KR102372561B1 - 감광성 열경화성 수지 조성물 및 플렉시블 프린트 배선판 - Google Patents

감광성 열경화성 수지 조성물 및 플렉시블 프린트 배선판 Download PDF

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Publication number
KR102372561B1
KR102372561B1 KR1020167003054A KR20167003054A KR102372561B1 KR 102372561 B1 KR102372561 B1 KR 102372561B1 KR 1020167003054 A KR1020167003054 A KR 1020167003054A KR 20167003054 A KR20167003054 A KR 20167003054A KR 102372561 B1 KR102372561 B1 KR 102372561B1
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KR
South Korea
Prior art keywords
bis
resin composition
dianhydride
resin
thermosetting resin
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KR1020167003054A
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English (en)
Korean (ko)
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KR20160029111A (ko
Inventor
히데카즈 미야베
마코토 하야시
유타카 요코야마
나오유키 고이케
Original Assignee
다이요 잉키 세이조 가부시키가이샤
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Publication of KR20160029111A publication Critical patent/KR20160029111A/ko
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Publication of KR102372561B1 publication Critical patent/KR102372561B1/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Optics & Photonics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020167003054A 2013-07-09 2014-06-17 감광성 열경화성 수지 조성물 및 플렉시블 프린트 배선판 KR102372561B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2013-144034 2013-07-09
JP2013144034A JP6306296B2 (ja) 2013-07-09 2013-07-09 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板
PCT/JP2014/066078 WO2015005077A1 (fr) 2013-07-09 2014-06-17 Composition de résine thermodurcissable photosensible et carte de circuits imprimés flexible

Publications (2)

Publication Number Publication Date
KR20160029111A KR20160029111A (ko) 2016-03-14
KR102372561B1 true KR102372561B1 (ko) 2022-03-10

Family

ID=52279763

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167003054A KR102372561B1 (ko) 2013-07-09 2014-06-17 감광성 열경화성 수지 조성물 및 플렉시블 프린트 배선판

Country Status (5)

Country Link
JP (1) JP6306296B2 (fr)
KR (1) KR102372561B1 (fr)
CN (1) CN105378564B (fr)
TW (1) TWI637665B (fr)
WO (1) WO2015005077A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6363861B2 (ja) * 2014-03-31 2018-07-25 太陽インキ製造株式会社 硬化性樹脂組成物、そのドライフィルムおよび硬化物、並びにそれらを用いて形成された硬化被膜を有するプリント配線板
TWI652281B (zh) * 2015-02-18 2019-03-01 日商住友電木股份有限公司 含有光產鹼劑的光可成像聚烯烴組成物
KR102040224B1 (ko) * 2016-08-09 2019-11-06 주식회사 엘지화학 절연층 제조방법 및 다층인쇄회로기판 제조방법
WO2018030761A1 (fr) * 2016-08-09 2018-02-15 주식회사 엘지화학 Procédé de production de couche isolante et procédé de production de carte de circuit imprimé multicouche
WO2018043262A1 (fr) * 2016-08-31 2018-03-08 富士フイルム株式会社 Procédé de formation de motifs, procédé de fabrication d'un stratifié, et procédé de fabrication d'un dispositif électronique
KR102040225B1 (ko) * 2016-11-11 2019-11-06 주식회사 엘지화학 절연층 제조방법 및 다층인쇄회로기판 제조방법
WO2018088754A1 (fr) * 2016-11-11 2018-05-17 주식회사 엘지화학 Procédé de fabrication de couche isolante et procédé de fabrication de carte de circuit imprimé multicouche
KR102207604B1 (ko) * 2018-11-06 2021-01-26 (주)이녹스첨단소재 Fpic 필름 및 이의 제조방법
CN110239163B (zh) * 2019-06-13 2021-01-08 东莞市政潮电子科技有限公司 一种提高PI膜与Cu箔间粘结性能的柔性印刷电路板基材

Citations (4)

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JP2009009107A (ja) * 2007-05-25 2009-01-15 Toray Ind Inc 感光性樹脂組成物
JP2009258471A (ja) * 2008-04-18 2009-11-05 Toray Ind Inc 感光性樹脂組成物フィルムおよびそれを用いたレジスト形成方法
JP2010020264A (ja) * 2007-08-09 2010-01-28 Nichigo Morton Co Ltd ソルダーレジストフィルム、レジストパターン形成方法および発光装置
WO2012005079A1 (fr) 2010-07-09 2012-01-12 東レ株式会社 Composition adhésive photosensible, film adhésif photosensible et dispositif semi-conducteur les comprenant

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JPS62263692A (ja) 1986-05-12 1987-11-16 ニツポン高度紙工業株式会社 耐熱性フレキシブルプリント配線板
JPS63110224A (ja) 1986-10-27 1988-05-14 Dainippon Printing Co Ltd フレキシブルオ−バ−レイフイルム
TW436491B (en) * 1997-08-22 2001-05-28 Ciba Sc Holding Ag Compositions for use in base-catalysed reactions, a process for curing said compostions and a process for photochemically generating bases in base catalysed polymeriaztion reactions
JP4191956B2 (ja) * 2002-05-24 2008-12-03 サンノプコ株式会社 感光性樹脂組成物
TWI398724B (zh) * 2005-03-15 2013-06-11 Toray Industries 感光性樹脂組成物
EP1909142B1 (fr) * 2005-06-30 2015-06-24 Toray Industries, Inc. Composition de résine photosensible et amplificateur d adhésion
KR20090038390A (ko) * 2006-07-11 2009-04-20 니폰 가야꾸 가부시끼가이샤 감광성 알칼리 수용액 가용형 폴리이미드 수지 및 이를 함유하는 감광성 수지 조성물
JP5402332B2 (ja) * 2009-07-09 2014-01-29 東レ株式会社 感光性樹脂組成物、感光性樹脂組成物フィルムおよびそれを用いた多層配線基板
JP5740915B2 (ja) * 2010-10-28 2015-07-01 東レ株式会社 フィルム積層体
WO2013171888A1 (fr) * 2012-05-17 2013-11-21 太陽インキ製造株式会社 Composition de résine thermodurcissable de type développement alcalin et carte de circuit imprimé

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009009107A (ja) * 2007-05-25 2009-01-15 Toray Ind Inc 感光性樹脂組成物
JP2010020264A (ja) * 2007-08-09 2010-01-28 Nichigo Morton Co Ltd ソルダーレジストフィルム、レジストパターン形成方法および発光装置
JP2009258471A (ja) * 2008-04-18 2009-11-05 Toray Ind Inc 感光性樹脂組成物フィルムおよびそれを用いたレジスト形成方法
WO2012005079A1 (fr) 2010-07-09 2012-01-12 東レ株式会社 Composition adhésive photosensible, film adhésif photosensible et dispositif semi-conducteur les comprenant

Also Published As

Publication number Publication date
TWI637665B (zh) 2018-10-01
WO2015005077A1 (fr) 2015-01-15
CN105378564B (zh) 2020-02-07
TW201519708A (zh) 2015-05-16
JP2015018049A (ja) 2015-01-29
KR20160029111A (ko) 2016-03-14
CN105378564A (zh) 2016-03-02
JP6306296B2 (ja) 2018-04-04

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