KR102041629B1 - Multilayer ceramic electronic component and method for manufacturing the same - Google Patents

Multilayer ceramic electronic component and method for manufacturing the same Download PDF

Info

Publication number
KR102041629B1
KR102041629B1 KR1020130022247A KR20130022247A KR102041629B1 KR 102041629 B1 KR102041629 B1 KR 102041629B1 KR 1020130022247 A KR1020130022247 A KR 1020130022247A KR 20130022247 A KR20130022247 A KR 20130022247A KR 102041629 B1 KR102041629 B1 KR 102041629B1
Authority
KR
South Korea
Prior art keywords
electrode
ceramic
internal electrode
internal
thickness
Prior art date
Application number
KR1020130022247A
Other languages
Korean (ko)
Other versions
KR20140107963A (en
Inventor
김종한
이민곤
이윤희
이승호
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020130022247A priority Critical patent/KR102041629B1/en
Publication of KR20140107963A publication Critical patent/KR20140107963A/en
Application granted granted Critical
Publication of KR102041629B1 publication Critical patent/KR102041629B1/en

Links

Images

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/012Form of non-self-supporting electrodes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics

Abstract

The present invention relates to a multilayer ceramic electronic component, comprising: a ceramic body; And internal electrodes formed in the ceramic body and having a plurality of non-electrode regions therein, wherein the internal electrodes have a thickness of Te, in a cross section formed by a length direction and a thickness direction of the ceramic body. A multilayer ceramic electronic component that satisfies 0.1 μm ≦ Te ≦ 0.55 μm and 3.2% ≦ Ao / Ae ≦ 4.5% when an area of the internal electrode is Ae and an area of the plurality of non-electrode areas is Ao. .

Description

Multilayer ceramic electronic component and method for manufacturing the same

The present invention relates to a multilayer ceramic electronic component and a method of manufacturing the same, and more particularly, to a multilayer ceramic electronic component and a method of manufacturing the same having excellent reliability.

In general, an electronic component using a ceramic material such as a capacitor, an inductor, a piezoelectric element, a varistor, or a thermistor is a ceramic body made of ceramic material, an internal electrode layer formed inside the ceramic body, and an external electrode provided on the surface of the ceramic body to be connected to the internal electrode layer. It is provided.

Among ceramic electronic components, a multilayer ceramic capacitor includes a plurality of stacked dielectric layers, internal electrode layers disposed to face each other with one dielectric layer interposed therebetween, and external electrodes electrically connected to the internal electrode layers.

Multilayer ceramic capacitors are widely used as components of mobile communication devices such as computers, PDAs, and mobile phones due to their small size, high capacity, and easy mounting.

In recent years, due to the high performance and light and small size reduction of the electric and electronic device industries, the miniaturization, high performance, and low cost of electronic components are also required. In particular, as the speed of the CPU, the weight reduction of the device, the digitization, and the high functionalization have been advanced, research and development for implementing the characteristics of the multilayer ceramic capacitor, such as miniaturization, thinning, high capacity, and low impedance in the high frequency range, are being actively conducted.

In particular, as the internal electrodes become thinner, there is a problem in the connectivity of the internal electrodes, which is one of the factors that lower the reliability of the multilayer ceramic electronic component.

Japanese Laid-Open Patent Publication 2001-311985

The present invention provides a multilayer ceramic electronic component capable of realizing the design capacity by adjusting the size and area distribution of the common material trapped in the internal electrode to implement the internal electrode connectivity of more than 98%, and prevent the occurrence of dielectric breakdown and cracks I would like to.

One embodiment of the invention the ceramic body; And internal electrodes formed in the ceramic body and having a plurality of non-electrode regions therein, wherein the internal electrodes have a thickness of Te, in a cross section formed by a length direction and a thickness direction of the ceramic body. When the area of the internal electrode is Ae and the area of the plurality of non-electrode areas is Ao, the multilayer ceramic electronic component may satisfy 0.1 μm ≦ Te ≦ 0.55 μm and 3.2% ≦ Ao / Ae ≦ 4.5%.

In one embodiment of the present invention, the thickness Te of the internal electrode may be an average thickness of the internal electrode.

In one embodiment of the present invention, the non-electrode region may include a ceramic blank.

In one embodiment of the present invention, the ceramic material may be the same material as the ceramic body.

In one embodiment of the present invention, the non-electrode region may further include pores.

In one embodiment of the present invention, if the ratio of the length of the portion where the actual inner electrode is formed to the total length of the inner electrode is defined as the connectivity (C) of the inner electrode, 98% ≦ C ≦ 99.99% may be satisfied. .

Another embodiment of the present invention comprises the steps of providing a conductive paste comprising a conductive metal powder and a common powder, the ratio of the average particle diameter of the common powder to the average particle diameter of the conductive metal powder is 1/12 or less; Forming an internal electrode on a ceramic green sheet using the conductive paste; Stacking the ceramic green sheets on which the internal electrodes are formed; Sintering the laminate in which the ceramic green sheets are laminated to form a ceramic body, wherein the ceramic body includes internal electrodes having a plurality of non-electrode regions therein, and the length direction and the thickness direction of the ceramic body In the cross section to be formed, when the area of the internal electrode is Ae and the area of the plurality of non-electrode areas is Ao, it may be a manufacturing method of a multilayer ceramic electronic component that satisfies 3.2% ≦ Ao / Ae ≦ 4.5%. have.

In another embodiment of the present invention, the ratio of the weight of the common material to the weight of the conductive metal may be 24.3% or less.

In another embodiment of the present invention, the common material may include a ceramic common material.

In another embodiment of the present invention, the ceramic blank may include barium titanate or strontium titanate.

In another embodiment of the present invention, in the cross section formed in the longitudinal direction and the thickness direction of the ceramic body, the ratio of the length of the portion where the actual internal electrode is formed to the total length of the internal electrode is determined by the connectivity (C) of the internal electrode. ), It can satisfy 98% ≤C≤99.99%.

In another embodiment of the present invention, the thickness Te of the internal electrode may satisfy 0.1 μm ≦ Te ≦ 0.55 μm.

In another embodiment of the present invention, the thickness Te of the internal electrode may be an average thickness of the internal electrode.

According to the present invention, by controlling the distribution of the barium titanate common material trapped in the internal electrode by adjusting the ratio and the amount of the barium titanate common material used in the internal electrode paste and the nickel powder size and the temperature increase rate during sintering, the connectivity is 98% or more. It is possible to secure the design capacity and to implement the design capacity, and to prevent the occurrence of breakdown and cracks.

1 is a perspective view of a multilayer ceramic electronic component according to an embodiment of the present disclosure.
FIG. 2 is a cross-sectional view taken along line XX 'of FIG. 1.
3 is an enlarged view of a portion Z of FIG. 2.
4 and 5 are schematic diagrams for explaining the connectivity of the internal electrode.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

Embodiment of the present invention can be modified in various other forms, the scope of the present invention is not limited to the embodiments described below.

In addition, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art.

Accordingly, the shape and size of elements in the drawings may be exaggerated for clarity, and the elements denoted by the same reference numerals in the drawings are the same elements.

1 is a perspective view of a multilayer ceramic electronic component according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line XX 'of FIG. 1. 3 is an enlarged view of a portion Z of FIG. 2.

1 to 3, a multilayer ceramic electronic component according to an exemplary embodiment of the present invention may include a ceramic body 10, an internal electrode 30 formed inside the ceramic body, and an external electrode formed outside the ceramic body 10 ( 20).

The ceramic body 10 may have a hexahedron shape. “L direction” can be referred to as “length direction”, “W direction” as “width direction” and “T direction” as “thickness direction”. Here, the thickness direction may mean a direction in which the internal electrodes 30 are stacked. The length of the ceramic body 10 may be larger than the width, and the width may be equal to the thickness. The ceramic body 10 may have an upper surface S1, a lower surface S4, side surfaces S3 and S6, and end surfaces S2 and S5.

The ceramic body 10 may include a dielectric material having a high dielectric constant, and specifically, may include barium titanate and strontium titanate. Dielectric materials contain electric dipoles, which can lead to higher charge accumulation.

The external electrode 20 may be formed outside the ceramic body 10, and specifically, may be formed on end surfaces S2 and S5 in the longitudinal direction (“L direction”). The external electrode 20 may extend to a portion of the upper and lower surfaces S1 and S4 and the side surfaces S3 and S6 of the ceramic body 10. The external electrode 20 may have first and second external electrodes 21 and 22, and electricity having opposite polarities may be applied to the first and second external electrodes 21 and 22.

The external electrode 20 may include a conductive metal and glass. The conductive metal may comprise one or more selected from the group consisting of gold, silver palladium, copper, nickel and alloys thereof.

The internal electrodes 30 may be stacked in the ceramic body 10, but are not limited thereto, and may have a rectangular shape. The internal electrode 30 may have first and second internal electrodes 32 and 32, and the first and second internal electrodes 31 and 32 may be drawn out in opposite directions to each other. 21 and 22, respectively, and may be charged with opposite polarities. Charges may accumulate in the first and second internal electrodes charged with opposite polarities, thereby contributing to the formation of capacitance.

The internal electrode 30 may include one or more selected from the group consisting of gold, silver, copper, nickel, palladium, platinum, and alloys thereof. However, the present invention is not limited thereto, and any conductive property may be provided to the internal electrode 30.

In the present embodiment, the internal electrode 30 may have a plurality of non-electrode regions N therein.

In the cross section (LT cross section) formed in the longitudinal direction and the thickness direction of the ceramic body 10, a region trapped in the internal electrode 30 is called a non-electrode region N, and a non-electrode region of the internal electrodes 30 is defined. The region except for (N) may be referred to as an electrode region (E).

A conductive metal such as nickel, a common material, and other sintering aids may be added to the conductive paste for the internal electrode, and a region in which the common material and the sintering aid is trapped inside the internal electrode may be a non-electrode region (N).

The non-electrode region N may include a material other than a conductive metal used as an internal electrode such as ceramic powder, a binder, a solvent, or may be an empty space such as pores.

When the common material is surrounded by conductive metal, specifically, nickel powder particles, it may be trapped in the inner electrode without exiting the inner electrode during the sintering process, which may form the non-electrode region (N).

The area of the non-electrode region N may be viewed as a measure of the content of the material constituting the non-electrode region N. Specifically, the content of the common material added to the internal electrode 30 may be measured.

The non-electrode region N may include a ceramic blank added to the internal electrode 30. The ceramic powder may move from the internal electrode 30 to the ceramic body during the firing process, and may use the same kind as the ceramic powder for forming the dielectric layer in order not to degrade the characteristics of the dielectric layer. Although not limited thereto, the ceramic powder may be, for example, barium titanate powder.

Some of the ceramic common powder is pushed to the surface of the internal electrode 30 and sintered together with the ceramic powder to form a dielectric layer, but some of the ceramic common powder cannot escape between the metal powders until sintering is completed, and grain boundaries Can be trapped in. As a result, the ceramic powder may form a non-electrode region inside the internal electrode 30.

The fact that sintering shrinkage of the internal electrode 30 is suppressed by adding a common material to the internal electrode 30 paste can be explained as follows.

When the common material is added to the internal electrode 30, the sintering start temperature may be increased to suppress sintering shrinkage, because the common material may be disposed between the conductive metal particles to prevent contact between the conductive metal particles.

The sintering process can begin with necking between conductive metal particles. Necking refers to a phenomenon in which contact portions between conductive metal particles become wider. When the common material is located between the conductive metal particles, the contact between the conductive metal particles may be restricted to prevent the necking, and the sintering start temperature may be increased by that amount to suppress sintering shrinkage.

In addition, since the common material may fill the empty space that the common material cannot fill with the conductive metal particles, the degree of shrinkage during sintering may be reduced.

In the present embodiment, the thickness Te of the internal electrode 30 may be 0.1 μm or more and 0.55 μm or less. That is, 0.1 μm ≦ Te ≦ 0.55 μm.

If Te <0.1㎛, design capacity cannot be realized. This is because the internal electrode 30 is too thin to suppress the sintering shrinkage of the internal electrode 30 even if a common material is added, and the connection of the internal electrode 30 can not be realized to 98% or more.

If Te> 0.55㎛, since the internal electrode 30 is thick, there is no difficulty in implementing the internal electrode 30 connectivity to 98% or more, even if sintering shrinkage of the internal electrode 30 occurs, and thus there is no difficulty in implementing the design capacity. .

In the case of 0.1 μm ≦ Te ≦ 0.55 μm, it may be difficult to implement the internal electrode 30 connectivity to 98% or more, and may have difficulty in implementing the design capacity. This embodiment solves this problem by adjusting the other factor regarding the non-electrode area | region N. FIG.

The thickness Te of the internal electrode 30 may be an average value. The cross section (LT section) formed in the longitudinal direction and the thickness direction of the ceramic body 10 was observed using a scanning electron microscope, measured at ten points at equal intervals, and the average value was determined as the thickness Te of the internal electrode 30. can do.

The thickness of the inner electrode 30 may be calculated as the ratio of the area of the inner electrode 30 to the actual length of the inner electrode 30 (the length of the inner electrode / the actual inner electrode).

Referring to FIG. 4, the area of the internal electrode 30 means an area including an electrode region E and a non-electrode region N, and the length of the actual internal electrode 30 is between the internal electrodes 30. It may have a length except for a gap G formed in the gap.

The area of the inner electrode 30, the area Ae of the electrode region E, the area Ao of the non-electrode region N, and the length of the actual inner electrode 30 are measured in one inner electrode 30 layer. It can be multiplied by the number of stacked layers and generalized to the whole multilayer ceramic capacitor.

In the present embodiment, the ratio Ao / Ae of the area Ao of the non-electrode region N to the area Ae of the electrode region E may be 3.2% to 4.5%. That is, 3.2% ≦ Ao / Ae ≦ 4.5%.

By adjusting the ratio (Ao / Ae) of the area (Ao) of the non-electrode area (N) to the area (Ae) of the electrode area (E) to satisfy 3.2% ≦ Ao / Ae ≦ 4.5%, connectivity of 98% or more is achieved. It is possible to implement the design capacity at the same time.

In particular, by adjusting to satisfy 3.2% ≦ Ao / Ae ≦ 4.5%, even when the electrode connectivity is greater than 99%, there is no cracking caused by stress, thereby implementing a multilayer ceramic capacitor having excellent reliability.

If Ao / Ae <3.2%, more than 98% of connectivity can not be achieved, and design capacity can be difficult to implement.

Since the proportion of the area Ao of the non-electrode region N of the internal electrodes 30 is small, the sintering shrinkage effect is small, and the improvement in connectivity of the internal electrodes 30 may be insignificant. When the connectivity of the internal electrode 30 is small, it is difficult to implement the design capacitance because the area substantially contributing to the formation of the capacity of the internal electrode 30 is reduced.

If Ao / Ae> 4.5%, ceramic grains may grow abnormally, resulting in reduced breakdown voltage (BDV).

The large ratio of the area Ao of the non-electrode region N may mean that the content of the material constituting the non-electrode region N is large. For example, when the common material uses the same dielectric ceramic as that of the ceramic body, the ceramic material added to the internal electrode 30 may come out of the internal electrode 30 and eventually grains of the ceramic body may grow excessively, resulting in breakdown voltage. This can be reduced.

With reference to FIG. 4, the measurement of the area Ae of the electrode area E and the area Ao of the non-electrode area N is demonstrated.

The area of the internal electrode 30 refers to an area in which the internal electrode 30 is continuously formed, and a portion where the internal electrode 30 is disconnected is not included. The area of the internal electrode 30 may exclude a gap G formed between the internal electrodes 30. The gap G refers to pores that penetrate the inner electrode 30, and do not include pores formed only on a part of the surface of the inner electrode 30, or formed in the inner electrode 30.

In the optical image, the internal electrode 30 and the dielectric layer may be distinguished, and the non-electrode region N and the electrode region E may be represented by different contrasts.

Although not limited thereto, the area of the internal electrode 30, the area Ae of the electrode region E, and the area Ao of the non-electrode region N may be obtained by using a computer program such as SigmaScan Pro. Etc. can be measured.

The material included in the composition of the conductive paste may be trapped at the interface of the metal grains, ie, grain boundaries, that make up the internal electrode 30 during firing. In addition, pores may be formed at the interface of the metal particles during the firing of the internal electrode 30, and the pores may be formed inside the internal electrode 30 in a form trapped by the internal electrode 30.

By controlling the particle size ratio of the ceramic co-powder and dispersing it among the metal powders, sintering of the metal powder can be suppressed to about 1000 ° C or more. Sintering of the metal powder to the predetermined temperature is suppressed as much as possible, and sintering of the ceramic powder forming the dielectric layer can be started. As the densification of the ceramic powder forming the dielectric layer proceeds, the internal electrode 30 may also be rapidly densified as the densification starts.

The ceramic common powder can delay the start of sintering shrinkage of the metal powder and can suppress the sintering shrinkage of the metal powder. The ceramic powder having a controlled particle size ratio can prevent contact between the metal powders during sintering shrinkage of the metal powder, thereby suppressing grain growth of the metal powder, and suppressing agglomeration of the internal electrodes 30.

The non-electrode region N may be evenly distributed in the internal electrode 30, and the size of the non-electrode region N may be small.

Even distribution of the non-electrode region N in the internal electrode 30 may mean that the function of raising the shrinkage start temperature of the internal electrode 30 is effectively performed.

The non-electrode region N may be evenly distributed in the internal electrode 30 in a small size. This may be determined by the following factors.

First is the amount of additives. The ratio of the area Ao of the non-electrode region N to the area Ae of the non-electrode region E can be adjusted by adjusting the amount of the common material added. When the content of the common material is large, the area Ao of the non-electrode region N may be increased. When the content of the common material is small, the area Ao of the non-electrode region N may be reduced.

Second, the maximum size of the common material particle. As the particle size of the common material is smaller, the size of the non-electrode region N formed in the internal electrode may also be smaller.

Third is the dispersion degree of the common material in the paste. As the material constituting the non-electrode region N, that is, the ceramic material is evenly dispersed in the internal electrode paste, the non-electrode region N may be evenly distributed in the internal electrode 30. In the process of preparing the conductive paste, additives such as a dispersant and milling time may be adjusted to improve dispersibility of the common material in the paste.

fourth, It is the size of the common good Specifically, it is the ratio of the common particle size to the conductive metal particle size. The ratio (Ds / Dn) of the average particle diameter (D50) (Ds) to the average particle diameter (D50) (Ds) of the conductive metal particles may be 1/12 or less, which is due to the use of fine particles. Initial sintering shrinkage can be suppressed.

Fifth, the rate of temperature increase during sintering. If the heating rate is high during sintering, the time for the common material to move during the sintering process is short. Therefore, if the common material is well dispersed, the common material may be evenly distributed in the internal electrode 30 even after sintering.

On the other hand, if the temperature increase rate during sintering is small enough to allow the movement of the common materials can be aggregated together, and thus the dispersibility may be reduced.

In one embodiment of the present invention, when the ratio of the length of the portion where the actual internal electrode 30 is formed to the total length of the internal electrode 30 is defined as the connectivity C of the internal electrode, 98% ≦ C ≦ 99.99% can be satisfied.

4 and 5, the connectivity of the inner electrode 30 is the ratio of the length of the portion where the actual inner electrode 30 is formed to the total length of the inner electrode 30 (the length of the portion where the actual inner electrode is formed / Internal electrode full length).

The entire length of the inner electrode 30 and the length of the portion where the actual inner electrode 30 is formed may be measured using an optical image of a cross section obtained by cutting the multilayer ceramic capacitor as described above.

More specifically, the ratio of the length of the portion where the actual internal electrode is formed to the total length of the internal electrode in the image scanned in the longitudinal section cut in the center portion in the width direction of the ceramic element can be measured.

In one embodiment of the present invention, the entire length of the internal electrode 30 may mean a length including a gap G formed between the internal electrodes 30 at one internal electrode, and the actual length of the portion where the actual internal electrode 30 is formed. The length may mean a length excluding a gap G formed between the internal electrodes 30 and the internal electrodes 30. As described above, the gap G refers to pores that penetrate the internal electrode 30, and do not include pores formed only on a portion of the internal electrode surface or inside the internal electrode 30.

As shown in FIG. 5, a portion of the optical image may be taken to measure the entire length of the inner electrode 30 and the actual length of the inner electrode 30. More specifically, the overall length of the internal electrode 30 including pores at some points of the internal electrode 30 is defined as T, and the length of the portion where the actual internal electrode 30 is formed is defined as t1, t2, t3, ... tn In other words, the connectivity of the internal electrode 30 may be represented by (t1 + t2 + t3 + · + tn) / T. In FIG. 5, portions where the actual internal electrodes 30 are formed are represented by t1, t2, t3, and t4, but the number of portions where the actual electrodes are formed is not particularly limited.

The actual length of the internal electrode 30 may be measured by subtracting the length of the gap G from the total length T of the internal electrode 30.

If C <98%, there may be difficulties in implementing the design capacity.

The large connectivity of the internal electrode 30 means that the internal electrode 30 is formed with little empty space in the middle, thereby ensuring a large capacitance. On the contrary, when the connectivity of the internal electrode 30 is small, since the effective surface for forming the capacitance is reduced, it is disadvantageous in forming the capacitance.

If C> 99.99%, the stress relaxation effect is insignificant and cracks may occur.

The internal electrode 30 may shrink in the thickness direction during the sintering process, and eventually a through hole may be formed in the thickness direction. The through hole formed in the internal electrode 30 also has a function of relieving stress in the ceramic body. If the connection between the internal electrodes 30 is too large, cracks may occur because there is little effect of stress relaxation due to the through holes.

Another embodiment of the present invention comprises the steps of providing a conductive paste comprising a conductive metal powder and a common powder, the ratio of the average particle diameter of the common powder to the average particle diameter of the conductive metal powder is 1/12 or less; Forming an internal electrode 30 on the ceramic green sheet using the conductive paste; And stacking a ceramic green sheet having the internal electrode 30 formed thereon.

First, conductive metal powder for imparting conductivity to the external electrode 20, glass powder for densification of the external electrode 20, ethanol as an organic solvent, polyvinyl butyral as a binder, and the like are mixed, and then ball milling. The paste for external electrode 20 can be provided.

The conductive paste composition for forming the internal electrode 30 may further include a binder, a solvent and other additives.

The binder is not limited thereto, but polyvinyl butyral, cellulose resin, or the like may be used. The polyvinyl butyral may improve the adhesive strength of the conductive paste and the ceramic green sheet with a strong adhesive property.

The cellulose-based resin has a chair-like structure and has a fast recovery by elasticity when deformation occurs. By including the cellulose resin, it is possible to secure a flat printing surface.

The solvent is not particularly limited, and for example, butylcarbitol, kerosine or terpineol solvent can be used. Specific types of the terpineol-based solvents are not limited thereto, but dihydroterpineol, dehydroterpinyl acetate, and the like may be used.

Next, a conductive paste containing conductive metal powder and common powder, and the ratio of the average particle diameter of the common powder to the average particle diameter of the conductive metal powder may be 1/12 or less.

If the ratio of the particle size of the common powder to the particle size of the metal powder (ceramic powder / metal powder) exceeds 1/12, it may be difficult for the common powder to suppress the shrinkage of the metal particles efficiently.

The particle size of the common powder is smaller than that of the metal powder, and the ceramic common powder may be distributed between the metal powders.

The common powder may be disposed between the metal particles during sintering of the metal particles to suppress grain growth of the metal particles. The co-powder powder smaller than the size of the pores formed during the sintering of the metal particles may have difficulty in limiting contact of the metal particles and thus preventing the grain growth of the metal particles.

The particle diameter of the conductive metal powder and the common powder can be measured by the average particle diameter. Specifically, it can measure by the average particle diameter measuring method prescribed | regulated by ASTM (American Society for Testing and Materials).

Particle diameter here means D50, and larger or smaller particles may be present. In the initial stage of sintering, conductive metal particles of small size may be sintered first, which may cause initial shrinkage. In order to suppress the initial shrinkage of the internal electrode 30, a fine grain material may be used.

The key point in using particulate materials is to disperse them. If the tribute is lumped together, it may not make sense to use the particulate tribute. By using a dispersing agent or the like and by adjusting the dispersing conditions, the fine grains may be well dispersed.

The degree of dispersion can be measured from the distribution of common materials in the internal electrodes 30. Specifically, as the non-electrode region N, that is, the common material is evenly distributed in a small size, it may be determined that the dispersion is better. As the non-electrode region N is evenly distributed, the sintering shrinkage suppression effect of the internal electrode 30 may be greater, and the connectivity of the internal electrode 30 may be improved.

Next, the internal electrode 30 may be formed on the ceramic green sheet using the conductive paste.

The conductive paste may be formed on the ceramic green sheet using a method such as screen printing.

Next, the ceramic green laminate may be prepared by stacking the ceramic green sheets on which the internal electrodes 30 are formed, and the green chips may be manufactured by cutting the ceramic green laminate. The green chip may be sintered to manufacture a sintered chip, and the external electrode 20 may be formed on the outside of the sintered chip to complete the multilayer ceramic electronic component.

When the base metal is used as the internal electrode 30, the firing may be performed in a reducing atmosphere because the internal electrode 30 may be oxidized when firing in the air.

In addition, a nickel plating layer and a tin plating layer may be formed on the external electrode 20 for ease of mounting.

In this embodiment, the ratio of the weight of the common material to the weight of the conductive metal may be 24.3% or less.

When the ratio of the weight of the common metal to the weight of the conductive metal is 24.3% or less, the ratio Ao / Ae of the area Ao of the non-electrode region N to the area Ae of the non-electrode region E is 3.2% to 4.5%. Can be implemented. It is because the ratio of the area which the non-electrode area | region N occupies can be adjusted by adjusting the addition amount of a common material.

The conductive metal may include nickel.

The common material may include a ceramic common material, and the ceramic common material may include barium titanate or strontium titanate.

Other matters relating to the conductive metal, the common material, and the like are the same as those described in the above embodiments.

Hereinafter, the present invention will be described in detail with reference to Examples and Comparative Examples.

Multilayer ceramic capacitors according to Examples and Comparative Examples were prepared according to the following method.

Barium titanate powder, ethanol as an organic solvent and polyvinyl butyral as a binder were mixed, ball milled to prepare a ceramic slurry, and a ceramic green sheet was prepared using the same.

The conductive paste for the internal electrode 30 containing nickel was printed on the ceramic green sheet to form the internal electrode 30, and the laminated green laminate was subjected to isostatic compression molding at a pressure of 1,000 kgf / cm 2 at 85 ° C. isostatic pressing).

After cutting the compressed green laminate to make a green chip, and after the debinder process of maintaining the cut green chip at 230 ℃ 60 hours in the air atmosphere, the green chip was sintered at 1000 ℃ to prepare a sintered chip. Sintering was performed in a reducing atmosphere to prevent oxidation of the internal electrode 30, and the reducing atmosphere was set to 10 −11 to 10 −10 atm lower than the Ni / NiO equilibrium oxygen partial pressure.

The external electrode 20 was formed by using a paste for the external electrode 20 including copper powder and glass powder on the outside of the sintered chip, and a nickel plating layer and a tin plating layer were formed on the external electrode 20 by electroplating. .

According to the above method, a multilayer ceramic capacitor having a size of 0603 was manufactured. The 0603 size may be 0.6 μm ± 0.1 μm and 0.3 μm ± 0.1 μm in length and width, respectively. The characteristics of the multilayer ceramic capacitor were evaluated as follows.

Capacity characteristics were judged as good (○) when more than 98.5% of the design capacity target value, and bad (x) when less than 98.5%.

The breakdown voltage (BDV) was evaluated by applying a DC voltage at a speed of 1.0 V / sec, and when the breakdown voltage did not occur based on 60 V, it was determined as good (○), and the insulation The case where breakdown occurred was marked as defective (×).

Reliability evaluation was evaluated as whether cracks occurred in the analysis after polishing the chip, and the case where cracks occurred was determined as defective (×), and the case where no crack occurred was judged as good (○).

Te (μm) Ao / Ae (%) Electrode Connectivity (%) Capacity characteristics
(98.5% or more capacity implemented)
BDV Reliability evaluation
One 0.102 4.12 98.1 2* 0.113 2.97 97.5 × 3 0.113 3.35 98.2 4* 0.237 4.52 98.2 × 5 0.245 3.47 98.3 6 0.258 3.85 98.6 7 * 0.276 2.71 96.3 × 8 0.284 3.41 98.2 9 * 0.334 4.85 98.9 × 10 * 0.345 3.02 99.1 × 11 0.378 3.23 99.2 12 * 0.412 2.89 96.7 × 13 0.434 4.17 99.2 14 * 0.465 4.58 99.6 × 15 0.487 3.45 98.9 16 * 0.512 2.98 98.3 × 17 * 0.523 3.19 99.1 × 18 * 0.527 2.48 95.2 × 19 0.530 4.50 99.9 20 0.550 3.25 98.1

*: Comparative Example

In Table 1, Te is the thickness of the internal electrode 30, Ao / Ae is the ratio of the area (Ao) of the non-electrode region (N) to the area (Ae) of the electrode region (E) in the internal electrode (30). Means.

Referring to Table 1, Samples 2, 7, 12, and 18, which are Comparative Examples, had Te of 0.113 µm, 0.276 µm, 0.412 µm and 0.527 µm, respectively, Ao / Ae of 2.97%, 2.71%, 2.89% and 2.48%, and electrode connectivity. In the case of 97.5%, 96.3%, 96.7% and 95.2%, the BDV was good and no crack was generated, but the design capacity was not realized. This is because the electrode connectivity did not realize more than 98% because the ratio of the non-electrode region N to the electrode region E was small.

Samples 4, 9 and 14, which are comparative examples, were designed with Te of 0.237 μm, 0.334 μm and 0.465 μm, Ao / Ae of 4.52%, 4.85% and 4.58%, and electrode connectivity of 98.2%, 98.9% and 99.6%, respectively. Capacitance was implemented, no crack was generated, but the dielectric breakdown voltage characteristics were poor. This is because a large proportion of the non-electrode region N occupies the ceramic material existing in the internal electrode 30 to the dielectric body, and grains of the dielectric between the internal electrodes 30 grow abnormally.

Samples 10, 16, and 17, Comparative Examples, were designed to have 0.345 μm, 0.512 μm and 0.523 μm Te, 3.02%, 2.98% and 3.19% Ao / Ae, and 99.1%, 98.3% and 99.1% electrode connectivity, respectively. The dose was implemented and the BDV characteristics were good, but cracks occurred. When the ratio of the area Ao of the non-electrode area N to the area Ae of the electrode area E does not satisfy the numerical range of the present invention, there is little effect of stress relaxation and cracks may occur.

Unlike the comparative examples discussed above, the samples 1, 3, 5, 6, 8, 11, 13, 15, 19 and 20 which are the examples are 0.1 μm ≦ Te ≦ 0.55 μm, 3.2% ≦ Ao / Ae ≦ 4.5%, In the case of 98% ≦ C ≦ 99.99%, the design capacity was implemented, the BDV characteristics were good, and no crack was generated.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions should be considered to include plural meanings unless the context clearly indicates otherwise.

The terms “comprise” or “have” and the like mean that there is a feature, number, step, operation, component, or combination thereof described in the specification, but not intended to exclude it.

The present invention is not limited by the above-described embodiment and the accompanying drawings, but is intended to be limited by the appended claims.

Accordingly, various forms of substitution, modification, and alteration may be made by those skilled in the art without departing from the technical spirit of the present invention described in the claims, which are also within the scope of the present invention. something to do.

10: ceramic body
20, 21, 22: external electrode
30, 31, 32: internal electrode
S1 to S6: outer surface of the ceramic body
Te: thickness of internal electrode
N: non-electrode region
E: electrode region
G: gap

Claims (13)

  1. Ceramic body; And
    An internal electrode formed in the ceramic body and having a plurality of non-electrode regions therein;
    In the cross section formed by the longitudinal direction and the thickness direction of the ceramic body, when the thickness of the internal electrode is Te, the area of the internal electrode is Ae, and the area of the plurality of non-electrode areas is Ao, 0.1 μm ≦ Te. A multilayer ceramic electronic component satisfying ≦ 0.55 μm, 3.2% ≦ Ao / Ae ≦ 4.5%.
  2. The method of claim 1,
    The thickness Te of the internal electrode is an average thickness of the internal electrode.
  3. The method of claim 1,
    The non-electrode region is a multilayer ceramic electronic component comprising a ceramic blank.
  4. The method of claim 3,
    The ceramic ceramic material is a multilayer ceramic electronic component of the same material as the ceramic body.
  5. The method of claim 3,
    The non-electrode region further comprises pores.
  6. The method of claim 1,
    The multilayer ceramic electronic component satisfying 98% ≦ C ≦ 99.99% when the ratio of the length of the portion where the actual internal electrode is formed to the total length of the internal electrode is defined as the connectivity (C) of the internal electrode.
  7. Preparing a conductive paste comprising a conductive metal powder and a common powder, wherein a ratio of the average particle diameter of the common powder to the average particle diameter of the conductive metal powder is 1/12 or less;
    Forming an internal electrode on a ceramic green sheet using the conductive paste; And
    Stacking the ceramic green sheets on which the internal electrodes are formed;
    Sintering the laminate in which the ceramic green sheets are stacked to form a ceramic body,
    The ceramic body includes an internal electrode having a plurality of non-electrode regions therein,
    In the cross section formed in the longitudinal direction and the thickness direction of the ceramic body, when the area of the internal electrode is Ae and the area of the plurality of non-electrode areas is Ao, 3.2% ≤Ao / Ae≤4.5% is satisfied. Method of manufacturing laminated ceramic electronic components.
  8. The method of claim 7, wherein
    The ratio of the weight of the said common material to the weight of the said conductive metal is 24.3% or less, The manufacturing method of the multilayer ceramic electronic component.
  9. The method of claim 7, wherein
    The method of manufacturing a multilayer ceramic electronic component comprising the ceramic material.
  10. The method of claim 9,
    The ceramic material manufacturing method of a multilayer ceramic electronic component containing barium titanate or strontium titanate.
  11. The method of claim 7, wherein
    In the cross section formed in the longitudinal direction and the thickness direction of the ceramic body, when the ratio of the length of the portion where the actual internal electrode is formed to the total length of the internal electrode is defined as the connectivity (C) of the internal electrode, 98% ≦ C A method of manufacturing a multilayer ceramic electronic component that satisfies ≤99.99%.
  12. The method of claim 7, wherein
    And a thickness Te of the internal electrode satisfies 0.1 μm ≦ Te ≦ 0.55 μm.
  13. The method of claim 12,
    And the thickness Te of the internal electrode is an average thickness of the internal electrode.
KR1020130022247A 2013-02-28 2013-02-28 Multilayer ceramic electronic component and method for manufacturing the same KR102041629B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020130022247A KR102041629B1 (en) 2013-02-28 2013-02-28 Multilayer ceramic electronic component and method for manufacturing the same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020130022247A KR102041629B1 (en) 2013-02-28 2013-02-28 Multilayer ceramic electronic component and method for manufacturing the same
JP2013096796A JP6161950B2 (en) 2013-02-28 2013-05-02 Multilayer ceramic electronic component and manufacturing method thereof
US13/891,923 US9177725B2 (en) 2013-02-28 2013-05-10 Multilayer ceramic electronic component having internal electrode with non-electrode regions and method of manufacturing the same
CN201310195189.XA CN104021937B (en) 2013-02-28 2013-05-23 Laminated ceramic electronic component and its manufacture method

Publications (2)

Publication Number Publication Date
KR20140107963A KR20140107963A (en) 2014-09-05
KR102041629B1 true KR102041629B1 (en) 2019-11-06

Family

ID=51387906

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130022247A KR102041629B1 (en) 2013-02-28 2013-02-28 Multilayer ceramic electronic component and method for manufacturing the same

Country Status (4)

Country Link
US (1) US9177725B2 (en)
JP (1) JP6161950B2 (en)
KR (1) KR102041629B1 (en)
CN (1) CN104021937B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104508772B (en) * 2012-08-07 2017-09-01 株式会社村田制作所 The manufacture method of laminated ceramic capacitor and laminated ceramic capacitor
KR101883016B1 (en) * 2013-07-22 2018-07-27 삼성전기주식회사 Multilayer ceramic electronic component and method for manufacturing the same
JP2015053502A (en) 2014-10-23 2015-03-19 株式会社村田製作所 Multilayer ceramic capacitor
KR20170005645A (en) 2015-07-06 2017-01-16 삼성전기주식회사 Multi-layered ceramic electronic component
KR20170077548A (en) * 2015-12-28 2017-07-06 삼성전기주식회사 Multi-layered ceramic electronic component and method for manufacturing the same
CN107173849B (en) * 2016-03-11 2019-11-22 周宏明 A kind of conductivity ceramics film Multi-hole ceramic heating element and its application
JP2018041813A (en) * 2016-09-06 2018-03-15 太陽誘電株式会社 Multilayer ceramic capacitor and manufacturing method of the same
JP2018041814A (en) 2016-09-06 2018-03-15 太陽誘電株式会社 Multilayer ceramic capacitor and manufacturing method of the same
KR20180074400A (en) * 2016-12-23 2018-07-03 삼성전자주식회사 Display apparatus and method for displaying
US10483038B2 (en) 2017-05-16 2019-11-19 Taiyo Yuden Co., Ltd. Multilayer ceramic capacitor and manufacturing method of multilayer ceramic capacitor
JP2018195672A (en) * 2017-05-16 2018-12-06 太陽誘電株式会社 Multilayer ceramic capacitor and method for manufacturing the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060198078A1 (en) * 2005-03-01 2006-09-07 Tdk Corporation Multilayer ceramic capacitor and method of producing the same
JP2007103453A (en) * 2005-09-30 2007-04-19 Tdk Corp Method of manufacturing laminated ceramic electronic part
JP2007258476A (en) * 2006-03-23 2007-10-04 Tdk Corp Laminated electronic component and manufacturing method thereof
JP2012094809A (en) * 2010-10-26 2012-05-17 Samsung Electro-Mechanics Co Ltd Multilayer ceramic electronic component and manufacturing method for the same

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0855753A (en) * 1994-08-10 1996-02-27 Taiyo Yuden Co Ltd Layered ceramic capacitor and manufacture thereof
JP3514117B2 (en) * 1998-06-03 2004-03-31 株式会社村田製作所 Multilayer ceramic electronic component, method of manufacturing multilayer ceramic electronic component, and conductive paste for forming internal electrode
JP2000277369A (en) * 1999-03-29 2000-10-06 Taiyo Yuden Co Ltd Multilayer ceramic electronic component and conductive paste thereof
JP2001052950A (en) * 1999-08-05 2001-02-23 Murata Mfg Co Ltd Laminated ceramic electronic part and manufacture thereof
JP4502342B2 (en) 2000-04-27 2010-07-14 キヤノン株式会社 Strobe device
JP3743406B2 (en) * 2001-10-05 2006-02-08 株式会社村田製作所 Conductive paste, multilayer ceramic electronic component manufacturing method, and multilayer ceramic electronic component
JP4200792B2 (en) * 2003-03-12 2008-12-24 株式会社村田製作所 Multilayer ceramic capacitor
JP4362079B2 (en) * 2003-03-27 2009-11-11 Tdk株式会社 Multilayer chip capacitor and manufacturing method thereof
JP4385726B2 (en) * 2003-10-31 2009-12-16 昭栄化学工業株式会社 Conductive paste and method for producing multilayer ceramic capacitor using the same
CN102017033B (en) * 2008-07-29 2012-07-18 株式会社村田制作所 Laminated ceramic capacitor
JP5293951B2 (en) * 2008-12-24 2013-09-18 Tdk株式会社 Electronic components
KR101070151B1 (en) * 2009-12-15 2011-10-05 삼성전기주식회사 multilayer ceramic capacitor
JP5093311B2 (en) * 2010-07-28 2012-12-12 Tdk株式会社 Multilayer ceramic electronic components
WO2012070376A1 (en) * 2010-11-24 2012-05-31 株式会社村田製作所 Multilayer ceramic electronic component and method for manufacturing same
JP5630363B2 (en) * 2011-04-06 2014-11-26 株式会社村田製作所 Conductive paste and method for producing the same
KR101952843B1 (en) * 2011-07-07 2019-02-27 삼성전기주식회사 Conductive paste composition for internal electrode and multilayer ceramic electronic component
KR101843190B1 (en) * 2011-08-31 2018-03-28 삼성전기주식회사 Ceramic electronic component and method for manufacturing the same
KR101761939B1 (en) * 2012-04-26 2017-07-26 삼성전기주식회사 Laminated ceramic electronic parts and manufacturing method thereof
KR20140081568A (en) * 2012-12-21 2014-07-01 삼성전기주식회사 Multilayered ceramic electronic component

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060198078A1 (en) * 2005-03-01 2006-09-07 Tdk Corporation Multilayer ceramic capacitor and method of producing the same
JP2007103453A (en) * 2005-09-30 2007-04-19 Tdk Corp Method of manufacturing laminated ceramic electronic part
JP2007258476A (en) * 2006-03-23 2007-10-04 Tdk Corp Laminated electronic component and manufacturing method thereof
JP2012094809A (en) * 2010-10-26 2012-05-17 Samsung Electro-Mechanics Co Ltd Multilayer ceramic electronic component and manufacturing method for the same

Also Published As

Publication number Publication date
US20140240898A1 (en) 2014-08-28
KR20140107963A (en) 2014-09-05
US9177725B2 (en) 2015-11-03
JP6161950B2 (en) 2017-07-12
CN104021937B (en) 2018-03-16
CN104021937A (en) 2014-09-03
JP2014170911A (en) 2014-09-18

Similar Documents

Publication Publication Date Title
CN108288543B (en) Multilayer ceramic capacitor and board having the same
US10347421B2 (en) Multilayer ceramic electronic component and method of manufacturing the same
EP2669915B1 (en) Laminated chip electronic component, board for mounting the same and packing unit
US10037849B2 (en) Ceramic capacitor and methods of manufacture
US10269499B2 (en) Multilayer ceramic capacitor and board having the same
TWI544507B (en) Embedded multilayer ceramic electronic component and printed circuit board having the same
US9129752B2 (en) Ceramic electronic component and method of manufacturing the same
JP6138467B2 (en) Electronic component and manufacturing method thereof
KR101843182B1 (en) Multilayer ceramic electronic component
US9326381B2 (en) Multilayer ceramic capacitor and board having the same mounted thereon
US9036328B2 (en) Multilayer ceramic electronic component
US10373762B2 (en) Multilayer ceramic capacitor and board having the same
US9449763B2 (en) Multilayer ceramic electronic component having alternatively offset internal electrodes and method of manufacturing the same
JP2015146454A (en) Multilayer ceramic capacitor and method of manufacturing the same
JP6257060B2 (en) Multilayer ceramic electronic components
KR101565640B1 (en) A multilayer ceramic capacitor and a method for manufactuaring the same
US9837215B2 (en) Multilayer ceramic capacitor and board for mounting of the same
US9396879B2 (en) Multilayer ceramic capacitor and board having the same
US9087644B2 (en) Multilayer ceramic electronic component and fabrication method thereof
JP6016637B2 (en) Capacitor including a three-dimensional electrode having a large surface area and manufacturing method
JP2018186291A (en) Multilayer ceramic capacitor
KR101771728B1 (en) Laminated ceramic electronic parts and fabricating method thereof
CN103377824B (en) Laminated ceramic electronic component and its manufacture method
US9490069B2 (en) Multilayer ceramic electronic component
KR101753420B1 (en) Multilayered ceramic capacitor

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right