KR102391577B1 - 세라믹 부품의 제조 방법 및 이의 제조 장치 - Google Patents
세라믹 부품의 제조 방법 및 이의 제조 장치 Download PDFInfo
- Publication number
- KR102391577B1 KR102391577B1 KR1020200008243A KR20200008243A KR102391577B1 KR 102391577 B1 KR102391577 B1 KR 102391577B1 KR 1020200008243 A KR1020200008243 A KR 1020200008243A KR 20200008243 A KR20200008243 A KR 20200008243A KR 102391577 B1 KR102391577 B1 KR 102391577B1
- Authority
- KR
- South Korea
- Prior art keywords
- ceramic
- heating
- manufacturing
- ceramic plate
- cutting
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 163
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 58
- 238000010438 heat treatment Methods 0.000 claims abstract description 84
- 238000005520 cutting process Methods 0.000 claims description 46
- 238000000034 method Methods 0.000 claims description 39
- 238000001816 cooling Methods 0.000 claims description 15
- 230000006698 induction Effects 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 3
- 239000000047 product Substances 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 9
- 239000011230 binding agent Substances 0.000 description 8
- 230000007547 defect Effects 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000007646 gravure printing Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920005596 polymer binder Polymers 0.000 description 1
- 239000002491 polymer binding agent Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020200008243A KR102391577B1 (ko) | 2020-01-22 | 2020-01-22 | 세라믹 부품의 제조 방법 및 이의 제조 장치 |
JP2020090887A JP2021118346A (ja) | 2020-01-22 | 2020-05-25 | セラミック部品の製造方法及びその製造装置 |
CN202010737618.1A CN113241257A (zh) | 2020-01-22 | 2020-07-28 | 陶瓷部件的制造方法及陶瓷部件的制造装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020200008243A KR102391577B1 (ko) | 2020-01-22 | 2020-01-22 | 세라믹 부품의 제조 방법 및 이의 제조 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20210094717A KR20210094717A (ko) | 2021-07-30 |
KR102391577B1 true KR102391577B1 (ko) | 2022-04-28 |
Family
ID=77129845
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020200008243A KR102391577B1 (ko) | 2020-01-22 | 2020-01-22 | 세라믹 부품의 제조 방법 및 이의 제조 장치 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2021118346A (zh) |
KR (1) | KR102391577B1 (zh) |
CN (1) | CN113241257A (zh) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002231571A (ja) * | 2001-01-30 | 2002-08-16 | Matsushita Electric Ind Co Ltd | 積層セラミック電子部品の製造方法 |
JP2006321702A (ja) * | 2005-04-18 | 2006-11-30 | Kyocera Corp | セラミック部材とその製造方法およびこれを用いた電子部品 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57132913A (en) * | 1981-02-05 | 1982-08-17 | Sumitomo Heavy Ind Ltd | Cutting-off equipment with local heating |
JPH01122408A (ja) * | 1987-11-06 | 1989-05-15 | Ngk Insulators Ltd | セラミック・グリーンシートの切断加工方法 |
JP2000124090A (ja) * | 1998-10-19 | 2000-04-28 | Tdk Corp | セラミック積層体の切断方法 |
DE19851353C1 (de) * | 1998-11-06 | 1999-10-07 | Schott Glas | Verfahren und Vorrichtung zum Schneiden eines Laminats aus einem sprödbrüchigen Werkstoff und einem Kunststoff |
JP4656602B2 (ja) * | 2005-09-22 | 2011-03-23 | Tdk株式会社 | グリーンシート積層体の切断装置及び切断方法 |
WO2008010303A1 (fr) * | 2006-07-20 | 2008-01-24 | Takita Research & Development Co., Ltd. | Dispositif de coupe |
JP5266166B2 (ja) * | 2009-08-31 | 2013-08-21 | 富士フイルム株式会社 | 透明ポリマーフィルムの裁断方法 |
JP2017034158A (ja) * | 2015-08-04 | 2017-02-09 | 株式会社村田製作所 | セラミック成形体の切断装置および積層セラミック電子部品の製造方法 |
JP6814033B2 (ja) * | 2016-11-25 | 2021-01-13 | リンテック株式会社 | 切断装置および切断方法 |
-
2020
- 2020-01-22 KR KR1020200008243A patent/KR102391577B1/ko active IP Right Grant
- 2020-05-25 JP JP2020090887A patent/JP2021118346A/ja active Pending
- 2020-07-28 CN CN202010737618.1A patent/CN113241257A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002231571A (ja) * | 2001-01-30 | 2002-08-16 | Matsushita Electric Ind Co Ltd | 積層セラミック電子部品の製造方法 |
JP2006321702A (ja) * | 2005-04-18 | 2006-11-30 | Kyocera Corp | セラミック部材とその製造方法およびこれを用いた電子部品 |
Also Published As
Publication number | Publication date |
---|---|
CN113241257A (zh) | 2021-08-10 |
JP2021118346A (ja) | 2021-08-10 |
KR20210094717A (ko) | 2021-07-30 |
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GRNT | Written decision to grant |