KR102214368B1 - 반송 장치 - Google Patents

반송 장치 Download PDF

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Publication number
KR102214368B1
KR102214368B1 KR1020150085133A KR20150085133A KR102214368B1 KR 102214368 B1 KR102214368 B1 KR 102214368B1 KR 1020150085133 A KR1020150085133 A KR 1020150085133A KR 20150085133 A KR20150085133 A KR 20150085133A KR 102214368 B1 KR102214368 B1 KR 102214368B1
Authority
KR
South Korea
Prior art keywords
workpiece
chuck
pressing
wafer
suction
Prior art date
Application number
KR1020150085133A
Other languages
English (en)
Korean (ko)
Other versions
KR20150144713A (ko
Inventor
고키치 미나토
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JPJP-P-2014-124362 priority Critical
Priority to JP2014124362A priority patent/JP6335672B2/ja
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20150144713A publication Critical patent/KR20150144713A/ko
Application granted granted Critical
Publication of KR102214368B1 publication Critical patent/KR102214368B1/ko

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/34Accessories
    • B24B37/345Feeding, loading or unloading work specially adapted to lapping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers
    • B24B37/30Work carriers for single side lapping of plane surfaces
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
KR1020150085133A 2014-06-17 2015-06-16 반송 장치 KR102214368B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-124362 2014-06-17
JP2014124362A JP6335672B2 (ja) 2014-06-17 2014-06-17 搬送装置

Publications (2)

Publication Number Publication Date
KR20150144713A KR20150144713A (ko) 2015-12-28
KR102214368B1 true KR102214368B1 (ko) 2021-02-08

Family

ID=54944289

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150085133A KR102214368B1 (ko) 2014-06-17 2015-06-16 반송 장치

Country Status (4)

Country Link
JP (1) JP6335672B2 (zh)
KR (1) KR102214368B1 (zh)
CN (1) CN105196162B (zh)
TW (1) TWI649157B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6761271B2 (ja) * 2016-04-05 2020-09-23 キヤノン株式会社 処理装置及び物品の製造方法
JP6696851B2 (ja) * 2016-07-13 2020-05-20 株式会社ディスコ チャックテーブル機構
JP6855217B2 (ja) * 2016-11-04 2021-04-07 株式会社東京精密 ウエハの搬送保持装置
CN108615697B (zh) * 2016-12-09 2020-11-03 矽电半导体设备(深圳)股份有限公司 自动上下芯片装置
JP2018126830A (ja) * 2017-02-09 2018-08-16 株式会社ディスコ 加工装置
TWI647782B (zh) * 2018-05-16 2019-01-11 力成科技股份有限公司 面板級扇出型封裝之真空定位設備

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009107097A (ja) * 2007-10-31 2009-05-21 Disco Abrasive Syst Ltd 加工装置
JP2011020215A (ja) * 2009-07-15 2011-02-03 Disco Abrasive Syst Ltd 加工装置
KR101019469B1 (ko) * 2003-01-29 2011-03-07 미쓰보시 다이야몬도 고교 가부시키가이샤 진공흡착 헤드

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005109057A (ja) 2003-09-30 2005-04-21 Okamoto Machine Tool Works Ltd 基板搬送器具
JP2006019566A (ja) 2004-07-02 2006-01-19 Toshiba Corp 半導体基板吸着ハンド及びその操作方法
JP2010153419A (ja) * 2008-12-24 2010-07-08 Ushio Inc ワークステージおよびこのワークステージを使った露光装置
JP2011135026A (ja) * 2009-11-27 2011-07-07 Disco Abrasive Syst Ltd ワークユニットの保持方法および保持機構
JP5669518B2 (ja) * 2010-10-18 2015-02-12 株式会社ディスコ ウエーハ搬送機構

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101019469B1 (ko) * 2003-01-29 2011-03-07 미쓰보시 다이야몬도 고교 가부시키가이샤 진공흡착 헤드
JP2009107097A (ja) * 2007-10-31 2009-05-21 Disco Abrasive Syst Ltd 加工装置
JP2011020215A (ja) * 2009-07-15 2011-02-03 Disco Abrasive Syst Ltd 加工装置

Also Published As

Publication number Publication date
KR20150144713A (ko) 2015-12-28
TWI649157B (zh) 2019-02-01
CN105196162B (zh) 2019-03-08
TW201603947A (zh) 2016-02-01
JP2016004909A (ja) 2016-01-12
CN105196162A (zh) 2015-12-30
JP6335672B2 (ja) 2018-05-30

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