KR102029218B1 - Air cleaning apparatus using multi venturi module and 3d mesh grid - Google Patents

Air cleaning apparatus using multi venturi module and 3d mesh grid Download PDF

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Publication number
KR102029218B1
KR102029218B1 KR1020180022719A KR20180022719A KR102029218B1 KR 102029218 B1 KR102029218 B1 KR 102029218B1 KR 1020180022719 A KR1020180022719 A KR 1020180022719A KR 20180022719 A KR20180022719 A KR 20180022719A KR 102029218 B1 KR102029218 B1 KR 102029218B1
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South Korea
Prior art keywords
mesh
frame
stage
module
gas
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KR1020180022719A
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Korean (ko)
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KR20190102395A (en
Inventor
윤금수
김현호
노학재
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(주)명성씨.엠.아이
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Priority to KR1020180022719A priority Critical patent/KR102029218B1/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D47/00Separating dispersed particles from gases, air or vapours by liquid as separating agent
    • B01D47/06Spray cleaning
    • B01D47/063Spray cleaning with two or more jets impinging against each other
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34Chemical or biological purification of waste gases
    • B01D53/74General processes for purification of waste gases; Apparatus or devices specially adapted therefor
    • B01D53/77Liquid phase processes
    • B01D53/78Liquid phase processes with gas-liquid contact

Abstract

The present invention relates to an exhaust gas treatment system for removing contaminant gas generated in a semiconductor manufacturing process. More particularly, the present invention relates to a housing, a nozzle provided in the housing, and a nozzle for cleaning the liquid, and an air flowing therein, in contact with the cleaning liquid. Including a filter module, the filter module is configured by combining a multi-stage multi venturi module and a 3D mesh grid, the semiconductor discharge made to reduce the contaminated gas through the gas-liquid mixing effect and the Venturi effect with the sprayed cleaning solution It relates to a gas treatment system.

Description

Semiconductor exhaust gas treatment system equipped with multi-stage multi venturi module and filter module combining 3D mesh grid {AIR CLEANING APPARATUS USING MULTI VENTURI MODULE AND 3D MESH GRID}

The present invention relates to an exhaust gas treatment system for removing contaminant gas generated in a semiconductor manufacturing process. More particularly, the present invention relates to a housing, a nozzle provided in the housing, and a nozzle for cleaning the liquid, and an air flowing therein, in contact with the cleaning liquid. Including a filter module, the filter module is configured by combining a multi-stage multi venturi module and a 3D mesh grid, the semiconductor discharge made to reduce the contaminated gas through the gas-liquid mixing effect and the Venturi effect with the sprayed cleaning solution It relates to a gas treatment system.

Currently, in the semiconductor process using various hazardous chemicals, various harmful chemicals such as hydrochloric acid, hydrofluoric acid, and ammonia are discharged into the exhaust gas, and a scrubbing dust collector is installed at the final stage to remove such exhaust gas. However, these facilities have a lot of difficulties due to the limitation of treatment efficiency and structural problems, and there is a need for an alternative to solve them.

Actually, harmful substances generated in each process of semiconductor manufacturing are converted into stable particles and gaseous substances by oxidation process such as combustion, due to environmental and safety problems, and then passed through a scrubber for temperature reduction and primary removal of high concentration of pollutants. The concentration of pollutant emissions is finally determined by the efficiency of the scrubber system.

However, due to the rapid response to the recent tightening of environmental regulations and the establishment of residential areas around the industry, the company is strengthening its own pollution regulations, but there is a lack of on-site facilities to meet these requirements. In addition, the air pollution prevention equipment market has been activated due to the development of various technologies, but in reality, new technologies used in the field are far shorter than developments, which satisfy consumers in terms of specific conditions, capacity, and cost. I can't let you.

In the case of the conventional packed bed type scrubber, which is currently used the most, the treatment efficiency is about 60 to 80%, and it is due to absorption removal due to the diffusion effect of gaseous materials rather than particulate matter removal. In addition, in order to increase the reduction effect, it can be seen that the performance of the facility is evaluated in terms of water consumption and filler use. For this reason, in order to satisfy the effect of reducing pollutants, the reaction period is widened and water usage is excessively installed. However, due to the large size of the facility, the actual site suffers a lot of difficulties in the shortage of the installation site and energy consumption.In addition, the packing maintenance can cause anxiety about industrial safety and maintenance of humans entering the facility. The situation is suffering from waste of time resources. Therefore, it is possible to supplement compact design that can obtain high efficiency expectation to remove particles and gaseous substances generated in semiconductor process, and to supplement without replacing the entire existing facility, and to reduce the energy consumption. This is necessary. In addition, it is possible to utilize the technology to meet the discharge characteristics of various industrial facilities, and it is urgent to develop a dust collector having a structure that is easy to maintain and to compensate for the disadvantages of existing equipment, reduce the maintenance cost and processing cost.

Accordingly, various techniques have been proposed regarding scrubbers for purifying air.

Such a prior art is the Patent No. 10-0887922 "Duct coupled air purification system,"

The prior art is provided with an air purification unit in the air supply duct, the duct coupling portion is provided on each side of the air purification unit, the air purification unit is provided so that the purification water is injected from the water spray nozzle of the upper, the air purification unit Purification water supply device is provided for supplying the purification water to the installed water spray nozzles, the air purification unit is provided in a tunnel type formed long in the air flow direction to present an air purification system to provide clean and safe air have.

However, the prior art is provided in the duct to purify the air through the purification water, the air purification function is lower than the scrubber using a general filler, in particular, it is difficult to completely remove the contaminated gas contained in the air.

In addition, there is a prior art Patent No. 10-0397208 "air purification device,"

The prior art is provided with a plurality of free rotation fan, to spray the water stream to the nozzle in the free rotation fan, to let the internal air containing the dust passes between the free rotation fan, the water droplets hit the fan is dust After collecting, the movement is prevented by a number of diaphragms to collect in the lower settling tank, only the air is discharged through the suction fan, and the collected water is settled down to the dust and then supplied to the nozzle using a pump. Presenting an air purifier.

However, the prior art also purifies the air by simply collecting dust in the water droplets hit by the fan, the purification efficiency is lowered, and the installation of a large number of fans causes problems such as large equipment.

Therefore, in order to solve the above problems, techniques for purifying contaminated air by adding a large amount of fillers to improve the purification efficiency have been proposed, and the related arts related to such fillers (Patent Nos. 10-1152015) Is also presented.

This scrubber facility sprays water into the space containing the filler (reaction zone Tri-pack) to form a liquid film on the filler. At this time, the pollutant gas (water-soluble: acid, alkali gas, etc.) entering the filler section is absorbed and removed by the liquid film and the droplets, and the gas from which the pollutants are removed is discharged to the rear of the scrubber facility.

Therefore, the gas residence time in the filler is the most important factor in the scrubber absorption process, and the higher the surface area, the larger the liquid film is formed and the amount of gas diffusion into the liquid increases.

However, these existing facilities have a large packing section and a large amount of water, so the efficiency of the installation is increasing. As a result, there is a shortage of installation sites, and when the maintenance time comes, the packing must be removed to the outside and put back after washing. By doing so, there is a problem of increasing the risk of safety accidents and maintenance costs and time.

Furthermore, in order to replace the packing fillers that have been used for more than 20 years in existing facilities, companies are developing various products. At present, the semiconductor business is applying a filter-type product to reduce the cost, efficiency improvement and maintenance cost compared to the existing ones. to be. This filter type product sprays the cleaning liquid from the front and the rear of the filter to increase the mixing effect and the gas-liquid contact area with the cleaning liquid when the polluting gas passes through the filter, so that the polluting gas can be removed even in a short reaction time. This method has been developed in the same structure, and this method is more efficient and maintainable than the existing packing, and is being gradually applied in the semiconductor business.

However, the problem of this filter method is that the pressure of the filter medium and the clogging of foreign matters such as dust and the filter medium are continuously injected to the cleaning liquid injection pressure, and the risk of pumping is increased due to broken ash. There is a risk of nozzle clogging frequently.

Therefore, the present invention has been made to solve the above problems,

And a filter module for contacting the contaminated gas with a nozzle for discharging the cleaning liquid and a nozzle provided in the housing, the contaminated gas is introduced therein, wherein the filter module comprises a multi-stage venturi module and a 3D mesh grid. By including, the object of the present invention is to provide a semiconductor exhaust gas treatment system which is excellent in gas-liquid dispersion and mixing and which can reduce contaminated gas through a venturi effect.

In particular, as the multi-stage multi venturi module is provided, contaminated gas induces gas-liquid contact with the cleaning liquid injected while passing between the first and second multistage members of the multistage multi venturi module, and at the same time, the venturi An object of the present invention is to provide a semiconductor exhaust gas treatment system that can improve the mixing effect according to the effect.

Another object of the present invention is to provide a semiconductor exhaust gas treatment system capable of maximizing liquid film, droplet, dispersion, collision, and mixing effect by configuring the 3D mesh grid to cross-align the first mesh and the second mesh.

In order to achieve the above object, the semiconductor exhaust gas treatment system according to the present invention is

A housing including an inlet part into which contaminated gas is introduced, a purifying part connected to the inlet part to purify the gas introduced therein, and a discharge part from which the purified gas is discharged from the purifying part;

A plurality of nozzles provided at an upper portion of the purification unit and spraying a cleaning liquid;

One or more filter module is provided in the purification unit, the filter module for purifying the contaminated gas flowing in contact with the sprayed cleaning solution;

Including but not limited to,

The filter module

A module case having a plurality of seating portions,

Multi-stage multi venturi module sequentially coupled to the seating portion of the module case

And a 3D mesh grid in which the first mesh and the second mesh overlap each other.

As described above, the semiconductor exhaust gas treatment system according to the present invention

And a filter module for contacting and purifying the nozzle, which is provided in the housing, with the nozzle for spraying the cleaning liquid and the sprayed cleaning liquid with the introduced contaminated gas, wherein the filter module is a module case, a multi-stage venturi module, and a 3D mesh grid. By configuring the module case to replace the existing filter, it is not necessary to configure the whole system newly, it is easy to replace,

In particular, the gas introduced through the multi-stage multi venturi module composed of the first and second row multi-stage members can improve the mixing effect through the Venturi principle, thereby increasing the contact force with the cleaning liquid. At the time of sharp decrease, the pressure rises again, and the removal efficiency can be improved by diffusing and removing the gas contaminated by the gas-liquid condensation field in the cleaning liquid.

In addition, the filter module further comprises a 3D mesh grid, and as the flat first mesh and the bent second mesh are assembled to overlap, the incoming gas passes through the 3D mesh grid, maximizing the gas-liquid mixing effect, and partially Through the formation of a liquid film, the contaminated gas can be absorbed and removed by diffusion, and the contact area is better than that of a conventional filter, and the pressure reduction rate is smaller, thereby improving the effect of reducing the contaminated gas.

1 is a perspective view of a semiconductor exhaust gas treatment system according to the present invention;
2 is a cross-sectional view of a semiconductor exhaust gas treatment system according to the present invention.
Figure 3 is a perspective view of the module case of the filter module according to the present invention
Figure 4 is a perspective view of a multi-stage multi venturi module of the filter module according to the present invention
Figure 5 is an enlarged cross-sectional view of the multi-stage multi venturi module of the filter module according to the present invention
Figure 6 is a perspective view of the 3D mesh grid of the filter module according to the present invention
7 is an exploded view of the 3D mesh grid of the filter module according to the present invention;
Figure 8 is an enlarged view of the 3D mesh grid of the filter module according to the present invention
9a, 9b and 10 are the test report table of the semiconductor exhaust gas treatment system according to the present invention

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

Since the present invention may be modified in various ways and have various forms, embodiments (or embodiments) will be described in detail in the text. However, this is not intended to limit the present invention to the specific form disclosed, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

In each of the drawings, the same reference numerals, in particular, the tens and ones digits, or the same digits, tens, ones, and alphabets refer to members having the same or similar functions, and unless otherwise specified, each member in the figures The member referred to by the reference numeral may be regarded as a member conforming to these criteria.

In addition, in the drawings, the components are exaggerated in size (or thick) in size (or thick) in size (or thin) or simplified in consideration of the convenience of understanding and the like, thereby limiting the scope of protection of the present invention. It should not be.

The terminology used herein is for the purpose of describing particular embodiments (suns, aspects, and embodiments) (or embodiments) only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms “comprises” or “consists” are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, but one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

First, as shown in FIGS. 1 and 2, the semiconductor exhaust gas processing system S according to the present invention includes a housing 10, a nozzle 20 provided in the housing 10, and the purifying unit 15. It comprises a filter module (F) provided in contact with the cleaning liquid to be sprayed with the contaminated gas.

In addition, in the present specification, the inlet 11 is referred to as the front end and the outlet 17 as the rear end based on the moving direction of the gas 535.

In more detail with respect to each configuration, first, the housing 10, the inlet portion 11, the contaminated gas is introduced, the moving path 13 through which the introduced gas is moved, purifying the gas to be moved It comprises a purifying unit 15 is provided with a filter module (F) and a discharge unit 17 for discharging the purified gas.

First, the inlet 11 is a place where the contaminated gas is introduced, and in particular, the external gas may be sucked or connected to the duct, and a fan may be provided to smoothly transport the gas.

The gas introduced through the inlet 11 is introduced into the purification unit 15 through the moving path 13, wherein the purification unit 15 is provided with one or more filter modules F, A nozzle 20 for spraying the cleaning liquid is provided to contact the cleaning liquid and the gas introduced therein so as to be purified.

The filter module F will be described in more detail below with reference to the drawings, and in the drawings, three filter modules F can be inserted for convenience of description, which shows one embodiment. As one, the number of filter modules F may be selected by the user according to the installation environment and the degree of air pollution.

In addition, the purifier 15 is provided with a nozzle 20 for spraying the cleaning liquid, more specifically, the nozzle 20 is the front of each filter module (F) provided in the purifier 15 Or it is provided in plurality at the rear or both, it is made to evenly spray the cleaning liquid to the filter module (F).

The gas purified in contact with the cleaning liquid is discharged to the air through the discharge unit 17.

Hereinafter, the filter module F, which is a key component of the present invention, will be described in detail with reference to FIGS. 3 to 8.

First, the filter module (F) is a multi-stage multi venturi module (40) and the first to be sequentially coupled to the module case 30, a plurality of seating portion 33, the seating portion 33 of the module case 30 It comprises a 3D mesh grid 60 in which the first mesh 61 and the second mesh 63 are arranged crosswise,

3 shows the module case 30, the module case 30 is to be coupled to the purifying unit 15 of the housing 10, a module frame in which a plurality of seating portion 33 is formed It consists of 31.

The seating portion 33 is provided to be fitted with the multi-stage multi venturi module 40 and the 3D mesh grid 60 to be described later, preferably three seating portions 33 are formed in front of the seating portion ( 33) the multi-stage multi venturi module 40 is fitted, the rear seating portion 33 is fitted with a 3D mesh grid 60, the intermediate seating portion 33 forms an empty space when the gas passes through In addition, it serves to secure a time space for mixing gas and liquid.

In addition, in order to insert the multi-stage multi venturi module 40 and the 3D mesh grid 60 to be described later in a sliding manner, it is more preferable that the inlet hole 37 is formed on one side.

In addition, the lower portion of the module frame 31 is preferably provided with a recovery hole 35, which is the cleaning liquid sprayed from the nozzle 20 flows into the front and rear of the filter module (F) to fall This is to recover the cleaning liquid thus dropped, more precisely the cleaning liquid mixed with the contaminated gas.

4 and 5 illustrate a multi-stage multi venturi module 40 included in the filter module F of the exhaust gas treatment system S according to the present invention.

The multi-stage multi venturi module 40 is fitted to the seating portion 33 of the front end of the module case 30, a pair of side frame 41 and the pair of side frame 41 to each other A plurality of first row multi-stage member 43 and the second row multi-stage member 45 is provided to be spaced apart.

Here, although the first row-shaped member 43 and the second row-shaped member 45 will be described in more detail below, each of the cylindrical members having a predetermined diameter is most preferably made of a pipe.

More specifically, the multi-stage multi venturi module 40 is designed to manufacture a plate 51 using the Venturi principle of a compact structure that is easy to apply to an existing scrubber, as shown in the drawing, a pair of side frames And a first row multi-stage member 43 and a second row multi-stage member 45 which are arranged between the side frame 41 and a plurality of spaced apart from each other.

Prior to the description, a reinforcement frame 411 may be further provided between the pair of side frames 41 to improve durability, and thus the scope of rights should not be limitedly interpreted.

First, the first row multi-stage member 43 will be described. The plurality of first row-stage members 43 are arranged in a plurality of stages so as to be spaced apart from each other to form the first spaced portion 431. The gas is provided at the front end portion of the side frame 41 to allow the gas to penetrate through the first spacer 431.

The second columnar member 45 is provided at a rear end of the first columnar member 43, and a plurality of second columnar members 45 are spaced apart from each other like the first columnar member 43 to form a second spacer 451. It is arranged in a multi-stage configuration, the gas passing through the first spacer 431 is configured to be discharged to the second spacer 451.

In addition, a third separation portion 453 is formed between the second columnar member 45 and the first columnar member 43. As a result, the gas flows into the first spacer 431 to be spaced apart from the third member. Expecting a venturi effect through the portion 453, and has a structure that can be discharged to the rear end through the second separation portion 451. In addition, some venturi effects may be expected at the time when the first spacer 431 flows into the first spacer 431.

At this time, the second row multi-stage member 45 is provided to be located between the plurality of first row multi-stage member 43, specifically, the second row multi-stage member 45 is the first row multi-stage type. Located at the rear end of the first spacer 431 formed between the members 43, the first spacer 431 and the second spacer 451 may be formed in a position that is shifted from each other, The first row multi-stage member 43 and the second row multi-stage member 45 are arranged not to contact each other so as to penetrate the gas.

In addition, the diameter of the second columnar member 45 may be smaller than the diameter of the first columnar member 43 so that the venturi effect may be more effective. When passing through the portion 431, the second row multi-stage member 45 is hit, passing along the outer surface of the second row multi-stage member 45, the third spaced portion 453 is provided up and down the speed It is to be increased to be discharged to the second spacer 451, for this purpose it is preferable that the width of the second spacer 451 is formed narrower than the width of the first spacer 431.

Therefore, the contaminated gas to be introduced passes through the first spacing portion 431 and the third spacing portion 453 between the first row-shaped member 43 and the second row-shaped member 45, and the nozzle ( 20) and the cleaning liquid is supplied together, inducing gas-liquid contact and at the same time, the mixing effect can be expected by using the Venturi principle, and after passing through the third spacing portion 453 of the second row multi-stage member 45, When discharging to the second separation unit 451, the pressure is increased again at the time when the speed is sharply reduced to have the effect that the contaminated gas due to the gas-liquid condensation action can be diffused into the cleaning liquid and removed.

In addition, in the case of the multi-stage multi venturi module 40, since it can be made of the same material as the scrubber equipment, it can be manufactured by structural integration with the equipment, and its durability is high, so it can be used semi-permanently without maintenance through maintenance and dust. B. Problems such as clogging due to foreign substances do not occur, and it is possible to manufacture with various materials such as PVC, FRP, PP, etc., and it is applicable to the installation environment and conditions.

In addition, the filter module (F) in the exhaust gas treatment system (S) according to the present invention is further provided with a 3D mesh grid 60 will be described in more detail with reference to Figures 6 to 8,

The 3D mesh grid 60 is inserted into the seating portion 33, more precisely, the rear seating portion 33 of the module case 30, and is disposed between the plurality of first meshes and the first mesh 61. Is made of a second mesh 63 provided in,

The first mesh frame 61 is formed in a plurality of first outer frame 611 and the first outer frame 611, the first horizontal frame 613 configured to form a plurality of first through holes 612. And a diagonal frame 615 which protrudes toward the center of the first through hole 612 at each corner of the first vertical frame 614 and the first through hole 612 and is spaced apart from each other. The second horizontal frame 63 is formed in a plurality of second outer frame 631 and the second outer frame 631 to form a plurality of second through holes 632. 633 and the second vertical frame 634.

In more detail, the 3D mesh grid 60 is formed by repeatedly overlapping and arranging the first mesh 61 and the second mesh 63 to each other. Five are arranged so that each of the first meshes 61 are positioned, and the second meshes 63 are provided between the first meshes 61, respectively, so that the total number of the second meshes 63 is four. As one embodiment is shown, the number may be selected and arranged in various ways, which should not be construed as limiting the scope.

First, the first mesh 61 will be described. The first mesh 61 is composed of a first outer frame 611 having a rectangular shape, and a plurality of first inside the first outer frame 611. A first horizontal frame 613 and a first vertical frame 614 are formed in a flat shape to form the through hole 612 in a lattice shape.

In addition, as the first through hole 612 penetrates the contaminated gas, the diagonal frame 615 may be provided to form a liquid film by a cleaning liquid sprayed more effectively.

Specifically, the diagonal frame 615 is provided at each corner of the first through hole 612 to face the center of the first through hole 612, the ends of the diagonal frame 615 are mutually It is provided to be spaced apart.

Therefore, when the gas penetrates, it is split by the diagonal frame 615 to improve the contact area with the cleaning liquid, and at the same time, the sprayed cleaning liquid is configured to form a liquid film.

In addition, the rear end of the first mesh 61, the second mesh 63 is arranged to overlap,

The second mesh 63 has a second outer frame 631, a second horizontal frame 633 is formed in a plurality of the second outer frame 631 to form a plurality of second through-holes 632 and It consists of a second vertical frame 634.

More specifically, the second mesh 63 has a quadrangular second outer frame 631 formed in the same manner as the first mesh 61, and has a plurality of lattice shapes inside the second outer frame 631. The second horizontal frame 633 and the second vertical frame 634 are provided to form the second through hole 632.

In this case, unlike the first mesh 61, the second mesh 63 is formed in a shape of a bent shape that is not flat. When the second mesh 63 is described in detail with reference to the drawings, the second mesh 63 has a second shape. The vertical frame 634 is provided so as to cross and protrude to the front and rear ends so that one side shape thereof forms a zigzag shape.

That is, the second horizontal frame 633 connecting the second vertical frame 634 is configured to be bent based on the second vertical frame 634 to form a zigzag shape.

In this way, the first mesh 61 and the second mesh 63 are alternately arranged to be alternately arranged with each other. In this case, the second mesh 63 (2-1-1) positioned only at the front end of the second mesh 63 is provided. Preferably, the mesh 63A and the second mesh 63 (second-2 mesh) positioned at the rear end are arranged differently from each other.

More specifically, the 2-1 mesh 63A and the 2-2 mesh 63B have the same shape, and the direction in which the 2-1 mesh 63A and the 2-2 mesh 63B are arranged is rotated by 90 degrees.

Specifically, the 2-1 mesh 63A is configured so that the planar shape is zigzag-shaped, and the 2-2 mesh 63B is arranged so that the side shape is zigzag-shaped so that the liquid film is formed and collided when the gas passes. It will be done to maximize the effect.

In this case, the first through hole 612 and the second through hole 632 are provided at positions opposite to each other, and the two first through holes 612 are connected to one second through hole 632. It is preferable to be provided to face each other (the horizontal length of the second through hole 632 becomes more than twice the horizontal length of the first through hole 612, and the vertical length is the same.)

That is, the present invention is provided with the 3D mesh grid 60 as described above, the first mesh 61 of the plate type and the second mesh 63 of the bent type is assembled in an overlapping arrangement to reproduce the 3D volume sense, spraying It is characterized in that the contact area is improved through the 3D structure shape to increase the dispersion rate of the cleaning liquid and contaminated gas, and gas-liquid mixing as the first through hole 612 and the second through hole 632 are repeatedly passed. Maximizing the effect, and by using the principle that can absorb and remove the contaminated gas by diffusion through the formation of a partial liquid film has a feature that can increase the reduction performance. In addition, the 3D mesh grid 60 is characterized by excellent durability and strength compared to the conventional filter by injecting the MP540 PP with excellent chemical resistance and excellent strength from the mold plate.

Furthermore, FIGS. 9A, 9B, and 10 are tests using the semiconductor exhaust gas treatment system S according to the present invention, and according to the test report according thereto, (required by Cheongryong Environment Co., Ltd., which has been certified by KOLAS, an internationally recognized test institute. This is a test report.)

Specifically, FIGS. 9A and 9B are measured at ppm of inflow and discharge of HCl and HF, which are acidic materials, and can confirm the superiority of the reduction effect such as not being detected at the time of discharge or only a very small amount is detected.

10 is a measure of ppm inflow and outflow of the NH3 alkaline substance, it can be confirmed the excellence of the reduction effect, such as not detected at the time of discharge or only a very small amount.

In addition, in the above description of the present invention, the semiconductor emission gas processing system having a specific shape, structure, and configuration has been described with reference to the accompanying drawings. , Changes and substitutions should be construed as falling within the protection scope of the present invention.

S: Semiconductor emission gas treatment system
10 housing 11 inlet
13: transfer path 15: purification unit
17 outlet 20: nozzle
F: Filter Module 30: Module Case
31: module frame 33: seating part
35: recovery hole 37: incoming hole
40: multi-stage multi venturi module 41: side frame
411: reinforcement frame 43: first row multi-stage member
431: first spacer 45: second row multi-stage member
451: second spacing 453: third spacing
60: 3D mesh grid 61: the first mesh
611: first outer frame 612: first through hole
613: first horizontal frame 614: first vertical frame
615: diagonal frame 63: the second mesh
631: second outer frame 632: second through hole
633: second horizontal frame 634: second vertical frame
63A: 2-1 mesh 63B: 2-2 mesh

Claims (4)

  1. An inlet part 11 into which contaminated gas is introduced, a purifying part 15 connected to the inlet part 11 to purify the gas introduced therein, and a discharge part from which the purified gas is discharged from the purifying part 15 ( A housing 10 comprising 17;
    A plurality of nozzles 20 provided in the purifying part 15 and spraying the cleaning liquid;
    A filter module (F) provided at one or two or more in the purifying unit (15) to contact and purify the contaminated gas flowing therein with the sprayed cleaning solution;
    Including but not limited to,
    The filter module (F) is
    A module case 30 in which a plurality of seating portions 33 are formed,
    Multi-stage multi venturi module 40 is sequentially coupled to the seating portion 33 of the module case 30 and
    The first mesh 61 and the second mesh 63 are made to include a 3D mesh grid 60 overlapping arrangement,
    The multi-stage multi venturi module 40
    A pair of side frames 41 and a plurality of first row multi-stage member 43 is provided in a plurality of spaced apart from each other between the pair of side frames 41, and the rear end of the first row multi-stage member 43 Be made of a plurality of second row multi-stage member 45,
    The second columnar member (45) is provided so as to be located between the first columnar member (43), the semiconductor exhaust gas processing system, characterized in that to improve the contact force between the gas and the cleaning liquid flowing.
  2. The method of claim 1,
    The 3D mesh grid 60
    Is composed of a plurality of first meshes 61 and the second mesh 63 provided between the first mesh 61,
    The first mesh frame 61 is formed in a plurality of first outer frame 611 and the first outer frame 611, the first horizontal frame 613 configured to form a plurality of first through holes 612. And a diagonal frame 615 formed to face the center of the first through hole 612 at each corner of the first vertical frame 614 and the first through hole 612, and the ends thereof are spaced apart from each other. Made of
    The second mesh frame 63 is formed in a plurality of second outer frame 631 and the second outer frame 631, and the second horizontal frame 633 configured to form a plurality of second through holes 632. ) And the second vertical frame 634,
    The first mesh 61 is a flat first mesh,
    The second mesh (63) is a semiconductor exhaust gas treatment system, characterized in that the second mesh of the bent shape in which the second vertical frame (634) is repeatedly protruded in the front and rear directions to form a zigzag shape.
  3. The method of claim 2,
    The second mesh 63 is provided between the plurality of first meshes 61, the 2-1 mesh 63A positioned at the front end portion to which the outside air is introduced, and the 2-2 mesh positioned at the rear end portion. Consisting of 63B,
    The 2-2 mesh 63B has the same shape as the 2-1 mesh 63A, but the 2-1 mesh 63A has a zigzag shape in plan view, and the 2-2 mesh 63B. The semiconductor exhaust gas treatment system, characterized in that the side shape is arranged rotated 90 degrees to each other to form a zigzag shape.
  4. The method of claim 3, wherein
    The mounting part 33 provided in the module case 30 is
    It consists of three seating portion 33, the multi-stage multi venturi module 40 is provided in the front seating portion 33, the 3D mesh grid 60 is provided in the rear seating portion 33, the middle The seating portion 33 of the semiconductor exhaust gas treatment system, characterized in that the empty space.
KR1020180022719A 2018-02-26 2018-02-26 Air cleaning apparatus using multi venturi module and 3d mesh grid KR102029218B1 (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101688622B1 (en) * 2016-03-11 2016-12-21 (주)명성씨.엠.아이 Scrubber with 3d-mesh filter

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KR101280541B1 (en) * 2011-10-04 2013-07-01 주식회사 지앤비에스엔지니어링 Residual product trap apparatus for semiconductor manufacturing equipment
KR20170032739A (en) * 2015-09-15 2017-03-23 (주)중앙플랜트 Hybrid packing for gas-liquid contact and cleaning method thereof
KR101853292B1 (en) * 2016-06-22 2018-04-30 문기학 Harmful exhaust gas treatment wet multi-scrubber system contaning wet electrostatic precipitator

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KR101688622B1 (en) * 2016-03-11 2016-12-21 (주)명성씨.엠.아이 Scrubber with 3d-mesh filter

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