KR102404458B1 - 도금 장치 및 도금 처리 방법 - Google Patents

도금 장치 및 도금 처리 방법 Download PDF

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Publication number
KR102404458B1
KR102404458B1 KR1020217033189A KR20217033189A KR102404458B1 KR 102404458 B1 KR102404458 B1 KR 102404458B1 KR 1020217033189 A KR1020217033189 A KR 1020217033189A KR 20217033189 A KR20217033189 A KR 20217033189A KR 102404458 B1 KR102404458 B1 KR 102404458B1
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KR
South Korea
Prior art keywords
plating
moving
substrate
substrate holder
lifting
Prior art date
Application number
KR1020217033189A
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English (en)
Korean (ko)
Inventor
마사키 도미타
야스유키 마스다
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 가부시키가이샤 에바라 세이사꾸쇼 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Application granted granted Critical
Publication of KR102404458B1 publication Critical patent/KR102404458B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020217033189A 2020-12-23 2020-12-23 도금 장치 및 도금 처리 방법 KR102404458B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/048113 WO2022137380A1 (ja) 2020-12-23 2020-12-23 めっき装置、およびめっき処理方法

Publications (1)

Publication Number Publication Date
KR102404458B1 true KR102404458B1 (ko) 2022-06-07

Family

ID=76967986

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217033189A KR102404458B1 (ko) 2020-12-23 2020-12-23 도금 장치 및 도금 처리 방법

Country Status (5)

Country Link
US (1) US20220396895A1 (ja)
JP (1) JP6911220B1 (ja)
KR (1) KR102404458B1 (ja)
CN (1) CN114981484B (ja)
WO (1) WO2022137380A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102456153B1 (ko) * 2022-07-22 2022-10-19 주식회사 에이치테크놀로지 도금 장치

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001316890A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd メッキ処理方法及びメッキ処理装置
JP2002212784A (ja) * 2001-01-12 2002-07-31 Tokyo Electron Ltd 電解メッキ装置及び電解メッキ方法
JP2003221700A (ja) * 2002-01-31 2003-08-08 Toppan Printing Co Ltd 電気めっき装置及びめっき膜の形成方法
KR20100063248A (ko) * 2008-12-03 2010-06-11 주식회사 케이씨텍 기판도금장치 및 그 방법
KR20120058717A (ko) * 2010-11-30 2012-06-08 주식회사 케이씨텍 기판 도금 장치
JP2014051697A (ja) 2012-09-05 2014-03-20 Mitomo Semicon Engineering Kk カップ式めっき装置及びこれを用いるめっき方法
KR20180092271A (ko) * 2017-02-08 2018-08-17 가부시키가이샤 에바라 세이사꾸쇼 도금 장치 및 도금 장치와 함께 사용되는 기판 홀더
KR20200009359A (ko) * 2018-07-18 2020-01-30 오성종 반도체 웨이퍼의 도금장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5982132A (en) * 1997-10-09 1999-11-09 Electroglas, Inc. Rotary wafer positioning system and method
JP4664320B2 (ja) * 2000-03-17 2011-04-06 株式会社荏原製作所 めっき方法
JP3979847B2 (ja) * 2000-03-17 2007-09-19 株式会社荏原製作所 めっき装置
US20050040049A1 (en) * 2002-09-20 2005-02-24 Rimma Volodarsky Anode assembly for plating and planarizing a conductive layer
JP4423359B2 (ja) * 2004-01-30 2010-03-03 株式会社荏原製作所 めっき方法
JP2007046092A (ja) * 2005-08-09 2007-02-22 Hyomen Shori System:Kk シート状ワークの銅めっき装置および方法
JP2008019496A (ja) * 2006-07-14 2008-01-31 Matsushita Electric Ind Co Ltd 電解めっき装置および電解めっき方法
US20140262028A1 (en) * 2013-03-13 2014-09-18 Intermolecular, Inc. Non-Contact Wet-Process Cell Confining Liquid to a Region of a Solid Surface by Differential Pressure
US20170260641A1 (en) * 2014-11-25 2017-09-14 Acm Research (Shanghai) Inc. Apparatus and method for uniform metallization on substrate

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001316890A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd メッキ処理方法及びメッキ処理装置
JP2002212784A (ja) * 2001-01-12 2002-07-31 Tokyo Electron Ltd 電解メッキ装置及び電解メッキ方法
JP2003221700A (ja) * 2002-01-31 2003-08-08 Toppan Printing Co Ltd 電気めっき装置及びめっき膜の形成方法
KR20100063248A (ko) * 2008-12-03 2010-06-11 주식회사 케이씨텍 기판도금장치 및 그 방법
KR20120058717A (ko) * 2010-11-30 2012-06-08 주식회사 케이씨텍 기판 도금 장치
JP2014051697A (ja) 2012-09-05 2014-03-20 Mitomo Semicon Engineering Kk カップ式めっき装置及びこれを用いるめっき方法
KR20180092271A (ko) * 2017-02-08 2018-08-17 가부시키가이샤 에바라 세이사꾸쇼 도금 장치 및 도금 장치와 함께 사용되는 기판 홀더
KR20200009359A (ko) * 2018-07-18 2020-01-30 오성종 반도체 웨이퍼의 도금장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102456153B1 (ko) * 2022-07-22 2022-10-19 주식회사 에이치테크놀로지 도금 장치

Also Published As

Publication number Publication date
JPWO2022137380A1 (ja) 2022-06-30
JP6911220B1 (ja) 2021-07-28
CN114981484B (zh) 2023-06-13
WO2022137380A1 (ja) 2022-06-30
CN114981484A (zh) 2022-08-30
US20220396895A1 (en) 2022-12-15

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