KR102108309B1 - Air cleaning apparatus using guide-vane module and 3d mesh grid - Google Patents

Air cleaning apparatus using guide-vane module and 3d mesh grid Download PDF

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Publication number
KR102108309B1
KR102108309B1 KR1020180022717A KR20180022717A KR102108309B1 KR 102108309 B1 KR102108309 B1 KR 102108309B1 KR 1020180022717 A KR1020180022717 A KR 1020180022717A KR 20180022717 A KR20180022717 A KR 20180022717A KR 102108309 B1 KR102108309 B1 KR 102108309B1
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South Korea
Prior art keywords
mesh
gas
module
frame
cone
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KR1020180022717A
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Korean (ko)
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KR20190102394A (en
Inventor
윤금수
김현호
노학재
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(주)명성씨.엠.아이
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Priority to KR1020180022717A priority Critical patent/KR102108309B1/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D47/00Separating dispersed particles from gases, air or vapours by liquid as separating agent
    • B01D47/06Spray cleaning
    • B01D47/063Spray cleaning with two or more jets impinging against each other
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34Chemical or biological purification of waste gases
    • B01D53/74General processes for purification of waste gases; Apparatus or devices specially adapted therefor
    • B01D53/77Liquid phase processes
    • B01D53/78Liquid phase processes with gas-liquid contact

Abstract

The present invention relates to an exhaust gas treatment system for removing contaminants generated in a semiconductor manufacturing process, and more specifically, to purify a housing, a nozzle provided in the housing, where the cleaning liquid is divided, and the inflowing air in contact with the cleaning liquid Containing a filter module, by combining the filter module with a guide van module and a 3D mesh grid, the semiconductor exhaust gas is made to reduce contaminated gas through the gas-liquid mixing effect and the venturi effect together with the sprayed cleaning liquid. It relates to a processing system.

Description

A semiconductor exhaust gas treatment system equipped with a filter module that combines a guide van module and a 3D mesh grid {AIR CLEANING APPARATUS USING GUIDE-VANE MODULE AND 3D MESH GRID}

The present invention relates to an exhaust gas treatment system for removing contaminants generated in a semiconductor manufacturing process, and more specifically, to purify a housing, a nozzle provided in the housing, where the cleaning liquid is divided, and the inflowing air in contact with the cleaning liquid Containing a filter module, by combining the filter module with a guide van module and a 3D mesh grid, the semiconductor exhaust gas is made to reduce contaminated gas through the gas-liquid mixing effect and the venturi effect together with the sprayed cleaning liquid. It relates to a processing system.

Currently, in the semiconductor process using various hazardous chemicals, various harmful chemicals such as hydrochloric acid, hydrofluoric acid, and ammonia are discharged as exhaust gas, and a cleaning dust collector is installed at the final stage to remove these exhaust gases. However, these facilities have many difficulties due to limitations in processing efficiency and structural problems, and there is a need for an alternative to solve them.

Actually, harmful substances generated in each process of semiconductor manufacturing are converted into stable particles and gaseous substances through oxidation processes such as combustion due to environmental and safety issues, and then passed through a scrubber for temperature reduction and primary removal of high concentration pollutants. As it is being discharged, the final concentration of pollutant emission is determined according to the efficiency of the scrubber system.

However, due to the rapid response to environmental regulations that have recently been strengthened and the formation of residential areas around the industry, the company's own pollution regulations are being strengthened, but there is a lack of on-site application facilities to meet them. In addition, it can be said that the market for air-conditioning equipment has been activated due to the development of various technologies, but practically new technologies applied to the site are in short supply compared to development, which satisfies consumers in terms of specific conditions, capacity, and cost. I cannot do it.

In the case of the conventional filling layer type cleaning dust collector currently being used most, the treatment efficiency is about 60 to 80%, which is due to absorption and removal due to the diffusion effect of gaseous materials rather than removal of particulate matter. In addition, in order to increase the reduction effect, it can be considered that the performance of the facility is evaluated in the use of water and filler, and for this reason, in order to satisfy the reduction effect of pollutants, the reaction section is widened and the amount of water used is excessively installed. However, due to the enormous size of facilities, the actual site suffers from shortages of installation sites and many difficulties with energy consumption, and due to packing maintenance, anxiety about industrial safety and maintenance for people entering the facilities directly The situation is a waste of time resources. Therefore, the optimal design method of a compact structure that can obtain high-efficiency expectations to remove particles and gaseous substances generated in the semiconductor process and the development of a dust collection facility that can be supplemented without replacing the entire existing facility and can also reduce energy consumption This is necessary. In addition, the technology can be used to suit the emission characteristics of various industrial facilities, and it is urgent to develop a dust collection facility with a structure that is easy to maintain and compensates for the disadvantages of existing facilities, and reduces maintenance and processing costs.

Therefore, various techniques have been proposed regarding a scrubber for purifying air.

Such a prior art is Patent Registration No. 10-0887922 『Duct-coupled Air Purification System』,

In the prior art, air purifying parts are provided in the air supply duct, duct coupling parts are provided on both sides of the air purifying part, and the air purifying part is provided so that purified water is sprayed from the upper water spray nozzle, and the air purifying part is provided. A purification water supply device is provided for supplying purified water to the installed water spray nozzle, and the air purifying part is provided in a tunnel type with a long length in the air flow direction to present an air purification system that provides clean and safe air. have.

However, the prior art is provided in a duct and purifies air through purification water, and has a low air purification function compared to a scrubber using a general filler, and is particularly difficult to completely remove contaminated gas contained in air.

In addition, there is a "air purification device" registered in the prior art Patent No. 10-0397208,

The prior art is provided with a plurality of free-rotation fans, to spray the water stream with a nozzle to the free-rotation fan, to allow the internal air containing dust to pass between the free-rotation fan, the water droplets generated by the fan is dust After collecting, the movement is blocked by a large number of plates to collect in the lower sedimentation tank, only air is discharged through the suction fan, and the water collected in the sedimentation tank sinks the dust and is supplied to the nozzle using a pump. An air purification device is proposed.

However, the prior art also purifies the air by simply collecting dust in water droplets generated by hitting the fan, and the purification efficiency is lowered, and installation of a large number of fans increases the size of the equipment.

Therefore, in order to solve the above problems, techniques for purifying contaminated air by introducing a large amount of filler to improve purification efficiency have been proposed, and prior art (registration patent No. 10-1152015) regarding such fillers Is also presented.

Such a scrubber facility sprays water in a space containing a filler (reaction section Tri-pack) to form a liquid film on the filler. At this time, the contaminant gas (water-soluble: acid, alkali gas, etc.) that has entered the filler section is absorbed and removed by the liquid film and droplets, and the contaminant-removed gas is discharged to the rear end of the scrubber facility.

Therefore, the gas residence time in the filler is the most important factor in the process of absorbing the scrubber, and the higher the surface area, the larger the liquid film is formed to increase the absorption amount of gas diffused into the liquid.

However, since these existing facilities have a wide packing section and high efficiency when water is used, the volume of the equipment is increasing, and as a result, a shortage of installation sites appears, and when the maintenance time comes, the packing must be taken out and washed and then put back. By doing so, there is a problem in that the risk of safety accidents and maintenance cost and time increase.

Furthermore, in order to replace packing fillers that have been used for more than 20 years in existing facilities, companies are developing various products, and currently, semiconductor businesses are applying filter-type products to reduce efficiency, increase efficiency, and maintenance costs. to be. This filter-type product sprays the cleaning liquid at the front and rear ends toward the filter to increase the mixing effect with the cleaning liquid and the gas-liquid contact area when the contaminant gas passes through the filter, and to remove the contaminant gas even in a short reaction time. It has been developed with a structure that has better efficiency and maintenance than conventional packing, and is currently being gradually applied in semiconductor business sites.

However, the problem of this filter method is that the pressure of the filter increases due to the damage of the filter media and clogging of foreign substances such as dust to the spray pressure of the cleaning liquid that is continuously sprayed, and there is a high risk of occurrence of drift, and the pump failure and nozzle due to the broken residue There is a risk of frequent clogging.

Therefore, the present invention was made to solve the above problems,

A housing in which contaminated gas is introduced, a nozzle provided in the housing to inject cleaning liquid, and a filter module for contacting the injected cleaning liquid with contaminated gas, the filter module including a guide van module and a 3D mesh grid The object is to provide a semiconductor exhaust gas treatment system that is excellent in gas-liquid dispersion and mixing and can reduce contaminated gas through diffusion and venturi effects.

In particular, as the guide van module is provided, a contaminated gas passes through the double cone-cap, causing a venturi effect and a diffusion effect, and provides a semiconductor exhaust gas treatment system that forms a turbulent flow and discharges through a turning hole. It is aimed at.

In addition, an object of the present invention is to provide a semiconductor exhaust gas treatment system capable of maximizing a liquid film, a droplet, a dispersion, a collision, and a mixing effect by configuring the 3D mesh grid to cross-align the first mesh and the second mesh.

In order to achieve the above object, the semiconductor exhaust gas treatment system according to the present invention

A housing including an inlet through which contaminated gas is introduced, a purification unit connected to the inlet to purify the introduced gas, and an outlet through which the purified gas is discharged from the purification unit;

A plurality of nozzles provided at the upper portion of the purification unit to spray cleaning liquid;

A filter module provided with one or more of the purifying parts to purify the contaminated gas introduced therein by contacting the cleaning liquid to be injected;

Including, but

The filter module includes a module case in which a plurality of seating portions are formed,

A guide van module sequentially coupled to the seating portion of the module case, and

Characterized in that it comprises a 3D mesh grid in which the first mesh and the second mesh are overlapped.

The semiconductor exhaust gas treatment system according to the present invention as described above

It consists of a housing, a nozzle provided on the housing, and a filter module for purifying the sprayed cleaning liquid by contacting the contaminated gas flowing therein, but the filter module is made of a module case, a guide van module, and a 3D mesh grid. By configuring the module case so that it can replace the existing filter, it is not necessary to configure the entire system, so it is easy to replace.

In particular, through the guide van module composed of the double cone-cap and the guide van, the gas can penetrate the double cone-cap and expect the diffusion effect, and at the same time, expect the venturi effect and can be mixed with the cleaning solution primarily, and guide the turning hole While passing through the van, it has the effect of removing harmful gases due to the swirling flow formation and mixing effect.

In addition, the filter module further comprises a 3D mesh grid, which maximizes the gas-liquid mixing effect as the incoming gas passes through the 3D mesh grid as the flat first mesh and the bent second mesh are assembled in an overlapping arrangement. Through the formation of a liquid film, it is possible to absorb and remove contaminated gas by diffusion, and it has an effect of improving the reduction effect of contaminated gas because it has a higher contact area and less pressure reduction rate than a conventional filter.

1 is a perspective view of a semiconductor exhaust gas treatment system according to the present invention
2 is a cross-sectional view of a semiconductor exhaust gas treatment system according to the present invention
3 is a perspective view of a module case of a filter module according to the present invention
4 is a perspective view of the guide van module of the filter module according to the present invention
Figure 5 is an enlarged view of the guide van module of the filter module according to the present invention
6 is a perspective view of a 3D mesh grid of a filter module according to the present invention
7 is an exploded view of a 3D mesh grid of a filter module according to the present invention
8 is an enlarged view of a 3D mesh grid of a filter module according to the present invention
9A, 9B, and 10 are test results of a semiconductor exhaust gas treatment system according to the present invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The present invention can be applied to a variety of changes and can have a variety of forms, the implementation (態 樣, aspect) (or embodiments) to describe in detail in the text. However, this is not intended to limit the present invention to a specific disclosure form, and it should be understood that it includes all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

The same reference numbers in each drawing, especially the number of tens and ones, or the same number of tens, ones and alphabets refer to members having the same or similar functions, and unless otherwise specified, The member indicated by the reference numeral can be understood as a member conforming to these standards.

In addition, in each drawing, the components are exaggeratedly large (or thick) or smallly (or thinly) or simplified to express the size or thickness in consideration of convenience, etc., thereby limiting the protection scope of the present invention. It should not be.

The terminology used herein is only used to describe a specific embodiment (sun, 態 樣, aspect) (or embodiment), and is not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, terms such as ~ include ~ or ~ consist of ~ are intended to designate the existence of features, numbers, steps, operations, components, parts or combinations thereof described in the specification, and one or more other features. It should be understood that the existence or addition possibilities of fields or numbers, steps, actions, components, parts or combinations thereof are not excluded in advance.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person skilled in the art to which the present invention pertains. Terms, such as those defined in a commonly used dictionary, should be interpreted as having meanings consistent with meanings in the context of related technologies, and should not be interpreted as ideal or excessively formal meanings unless explicitly defined in the present application. Does not.

First, the semiconductor exhaust gas treatment system S according to the present invention is as shown in FIGS. 1 and 2, a housing 10, a nozzle 20 provided in the housing 10, and the purification unit 15 It is provided with a filter module (F) for cleaning the contaminated gas in contact with the cleaning solution to be sprayed.

In addition, in this specification, the inlet 11 will be referred to as a front end and the outlet 17 direction as a rear end based on the moving direction of the gas.

Described in more detail for each configuration, first, the housing 10, the inlet 11 through which the contaminated gas flows, and the moving path 13 through which the inflowed gas moves, purifying the gas to be moved In order to include the filter module (F) is provided with a purification unit 15 and the discharge unit 17 for discharging the purified gas.

First, the inlet 11 is a place where contaminated gas is introduced, and in particular, may be inhaled with an external gas, or may be connected to a duct, and a fan may be provided to smoothly transport the gas.

The gas introduced through the inlet 11 passes through the moving path 13 and flows into the purifying unit 15, wherein the purifying unit 15 is provided with one or more filter modules F, A nozzle 20 for spraying the cleaning liquid is provided, and is configured to contact the cleaning liquid and the introduced gas to purify it.

The filter module (F) will be described in more detail with reference to the drawings below, and the drawing shows three filter modules (F) to be inserted for convenience of description, which shows one embodiment. As one, the number of filter modules F may be selected by the user according to the installation environment and the degree of air pollution.

In addition, the purification unit 15 is provided with a nozzle 20 for spraying a cleaning solution, and more specifically, the nozzle 20 is in front of each filter module F provided in the purification unit 15 Or it is provided in a plurality in the rear or both, it is made to evenly spray the cleaning solution to the filter module (F).

The gas purified in contact with the cleaning liquid is configured to be discharged into the air through the discharge unit 17.

Hereinafter, a filter module F, which is a core component of the present invention, will be described in detail with reference to FIGS. 3 to 8.

First, the filter module F includes a module case 30 in which a plurality of seating parts 33 are formed, and a guide van module 50 and a first coupled to the seating parts 33 of the module case 30 sequentially. The mesh 61 and the second mesh 63 includes a 3D mesh grid 60 that is arranged to cross,

Figure 3 shows the module case 30, the module case 30 is to be coupled to the purification section 15 of the housing 10, a module frame in which a plurality of seating portions 33 are formed (31).

The seating portion 33 is provided so that the guide van module 50 and the 3D mesh grid 60, which will be described later, can be fitted. Preferably, three seating portions 33 are formed to form the front seating portion 33. ), The guide van module 50 is fitted, the rear seating portion 33 is fitted with a 3D mesh grid 60, and the middle seating portion 33 forms an empty space where the gas passes through. It is made to play a role of securing a free time space for mixing the and liquid.

In addition, it is more preferable that the guide hole module 50 and the 3D mesh grid 60, which will be described later, are formed on one side of the inlet hole 37 to be inserted in a sliding manner.

In addition, it is preferable that the recovery hole 35 is provided at the lower portion of the module frame 31, and the cleaning liquid sprayed from the nozzle 20 flows into the front and rear surfaces of the filter module F and falls. In order to recover the cleaning solution falling in this way, more precisely, the cleaning solution mixed with the contaminated gas.

4 and 5 show the guide van module 50 included in the filter module F of the exhaust gas treatment system S according to the present invention,

The guide van module 50 is fitted to the front end seating portion 33 of the module case 30, a plate 51 formed with a plurality of turning holes 511, and the plurality of turning holes 511 It comprises a double cone-cap 53 provided in the surrounding and a guide van 55 provided in the orbiting hole 511 to orbit the incoming gas.

In more detail for each configuration, first, the plate 51 is fitted to the seating portion 33, and a plurality of orbiting holes 511 are arranged in a lattice shape to be provided to allow gas to flow therethrough. Preferably, the orbiting hole 511 is provided with a sealing tube 513, respectively, and preferably serves to prevent gas or cleaning liquid from flowing into the plate 51 through the orbiting hole 511.

In addition, the plate 51 is further provided with a double cone-cap 53 for diffusing the gas. The double cone-cap 53 is provided at the front end of the plate 51, but the turning hole 511 It is preferable that it is provided in plurality in between.

More specifically, as shown in the drawing, it is preferable that the double cone-caps 53 are arranged between four adjacent turning holes 511 of the turning holes 511 arranged in a lattice shape.

The double cone-cap 53 is configured to be crushed and diffused by an inflowing gas so that it can penetrate through the turning hole 511, and the structure thereof will be described in more detail.

The double cone-cap 53 has a first cone 531 provided on the plate 51 and a second cone spaced apart from the outer surface of the first cone 531 such that the pointed portion 531A is formed forward. Cone 533.

First, the first cone 531 is provided on the plate 51 so that the pointed portion 531A faces forward in a conical shape, and the second cone 533 covers a portion of the outer surface of the first cone 531. It is coupled to the first cone 531 so as to be provided with a plurality of support legs 533B so as to be provided spaced apart from the first cone (531).

In addition, the second cone 533 is provided with a communication hole 533A in the front so that the pointed portion 531A of the first cone 531 protrudes, and as a result, the shape of the second cone 533 Has a conical shape.

In addition, as the second cone 533 is spaced from the outer surface of the first cone 531 through the support leg 533B, between the outer surface of the first cone 531 and the inner surface of the second cone 533 Gas spaces 535 are formed by being spaced apart, and the gas introduced into the gas passage 535 may be discharged as the rear end of the second cone 533 is located more forward than the rear end of the first cone 531. It is configured to.

Therefore, the gas from the front of the double cone-cap 53 flows into the communication hole 533A, and the gas flowing into the communication hole 533A is through the passage 535 (of the first cone 531). Diffusion effect can be improved by being discharged by moving to the rear end (along the outer surface), and it has an effect of preventing a gas from colliding between the orbiting holes 511 of the plate 51 and interfering with the flow.

As described above, the gas diffused by the double cone-cap 53 flows into the orbiting hole 511 and performs a turning movement. To this end, a guide van 55 is provided in the orbiting hole 511. .

The guide van 55 is characterized in that it consists of a central shaft 551 and a plurality of similar screw-shaped wing members 553 provided in a plurality on the outer surface of the central shaft 551.

Therefore, when gas is introduced into the orbiting hole 511, the gas moving through the wing member 553 is rotated, and accordingly, the gas that has passed through the guide van module 50 can be discharged through orbiting movement. It is configured to.

Through this structure, by increasing the speed of the incoming gas and giving the rotational force (turbulent formation), it is possible to remove the polluted gas by increasing the gas-liquid contact and mixing effect with the cleaning liquid sprayed at the front end, and double-con-cap ( 53) it is possible to reduce the pressure loss caused by the gas introduced by the collision with the end face of the plate 51, and diffuse the gas to be introduced more effectively into the guide van 55.

In addition, the double cone-cap 53 is primarily used with the Venturi effect by allowing it to be mixed primarily with the cleaning solution by passing through a narrow area of the passage 535 to help remove contaminated gas as well as the diffusion effect. It is possible to remove the polluted gas, and the gas that has passed through the guide van 55 has a feature capable of removing harmful gas due to swirl flow formation and mixing effect.

In addition, in the exhaust gas treatment system (S) according to the present invention, the filter module (F) is further provided with a 3D mesh grid 60. Referring to FIGS. 6 to 8 in more detail,

The 3D mesh grid 60 is inserted into the seating portion 33 of the module case 30, and more precisely the rear seating portion 33, between a plurality of first meshes and the first mesh 61 It is made of a second mesh 63 provided in,

The first mesh 61 has a first outer frame 611 and a first horizontal frame 613 formed in a plurality of first outer frames 611 to form a plurality of first through holes 612. ) And the first vertical frame 614 and each of the first through-hole 612 protrudes toward the center of the first through-hole 612, and is composed of diagonal frames 615 configured to be spaced apart from each other. , The second mesh 63 is a second horizontal frame (631), and a second horizontal frame configured to be formed in a plurality of the second outer frame 631 to form a plurality of second through holes 632 ( 633) and the second vertical frame 634.

In more detail, the 3D mesh grid 60 is formed by repeatedly arranging the first mesh 61 and the second mesh 63 with each other, and as shown in the drawing, the front end and the rear end are formed. It is preferable that the five meshes are arranged so that the first meshes 61 are positioned, and the second meshes 63 are respectively provided between the first meshes 61 to form a total of four second meshes 63. As an example, the number may be variously selected and arranged, and the scope of rights should not be interpreted.

First, when the first mesh 61 is described, the first mesh 61 is composed of a first outer frame 611 formed in a quadrangular shape, and a plurality of first inside the first outer frame 611. The first horizontal frame 613 and the first vertical frame 614 are formed in a flat plate shape so as to form the through hole 612 in a lattice shape.

In addition, the first through hole 612 is a contaminant gas flowing therethrough, and it is preferable that a diagonal frame 615 is provided so that a liquid film is formed by a cleaning liquid sprayed more effectively.

Specifically, the diagonal frame 615 is provided at each corner of the first through-hole 612 is provided so as to face the center of the first through-hole 612, the ends of the diagonal frame 615 to each other It will be provided to be spaced apart.

Therefore, when the gas penetrates, it is split by the diagonal frame 615 to improve the contact area with the cleaning liquid, and at the same time, the cleaning liquid to be sprayed is configured to form a liquid film.

In addition, the second mesh 63 is arranged to overlap the rear end of the first mesh 61,

The second mesh 63 includes a second outer frame 631 and a second horizontal frame 633 formed in a plurality in the second outer frame 631 to form a plurality of second through holes 632 and It is composed of a second vertical frame (634).

More specifically, the second mesh 63 has a second rectangular outer frame 631 formed in the same manner as the first mesh 61, and a plurality of grids are formed inside the second outer frame 631. The second horizontal frame 633 and the second vertical frame 634 are provided to form the second through hole 632.

At this time, the second mesh 63 is made of a bent shape that is not flat unlike the first mesh 61. Referring to the drawings, the second mesh 63 is described in more detail. The vertical frame 634 is provided to form a zigzag shape by crossing the front end and the rear end so as to protrude.

That is, the second horizontal frame 633 connecting the second vertical frame 634 is bent based on the second vertical frame 634 to form a zigzag shape.

In this way, the first mesh 61 and the second mesh 63 are provided so as to alternately overlap each other. At this time, only the second mesh 63, the second mesh 63 located at the front end (second-2-1) The mesh 63A) and the second mesh 63 (second-2 mesh) located at the rear end are preferably configured to be arranged differently.

More specifically, the 2-1 mesh (63A) and the 2-2 mesh (63B) is made of the same shape, the direction in which the arrangement is rotated by 90 degrees is arranged,

Specifically, the 2-1 mesh 63A is configured such that the planar shape is formed in a zigzag shape, and the 2-2 mesh 63B is arranged so that the side shape is formed in a zigzag shape, resulting in liquid film formation and collision when the gas passes. This is done to maximize the effect.

In addition, in this case, the first through hole 612 and the second through hole 632 are provided at opposite positions, and the two first through holes 612 and one second through hole 632 are provided. It is preferable that they are provided to face each other (the horizontal length of the second through hole 632 becomes more than twice the horizontal length of the first through hole 612, and the vertical length is implemented in the same manner).

That is, the present invention is provided with the 3D mesh grid 60 as described above, the first mesh 61 of the flat plate and the second mesh 63 of the bending type are assembled in an overlapping arrangement to reproduce a 3D volume feeling, and spraying. It is characterized in that the contact area is improved through the 3D structure shape that increases the dispersion rate of the contaminated gas and the cleaned liquid, and the gas-liquid mixing is performed by repeatedly passing the first through hole 612 and the second through hole 632 It has the feature of maximizing the effect and improving the reduction performance by using the principle of absorbing and removing contaminated gas by diffusion through partial liquid film formation. In addition, the 3D mesh grid 60 is characterized by having excellent durability and strength compared to the conventional filter used by injecting MP540 PP, which has excellent chemical resistance and excellent strength, from a mold plate.

Further, FIGS. 9A, 9B, and 10 are tested using the semiconductor emission gas treatment system S according to the present invention, and as a test report accordingly (requested by Cheongnyong Environment Co., Ltd. which has been certified by KOLAS, an internationally recognized testing organization) It is a test report.)

Specifically, FIGS. 9A and 9B measure ppm in the inflow and outflow of the acidic substances HCl and HF, and it is possible to confirm the excellence of the reduction effect, such as not being detected at the time of discharge or detecting only a small amount.

10 is a measure of the ppm of the inflow and outflow of the alkaline substance NH3, and it can be confirmed that the excellence of the reduction effect is not detected at the time of discharge or only a small amount is detected.

In addition, in the above description, the semiconductor exhaust gas treatment system having a specific shape, structure, and configuration has been mainly described with reference to the accompanying drawings, but the present invention is capable of various modifications, changes, and substitutions by those skilled in the art. , Modifications and substitutions should be construed as falling within the protection scope of the present invention.

S: Semiconductor emission gas treatment system
10: housing 11: inlet
13: moving path 15: purification unit
17: outlet 20: nozzle
F: Filter module 30: Module case
31: module frame 33: seating portion
35: recovery hole 37: incoming hole
50: guide van module 51: plate
511: turning hole 513: sealed tube
53: double cone-cap 531: first cone
531A: Point 533: Second cone
533A: Communication hole 533B: Support leg
535: Crossroads 55: Guide van
551: central axis 553: wing member
60: 3D mesh grid 61: first mesh
611: first outer frame 612: first through hole
613: 1st horizontal frame 614: 1st vertical frame
615: Diagonal frame 63: Second mesh
631: 2nd outer frame 632: 2nd through hole
633: second horizontal frame 634: second vertical frame
63A: 2-1 mesh 63B: 2-2 mesh

Claims (4)

  1. The inlet 11 through which contaminated gas is introduced, the purification unit 15 connected to the inlet 11 to purify the introduced gas, and an exhaust unit through which the purified gas is discharged from the purification unit 15 ( 17) a housing 10 including;
    A plurality of nozzles 20 provided on the purification part 15 to spray cleaning liquid;
    A filter module (F) which is provided in one or two or more of the purification units 15 to purify the inflowing contaminated gas by contacting the cleaning solution to be injected;
    Including, but
    The filter module (F) is a module case 30 is formed with a plurality of seating portion 33,
    The guide van module 50 is sequentially coupled to the seating portion of the module case 30 and
    The first mesh 61 and the second mesh 63 is made of a 3D mesh grid 60, which is arranged overlapping,
    The 3D mesh grid 60 is
    It is composed of a plurality of first mesh 61 and the second mesh 63 provided between the first mesh 61,
    The first mesh 61 has a first outer frame 611 and a first horizontal frame 613 formed in a plurality of first outer frames 611 to form a plurality of first through holes 612. ) And a first vertical frame 614 and a diagonal frame 615 that is formed to face the center of the first through hole 612 at each corner of the first through hole 612, and its ends are spaced apart from each other. Is made of,
    The second mesh 63 has a second outer frame 631 and a second horizontal frame 633 which is formed in a plurality in the second outer frame 631 to form a plurality of second through holes 632. ) And the second vertical frame (634),
    The first mesh 61 is a plate-shaped first mesh 61,
    The second mesh 63 is a second mesh 63 of a bending type in which the second vertical frame 634 is repeatedly protruded in the front-rear direction to form a zigzag shape,
    The second mesh 63 is provided between the plurality of first meshes 61, the 2-1 mesh 63A located at the front end of which the outside air flows, and the 2-2 mesh located at the rear end. It consists of (63B),
    The 2-2 mesh 63B has the same shape as the 2-1 mesh 63A, and the 2-1 mesh 63A has a zigzag shape in a planar shape, and the 2-2 mesh 63B Is a semiconductor exhaust gas treatment system characterized in that the side shape is arranged to be rotated 90 degrees to each other to form a zigzag shape.
  2. According to claim 1,
    The guide van module 50 is
    A plate 51 having a plurality of orbiting holes 511, a double cone-cap 53 provided around the plurality of orbiting holes 511, and a gas provided in the orbiting hole 511 to rotate the inflow gas Semiconductor exhaust gas treatment system characterized in that it comprises a guide van (55).
  3. According to claim 2,
    The double cone-cap 53 of the guide van module 50 is
    The first cone 531 is provided on the plate 51 so that the pointed portion 531A is formed forwardly, and is provided to form a crossroad 535 spaced apart from the outer surface of the first cone 531. The second cone 533 is formed with a communication hole 533A so that the 531A can protrude,
    A semiconductor exhaust gas treatment system, characterized in that the inflowing gas is introduced into the communication hole (533A) and diffused and discharged through the passage.
  4. The method according to claim 2 or 3,
    The guide van 55 is
    The central axis 551 and the central axis 551, a plurality of provided on the outer surface, the semiconductor exhaust gas treatment system characterized in that it consists of a screw-shaped wing member 553 curved in one direction.

KR1020180022717A 2018-02-26 2018-02-26 Air cleaning apparatus using guide-vane module and 3d mesh grid KR102108309B1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003003835A (en) * 2001-06-25 2003-01-08 Fet Power Craft Shizuoka Kojo:Kk Exhaust emission control device
KR101688622B1 (en) * 2016-03-11 2016-12-21 (주)명성씨.엠.아이 Scrubber with 3d-mesh filter

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100653431B1 (en) * 2005-03-29 2006-12-01 주식회사 코캣 Chemical Filters Using Metallic compounds and Preparation Method Thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003003835A (en) * 2001-06-25 2003-01-08 Fet Power Craft Shizuoka Kojo:Kk Exhaust emission control device
KR101688622B1 (en) * 2016-03-11 2016-12-21 (주)명성씨.엠.아이 Scrubber with 3d-mesh filter

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