KR102030945B1 - Liquid treatment device and liquid treatment method - Google Patents

Abstract

A liquid processing apparatus connected to a processing liquid supply nozzle for supplying a processing liquid to a processing target substrate, the supply passage connecting a processing liquid storage container and the processing liquid supply nozzle, a filter device provided in the supply passage, and a filter device. A circulation conduit connecting the pump on the primary side, the discharge side of the pump and the suction side of the filter device, a supply control valve provided in the supply line on the secondary side of the pump, a circulation control valve provided in the circulation line, a pump, a supply control valve, and A control device for controlling the circulation control valve is provided, and when the supply of the processing liquid from the processing liquid supply nozzle to the processing target is stopped by closing the supply control valve, the circulation control valve is opened. Then, the pump is driven, and the treatment liquid is circulated between the supply line having the filter device and the circulation line.

Description

LIQUID TREATMENT DEVICE AND LIQUID TREATMENT METHOD}

The present invention relates to a liquid processing apparatus and a liquid processing method for supplying a processing liquid to a surface of a substrate to be processed, such as a semiconductor wafer or a glass substrate for LCD, for example.

This application claims priority based on Japanese Patent Application No. 2012-39538 for which it applied to Japan on February 27, 2012, and Japanese Patent Application No. 2012-288515 which was filed in Japan on December 28, 2012, and The content is used here.

In general, in photolithography technology for the manufacture of semiconductor devices, a photoresist is applied to a semiconductor wafer, an FPD substrate, or the like (hereinafter referred to as a wafer), and the resist film formed thereby is exposed along a predetermined circuit pattern. By developing the exposure pattern, a circuit pattern is formed in the resist film.

In such a photolithography step, a treatment such as a resist solution or a developer supplied to a wafer or the like may mix bubbles or particles (foreign matter) such as nitrogen gas for various reasons, and a mixture of bubbles and particles may be mixed. If the liquid is supplied to a wafer or the like, coating irregularities or defects may occur. For this reason, the apparatus for removing the bubble and particle mixed in a process liquid is provided in the process liquid pipeline.

Background Art [0002] Conventionally, as a device of this kind, a temporary storage container, a filter and a pump are provided in a supply line connecting a supply nozzle and a processing liquid storage container, and a circulation line is connected to a supply line and a filter between the processing liquid storage container and the temporary storage container. The processing liquid supply apparatus which has a piping and a variable diaphragm provided in the circulation pipe is known (for example, refer patent document 1). This processing liquid supply apparatus is provided with the some supply nozzle in order to plan the efficiency and the diversification of the process performed in a photolithography process, The supply nozzle is selected and used according to the objective.

In this processing liquid supply device, the liquid pressure of the processing liquid from which bubbles are removed by the filter is lowered by the variable diaphragm so that gas dissolved in the processing liquid is bubbled, and this bubble passes through the filter from the circulation path through the supply pipe again. By removing it. Therefore, the gas dissolved in a process liquid can be removed efficiently.

Japanese Patent Application Laid-Open No. 2010-135535 (claims, Figs. 3 and 4)

By the way, in the process liquid supply apparatus provided with the some supply line, the process liquid stays in the filter provided in the supply line connected with the supply nozzle which is not used. Here, when the treatment liquid is retained for a long time in a place where the capacity of the filter is large, bubbles or gel retained in the filter tend to grow and increase as particles at the interface between the filter and the treatment liquid. Therefore, as a method of preventing the increase of particles mixed in the processing liquid, the processing liquid is periodically discharged to a place other than a wafer to prevent the processing liquid from staying in a place having a large capacity such as a filter for a long time. This is considered (so-called dummy discharge). However, in the dummy discharge, the discharged processing liquid is discarded, so that the consumption amount of the processing liquid increases.

This invention is made | formed in view of the said situation, and an object of this invention is to restrain the increase of the particle in a process liquid efficiently, without unnecessary consumption of a process liquid.

In order to solve the said subject, the liquid processing apparatus of this invention is a liquid processing apparatus connected to one process liquid supply nozzle of the some process liquid supply nozzle which supplies a process liquid to a to-be-processed substrate,

A supply pipe for connecting the processing liquid storage container for storing the processing liquid and the processing liquid supply nozzle;

A filter device provided in the supply pipe and filtering the processing liquid and removing foreign matters mixed in the processing liquid;

A pump provided in said supply line on the secondary side of said filter device,

A circulation pipe connecting the discharge side of the pump and the suction side of the filter device;

A supply control valve installed in the supply line on the secondary side of the pump,

A circulation control valve installed in the circulation pipe;

A control device for controlling the pump, the supply control valve and the circulation control valve,

When the supply of the processing liquid from the one processing liquid supply nozzle to the processing target substrate is stopped by the control device by closing the supply control valve, the circulation control valve is opened to drive the pump. And the processing liquid is circulated between the supply line having the filter device and the circulation line.

With this configuration, the processing liquid staying in the filter device is circulated through the supply pipe and the circulation pipe in a state in which the supply of the processing liquid from the one processing liquid supply nozzle to the substrate to be processed is stopped (so-called idle state). You can.

In addition, in the present invention, the idle state refers to the processing liquid from the processing liquid storage container immediately after installation of the processing liquid storage container, in addition to the state in which the supply of the processing liquid is stopped from one processing liquid supply nozzle. It is assumed that the state until the supply start of is included.

Moreover, according to another viewpoint, this invention is the liquid processing method using the liquid processing apparatus,

The liquid processing apparatus includes a supply pipe connecting a processing liquid storage container for storing the processing liquid and a processing liquid supply nozzle for supplying the processing liquid to the substrate to be processed;

A filter device provided in the supply pipe and filtering the processing liquid and removing foreign matters mixed in the processing liquid;

A pump provided in said supply line on the secondary side of said filter device,

A circulation pipe connecting the discharge side of the pump and the suction side of the filter device;

A supply control valve installed in the supply line on the secondary side of the pump,

A circulation control valve installed in the circulation pipe;

A control device for controlling the pump, the supply control valve and the circulation control valve is provided.

And a processing liquid supply step of supplying the processing liquid to the substrate to be processed by opening the supply control valve and closing the circulation control valve to drive the pump.

When the processing liquid supply step is not performed, the supply control valve is closed, the circulation control valve is opened, and the pump is driven to circulate the processing liquid between the circulation pipe and the supply pipe. have.

By using such a method, in order to circulate the processing liquid between the circulation conduit and the supply conduit when the processing liquid is not supplied to the substrate to be processed, the processing liquid which remains in the filter device in the idle state is supplied to the supply pipe. It can be circulated through furnaces and circulation lines.

According to the present invention, since the processing liquid staying in the filter device can be circulated through the supply line and the circulation line in the unused state, it is possible to suppress the increase of particles in the processing liquid without performing dummy discharge during use. . Therefore, an increase in particles in the processing liquid can be effectively prevented without consuming the processing liquid unnecessarily.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic perspective view which shows the whole of the processing system which connected the exposure processing apparatus to the coating and developing processing apparatus to which the liquid processing apparatus which concerns on this invention was applied.
2 is a schematic plan view of the processing system.
FIG. 3: shows the outline of the structure of 1st Embodiment of the liquid processing apparatus which concerns on this invention, FIG.3 (a) is a schematic sectional drawing, FIG.3 (b) is in FIG.3 (a). Part A is a schematic cross-sectional view.
It is an enlarged schematic sectional drawing which shows the vicinity of the filter apparatus of 1st Embodiment of the liquid processing apparatus which concerns on this invention.
5 is a schematic cross-sectional view showing the normal processing operation in the liquid processing apparatus.
6 is a schematic cross-sectional view showing the circulation processing operation in the liquid processing apparatus.
It is a schematic sectional drawing which shows 2nd Embodiment of the liquid processing apparatus which concerns on this invention.
8 is a schematic cross-sectional view showing the third embodiment of the liquid processing apparatus according to the present invention.
It is a schematic sectional drawing which shows 4th Embodiment of the liquid processing apparatus which concerns on this invention.
It is a schematic sectional drawing which shows 5th Embodiment of the liquid processing apparatus which concerns on this invention.
FIG. 11: shows the whole degassing mechanism of 5th Embodiment of the liquid processing apparatus which concerns on this invention, FIG. 11 (a) is sectional drawing, FIG. 11 (b) is in FIG. It is an enlarged sectional view of part B of the.
It is a schematic sectional drawing which shows 6th Embodiment of the liquid processing apparatus which concerns on this invention.
It is an enlarged schematic sectional drawing which shows the vicinity of the filter apparatus of 6th Embodiment of the liquid processing apparatus which concerns on this invention.
It is a schematic sectional drawing which shows 7th Embodiment of the liquid processing apparatus which concerns on this invention.
It is an expanded schematic sectional drawing which shows the vicinity of the filter apparatus of 7th Embodiment of the liquid processing apparatus which concerns on this invention.
It is a schematic sectional drawing which shows 8th Embodiment of the liquid processing apparatus which concerns on this invention.
It is a schematic sectional drawing which shows 9th Embodiment of the liquid processing apparatus which concerns on this invention.
It is a schematic sectional drawing which shows 10th Embodiment of the liquid processing apparatus which concerns on this invention.
It is an enlarged schematic sectional drawing which shows the vicinity of the pump of 10th Embodiment of the liquid processing apparatus which concerns on this invention.
20 is a schematic view of a tenth embodiment of a liquid processing apparatus according to the present invention, FIG. 20A illustrates a bubble presenting step, and FIG. 20B illustrates a degassing step.
It is a schematic diagram which shows operation | movement which replenishes a process liquid to a trap tank in 10th Embodiment of the liquid processing apparatus which concerns on this invention.
It is a schematic sectional drawing which shows the liquid processing unit connected to the liquid processing apparatus which concerns on this invention.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on an accompanying drawing. Here, the case where the resist liquid processing apparatus as the liquid processing apparatus which concerns on this invention is mounted in the application | coating / development processing apparatus is demonstrated.

As shown in Figs. 1 and 2, the coating and developing processing apparatus includes a carrier station for carrying in and out of a carrier 10 for hermetically storing a plurality of, for example, 25 sheets of a wafer W as a substrate to be processed ( 1), the processing part 2 which performs resist application | coating, the developing process, etc. to the wafer W taken out from this carrier station 1, and the liquid layer which permeate | transmits the light on the surface of the wafer W is formed. The exposure part 4 which immerses and exposes the surface of the wafer W, and the interface part 3 which is connected between the process part 2 and the exposure part 4, and delivers the wafer W is provided.

The carrier station 1 has a loading section 11 capable of stacking a plurality of carriers 10 side by side, an opening / closing section 12 provided on a wall surface in front of the loading section 11 and a carrier section through the opening / closing section 12. Delivery means A1 for taking out the wafer W from 10 is provided.

The interface part 3 is comprised from the 1st conveyance chamber 3A and the 2nd conveyance chamber 3B which are provided back and forth between the process part 2 and the exposure part 4, and each of the 1st wafer conveyance parts 30A is carried out. ) And a second wafer transfer section 30B are provided.

In addition, a processing unit 2 enclosed by a housing 20 is connected to the inner side of the carrier station 1, and the processing unit 2 has a multistage unit of a heating and cooling system sequentially from the front side. Lathe units U1, U2, U3, liquid processing units U4, U5, and main transport means A2, A3 for transferring the wafers W between the units are alternately arranged.

In addition, the main transport means A2, A3 are the one surface part of the shelf unit U1, U2, U3 side arrange | positioned in the front-back direction seen from the carrier station 1, and the liquid processing unit U4, U5 side mentioned later, for example It is arrange | positioned in the space enclosed by the partition wall 21 comprised by the one surface part of and the back surface part which comprises one surface of the left side. In addition, between the carrier station 1 and the processing unit 2, and between the processing unit 2 and the interface unit 3, a temperature and humidity control unit 22 including a temperature control device for a processing liquid used in each unit, a duct for controlling temperature and humidity, and the like. ) Is arranged.

The lathe units U1, U2 and U3 have a configuration in which various units for pre- and post-treatment of the processes performed in the liquid processing units U4 and U5 are stacked in multiple stages, for example, 10 stages, and the combination includes wafers. Heating units (not shown) for heating (so-called baking) W, cooling units (not shown) for cooling the wafers W, and the like. Further, the liquid processing units U4 and U5 for supplying a predetermined processing liquid to the wafer W and performing the processing are reflected on the chemical liquid storage unit 14 such as a resist or a developing solution, for example, as shown in FIG. 1. Anti-reflection film coating unit (BCT) 23 for applying the anti-coat film, coating unit (COT) 24 for applying the resist solution to the wafer W, and developing unit for developing and supplying the developer to the wafer W (DEV) 25) is laminated | stacked in multiple steps, for example, 5 steps. The coating unit (COT) 24 includes the liquid processing apparatus 5 and the liquid processing unit 100 according to the present invention.

An example of the flow of the wafer in the coating / developing apparatus configured as described above will be briefly described with reference to FIGS. 1 and 2. First, when the carrier 10 containing 25 wafers W, for example, is loaded in the loading portion 11, the cover of the carrier 10 is removed together with the opening and closing portion 12 and the wafer is transferred by the transfer means A1. (W) is taken out. Then, the wafer W is transferred to the main transport means A2 via a transfer unit (not shown) constituting one end of the shelf unit U1, and as a pretreatment of the coating treatment, for example, after the antireflection film formation treatment and the cooling treatment are performed. The resist liquid is applied by the coating unit (COT) 24. Subsequently, by the main transport means A2, the wafer W is heated (baked) in a heating unit constituting one shelf of the shelf units U1 and U2, and further cooled, and then interfaced via the transfer unit of the shelf unit U3. It is carried in to the part 3. In the interface unit 3, the exposure unit 4 is formed by the first wafer transfer unit 30A and the second wafer transfer unit 30B of the first transfer chamber 3A and the second transfer chamber 3B. It conveys and an exposure means (not shown) is arrange | positioned so that it may face the surface of the wafer W, and exposure is performed. After exposure, the wafer W is conveyed to the main transport means A3 in the reverse path, and developed in the developing unit (DEV) 25 to form a pattern. Thereafter, the wafer W is returned to the original carrier 10 loaded on the mounting portion 11.

Next, a first embodiment of a liquid processing apparatus according to the present invention will be described.

<First Embodiment>

As shown in FIG. 3, the liquid processing apparatus 5 according to the present invention includes a processing liquid storage container 60 (hereinafter referred to as a resist container 60) that stores a resist liquid L as a processing liquid. And a supply conduit 51 for connecting one processing liquid supply nozzle 7a of the processing liquid supply nozzle 7 described later, which ejects and supplies the resist liquid L to the wafer W, and the supply conduit 51 Filter device 52a which is installed in the filter, removes particles by filtering the resist liquid L, and removes foreign substances (bubbles) mixed in the resist liquid L, and the secondary side of the filter apparatus 52a. The first trap tank 53 provided in the supply pipe 51 of the pump, the pump P provided in the supply pipe 51 on the secondary side of the first trap tank 53, and the supply pipe on the secondary side of the pump P. Circulation control provided in the circulation pipe 55 and the circulation pipe 55 which connect the 2nd trap tank 54 provided in the furnace 51, the discharge side of the pump P, and the suction side of the filter apparatus 52a. With valve 56, The second trap tank 54 is provided with a second supply control valve 57 provided in the supply pipe 51 of the side of the.

The supply line 51 is the first processing liquid supply line 51a for connecting the resist container 60 and the buffer tank 61 as a processing liquid temporary storage container for temporarily storing the processing liquid guided from the resist container 60. ) And a second processing liquid supply pipe 51b connecting the buffer tank 61 and the processing liquid supply nozzle 7 to each other. Therefore, the filter apparatus 52a, the 1st trap tank 53, the pump P, the 2nd trap tank 54, and the supply control valve 57 are provided in the 2nd process liquid supply line 51b.

The circulation pipe 55 connects the second processing liquid supply pipe 51b on the secondary side of the pump P and the second processing liquid supply pipe 51b on the primary side of the filter device 52a to the second trap tank 54. Connect via Moreover, the 2nd trap tank 54 is provided in the connection part which connects the supply line 51 and the circulation line 55. As shown in FIG.

As shown in FIG. 3B, a diaphragm pump for sucking and discharging the processing liquid in the second processing liquid supply pipe 51b is used for the pump P. As shown in FIG. The pump P is divided into a pump chamber 72 corresponding to the pump portion and an operating chamber 73 corresponding to the driving portion by the diaphragm 71 which is a flexible member. In addition, the inlet of the pump P is provided with an electromagnetic opening / closing valve V31 for enabling the inflow of the resist liquid L from the second processing liquid supply line 51b into the pump P, and the discharge port has an electromagnetic valve. An on-off valve V32 is provided. On-off valves V31 and V32 communicate with pump chamber 72.

The operating means 73 is connected to a driving means 74 having a major regulator for controlling the depressurization and pressurization of the gas in the operating chamber 73 based on the signal from the controller 200. The open / close valves V31 and V32 are controlled based on the signal from the controller 200. The controller 200 mainly comprises a central processing unit (CPU) as a control device described later.

In addition, the processing liquid supply nozzle 7 provided in the nozzle unit 70 is connected to the second processing liquid supply pipe 51b on the secondary side of the supply control valve 57. As the supply control valve 57, for example, a flow control valve having a dispense valve is used.

The nozzle unit 70 is provided with a plurality of processing liquid supply nozzles 7a to 7d (shown as four cases in the drawing), among which the processing liquid supply nozzle 7a is the liquid processing apparatus of this embodiment ( 5) is connected. Moreover, the same resist container, filter apparatus, and pump as the above-mentioned resist container 60, the filter apparatus 52a, and the pump P are connected to the other process liquid supply nozzles 7b-7d.

The upper portion of the resist container 60 has a gas supply pipe of claim 1 (8a) is provided for connecting with an inert gas, such as nitrogen gas (N ₂₎ nitrogen gas source 62 for supplying a. The first gas supply line 8a is provided with an electric regulator R which is a variable pressure control means that can be adjusted. This electric regulator R is provided with the operation part which is operated by the control signal from the controller 200, for example, a proportional solenoid, and the valve mechanism which opens and closes by operation of the said proportional solenoid, It is configured to adjust.

An electromagnetic switching valve V1 is provided between the electric regulator R of the first gas supply line 8a and the resist container 60. In addition, an electromagnetic switching valve V2 is provided between the resist container 60 and the buffer tank 61 of the first processing liquid supply pipe 51a.

The first gas supply line 8a is connected with a second gas supply line 8b having one end branched from the first gas supply line 8a and the other end connected to the upper portion of the buffer tank 61. . The second gas supply line 8b is provided with a switching valve V3 that communicates switchably between the buffer tank 61 and the atmospheric portion 63 or the nitrogen gas supply source 62 which are open to the atmosphere. The switching valve V3 is an electromagnetic switching valve that can be switched between three ports for switching one port on the buffer tank 61 side, two ports on the nitrogen gas supply source 62 side, and the standby section 63 side. It is formed, and the inside of the buffer tank 61 is formed so that communication with the atmosphere side or the nitrogen gas supply source 62 side is possible by the switching operation of this switching valve V3.

On the other hand, the drain pipe 51c for exhausting the atmosphere in the filter device 52a is provided in the upper part of the filter device 52a, and the electromagnetic opening / closing valve V4a is provided in the drain pipe 51c. In addition, drain pipes 51d and 51h for exhausting the atmosphere in the first trap tank 53 and the second trap tank 54 are also disposed on the first trap tank 53 and the second trap tank 54. Electromagnetic open / close valves V5a and V5b are provided in the drain pipes 51d and 51h.

The open / close valves V4a, V5a, V5b, the circulation control valve 56, and the supply control valve 57 are electrically connected to the controller 200, and are switched based on the control signal from the controller 200. And opening / closing operations are performed. Moreover, the upper limit liquid level sensor 61a and the lower limit liquid level sensor 61b which detect the upper limit liquid level and the lower limit liquid level of the resist liquid L in the buffer tank 61 are provided. The signal detected by these upper limit liquid level sensor 61a and the lower limit liquid level sensor 61b is transmitted to the controller 200. In addition, the electric regulator R, the switching valve V1, the switching valve V2, and the switching valve V3 are electrically connected to the controller 200, and operate | move based on the control signal from this controller 200. FIG. Further, the electric regulator R, the upper limit liquid level sensor 61a, the lower limit liquid level sensor 61b, the switching valves V1 and V3, the opening and closing valves V2 and V4a to V7, the opening and closing valves V31 to V33, the circulation control valve ( 56 and the connection of the supply control valve 57 and the controller 200 are not shown in FIGS. 4 to 17.

Next, the structure of the filter apparatus 52a of the said liquid processing apparatus is demonstrated based on FIG. The filter device 52a is mainly composed of a filter 52f formed in a cylindrical shape, a holding portion 52i held so as to surround the filter 52f, and an outer wall portion 52o. Further, on the inner circumferential side of the filter 52f, a space portion 52s is formed in which the circulating resist liquid L is filled. A resist liquid passage 52p is provided between the outer wall portion 52o of the filter device 52a and the holding portion 52i. In addition, the secondary side of the resist liquid passage 52p communicates with the space portion 52s through the filter 52f. In addition, the primary side and the secondary side of the space portion 52s communicate with the second processing liquid supply pipe 51b, and the secondary side of the resist liquid passage 52p communicates with the drain tube 51c.

Next, an operation mode of the liquid processing apparatus will be described with reference to FIGS. 3A to 6. 5 and 6, control systems such as the controller 200 are omitted.

ㆍ Resist liquid supply to buffer tank

First, after the resist container 60 is set (installed), the switching valve V1 provided in the first gas supply line 8a and the first processing liquid supply line (based on the control signal from the controller 200) The opening / closing valve V2 provided in 51a is opened, and the resist liquid L is supplied into the buffer tank 61 by pressurization of the nitrogen gas supplied from the nitrogen gas supply source 62 into the resist container 60. At this time, the switching valve V3 is switched to the atmospheric portion 63 side, and the buffer tank 61 communicates with the atmosphere.

Nitrogen gas pressurization-resist liquid discharge of resist liquid

As shown in FIG. 5, when a predetermined amount of the resist liquid L is replenished in the buffer tank 61, based on a control signal from a controller (not shown) that receives a detection signal from the upper limit liquid level sensor 61a, The switching valve V1 and the closing valve V2 are closed, and the switching valve V3 is switched to the nitrogen gas supply source 62 side. Thereby, while nitrogen gas is supplied from the nitrogen gas supply source 62 into the buffer tank 61, the supply control valve 57 of the 2nd process liquid supply line 51b is opened, and the pump P drives. The resist liquid L is discharged (supplied) from the processing liquid supply nozzle 7a to the wafer W, and processing is performed (processing liquid supplying process). At this time, the open / close valves V4a, V5a, and V5b are opened by signals from a controller (not shown), and bubbles are dissolved in the filter device 52a, the first trap tank 53, and the second trap tank 54. Is discharged to the outside through the drain pipes 51c, 51d, and 51h.

Circulation of resist liquid

Next, the circulation of the resist liquid L performed through the supply line 51 and the circulation line 55 will be described. As shown in FIG. 6, when the resist liquid is supplied from the processing liquid supply nozzle 7d to the wafer W, the supply control valve 57 is closed by a signal from a controller (not shown), whereby the processing liquid supply nozzle Supply of the resist liquid L from 7a to the wafer W is stopped (idle state). In this idle state, the circulation control valve 56 is opened by a signal from a controller (not shown).

When the pump P is driven in a state where the supply control valve 57 provided in the second processing liquid supply pipe 51b is closed and the circulation control valve 56 provided in the circulation pipe 55 is opened, the filter device 52a The resist liquid L retained in the inlet flows into the circulation conduit 55 through the first trap tank 53 and the second trap tank 54, and the resist liquid L introduced into the circulation conduit 55 is And flows into the second processing liquid supply pipe 51b on the primary side of the filter device 52a. Therefore, when supplying the processing liquid from the processing liquid supply nozzle 7d to the wafer W, the supply control valve 57 is closed, the circulation control valve 56 is opened, and the pump P is driven. The resist liquid L is circulated between the processing liquid supply line 51b and the circulation line 55 (circulation step). And a process liquid supply process is performed after a circulation process is completed.

With this configuration, a resist is supplied from the processing liquid supply nozzle 7d to the wafer W, and the supply of the resist liquid L from the processing liquid supply nozzle 7a to the wafer W is stopped (children State), the resist liquid L remaining in the filter device 52a can be circulated through the second processing liquid supply pipe 51b and the circulation pipe 55. Therefore, even when the supply of the resist liquid L is stopped from the process liquid supply nozzle 7a to the wafer W, the particles in the resist liquid L are not discharged at the time of supply of the process liquid. The increase can be suppressed. Therefore, the increase of the particle of the resist liquid L can be suppressed efficiently, without consuming the resist liquid L unnecessarily.

In addition, even after the installation of the resist container 60, when the idle state until the process liquid supply process is started is long, it is preferable to perform a circulation process before starting the process liquid supply process. Thus, by performing a circulation process before starting a process liquid supply process, since the increase of the particle in the resist liquid L before starting a process liquid supply process can be suppressed, it does not consume the resist liquid L unnecessarily. The increase of the particle | grains of the resist liquid L can be suppressed efficiently.

Here, it is preferable to perform circulation of the resist liquid L between the 2nd process liquid supply line 51b and the circulation line 55 at intervals of about 15 minutes. By circulating the resist liquid L at predetermined intervals, the retention of the resist liquid L in the filter device 52a can always be suppressed, so that the idle state is terminated and the wafer is released from the processing liquid supply nozzle 7a. When discharging (supplying) the resist liquid L to (W), the resist liquid L can be supplied to the wafer W without circulating the resist liquid L by the liquid processing apparatus 5. . Therefore, the time required for the process of supplying the resist liquid L to the wafer W can be shortened.

<2nd embodiment>

Based on FIG. 7, the 2nd Embodiment of the liquid processing apparatus which concerns on this invention is described. In addition, in 2nd Embodiment, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected to the same part and description is abbreviate | omitted.

In the circulation conduit 55 of the second embodiment, the second processing liquid supply conduit 51b on the secondary side of the pump P and the buffer tank 61 are connected via the second trap tank 54. Therefore, by operating the pump P in a state in which the supply control valve 57 and the switching valve V1 are closed and the circulation control valve 56 is opened, the resist liquid L sucked into the pump P is connected to the circulation pipe. It is stored in the buffer tank 61 through 55. In addition, the circulation pipe 55 may connect the discharge port of the pump and the buffer tank 61.

In this manner, similarly to the first embodiment, even in the idle state, an increase in particles in the resist liquid L can be suppressed without performing dummy discharge during the supply of the processing liquid. Therefore, the increase in the particle of the resist liquid L can be suppressed efficiently, without consuming the resist liquid L unnecessarily. In addition, similarly to the first embodiment, the resist liquid by the liquid processing apparatus 5 when the idle state is completed and the resist liquid L is discharged (supplied) from the processing liquid supply nozzle 7a to the wafer W. The resist liquid L can be supplied to the wafer W without circulating (L). Therefore, the time required for the process of supplying the resist liquid L to the wafer W can be shortened.

Third Embodiment

Based on FIG. 8, 3rd Embodiment of the liquid processing apparatus which concerns on this invention is described. In addition, in 3rd Embodiment, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected to the same part and description is abbreviate | omitted.

In the pump P used in the third embodiment, there is one suction port for suctioning the processing liquid in the second processing liquid supply pipe 51b on the primary side and the second processing liquid supply pipe 51b on the secondary side. Two discharge ports for discharging the processing liquid are formed in the conduit 55. The inlet port is operated based on a signal from the controller 200, and the electromagnetic shut-off valve V33 enabling the inflow of the resist liquid L into the pump P from the second processing liquid supply line 51b on the primary side. ) (Suction valve V33 on the suction side) is provided. In addition, the discharge opening is provided with an electromagnetic opening / closing valve V34 that makes it possible to discharge the resist liquid L from the pump P to the processing liquid supply nozzle 7a by operating based on a signal from the controller 200. 1 open / close valve V34] and electromagnetic open / close valve V35 for selectively supplying the resist liquid L to the circulation line 55 of the pump P and discharging the gas in the pump P. 2 on-off valve (V35)] is provided. The opening / closing valve V33, the first opening / closing valve V34, and the second opening / closing valve V35 on the suction side communicate with the pump chamber 72.

The operating means 73 is connected to a driving means 74 having a major regulator for controlling the depressurization and pressurization of the gas in the operating chamber 73 based on the signal from the controller 200. The opening / closing valve V33, the first opening / closing valve V34, and the second opening / closing valve V35 on the suction side are controlled based on the signal from the controller 200.

In the first and second embodiments, the circulation control valve 56 is provided in the circulation conduit 55, but in the third embodiment, the circulation control valve 56 is not provided in the circulation conduit 55. In addition, in 1st Embodiment and 2nd Embodiment, although the 2nd trap tank 54 is provided in the 2nd process liquid supply line 51b of the secondary side of the pump P, in 3rd Embodiment, The trap tank is not installed. In addition, in 3rd Embodiment, the circulation pipe 55 is the discharge port of the pump P which communicates through the 2nd opening / closing valve V35, and the 2nd process liquid supply pipe 51b of the primary side of the filter apparatus 52a. ) Is connected.

Next, the circulation of the resist liquid L in the third embodiment will be described. In the idling state, the first open / close valve V34 and the supply control valve 57 are closed by the signal from the controller 200, and the open / close valve V33 and the second open / close valve V35 are opened. . When the pump P is driven in this state, the resist liquid L retained in the filter device 52a flows into the circulation conduit 55 through the first trap tank 53 and flows into the circulation conduit 55. The resist liquid L flows into the second processing liquid supply pipe 51b on the primary side of the filter device 52a.

In this manner, similarly to the first embodiment, even in the idle state, an increase in particles in the resist liquid L can be suppressed without performing dummy discharge during the supply of the processing liquid. Therefore, the increase in the particle of the resist liquid L can be suppressed efficiently, without consuming the resist liquid L unnecessarily. In addition, similarly to the first embodiment, the resist liquid by the liquid processing apparatus 5 when the idle state is completed and the resist liquid L is discharged (supplied) from the processing liquid supply nozzle 7a to the wafer W. The resist liquid L can be supplied to the wafer W without circulating (L). Therefore, the time required for the process of supplying the resist liquid L to the wafer W can be shortened.

<4th embodiment>

Based on FIG. 9, 4th Embodiment of the liquid processing apparatus which concerns on this invention is described. In addition, in 4th Embodiment, about the structure similar to 3rd Embodiment, the same code | symbol is attached | subjected to the same part and description is abbreviate | omitted.

The circulation line 55 in 4th Embodiment is the 1st circulation line 55a which connects the 1st trap tank 53 and the pump P, the 1st trap tank 53, and the filter apparatus 52a. It consists of the 2nd circulation pipe 55b which connects the 2nd process liquid supply pipe 51b of the primary side of the said to. In addition, the second circulation pipe 55b is provided with a circulation control valve 56 that operates on the basis of the signal from the controller 200 to enable distribution from the pump P to the filter device 52a.

Next, the circulation of the resist liquid L in the fourth embodiment will be described. In the idling state, the first open / close valve V34 and the supply control valve 57 are closed by the signal from the controller 200, and the open / close valve V33 and the second open / close valve V35 are opened. . When the pump P is driven in this state, the resist liquid L remaining in the filter device 52a flows into the first circulation pipe 55a through the first trap tank 53 and the pump P, The resist liquid L introduced into the first circulation conduit 55a passes through the first trap tank 53 and the second circulation conduit 55b to form the second processing liquid supply conduit 51b on the primary side of the filter device 52a. Flows into).

In this manner, similarly to the third embodiment, even in the idle state, the increase in the particles in the resist liquid L can be suppressed without performing dummy discharge during the supply of the processing liquid. Therefore, the increase in the particle of the resist liquid L can be suppressed efficiently, without consuming the resist liquid L unnecessarily. In addition, similarly to the third embodiment, the resist liquid by the liquid processing apparatus 5 when the idle state is completed and the resist liquid L is discharged (supplied) from the processing liquid supply nozzle 7a to the wafer W. The resist liquid L can be supplied to the wafer W without circulating (L). Therefore, the time required for the process of supplying the resist liquid L to the wafer W can be shortened.

<Fifth Embodiment>

Based on FIG. 10, FIG. 11 (a), FIG. 11 (b), 5th Embodiment of the liquid processing apparatus which concerns on this invention is described. In addition, in 5th Embodiment, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected to the same part and description is abbreviate | omitted.

The liquid processing apparatus 5 of 5th Embodiment is a secondary side of the connection point of the circulation line 55 and the 2nd processing liquid supply line 51b, and is the 2nd processing liquid supply line of the primary side of the filter apparatus 52a. The degassing mechanism 80 is provided in 51b.

The degassing mechanism 80 has the container 81 and the semi-permeable membrane tube 82, as shown to FIG. 11 (a), (b), and removes the gas which exists in the resist liquid L. FIG. It is configured to. Moreover, the container 81 has the inflow port 83 and the outflow port 84 connected to the 2nd process liquid supply line 51b. The container 81 also has an exhaust port 85 to which a discharge pipe 86 for discharging gas present in the resist liquid L to the outside is connected. In addition, the discharge pipe 86 is connected to an exhaust pump not shown.

On the other hand, the semi-permeable membrane tube 82 is arrange | positioned in the container 81, and is connected to both ports 83 and 84. And the whole is formed with the hollow fiber membrane of ethylene tetrafluoride type or polyolefin type, for example. Therefore, when the pump P is driven, the resist liquid L is introduced into the semi-permeable membrane tube 82, and the exhaust pump not shown in the air around the semi-permeable membrane tube 82 in the container 81 is removed. By driving and exhausting, the air around the semi-permeable membrane tube 82 is reduced in pressure, and the gas in the resist liquid L can be made present. The current gas is discharged to the outside through the discharge pipe 86 by the driving of the exhaust pump.

With this configuration, since the gas dissolved in the resist liquid L can be discharged to the outside by the degassing mechanism 80, the gas in the resist liquid L circulated in the supply line 51 or the circulation line 55. Can be degassed (degassing step). Therefore, mixing of gas into the resist liquid L supplied to the wafer W can be suppressed.

In this manner, as in the first embodiment, even in the idle state, an increase in particles in the resist liquid L can be suppressed without performing dummy ejection at the time of supply of the processing liquid. Therefore, the increase in the particle of the resist liquid L can be suppressed efficiently, without consuming the resist liquid L unnecessarily. In addition, similarly to the first embodiment, the resist liquid by the liquid processing apparatus 5 when the idle state is completed and the resist liquid L is discharged (supplied) from the processing liquid supply nozzle 7a to the wafer W. The resist liquid L can be supplied to the wafer W without circulating (L). Therefore, the time required for the process of supplying the resist liquid L to the wafer W can be shortened.

Sixth Embodiment

Based on FIG. 12, FIG. 13, 6th Embodiment of the liquid processing apparatus which concerns on this invention is described. In addition, in 6th Embodiment, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected to the same part and description is abbreviate | omitted.

The liquid processing apparatus 5 of 6th Embodiment is provided with the vibrating body 58 which ultrasonically vibrates the processing liquid in the filter apparatus 52a. In this case, as shown in FIG. 13, the vibrating body 58 drives the diaphragm 58a and the diaphragm 58a adhering to the bottom face of the filter apparatus 52a, for example, and the ultrasonic power supply 58c. It is mainly comprised by the ultrasonic generator 58b provided with the following. The ultrasonic generator 58b is electrically connected to the controller 200, and drive control is performed based on the control signal from the controller 200. As the vibrating body 58, for example, an ultrasonic vibrator is used.

The filter 52f for removing a foreign material is provided in the inside of the filter apparatus 52a. The vibration of the diaphragm 58a based on the control signal from the controller 200 is applied to this filter 52f, so that the retention of the resist liquid L in the filter 52f can be prevented and the filter 52f The increase in the particle of the resist liquid L which stays in) can be prevented efficiently.

In this manner, similarly to the first embodiment, even in the idle state, an increase in particles in the resist liquid L can be suppressed without performing dummy discharge at the time of supply of the processing liquid. Therefore, the increase in the particle of the resist liquid L can be suppressed efficiently, without consuming the resist liquid L unnecessarily. In addition, similarly to the first embodiment, the resist liquid by the liquid processing apparatus 5 when the idle state is completed and the resist liquid L is discharged (supplied) from the processing liquid supply nozzle 7a to the wafer W. The resist liquid L can be supplied to the wafer W without circulating (L). Therefore, the time required for the process of supplying the resist liquid L to the wafer W can be shortened.

Seventh Embodiment

Based on FIG. 14, FIG. 15, 7th Embodiment of the liquid processing apparatus which concerns on this invention is described. In addition, in 7th Embodiment, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected to the same part and description is abbreviate | omitted.

In addition to the liquid processing apparatus of the first embodiment, the liquid processing apparatus 5 of the seventh embodiment includes a temperature sensor 59a for detecting the temperature of the resist liquid L in the filter apparatus 52a, and the filter apparatus 52a. As a temperature control device which controls the temperature of the resist liquid L in the inside, a temperature controller 59b is disposed. The temperature sensor 59a is provided in the second processing liquid supply pipe 51b on the secondary side of the filter device 52a. Moreover, the thermostat 59b is provided so that the filter apparatus 52a may be covered. The temperature sensor 59a, the temperature controller 59b, and the temperature control power supply 59c are connected to the controller 200. As the temperature sensor 59a, a thermistor is used, for example. As the temperature controller 59b, for example, a thermocouple is used.

As temperature control of the thermostat 59b, when the temperature of the resist liquid L in the filter apparatus 52a detected by the temperature sensor 59a is predetermined temperature, for example, 22 degrees C or less, The control signal is transmitted to the temperature regulator 59b, and the control which raises the temperature of the resist liquid L in the filter apparatus 52a to 40 degreeC is performed.

By configuring in this way, since the temperature of the resist liquid L which stays in the filter apparatus 52a can be detected, and the temperature of the resist liquid L can be controlled by the temperature controller 59b and the controller 200, The viscosity of the resist liquid L resulting from temperature can be kept below a predetermined value, and it can suppress that the resist liquid L stays in the filter apparatus 52a. Therefore, the increase of the particle in the resist liquid L which stays in the filter apparatus 52a can be prevented efficiently.

In this manner, as in the first embodiment, even in the idle state, an increase in particles in the resist liquid L can be suppressed without performing dummy ejection at the time of supply of the processing liquid. Therefore, the increase in the particle of the resist liquid L can be suppressed efficiently, without consuming the resist liquid L unnecessarily. In addition, similarly to the first embodiment, the resist liquid by the liquid processing apparatus 5 when the idle state is completed and the resist liquid L is discharged (supplied) from the processing liquid supply nozzle 7a to the wafer W. The resist liquid L can be supplied to the wafer W without circulating (L). Therefore, the time required for the process of supplying the resist liquid L to the wafer W can be shortened.

<8th embodiment>

Based on FIG. 16, 8th Embodiment of the liquid processing apparatus which concerns on this invention is described. In addition, in 8th Embodiment, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected to the same part and description is abbreviate | omitted.

The liquid processing apparatus 5 of 8th Embodiment connects several, for example, two filter apparatuses provided in the liquid processing apparatus 5 of 1st Embodiment in series. Drain pipes 51c and 51e for exhausting the atmosphere in the filter devices 52a and 52b are provided above the filter devices 52a and 52b, and electromagnetic shutoff valves V4a and 51e are provided in the drain pipes 51c and 51e. V4b) is installed. In the eighth embodiment, two filter devices 52a and 52b are connected in series, but three or more filter devices 52a and 52b may be connected in series. In addition, in 8th Embodiment, since another part is the same as that of 1st Embodiment, the same code | symbol is attached | subjected to the same part and description is abbreviate | omitted.

With this configuration, it is possible to remove more foreign matter (particles and bubbles) than when one filter device 52a is provided in the second processing liquid supply pipe 51b.

In this manner, similarly to the first embodiment, even in the idle state, an increase in particles in the resist liquid L can be suppressed without performing dummy discharge at the time of supply of the processing liquid. Therefore, the increase in the particle of the resist liquid L can be suppressed efficiently, without consuming the resist liquid L unnecessarily. In addition, similarly to the first embodiment, the resist liquid by the liquid processing apparatus 5 when the idle state is completed and the resist liquid L is discharged (supplied) from the processing liquid supply nozzle 7a to the wafer W. The resist liquid L can be supplied to the wafer W without circulating (L). Therefore, the time required for the process of supplying the resist liquid L to the wafer W can be shortened.

<Ninth Embodiment>

17, the 9th Embodiment of the liquid processing apparatus which concerns on this invention is described. In addition, in 9th Embodiment, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected to the same part and description is abbreviate | omitted.

In addition to the liquid processing apparatus 5 of 1st Embodiment, the liquid processing apparatus 5 of 9th Embodiment has the filter apparatus 52c in the 2nd process liquid supply pipe 51b of the secondary side of the supply control valve 57. Is installed. In other words, this filter device 52c is provided in the second processing liquid supply line 51b near the processing liquid supply nozzle 7a. In addition, a return pipe 51f for returning the bubbles separated by the filter device 52c to the buffer tank 61 is formed at the upper portion of the filter device 52c, and the return pipe 51f is a buffer tank 61. Is connected to the upper part of the In addition, an electromagnetic on / off valve V7 is provided in the return line 51f, and the on / off valve V7 is opened and closed by a control signal from the controller 200. In addition, in 9th Embodiment, since another part is the same as that of 1st Embodiment, the same code | symbol is attached | subjected to the same part and description is abbreviate | omitted.

In this configuration, when the resist liquid L is supplied (discharged) to the wafer W, the resist liquid L passes through the filter device 52c, so that the filter device 52a or the first trap tank 53 are provided. ), It becomes possible to remove foreign matters (particles and bubbles) in the resist liquid L which could not be completely removed from the second trap tank 54.

In this manner, similarly to the first embodiment, even in the idle state, an increase in particles in the resist liquid L can be suppressed without performing dummy discharge at the time of supply of the processing liquid. Therefore, the increase in the particle of the resist liquid L can be suppressed efficiently, without consuming the resist liquid L unnecessarily. In addition, similarly to the first embodiment, the resist liquid by the liquid processing apparatus 5 when the idle state is completed and the resist liquid L is discharged (supplied) from the processing liquid supply nozzle 7a to the wafer W. The resist liquid L can be supplied to the wafer W without circulating (L). Therefore, the time required for the process of supplying the resist liquid L to the wafer W can be shortened.

<10th embodiment>

18-21, 10th Embodiment of the liquid processing apparatus which concerns on this invention is described.

In the liquid processing apparatus 5 shown in FIG. 18, the third open / close valve V6 is the primary side of the filter device 52a and the second processing liquid supply line 51b on the secondary side of the connection portion with the second circulation conduit 55b. ) Is installed. In addition, in 10th Embodiment, the level sensor which is not shown in figure which detects the liquid level of the resist liquid L stored in the 1st trap tank 53 is provided.

As shown in FIG. 19, the said pump P is divided into the pump chamber 72 corresponded to a pump part, and the operation chamber 73 corresponded to a drive part by the diaphragm 71 which is a flexible member, and a pump chamber 72, the primary side communication path 72a connected to the filter apparatus 52a side, the secondary side communication path 72b connected to the process liquid supply nozzle 7a side via the 1st opening / closing valve V34, and And a circulation and exhaust side communication path 72c connected to the first circulation pipe 55a via the second open / close valve V35 is provided.

In addition, a driving means is connected to the operation chamber 73. That is, a supply passage 73a communicating with the operation chamber 73 is provided, and the air pressurization source 75a (hereinafter referred to as the pressurization source 75a) is provided in the supply passage 73a via the supply distribution switch valve V36. ) And a pipe line 76 selectively communicating with the decompression source 75b. In this case, the conduit 76 is branched from the main conduit 76a connected to the operation chamber 73, the exhaust conduit 76b connected to the decompression source 75b, and the pressurized source. It consists of the pressurization pipe | tube 76c connected to 75a. A flow meter 77 serving as a flow sensor is provided in the main pipe path 76a, and a pressure adjusting mechanism for adjusting the exhaust pressure provided in the exhaust pipe path 76b and a pressure, that is, an air pressure, installed in the pressure pipe path 76c. The pressure adjustment mechanism to be configured is configured in the flexible pressure adjustment mechanism 78. In this case, the flexible pressure adjustment mechanism 78 cuts off the communication between the common communication block 78a and the exhaust pipe passage 76b or the pressure pipeline 76c which selectively connect the exhaust pipe passage 76b and the pressure passage 76c. The electrostatic regulator is provided with two stop blocks 78b and 78c to be described above, and an electromagnetic switching unit 78d for switching and controlling the communication block 78a and the stop blocks 78b and 78c. Moreover, the pressure sensor 79 is provided in the flexible pressure adjustment mechanism 78 (henceforth an electric regulator 78), and the operation chamber 73 which the pipeline 76 connects by the pressure sensor 79 is connected. Inner pressure is detected.

In the supply / discharge portion of the working air connected to the working chamber 73 side of the pump P configured as described above, the flow meter 77, the pressure sensor 79, and the electric regulator 78 constituting the driving means are provided. Are electrically connected to the controller 200, respectively. Then, the exhaust flow rate in the conduit 76 detected by the flow meter 77 and the pressure in the conduit 76 detected by the pressure sensor 79 are transmitted (input) to the controller 200, whereby the controller 200 The control signal from () is transmitted to the electric regulator 78 (output).

Next, based on FIG. 20, 21, the process of making gas in the resist liquid L in a diaphragm pump current and discharging the gas which has been made to the outside is demonstrated. The opening / closing valves V4a and V5a, the opening / closing valve V33 on the suction side, the first opening / closing valve V34, the second opening / closing valve V35, the supply / discharge switching valve V36, and the circulation control valve 56 are shown in FIG. The opening and closing operation is performed based on the control signal from the controller 200 shown in 19.

As shown in FIG. 20A, the first trap tank 53 is provided with a sensor line I1 for setting an upper limit of the amount of storage of the resist liquid L by a level sensor (not shown). The replenishment of the resist liquid L to the pump chamber 72 and the first trap tank 53 is terminated by closing the third open / close valve V6 when L) exceeds the sensor line I1. At this time, a base layer is formed above the first trap tank 53, and the resist liquid L is filled in the pump chamber 72.

Subsequently, in the state in which the opening / closing valve V33, the first opening / closing valve V34, the second opening / closing valve V35, the opening / closing valves V4a and V5a and the circulation control valve 56 on the suction side are closed, By evacuating the air in 73, the pump chamber 72 becomes negative pressure. By setting the pump chamber 72 to a negative pressure, the minute bubbles existing in the resist liquid L flowing into the pump chamber 72 are present (bubble presenting step). In the bubble presenting process, the processing liquid sucked into the pump becomes a negative pressure, so that the gas in the present processing liquid is discharged to the outside by the degassing process, so that the gas in the processing liquid can be reliably removed, and the processing liquid is circulated. Bubbles attached to the filter can be easily removed.

Here, in the bubble presenting step, the opening / closing valve V33 on the suction side is opened, and the first opening / closing valve V34, the second opening / closing valve V35, the opening / closing valves V4a and V5a, and the circulation control valve 56 are used. May be exhausted from the operating chamber 73 in the closed state. The air in the operating chamber 73 is exhausted while the on / off valve V33 on the suction side is opened to present bubbles in the resist liquid L replenished in the pump chamber 72 and the first trap tank 53. It is possible to reduce the displacement of the diaphragm-type pump P necessary for the reduction.

Here, the reason why the amount of displacement of the diaphragm-type pump P can be reduced by evacuating the air in the operating chamber 73 in the state where the inlet / off valve V33 is opened is described. When the volume of the pump chamber 72 is increased with the air exhaust in the operating chamber 73, the volume of the resist liquid L in the pump chamber 72 and the first trap tank 53 hardly changes, but the first trap The volume of the base layer in the tank 53 increases. As a result, the pressure in this substrate decreases with increase in volume. In addition, since the pressure of the resist liquid L in contact with the base layer is balanced with the pressure of the base layer, the pressure of the resist liquid L also decreases. Since the fine bubbles which can be melted in the resist liquid L decrease as the pressure of the resist liquid L decreases, the pressure of the resist liquid L decreases, whereby insoluble bubbles are present.

Therefore, even if the diaphragm pump with a small discharge amount is made to exist, the microbubble which exists in the resist liquid L can be made to exist by exhausting the air in the operation chamber 73 in the state which opened the opening / closing valve V33 of the suction side.

Subsequently, as shown in FIG. 20B, the second on-off valve V35 and the circulation control valve 56 are opened while the on-off valve V33 on the suction side is closed to supply and switch the supply / discharge valve ( In the state where V36 is switched to the pressure source 75a side, the electric regulator 78 communicates with the pressure side to supply air into the operating chamber 73. By supplying air into the operating chamber 73, the current bubbles are moved from the resist liquid L flowing into the pump chamber 72 to the resist liquid L stored in the first trap tank 53 (bubble movement). fair). Here, since the opening-closing valve V5a is closed, the bubble which moved to the 1st trap tank 53 turns into the base layer of the upper part of the 1st trap tank 53, and the resist liquid L in the 1st trap tank 53 is carried out. This is pressurized. Therefore, part of the resist liquid L stored in the first trap tank 53 flows through the second circulation conduit 55b, and the resist liquid L stored in the first trap tank 53 is discharged. Storage is reduced.

When the amount of storage of the resist liquid L stored in the first trap tank 53 becomes less than or equal to the sensor line I2 detected by a level sensor (not shown) by performing the bubble presenting step and the bubble moving step a plurality of times, As shown in FIG. 21, the opening / closing valve V5a is opened in a state in which the circulation control valve 56 is closed, and bubbles in the first trap tank 53 are discharged to the outside through the drain pipe 51d (degassing). fair). At this time, the third open / close valve V6 is opened, and a part of the resist liquid L stored in the buffer tank 61 flows into the first trap tank 53 through the second processing liquid supply pipe 51b. do. The third opening / closing valve V6 is closed when the liquid level of the resist liquid L flowing into the first trap tank 53 reaches the sensor line I1, and thus the resist liquid L to the first trap tank 53 is closed. Inflow is terminated.

By such a configuration, it is possible to degas after presenting the gas dissolved in the resist liquid L replenished in the pump P. Therefore, mixing of gas into the resist liquid L supplied to the resist liquid L can be suppressed.

In addition, since the bubble presenting process and the degassing process are repeated in this way, it becomes possible to efficiently remove the air bubbles existing in the resist liquid L stored in the pump chamber 72 and the first trap tank 53.

<Eleventh embodiment>

Based on FIG. 22, the liquid processing unit connected to the liquid processing apparatus which concerns on this invention is demonstrated. The liquid processing unit 100 connected to the liquid processing apparatus 5 includes a nitrogen gas supply source 101 for supplying an inert gas, for example, nitrogen gas N ₂ , as shown in FIG. 22, and a resist liquid ( A resist container 102 for storing L), a buffer tank 103 for temporarily storing a processing liquid induced from the resist container 102, and a resist liquid L stored in the buffer tank 103 are discharged. Two pumps P1 and P2 and four filter devices 104a to 104d (hereinafter referred to as filter device 104) are provided on the secondary side of the pumps P1 and P2. In this embodiment, the diaphragm pump is used for the pumps P1 and P2.

Moreover, the resist container 60 is provided in the secondary side of the filter apparatus 104 via the electromagnetic opening / closing valve V8. On the secondary side of this resist container 60, the 1st process liquid supply line 51a, the liquid process apparatus 5, the process liquid supply nozzle 7, etc. which were demonstrated from 1st Embodiment to 10th Embodiment are provided. .

The primary side of the resist container 102 is provided with a third gas supply line 110a for connecting with the nitrogen gas supply source 101. An electromagnetic switching valve V9 is provided between the nitrogen gas supply source 101 and the resist container 102 of the third gas supply line 110a. A pressure control valve V10 is provided between the nitrogen gas supply source 101 of the third gas supply line 110a and the resist container 102, and a pressure gauge 105 is provided. In addition, a gas drain pipe line 110b is connected between the pressure control valve V10 and the switching valve V9 of the third gas supply line 110a, and a relief valve V11 is connected to the gas drain pipe line 110b. It is installed.

In addition, at the primary side of the resist container 102, a fourth gas supply line 110c is formed at one end of which branches from the third gas supply line 110a and the other end thereof is connected to the upper portion of the buffer tank 103. . The fourth gas supply line 110c is provided with an opening / closing valve V12 in switchable communication with the atmospheric portion 106 or the nitrogen gas supply source 101 which are opened in the buffer tank 103 and into the atmosphere. In addition, an electromagnetic on / off valve V13 and a check valve V14 are provided in the fourth gas supply line 110c.

On the secondary side of the resist container 102, a third processing liquid supply pipe 111a for connecting with the buffer tank 103 is provided. An electromagnetic on / off valve V15 is provided in this third processing liquid supply passage 111a.

The fourth processing liquid supply pipe 111b is provided on the secondary side of the buffer tank 103. Electromagnetic open / close valves V8 and V16, pumps P1 and P2, filter device 104, and resist container 60 are provided in fourth processing liquid supply line 111b. The pumps P1 and P2 are provided in parallel in the fourth processing liquid supply line 111b on the primary side of the filter device 104, and check valves V17 to V20 are provided on the primary and secondary sides of the pump, respectively. It is. Further, a drain pipe line 111d having an on / off valve V27 is connected to the secondary side of the on / off valve V16 of the fourth processing liquid supply pipe 111b connecting the on / off valve V16 and the pumps P1 and P2. It is.

Moreover, four filter apparatuses 104a-104d are provided in series in the 4th process liquid supply line 111b of the secondary side of pump P1, P2. Drain pipe passages 112a to 112d are provided above the respective filter devices 104a to 104d, and electromagnetic drain valves V21 to corresponding to the filter devices 104a to 104d are provided in the drain pipe paths 112a to 112d. V24) is installed.

The return pipe 111c branches off from the fourth processing liquid supply pipe 111b on the secondary side of the filter device 104. This return pipe 111c is connected to the upper portion of the buffer tank 103. In addition, a drain pipe 112 is connected to the return pipe 111 c. In addition, electromagnetic return valves V25 and V26 are provided in the return line 111c.

An electromagnetic open / close valve V28 is provided in the drain pipe 112. The resist liquid L supplied through the filter device 104 to the drain pipe 112 on the primary side of the on-off valve V28 can be switched to the drain or return pipe 111 c via the standby portion 107. An electromagnetic on / off valve V29 is provided.

The on-off valves V12 and V29 and the on-off valves V13, V15, V16, and V21 to V28 are electrically connected to a controller (not shown), and the switching operation or the opening / closing operation is performed based on the control signal from the controller. It is supposed to be done. In addition, the upper limit liquid level sensor 103a and the lower limit liquid level sensor 103b are provided in the buffer tank 103 similarly to the buffer tank 61, and these upper limit liquid level sensors 103a and the lower limit liquid level sensor 103b are provided. The detected signal is configured to be transmitted to a controller (not shown).

Next, the operation form of the liquid processing unit will be described.

ㆍ Resist liquid supply to buffer tank

First, the resist container 102 is set, and then, based on a control signal from a controller (not shown), to the switching valve V9 and the third processing liquid supply pipe 111a provided in the third gas supply pipe 110a. The on-off valve V15 provided is opened to supply the resist liquid L into the buffer tank 103 by pressurization of the nitrogen gas supplied from the nitrogen gas supply source 101 into the resist container 102. At this time, the opening / closing valve V12 is switched to the standby section 106 side, and the buffer tank 103 is in communication with the atmosphere. When the resist liquid L supplied from the resist container 102 is supplied (supplied) to the buffer tank 103 through the third processing liquid supply line 111a, the resist liquid L is stored in the buffer tank 103. By contacting the substrate (atmosphere), the gas dissolved in the resist liquid L is made current by increasing the atmospheric contact area of the resist liquid L, so that bubbles are easily generated or generated.

Circulation of resist liquid

Next, the circulation of the resist liquid L performed through the fourth processing liquid supply pipe 111b and the return pipe 111c will be described. When a predetermined amount of the resist liquid L is supplied (supplied) to the buffer tank 103, the opening / closing valve V15 is based on a control signal from a controller (not shown) that receives a detection signal from the upper limit liquid level sensor 103a. Is closed and the on-off valve V16 is opened.

When circulating the resist liquid L, the pumps P1 and P2 are alternately driven so that the resist liquid L stored in the buffer tank 103 is transferred to the return pipe 111c through the filter device 104. Inflow. In addition, the resist liquid L introduced into the return pipe 111c flows into the buffer tank 103. Therefore, the resist liquid L is circulated between the fourth processing liquid supply pipe 111b and the return pipe 111c, and passes through the filter device 104 to remove the particles or bubbles from the buffer liquid L. It is stored in 103.

Supply of nitrogen gas pressurized-resist container of resist liquid

The supply to the resist liquid L from the buffer tank 103 to the resist container 60 is demonstrated. When the resist liquid L is supplied from the buffer tank 103 to the resist container 60, the switching valve V9 and the opening / closing valve V15 are closed based on a control signal from a controller (not shown). The open / close valve V13 is opened, and the open / close valve V13 is switched to the nitrogen gas supply source 101 side. As a result, nitrogen gas is supplied from the nitrogen gas supply source 101 into the buffer tank 103, while the opening / closing valves V8 and V16 of the fourth processing liquid supply pipe 111b are opened to open the pumps P1 and P2. By driving, the resist liquid L is supplied to the filter device 104 and the resist container 60. At this time, the bubbles dissolved in the filter device 104 are discharged to the atmospheric portion 107 through the drain pipe passages 112a to 112d. In addition, the resist liquid L supplied to the resist container 60 is discharged (supplied) to the wafer W from the processing liquid supply nozzle 7a as described above in the first embodiment. Alternatively, the resist liquid L circulates between the supply line 51 and the circulation line 55.

As described above, since the four filter devices 104a to 104d are provided in the fourth processing liquid supply pipe 111b, the time for filtering the resist liquid L stored in the buffer tank 103 is one. It becomes one quarter when only the filter device of is used. Therefore, the time required for the removal of particles and bubbles in the resist liquid L due to the circulation of the resist liquid L can be shortened.

<Other embodiments>

Moreover, in the said embodiment, although the case where the processing liquid supply apparatus which concerns on this invention was applied to the resist coating processing apparatus was demonstrated, it applies also to processing apparatuses other than resist, for example, supply apparatuses, such as a developing solution, and the supply apparatus of a cleaning process. It is possible.

Moreover, it is also possible to set it as the form which built in at least 1 of 10th Embodiment from 2nd Embodiment in 1st Embodiment. Thereby, increase of the particle in the resist liquid L can be prevented superimposed, without unnecessary consumption of the resist liquid L. FIG.

5: liquid treatment device
7, 7a to 7d: treatment liquid supply nozzle
51: supply line
51a: first treatment liquid supply line
51b: second processing liquid supply line
52a: filter unit
53: first trap tank
54: second trap tank
55: circulation pipe
56: circulation control valve
57: supply control valve
58: vibrating body
59a: temperature sensor
59b: thermostat
60: resist container
61: buffer tank
71: diaphragm
72: pump room
73: operating room
80: degassing mechanism
81: container
82: semipermeable membrane tube
83: inlet port
84: outflow port
85: exhaust port
86: discharge pipe
200: controller
L: resist liquid
P: Pump
V6: third open / close valve
V31, V32: on-off valve
V33: on-off valve on suction side
V34: first on-off valve
V35: second on-off valve
V36: Rapid Supply Switch Valve
V4a, V5a: on-off valve
W: Wafer

Claims (3)

It is a liquid processing apparatus connected to the process liquid supply nozzle which supplies a process liquid to a to-be-processed substrate,
A supply pipe for connecting the processing liquid storage container for storing the processing liquid and the processing liquid supply nozzle;
A filter device interposed in the supply pipe and filtering the processing liquid and removing foreign matters and bubbles mixed in the processing liquid;
A pump interposed in the supply line on the secondary side of the filter device,
A supply control valve interposed in the supply line on the secondary side of the pump,
A circulation pipe connecting the discharge side of the pump portion of the pump and the primary side of the filter device;
A switching valve provided at the primary side of the filter device and provided in the supply line on the secondary side of the connection portion with the circulation line;
An opening / closing valve which is provided on the discharge side of the pump portion of the pump and selectively enables the supply of the treatment liquid to the circulation pipe;
Control means for controlling the pump, a supply control valve, a switching valve, and an open / close valve;
When the supply of the processing liquid from the processing liquid supply nozzle to the processing target substrate is stopped by closing the supply control valve by the control means, the pump is opened in the state where the opening / closing valve and the switching valve are closed. By setting the pump portion to negative pressure by driving the drive means, the bubbles existing in the processing liquid are present, and then the on-off valve and the switching valve are opened to drive the pump, and the filter device The processing apparatus characterized by circulating the said processing liquid which made the bubble present between the said supply line and the said circulation line installed through the said supply line. The method of claim 1,
And a suction side on / off valve provided on the suction side of the pump portion of the pump, wherein the supply control valve, the on / off valve, the switching valve, and the suction side on / off valve are closed by the control means. A liquid processing apparatus, wherein the pump portion is subjected to negative pressure. A supply line for connecting the processing liquid storage container for storing the processing liquid and the processing liquid supply nozzle;
A filter device interposed in the supply pipe and filtering the processing liquid and removing foreign matters and bubbles mixed in the processing liquid;
A pump interposed in the supply line on the secondary side of the filter device,
A supply control valve interposed in the supply line on the secondary side of the pump,
A circulation pipe connecting the discharge side of the pump portion of the pump and the primary side of the filter device;
A switching valve provided at the primary side of the filter device and provided in the supply line on the secondary side of the connection portion with the circulation line;
An opening / closing valve which is provided on the discharge side of the pump portion of the pump and selectively enables the supply of the treatment liquid to the circulation pipe;
It is a liquid processing method using the liquid processing apparatus provided with the control means which controls the said pump, a supply control valve, a switching valve, and an opening / closing valve,
A processing liquid supply step of supplying the processing liquid to the substrate to be processed by opening the supply control valve, closing the open / close valve, and driving the pump;
When the supply of the processing liquid from the processing liquid supply nozzle to the processing target substrate is stopped by closing the supply control valve, driving of the driving means of the pump is performed while the switching valve and the switching valve are closed. By supplying the said pump part to negative pressure by this, the said supply pipe which makes the bubble which exists in the said processing liquid present, opens the said switching valve and the said switching valve, drives the said pump, and installs through the said filter apparatus. And a circulation step of circulating the treatment liquid in which bubbles are present between the furnace and the circulation conduit.

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