KR102018157B1 - Elctromagnetic interference shielding film, printed circuit board comprising the same and method for prepareing the same - Google Patents

Abstract

The electromagnetic wave shielding film of the present invention includes a conductive adhesive layer, a conductive layer formed on the conductive adhesive layer, and an insulating layer formed on the conductive layer, wherein the conductive layer has a surface roughness Rz of 20 in contact with the conductive adhesive layer. nm to 1,000 nm.

Description

Electromagnetic shielding film, printed circuit board including the same, and manufacturing method therefor {ELCTROMAGNETIC INTERFERENCE SHIELDING FILM, PRINTED CIRCUIT BOARD COMPRISING THE SAME AND METHOD FOR PREPAREING THE SAME}

The present invention relates to an electromagnetic wave shielding film, a printed circuit board including the same, and a manufacturing method thereof.

An electronic device includes a circuit board on which chips, electronic components, and the like are mounted to operate the electronic device. In the circuit board, electromagnetic waves are generated during the operation of the electronic device. These electromagnetic waves generate various problems such as distortion of a signal or harmful effects on the human body, and in order to block the circuit board, The electromagnetic shielding film is attached to.

However, when electromagnetic wave shielding film is applied to a circuit board, loss occurs in the transmitted signal, and research for this is being actively conducted.

In order to improve the signal transmission efficiency, there is a method of lowering the conductive filler content of the conductive adhesive layer included in the electromagnetic shielding film, but in this case, there is a disadvantage that the conduction efficiency and the electromagnetic shielding efficiency with the metal layer are reduced.

Thus, an electromagnetic shielding film for improving the signal transmission efficiency without lowering the conductive filler content of the conductive adhesive layer is required.

Prior art in this regard is disclosed in Korean Laid-Open Patent No. 2006-0052892.

An object of the present invention is to provide an electromagnetic wave shielding film having excellent signal transmission efficiency and electromagnetic shielding efficiency, a printed circuit board including the same and a method of manufacturing the same.

The above and other objects of the present invention can be achieved by the present invention described below.

One aspect of the present invention relates to an electromagnetic shielding film.

In one embodiment, the electromagnetic shielding film comprises a conductive adhesive layer, a conductive layer formed on the conductive adhesive layer and an insulating layer formed on the conductive layer, the conductive layer is a surface roughness of the surface in contact with the conductive adhesive layer Rz is 20 nm to 1,000 nm.

The conductive layer may have a surface roughness Ra of 100 nm or less in contact with the conductive adhesive layer.

The conductive layer may include one or more of nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, and zinc.

The conductive adhesive layer includes at least one of a dendrite-shaped conductive particle and carbon nanotubes (CNT), and the dendrite-shaped conductive particles and carbon nanotubes (CNT) are formed on the conductive adhesive layer. 20 to 75% by weight may be included.

The conductive adhesive layer may have a resistance with a metal layer of 2 Ω or less at a diameter of 2.0 mm.

The conductive layer may have a thickness of 1 μm to 12 μm.

The conductive adhesive layer may have a thickness of 3 μm to 30 μm.

The conductive adhesive layer is formed of a composition for a conductive adhesive layer, the composition for the conductive adhesive layer, 20 to 70% by weight of the dendrite-shaped conductive particles, 10 to 60% by weight epoxy resin and 1 to 20% by weight of the curing agent It may include.

The dendrite conductive particles may be silver coated copper.

The conductive adhesive layer composition further comprises 0.1 to 5% by weight of carbon nanotubes (CNT), the carbon nanotubes (CNT) has an average diameter of 1nm to 20nm, an average length of 5㎛ to 100㎛, bulk density (bulk) density) may be 0.01 to 0.08 g / ml.

The electromagnetic shielding film may have a thickness of 10 μm to 40 μm.

Another aspect of the invention relates to a printed circuit board.

In one embodiment, the printed circuit board may be a printed circuit board formed with an electromagnetic shielding film on at least one surface, the electromagnetic shielding film may be an electromagnetic shielding film according to one aspect of the present invention.

Another aspect of the present invention provides a method for manufacturing an electromagnetic shielding film, the electromagnetic shielding film comprising the step of forming a conductive layer on the insulating layer and the step of applying and curing the composition for the conductive adhesive layer on the conductive layer. It may be a way to.

The present invention has the effect of providing an electromagnetic shielding film excellent in signal transmission efficiency and electromagnetic shielding efficiency, a printed circuit board including the same and a method of manufacturing the same.

Figure 1 shows a simplified cross-sectional view of the electromagnetic shielding film according to an embodiment of the present invention.

In describing the present invention, when it is determined that the detailed description of the related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

It is merely to be understood that the embodiments introduced herein are provided so that the disclosure can be made thorough and complete, and that the spirit of the present application can be sufficiently conveyed to those skilled in the art. In the drawings, the width, thickness, and the like of the components are enlarged in order to clearly express the components of each device. In addition, although only a part of the components are shown for convenience of description, those skilled in the art will be able to easily understand the rest of the components.

In the present specification, "upper" and "lower" are defined based on the drawings, and according to a viewpoint, "upper" may be changed to "lower", "lower" to "upper", and "on". Alternatively, what is referred to as "on" may include intervening other structures in the middle as well as directly above. On the other hand, what is referred to as "directly on" or "directly on" means that there is no intervening structure in between.

In the present specification, terms including ordinal numbers such as first and second may be used to describe various components, but the components are not limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

In addition, one of ordinary skill in the art may implement the spirit of the present application in various other forms without departing from the technical spirit of the present application.

In the case where 'comprises', 'haves', 'consists of' and the like mentioned in the present specification are used, other parts may be added unless 'only' is used. In the case where the component is expressed in the singular, the plural includes the plural unless specifically stated otherwise.

In addition, in carrying out a method or a manufacturing method, each process constituting the method may occur differently from the stated order unless the context clearly indicates a specific order. That is, each process may occur in the same order as specified, may be performed substantially simultaneously, or may be performed in the reverse order.

In addition, in interpreting a component, even if there is no separate description, it is interpreted as including an error range.

In addition, in this specification, "X-Y" which shows a range means "X or more and Y or less."

In the present specification, 'surface roughness Rz' may mean ten-point average surface roughness, and 'surface roughness Ra' may mean arithmetic mean roughness.

EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated more concretely.

Electromagnetic shielding film

Referring to Figure 1 will be described an electromagnetic shielding film according to an embodiment of the present invention. Figure 1 shows a simplified cross-sectional view of the electromagnetic shielding film according to an embodiment of the present invention.

Electromagnetic shielding film 10 according to an embodiment of the present invention is a conductive adhesive layer 100, the conductive layer 200 formed on the conductive adhesive layer 100 and the insulating layer formed on the conductive layer (200) 300).

The conductive adhesive layer 100 may not only shield electromagnetic waves, but also have adhesiveness, and may be attached and fixed to the electromagnetic shielding object (for example, a printed circuit board).

The conductive adhesive layer 100 may include conductive particles having a dendrite shape for the conductive effect. The conductive particles of the dendrite (dendrite) shape has an advantage of excellent conductivity compared to the conductive particle content, compared to the spherical, rod-shaped, needle-like, flake, rugby ball shape.

The dendrite conductive particles may include one or more of conductive metals such as silver, copper, nickel, gold, and aluminum. In addition, the dendrite-shaped conductive particles may be a single conductive metal particle or a form in which the second conductive metal is coated on the first conductive metal particle. For example, the conductive particles may be one of copper powder, silver powder, nickel powder, silver coated copper powder (Ag coated Cu powder), gold coated copper powder, silver coated nickel powder (Ag coated Ni powder), and gold coated nickel powder. It may contain the above. Specifically, the conductive particles may use a silver coated copper powder in terms of electromagnetic shielding efficiency and economics.

The conductive adhesive layer 100 may further include carbon nanotubes (CNT) in order to further improve the electromagnetic shielding efficiency.

The conductive adhesive layer may include 20 to 75% by weight, specifically 30 to 65% by weight of the dendrite conductive particles and / or carbon nanotubes (CNT) in the conductive adhesive layer. In the above content range, the conductive adhesive layer is excellent in current carrying efficiency with the metal layer, it may have a sufficient electromagnetic shielding effect.

The conductive adhesive layer may have a resistance with a metal layer of 2 Ω or less, for example, 0 Ω to 2 Ω, specifically 0 Ω to 1 Ω, more specifically 0 Ω to 0.5 Ω at a diameter of 2.0 mm. In the resistance range, the electromagnetic shielding film is excellent in electromagnetic shielding efficiency. Here, the resistance with the metal layer can be measured by the resistance between the Cu foil of the lower layer and the electromagnetic shielding film of the upper layer by forming an insulating layer having a hole of 2.0mm diameter on the surface of the Cu Foil and then attaching the electromagnetic shielding film on the upper layer. have.

The conductive adhesive layer 100 may have a thickness of 3 μm to 30 μm, specifically 4 μm to 20 μm, and more specifically 5 μm to 15 μm. In the thickness range, not only the electric wave shielding effect is sufficient, but also the thinning of the electromagnetic wave shielding film can be achieved.

The conductive adhesive layer 100 may be formed of a composition for a conductive adhesive layer, which will be described later.

The conductive layer 200 may shield noise such as electromagnetic waves generated from a printed circuit board, thereby improving electromagnetic shielding efficiency in a printed circuit board for high frequency or high speed transmission of 1 GHz or more.

The conductive layer 200 has a surface roughness Rz of the surface 210 in contact with the conductive adhesive layer 100 of 20 nm to 1,000 nm. In the surface roughness (Rz) range, the electromagnetic shielding film has an effect of improving the signal transmission efficiency. For example, the conductive layer 200 has a surface roughness Rz of the surface 210 in contact with the conductive adhesive layer 100 of 20 nm to 700 nm, specifically 20 nm to 500 nm, more specifically 20 nm to 300 nm.

The conductive layer 200 may have a surface roughness Ra of the surface 210 in contact with the conductive adhesive layer 100 of 100 nm or less, for example, 0 to 100 nm, specifically 0 to 50 nm. In the surface roughness (Ra) range, the electromagnetic shielding film has an effect of improving the signal transmission efficiency.

The conductive layer 200 may include nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc, and one or more of these materials, and may be an alloy including two or more of them. For example, the conductive layer 200 may use copper in terms of shielding efficiency and economy. The surface of the conductive layer 200 can be subjected to surface treatment such as oxidation prevention, heat treatment, and chemical treatment.

The conductive layer 200 may have a thickness of 1 μm to 12 μm, specifically 2 μm to 10 μm, and more specifically 3 μm to 8 μm. In the above thickness range, signal transmission efficiency is excellent and thinning can be achieved.

In addition, the conductive layer 200 and the conductive adhesive layer 100 may have a thickness ratio of 1: 1 to 1: 5, specifically, 1: 1 to 1: 3. In the thickness ratio range, the balance of electromagnetic wave shielding efficiency and thinning is excellent, and the durability of the electromagnetic shielding film is also excellent.

The insulating layer 300 allows the electromagnetic wave conductive layer 200 to be electrically insulated from the outside and protects the conductive layer 200. In addition, by imparting a certain strength to the electromagnetic shielding film, and protects the conductive adhesive and the FPCB substrate from the external impact generated during the FPCB process, it is possible to prevent damage and wear.

The insulating layer 300 may be a polymer resin, and may be used without limitation as long as it is a polymer resin commonly used in the art. Specifically, it may be an acrylic resin, a polyurethane resin, a polyester resin, a cellulose resin, an epoxy resin, a polyamide resin, a polyimide resin, a silicone resin, a phenol resin, an alkyd resin, a melamine resin, or a mixture thereof. have. In this case, the number average molecular weight of the polymer resin may be 10,000 to 300,000, but is not limited thereto. For example, the insulating layer 300 may use a polyimide resin in terms of chemical resistance, voltage resistance, scratch resistance, and abrasion resistance.

The insulating layer 300 may have a thickness of 1 μm to 30 μm, specifically 3 μm to 20 μm, and more specifically, 5 μm to 15 μm. In the thickness range, a certain strength or more may be given to the electromagnetic shielding film, and the electromagnetic shielding performance may not be reduced.

The electromagnetic shielding film may have a thickness of 10 μm to 40 μm, specifically 13 μm to 35 μm.

conductivity Adhesive layer  Composition

The conductive adhesive layer 100 is formed of a conductive adhesive layer composition, and in one embodiment, the conductive adhesive layer composition may include a dendrite-shaped conductive particle, an epoxy resin, and a curing agent.

The kind and shape of the dendrite conductive particles are substantially the same as described in the conductive adhesive film. The dendrite conductive particles may be included in the composition for the conductive adhesive layer in an amount of 20 to 70 wt%, specifically 30 to 60 wt%. In the above content range, the electromagnetic shielding effect of the electromagnetic shielding film is excellent.

In another embodiment, the composition for the conductive adhesive layer may further include carbon nanotubes (CNT). In this case, the electromagnetic shielding film has an effect of further improving the electromagnetic shielding efficiency.

The carbon nanotubes (CNT) have an average diameter of 1 nm to 20 nm, specifically 3 nm to 15 nm, an average length of 5 μm to 100 μm, specifically 10 μm to 50 μm, and a bulk density of 0.01 to 0.08 g /. ml, specifically 0.02 to 0.04 g / ml.

The carbon nanotubes (CNT) may be included in the composition for the conductive adhesive layer in an amount of 0.1 to 5 wt%, specifically 0.5 to 3 wt%. In the above content range, the electromagnetic shielding film may be sufficiently improved electron shielding efficiency. On one side, the total content of the dendrite conductive particles and the carbon nanotubes (CNT) is 100% of the dendrite conductive particles (and / or carbon nanotubes (CNTs)), the epoxy resin and the curing agent. 20 to 75% by weight, specifically 30 to 65% by weight may be included. In the above content range, the conductive adhesive layer is excellent in current carrying efficiency with the metal layer, it may have a sufficient electromagnetic shielding effect.

The epoxy resin is excellent in reactivity and can improve the heat resistance of the conductive adhesive layer. The epoxy resin may be used in the presence of two or more epoxy groups in one molecule, specifically, bisphenol A epoxy resin, bisphenol F-type epoxy resin, bisphenol S-type epoxy resin, naphthalene type epoxy resin, anthracene epoxy resin, biphenyl Type epoxy resin, tetramethyl biphenyl type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, bisphenol A novolak type epoxy resin, bisphenol S novolak type epoxy resin, biphenyl novolak type epoxy resin, Naphthol novolac epoxy resin, naphthol phenol coaxial novolac epoxy resin, naphthol corresol coaxial novolac epoxy resin, aromatic hydrocarbon formaldehyde resin modified phenolic resin epoxy resin, triphenyl methane epoxy resin, tetraphenylethane epoxy Resin, dicyclopentadiene phenol addition reaction type epoxy resin, phenol a It may include type epoxy resin, polyfunctional phenolic resin, and one or more of the naphthol aralkyl type epoxy resin. For example, the epoxy resin may include at least one of a bisphenol type and a biphenyl type in terms of adhesive strength and heat resistance. The epoxy resin may have a weight average molecular weight of 100 to 10,000, specifically 170 to 2,800.

The epoxy resin may be included in the composition for the conductive adhesive layer 10 to 60% by weight, specifically 20 to 55% by weight. In the content range, the conductive adhesive layer has an effect of excellent adhesion, heat resistance and workability.

The curing agent may include one or more of an amine compound, an imidazole compound, and a BF3 complex, but is not limited thereto. Specifically, the amine compound may include one or more of benzyldimethylamine (BDMA), 4,4-diaminodiphenylsulfone and 2,4,6-trisdimethylaminomethylphenol (DMP-30), The imidazole compound may include one or more of 2-methylimidazole and 2-ethyl-4-methylimidazole (EMI24).

The curing agent may be included in the composition for the conductive adhesive layer 1 to 20% by weight, specifically 2 to 10% by weight. In the above content range, the composition for the conductive adhesive layer can be sufficiently cured, and excellent in fluidity and moldability.

The composition for the conductive adhesive layer may further include a solvent. Specifically, the solvent is hexane, toluene, texanol, methyl cellosolve, ethyl cellosolve, cyclohexanone, butyl cellosolve, butyl carbitol (diethylene glycol monobutyl ether), dibutyl carbitol (di Ethylene glycol dibutyl ether), butyl carbitol acetate (diethylene glycol monobutyl ether acetate), propylene glycol monomethyl ether, hexylene glycol, terpineol, methyl ethyl ketone, benzyl alcohol, gamma butyrolactone and ethyl It may comprise one or more of lactates. For example, the solvent may be used in combination of methyl ethyl ketone and toluene, the weight ratio of methyl ethyl ketone and toluene may be 1: 1 to 5: 1, specifically 2: 1 to 4: 1. In the above weight ratio range, all components of the composition may be dissolved, and dispersion of the conductive particles and / or carbon nanotubes having a dendrite shape is also excellent.

The solvent is 30 to 200 parts by weight, specifically 40 to 180 parts by weight, based on 100 parts by weight of the total content of the dendrite conductive particles (and / or carbon nanotubes (CNT)), the epoxy resin and the curing agent. In more detail, it may be included in an amount of 50 to 160 parts by weight. In the above content range, it is possible to dissolve all the components of the composition, it is also excellent in processability by maintaining an appropriate viscosity.

The conductive adhesive layer composition may further include an additive in addition to the component according to the purpose and use. Specifically, the additive may include one or more of a dispersant, thixotropic agent, plasticizer, rust preventive agent, viscosity stabilizer, antifoaming agent, pigment, UV stabilizer, antioxidant and coupling agent. The additive may be included in 5% by weight or less of the composition for the conductive adhesive layer.

The composition for the conductive adhesive layer may have a viscosity of 200 cps to 3,000 cps. In the said viscosity range, processability is excellent.

Printed circuit board

Another aspect of the invention relates to a printed circuit board. According to one embodiment, the printed circuit board may be formed with an electromagnetic shielding film on at least one surface, the electromagnetic shielding film may be an electromagnetic shielding film according to one aspect of the present invention.

In an embodiment, the printed circuit board may be a flexible printed circuit board (FPCB), FPCB applying the electromagnetic shielding film of the present invention is not only excellent in durability, but also the signal without deteriorating the electromagnetic shielding efficiency It has the advantage of low loss rate.

The printed circuit board may include an insulating layer between the electromagnetic shielding film.

Electromagnetic shielding film manufacturing method

Another aspect of the invention relates to a method for manufacturing an electromagnetic shielding film.

Method of manufacturing an electromagnetic shielding film according to an embodiment comprises the steps of forming a conductive layer on the insulating layer and coating and curing the composition for the conductive adhesive layer on the conductive layer. Can be.

The forming of the conductive layer on the insulating layer may be performed by electroplating, electroless plating, chemical vapor deposition (CVD) and physical vapor deposition (PVD) processes. Moreover, a conductive layer can be formed by the process of performing two or more processes together in the said process.

Specifically, the conductive layer may be formed by CVD, PVD, and / or electroplating on the insulating layer, in which case the conductive layer has a surface roughness Rz of 20 nm to 1,000 nm at the surface in contact with the conductive adhesive layer. It may have a range of. For example, the conductive layer may satisfy the specific roughness Rz of the present invention by controlling the surface roughness of the base layer, the concentration and the formation rate of the plating liquid, the additive, and the like in the process of manufacturing the Cu layer.

The composition for the conductive adhesive layer may use the composition for the conductive adhesive layer described above. Specifically, the composition for the conductive adhesive layer is applied to a thickness of 3㎛ to 30㎛, specifically 4㎛ to 20㎛ on the insulating layer, and dried the solvent for 2 to 10 minutes at 80 ℃ to 150 ℃ 40 ℃ The conductive adhesive layer may be formed by aging at 0 to 60 ° C. for 0 to 120 hours.

Electromagnetic shielding film manufacturing method according to another embodiment is to form an insulating layer by coating an insulating layer on the conductive layer and to apply and cure the composition for the conductive adhesive layer on the opposite surface formed with the insulating layer of the conductive layer It may include a step.

Specifically, after coating the composition for forming an insulating layer on the conductive layer to a thickness of 1㎛ 30㎛, specifically 2㎛ 20㎛, and then drying the solvent for 2 to 10 minutes at 80 ℃ to 180 ℃ The insulating layer can be formed.

The conductive adhesive layer may be prepared by applying and curing the composition for the conductive adhesive layer on the opposite side of the conductive layer on which the insulating layer is formed as described in the method for manufacturing the electromagnetic shielding film according to the embodiment.

Hereinafter, the configuration and operation of the present invention through the preferred embodiment of the present invention will be described in more detail. However, this is presented as a preferred example of the present invention and in no sense can be construed as limiting the present invention.

Details that are not described herein will be omitted since those skilled in the art can sufficiently infer technically.

Example  One

The conductive layer was formed on the insulating layer (Polyimide) by vapor deposition and plating. And, 45% by weight of the dendrite silver coated copper powder (A), carbon nanotube (CNT) (average diameter 3nm, average length 15㎛) (B) 2% by weight, bisphenol-A epoxy resin (C ) 100 parts by weight of a mixture comprising 48% by weight and 4% by weight of 4,4-diaminodiphenylsulfone (polyscience, AEW: 64) (E) and a solvent (50 parts by weight of methyl ethyl ketone and 30 parts by weight of toluene) A composition for a conductive adhesive layer comprising a was applied on the conductive layer, and aged at 50 ° C. for 24 hours to prepare an electromagnetic shielding film.

The prepared electromagnetic shielding film has an insulating layer thickness of 12 μm, a conductive layer thickness of 3 μm, a conductive adhesive layer thickness of 8 μm, and a surface roughness Rz of a surface in contact with the conductive adhesive layer of the conductive layer is 200 nm, Ra was 30 nm.

Example  2

The electromagnetic wave shielding film was prepared in the same manner as in Example 1 except that the surface roughness Rz of the surface in contact with the conductive adhesive layer of the conductive layer was 800 nm and Ra was 90 nm by forming the conductive layer by plating in Example 1. It was.

Comparative example  One

In Example 1, the electromagnetic wave shielding film was manufactured in the same manner as in Example 1, except that the surface roughness Rz of the surface contacting the conductive adhesive layer of the conductive layer was 1,500 nm and Ra was 120 nm. It was.

Comparative example  2

The electromagnetic wave shielding film was manufactured in the same manner as in Example 1 except that the surface roughness Rz of the surface contacting the conductive adhesive layer of the conductive layer was 3,000 nm and Ra was 250 nm in Example 1 by plating. It was.

Property evaluation method

(1) Surface roughness (Rz and Ra) measurement (nm): For the electromagnetic wave shielding films of Examples and Comparative Examples, Scan length 500㎛, Scan Speed 50㎛ / using Alpha-Step equipment, KLA Tencor's surface profiler Surface roughness was measured by s, and is shown in Table 1 below.

(2) Signal loss (unit: dB): For the electromagnetic shielding film of the Examples and Comparative Examples, form a Micro Strip Line circuit 100mm long, attach the electromagnetic shielding film on top of the circuit and then E8364A Network Analyzer of Agilent The signal loss data calculated by measuring the s-parameter using is shown in Table 1 below.

(3) Electromagnetic wave shielding rate (unit: dB): For the electromagnetic wave shielding film of the Example and the comparative example, after measuring the electromagnetic wave shielding rate using EM-2108 shielding rate jig and E8364A Network Analyzer, it is shown in Table 2 below. .

Signal frequency 5 GHz 10 GHz 15 GHz 20 GHz Surface roughness Signal loss (dB) Rz (nm) Ra (nm) Example 1 200 30 -6.0 -9.8 -14.1 -18.4 Example 2 800 90 -6.2 -9.9 -14.5 -19.1 Comparative Example 1 1500 120 -6.5 -10.5 -15.2 -20.3 Comparative Example 2 3000 250 -6.6 -11.3 -16.4 -21.4

Signal frequency 2 GHz 4 GHz 6 GHz 8 GHz 10 GHz Surface roughness Electromagnetic shielding rate (dB) Rz (nm) Ra (nm) Example 1 200 30 ≥80 dB ≥80 dB ≥80 dB ≥80 dB ≥80 dB Example 2 800 90 ≥80 dB ≥80 dB ≥80 dB ≥80 dB ≥80 dB Comparative Example 1 1500 120 ≥80 dB ≥80 dB ≥80 dB ≥80 dB ≥80 dB Comparative Example 2 3000 250 ≥80 dB ≥80 dB ≥80 dB ≥80 dB ≥80 dB

As shown in Tables 1 and 2, it can be seen that the electromagnetic wave shielding film having the surface roughness of the present invention can minimize signal loss without lowering the electromagnetic shielding rate. On the other hand, Comparative Examples 1 and 2 outside the surface roughness range of the present invention can be seen that the signal loss of the present invention is larger than the present invention.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments and can be manufactured in various forms, and a person of ordinary skill in the art to which the present invention pertains has the technical spirit of the present invention. However, it will be understood that other specific forms may be practiced without changing the essential features. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

10: electromagnetic shielding film 100: conductive adhesive layer
200: conductive layer 210: surface in contact with the conductive adhesive layer of the conductive layer
300: insulation layer

Claims (14)

Conductive adhesive layer;
A conductive layer formed on the conductive adhesive layer; And
An insulating layer formed on the conductive layer; Electromagnetic shielding film, including
The conductive layer has a surface roughness Rz of the surface in contact with the conductive adhesive layer is 20 nm to 1,000 nm,
A metal layer of the conductive adhesive layer measured by the resistance between the copper foil of the lower layer and the electromagnetic shielding film of the upper layer by forming an insulating layer having a hole of 2.0 mm in diameter on the surface of the copper (Cu) foil, and then attaching an electromagnetic shielding film on the upper layer thereof. Electromagnetic shielding film having a resistance of 2 Ω or less.
The method of claim 1,
The conductive layer has an electromagnetic shielding film having a surface roughness Ra of 100 nm or less in contact with the conductive adhesive layer.
The method of claim 1,
The conductive layer is at least one of nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium and zinc.
The method of claim 1,
The conductive adhesive layer includes at least one of a dendrite-shaped conductive particles and carbon nanotubes (CNT),
The dendrite-shaped conductive particles and carbon nanotubes (CNT) are contained in the conductive adhesive layer 20 to 75% by weight of the electromagnetic shielding film.
delete The method of claim 1,
The conductive layer has a thickness of 1 to 12 ㎛ electromagnetic shielding film.
The method of claim 1,
The conductive adhesive layer has a thickness of 3 ㎛ to 30 ㎛ electromagnetic shielding film.
The method of claim 1,
The conductive adhesive layer is formed of a composition for a conductive adhesive layer,
The composition for the conductive adhesive layer,
20 to 70 wt% of dendrite conductive particles;
10 to 60 wt% epoxy resin; And
1 to 20 weight percent of hardener;
Electromagnetic shielding film comprising a.
The method of claim 8,
The dendrite conductive particles are silver-coated copper electromagnetic shielding film.
The method of claim 8,
The composition for the conductive adhesive layer further comprises 0.1 to 5% by weight of carbon nanotubes (CNT),
The carbon nanotube (CNT) has an average diameter of 1 nm to 20 nm, an average length of 5 μm to 100 μm, and a bulk density of 0.01 to 0.08 g / ml.
delete The method of claim 1,
The electromagnetic shielding film has a thickness of 10㎛ to 40㎛ electromagnetic shielding film.
Is a printed circuit board formed with an electromagnetic shielding film on at least one side,
The electromagnetic shielding film is a printed circuit board of any one of claims 1 to 4, 6 to 10 and 12.
Forming a conductive layer on the insulating layer; And
Applying and curing the composition for the conductive adhesive layer on the conductive layer;
Claim 1 to 4, claim 6 to claim 10 and claim 12, wherein any one of the electromagnetic wave shielding film manufacturing method.

Images