KR102404458B1 - 도금 장치 및 도금 처리 방법 - Google Patents
도금 장치 및 도금 처리 방법 Download PDFInfo
- Publication number
- KR102404458B1 KR102404458B1 KR1020217033189A KR20217033189A KR102404458B1 KR 102404458 B1 KR102404458 B1 KR 102404458B1 KR 1020217033189 A KR1020217033189 A KR 1020217033189A KR 20217033189 A KR20217033189 A KR 20217033189A KR 102404458 B1 KR102404458 B1 KR 102404458B1
- Authority
- KR
- South Korea
- Prior art keywords
- plating
- moving
- substrate
- substrate holder
- lifting
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2020/048113 WO2022137380A1 (ja) | 2020-12-23 | 2020-12-23 | めっき装置、およびめっき処理方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR102404458B1 true KR102404458B1 (ko) | 2022-06-07 |
Family
ID=76967986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020217033189A KR102404458B1 (ko) | 2020-12-23 | 2020-12-23 | 도금 장치 및 도금 처리 방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20220396895A1 (ja) |
JP (1) | JP6911220B1 (ja) |
KR (1) | KR102404458B1 (ja) |
CN (1) | CN114981484B (ja) |
WO (1) | WO2022137380A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102456153B1 (ko) * | 2022-07-22 | 2022-10-19 | 주식회사 에이치테크놀로지 | 도금 장치 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001316890A (ja) * | 2000-05-08 | 2001-11-16 | Tokyo Electron Ltd | メッキ処理方法及びメッキ処理装置 |
JP2002212784A (ja) * | 2001-01-12 | 2002-07-31 | Tokyo Electron Ltd | 電解メッキ装置及び電解メッキ方法 |
JP2003221700A (ja) * | 2002-01-31 | 2003-08-08 | Toppan Printing Co Ltd | 電気めっき装置及びめっき膜の形成方法 |
KR20100063248A (ko) * | 2008-12-03 | 2010-06-11 | 주식회사 케이씨텍 | 기판도금장치 및 그 방법 |
KR20120058717A (ko) * | 2010-11-30 | 2012-06-08 | 주식회사 케이씨텍 | 기판 도금 장치 |
JP2014051697A (ja) | 2012-09-05 | 2014-03-20 | Mitomo Semicon Engineering Kk | カップ式めっき装置及びこれを用いるめっき方法 |
KR20180092271A (ko) * | 2017-02-08 | 2018-08-17 | 가부시키가이샤 에바라 세이사꾸쇼 | 도금 장치 및 도금 장치와 함께 사용되는 기판 홀더 |
KR20200009359A (ko) * | 2018-07-18 | 2020-01-30 | 오성종 | 반도체 웨이퍼의 도금장치 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5982132A (en) * | 1997-10-09 | 1999-11-09 | Electroglas, Inc. | Rotary wafer positioning system and method |
JP4664320B2 (ja) * | 2000-03-17 | 2011-04-06 | 株式会社荏原製作所 | めっき方法 |
JP3979847B2 (ja) * | 2000-03-17 | 2007-09-19 | 株式会社荏原製作所 | めっき装置 |
US20050040049A1 (en) * | 2002-09-20 | 2005-02-24 | Rimma Volodarsky | Anode assembly for plating and planarizing a conductive layer |
JP4423359B2 (ja) * | 2004-01-30 | 2010-03-03 | 株式会社荏原製作所 | めっき方法 |
JP2007046092A (ja) * | 2005-08-09 | 2007-02-22 | Hyomen Shori System:Kk | シート状ワークの銅めっき装置および方法 |
JP2008019496A (ja) * | 2006-07-14 | 2008-01-31 | Matsushita Electric Ind Co Ltd | 電解めっき装置および電解めっき方法 |
US20140262028A1 (en) * | 2013-03-13 | 2014-09-18 | Intermolecular, Inc. | Non-Contact Wet-Process Cell Confining Liquid to a Region of a Solid Surface by Differential Pressure |
US20170260641A1 (en) * | 2014-11-25 | 2017-09-14 | Acm Research (Shanghai) Inc. | Apparatus and method for uniform metallization on substrate |
-
2020
- 2020-12-23 JP JP2021520236A patent/JP6911220B1/ja active Active
- 2020-12-23 CN CN202080027298.9A patent/CN114981484B/zh active Active
- 2020-12-23 US US17/442,864 patent/US20220396895A1/en active Pending
- 2020-12-23 WO PCT/JP2020/048113 patent/WO2022137380A1/ja active Application Filing
- 2020-12-23 KR KR1020217033189A patent/KR102404458B1/ko active IP Right Grant
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001316890A (ja) * | 2000-05-08 | 2001-11-16 | Tokyo Electron Ltd | メッキ処理方法及びメッキ処理装置 |
JP2002212784A (ja) * | 2001-01-12 | 2002-07-31 | Tokyo Electron Ltd | 電解メッキ装置及び電解メッキ方法 |
JP2003221700A (ja) * | 2002-01-31 | 2003-08-08 | Toppan Printing Co Ltd | 電気めっき装置及びめっき膜の形成方法 |
KR20100063248A (ko) * | 2008-12-03 | 2010-06-11 | 주식회사 케이씨텍 | 기판도금장치 및 그 방법 |
KR20120058717A (ko) * | 2010-11-30 | 2012-06-08 | 주식회사 케이씨텍 | 기판 도금 장치 |
JP2014051697A (ja) | 2012-09-05 | 2014-03-20 | Mitomo Semicon Engineering Kk | カップ式めっき装置及びこれを用いるめっき方法 |
KR20180092271A (ko) * | 2017-02-08 | 2018-08-17 | 가부시키가이샤 에바라 세이사꾸쇼 | 도금 장치 및 도금 장치와 함께 사용되는 기판 홀더 |
KR20200009359A (ko) * | 2018-07-18 | 2020-01-30 | 오성종 | 반도체 웨이퍼의 도금장치 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102456153B1 (ko) * | 2022-07-22 | 2022-10-19 | 주식회사 에이치테크놀로지 | 도금 장치 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2022137380A1 (ja) | 2022-06-30 |
JP6911220B1 (ja) | 2021-07-28 |
CN114981484B (zh) | 2023-06-13 |
WO2022137380A1 (ja) | 2022-06-30 |
CN114981484A (zh) | 2022-08-30 |
US20220396895A1 (en) | 2022-12-15 |
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