KR102293749B1 - 다이싱 필름 기재 및 다이싱 필름 - Google Patents
다이싱 필름 기재 및 다이싱 필름 Download PDFInfo
- Publication number
- KR102293749B1 KR102293749B1 KR1020197018726A KR20197018726A KR102293749B1 KR 102293749 B1 KR102293749 B1 KR 102293749B1 KR 1020197018726 A KR1020197018726 A KR 1020197018726A KR 20197018726 A KR20197018726 A KR 20197018726A KR 102293749 B1 KR102293749 B1 KR 102293749B1
- Authority
- KR
- South Korea
- Prior art keywords
- resin
- unsaturated carboxylic
- ethylene
- carboxylic acid
- mass
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016253244 | 2016-12-27 | ||
JPJP-P-2016-253244 | 2016-12-27 | ||
PCT/JP2017/045918 WO2018123804A1 (ja) | 2016-12-27 | 2017-12-21 | ダイシングフィルム基材およびダイシングフィルム |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20190091297A KR20190091297A (ko) | 2019-08-05 |
KR102293749B1 true KR102293749B1 (ko) | 2021-08-26 |
Family
ID=62710436
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020197018726A KR102293749B1 (ko) | 2016-12-27 | 2017-12-21 | 다이싱 필름 기재 및 다이싱 필름 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6667671B2 (ja) |
KR (1) | KR102293749B1 (ja) |
CN (1) | CN110178203B (ja) |
TW (1) | TWI736728B (ja) |
WO (1) | WO2018123804A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102483810B1 (ko) * | 2018-08-08 | 2023-01-03 | 미츠이·다우 폴리케미칼 가부시키가이샤 | 다이싱 필름 기재용 수지 조성물, 다이싱 필름 기재 및 다이싱 필름 |
JP7052045B2 (ja) * | 2018-08-10 | 2022-04-11 | 三井・ダウポリケミカル株式会社 | 熱可塑性ポリウレタンエラストマー組成物および積層体 |
WO2022196392A1 (ja) * | 2021-03-18 | 2022-09-22 | 三井・ダウポリケミカル株式会社 | ダイシングフィルム基材用樹脂組成物、ダイシングフィルム基材、およびダイシングフィルム |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012089732A (ja) | 2010-10-21 | 2012-05-10 | Achilles Corp | 半導体製造工程用テープの基材フィルム |
WO2013099778A1 (ja) | 2011-12-26 | 2013-07-04 | 三井・デュポンポリケミカル株式会社 | レーザーダイシング用フィルム基材、レーザーダイシング用フィルム、及び電子部品の製造方法 |
JP2013158098A (ja) | 2012-01-27 | 2013-08-15 | Mitsubishi Heavy Ind Ltd | 発電システム及びその制御方法並びに制御プログラム |
JP2013168258A (ja) | 2012-02-15 | 2013-08-29 | Nitto Denko Corp | 導電性を有する伸長性有機基材 |
JP2015109436A (ja) | 2013-10-23 | 2015-06-11 | リンテック株式会社 | ダイシングシート |
WO2015193991A1 (ja) | 2014-06-18 | 2015-12-23 | リンテック株式会社 | ダイシングシート用基材フィルムおよびダイシングシート |
JP2017098369A (ja) | 2015-11-20 | 2017-06-01 | 三井・デュポンポリケミカル株式会社 | ダイシングフィルム基材用樹脂組成物、ダイシングフィルム基材およびダイシングフィルム |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3014518B2 (ja) * | 1991-11-12 | 2000-02-28 | 古河電気工業株式会社 | 半導体ウエハ固定用粘着テープ |
US5866658A (en) | 1996-08-26 | 1999-02-02 | E. I. Du Pont De Nemours And Company | High performance ionomer blends |
JP4578050B2 (ja) * | 2001-09-04 | 2010-11-10 | グンゼ株式会社 | ウェハダイシングテープ用基材 |
JP2007084722A (ja) * | 2005-09-22 | 2007-04-05 | Nitto Denko Corp | 粘着シートとその製造方法、及び、製品の加工方法 |
KR20080062642A (ko) * | 2006-12-29 | 2008-07-03 | 제일모직주식회사 | 점착제, 점착제 조성물 및 그로부터 제조되는 다이싱 필름 |
JP2011210887A (ja) | 2010-03-29 | 2011-10-20 | Furukawa Electric Co Ltd:The | 放射線硬化型ウエハ加工用粘着テープ |
KR101845857B1 (ko) * | 2010-07-28 | 2018-05-18 | 듀폰-미츠이 폴리케미칼 가부시키가이샤 | 적층 필름 및 그것을 사용한 반도체 제조용 필름 |
JPWO2014103467A1 (ja) * | 2012-12-28 | 2017-01-12 | リンテック株式会社 | ダイシングシート用基材フィルムおよびダイシングシート |
JP6110877B2 (ja) * | 2012-12-28 | 2017-04-05 | リンテック株式会社 | ダイシングシート用基材フィルムおよびダイシングシート |
KR20150126009A (ko) * | 2013-03-04 | 2015-11-10 | 린텍 가부시키가이샤 | 다이싱 시트용 기재 필름 및 해당 기재 필름을 구비한 다이싱 시트 |
JP6472972B2 (ja) * | 2013-10-23 | 2019-02-20 | 三井・デュポンポリケミカル株式会社 | ダイシングテープ基材用樹脂組成物およびダイシングテープ基材 |
-
2017
- 2017-12-21 JP JP2018559117A patent/JP6667671B2/ja active Active
- 2017-12-21 CN CN201780080673.4A patent/CN110178203B/zh active Active
- 2017-12-21 KR KR1020197018726A patent/KR102293749B1/ko active IP Right Grant
- 2017-12-21 WO PCT/JP2017/045918 patent/WO2018123804A1/ja active Application Filing
- 2017-12-26 TW TW106145749A patent/TWI736728B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012089732A (ja) | 2010-10-21 | 2012-05-10 | Achilles Corp | 半導体製造工程用テープの基材フィルム |
WO2013099778A1 (ja) | 2011-12-26 | 2013-07-04 | 三井・デュポンポリケミカル株式会社 | レーザーダイシング用フィルム基材、レーザーダイシング用フィルム、及び電子部品の製造方法 |
JP2013158098A (ja) | 2012-01-27 | 2013-08-15 | Mitsubishi Heavy Ind Ltd | 発電システム及びその制御方法並びに制御プログラム |
JP2013168258A (ja) | 2012-02-15 | 2013-08-29 | Nitto Denko Corp | 導電性を有する伸長性有機基材 |
JP2015109436A (ja) | 2013-10-23 | 2015-06-11 | リンテック株式会社 | ダイシングシート |
WO2015193991A1 (ja) | 2014-06-18 | 2015-12-23 | リンテック株式会社 | ダイシングシート用基材フィルムおよびダイシングシート |
JP2017098369A (ja) | 2015-11-20 | 2017-06-01 | 三井・デュポンポリケミカル株式会社 | ダイシングフィルム基材用樹脂組成物、ダイシングフィルム基材およびダイシングフィルム |
Also Published As
Publication number | Publication date |
---|---|
CN110178203B (zh) | 2023-05-23 |
WO2018123804A1 (ja) | 2018-07-05 |
JPWO2018123804A1 (ja) | 2019-10-31 |
JP6667671B2 (ja) | 2020-03-18 |
TWI736728B (zh) | 2021-08-21 |
KR20190091297A (ko) | 2019-08-05 |
TW201840434A (zh) | 2018-11-16 |
CN110178203A (zh) | 2019-08-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6554708B2 (ja) | ダイシングフィルム基材用樹脂組成物、ダイシングフィルム基材およびダイシングフィルム | |
JP6247733B2 (ja) | レーザーダイシング用フィルム基材、レーザーダイシング用フィルム、及び電子部品の製造方法 | |
JP6617215B2 (ja) | ダイシングシート | |
TWI498215B (zh) | A laminated film, and a thin film for manufacturing a semiconductor thereof | |
JP6472972B2 (ja) | ダイシングテープ基材用樹脂組成物およびダイシングテープ基材 | |
KR102293749B1 (ko) | 다이싱 필름 기재 및 다이싱 필름 | |
CN112236469B (zh) | 切割膜基材用树脂组合物、切割膜基材及切割膜 | |
KR20140039041A (ko) | 반도체 가공시트용 기재필름, 반도체 가공시트 및 반도체 장치의 제조방법 | |
WO2022196392A1 (ja) | ダイシングフィルム基材用樹脂組成物、ダイシングフィルム基材、およびダイシングフィルム | |
JPH05148462A (ja) | 半導体ウエハ固定用粘着テープ | |
JPH05263048A (ja) | 半導体ウエハ固定用粘着テープ | |
JP2022167401A (ja) | バックグラインド工程用フィルム | |
JP2022093019A (ja) | 複層フィルム、粘着フィルム及び半導体製造工程用粘着フィルム |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right |