be described in more detail.

6 is a perspective view schematically showing an electronic component detaching device according to another embodiment of the present invention, FIG. 7 is a side view of FIG. 6, and FIG. It is a detailed view showing the UNLOCK state, and FIG. 9 is a side view showing examples of a state in which a lock bar is mounted.

6 to 9 , for sensing a step motor, an up sensor for sensing socket input/output, a down sensor, and a Ball Lock/Unlock state It includes an up sensor, a down sensor, and a cam follower to guide the screw up and down status. The overall configuration is the same as the device shown in FIG. 1, or there is only a partial difference, and the operation is almost the same.

A convex/unlock cylinder 30-1 is provided, a steel ball is mounted, and a ball screw is mounted. A lock bar 60-1 is fastened to the stiffener and the probe upper plate (see FIG. 9). The lock bar is positioned vertically below the device.

Referring to FIG. 8 , convex and unlocked states can be seen.

10 is a side view schematically showing a state coupled with a product under test in a semiconductor test apparatus in which an electronic component attachment/detachment device according to the present invention is installed, and FIG. A side view schematically illustrating a disassembled state of the product, FIGS. 12 and 13 are perspective views schematically illustrating a probe card and a stiffener tested in a semiconductor test apparatus in which an electronic component attachment/detachment device according to the present invention is installed.

10 to 13 , it can be seen that the device of FIG. 1 of the present invention is mounted at a partial position indicated by a circle in FIG. 10 .

In a state in which the electronic component detaching device according to the present invention is installed, the probe card and the stiffener to be tested are inserted through the locking means and tested, and disassembly can be made simply.

As described above, according to the electronic component attachment/detachment device according to the present invention, the structure for holding the device under test is simple, and it is possible to secure a sense of stability, so that the test while attaching and detaching the device under test and parts more easily and conveniently compared to the prior art be able to do

In addition, according to the present invention, when testing the device under test, the straightness is improved compared to the prior art, and the error rate is lowered, so that the test effect can be improved.

In addition, according to the present invention, there is an advantage of easy post-maintenance compared to the existing test apparatus (A/S is simple), and it can contribute to the localization of semiconductor-related parts.

And, as another temporary example of the present invention, as an electronic component testing apparatus for testing electrical characteristics of an electronic component under test, the electronic component attachment and detachment means according to claim 1 electrically connected to the electronic component under test, and the electronic component A test signal is inputted to the electronic component under test through a detachable means to operate, and the response signal is inspected.

Although the technical idea of the present invention has been described in detail according to the above preferred embodiments, it should be noted that the above-described embodiments are for explanation and not for limitation. In addition, those skilled in the art will understand that various embodiments are possible within the scope of the technical spirit of the present invention.

10. Up-Down Cylinder
20. Up-Down Cylinder Block
30. Lock/unlock cylinder
40. Lock/unlock unit
50. Up-Down Unit
60. Locking Block
70. steel ball

Claims (3)

An electronic component test apparatus comprising a first substrate on which an electronic component for testing is embedded and a second substrate on which the first substrate is mounted, wherein the electronic component attachment/detachment device for attaching and detaching the first substrate to and from the second substrate as,
a locking means coupled to the first substrate;
and an electronic component attachment/detachment means for interviewing the first substrate in contact with each other,
The electronic component attachment and detachment means
It is composed of an 'L' shape, and up/down cylinders are installed on the flat part,
The vertical portion includes locking/unlocking means having locking means receiving/unlocking means into which the locking means of the first substrate are inserted and released,
The locking means receiving/releasing means includes an up/down unit installed inside the locking/unlocking means and a steel ball for locking installed in a side groove formed in the up/down unit,
When the locking/unlocking means is vertically moved, the internal up/down unit is also vertically moved, and a gap is created between the two components,
The steel ball is pushed down by the up/down unit to a slightly wider part at the lower end while simultaneously moving up and down the locking/unlocking means.
When pushed up by the locking means, a part is inserted into the side groove of the locking means and moved upward along the inner surface of the locking/unlocking means,
The steel ball is interviewed on the side groove of the locking means and the inner surface of the lock/unlock means to improve contact performance and test performance.
The device of claim 1, wherein the first substrate is a probe card or a stiffener, and the second substrate is a test head body.
An electronic component testing device for testing the electrical characteristics of an electronic component under test, comprising:
The electronic component attachment/detachment means according to claim 1 electrically connected to the electronic component under test;
An electronic component testing apparatus, characterized in that inputting and operating a test signal to the electronic component under test through the electronic component attachment/detachment means, and inspects the response signal.

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