KR102017492B1 - Antenna having magnet and fabricating method the same - Google Patents

Abstract

Disclosed are a magnetic embedded antenna and a method of manufacturing the same. The magnetic embedded antenna according to an embodiment of the present disclosure includes a magnetic structure, a first conductive layer provided on a lower surface of the magnetic structure, and a second conductive layer provided on an upper surface of the magnetic structure, and the magnetic structure includes the first conductive layer. The first insulating layer provided on the upper layer, the second insulating layer provided on the lower portion of the second conductive layer, the magnetic material provided between the first insulating layer and the second insulating layer, and the first insulating layer and the second insulating layer It includes a reinforcement provided to surround the side of the magnetic material therebetween.

Description

Magnetic substance built-in antenna and manufacturing method thereof {ANTENNA HAVING MAGNET AND FABRICATING METHOD THE SAME}

Embodiments of the present invention relate to a magnetic built-in antenna.

Magnetic materials are used in the antenna module for various purposes such as magnetic induction or electromagnetic wave blocking. In the case of a conventional magnetic embedded antenna, a magnetic material is embedded between the first conductive layer and the second conductive layer, wherein the first adhesive sheet formed on the first conductive layer and the second adhesive sheet formed under the second conductive layer are formed. The magnetic body was adhered to the first conductive layer and the second conductive layer through each. In this case, a step occurs between the magnetic body and the magnetic peripheral part due to the thickness of the magnetic body, and thus there is a problem that the flatness of the magnetic embedded antenna is reduced. In addition, the gap between the magnetic body and the magnetic body may be formed due to a gap, which may cause defects when left for a long time, and the side of the magnetic body may be exposed to the outside, thereby deteriorating reliability when the salt water test is performed.

Korean Patent Publication No. 10-2013-0076427 (2013.07.08)

Embodiment of the present invention is to provide a magnetic built-in antenna having a uniform thickness and a method of manufacturing the same.

An embodiment of the present invention is to provide a magnetic built-in antenna and a method of manufacturing the same that can improve the reliability.

Magnetic internal antenna according to an embodiment of the present disclosure, a magnetic structure; A first conductive layer provided on a bottom surface of the magnetic structure; And a second conductive layer provided on an upper surface of the magnetic structure, wherein the magnetic structure includes: a first insulating layer provided on the first conductive layer; A second insulating layer provided under the second conductive layer; A magnetic material provided between the first insulating layer and the second insulating layer; And a reinforcing member provided surrounding the side surface of the magnetic material between the first insulating layer and the second insulating layer.

The reinforcing material may include a magnetic material accommodating hole formed of an insulating material, penetrating the reinforcing material, having the magnetic material contained therein, and having a size corresponding to the magnetic material.

The reinforcing material may be made of the same thickness as the thickness of the magnetic material.

The magnetic embedded antenna may include: a first via hole provided at one side of the magnetic embedded antenna to electrically connect the first conductive layer and the second conductive layer; And a second via hole electrically connected to the first conductive layer and the second conductive layer on the other side of the magnetic embedded antenna, wherein the first via hole and the second via hole are formed of the magnetic material. It may be provided through the reinforcement on both sides of the.

The magnetic embedded antenna may include: a first unit pattern formed in the first conductive layer and formed in the width direction of the magnetic embedded antenna, and a plurality of the plurality of spaced apart from each other along the longitudinal direction of the magnetic embedded antenna; And a second unit pattern formed on the second conductive layer and formed in the width direction of the magnetic embedded antenna, wherein a plurality of second unit patterns are spaced apart from each other along the longitudinal direction of the magnetic embedded antenna. The pattern and the second unit pattern may be electrically connected to each other by winding the magnetic structure through the first via hole and the second via hole.

According to one or more exemplary embodiments, a method of manufacturing a magnetic embedded antenna includes: providing a first insulating layer on an upper portion of a first conductive layer; Providing a reinforcing member formed on the first insulating layer with a plurality of magnetic material receiving holes spaced apart from each other; Storing magnetic materials in the plurality of magnetic material receiving holes; Providing a second insulating layer covering the magnetic material on the reinforcing material; And providing a second conductive layer on the second insulating layer.

The reinforcing material may be made of an insulating material, and the magnetic body accommodating hole may have a size corresponding to that of the magnetic body.

The reinforcing material may be made of the same thickness as the thickness of the magnetic material.

After preparing the second conductive layer, electrically connecting the first conductive layer and the second conductive layer at one side of the magnetic embedded antenna to provide a first via hole; And providing a second via hole by electrically connecting the first conductive layer and the second conductive layer on the other side of the magnetic embedded antenna, wherein the first via hole and the second via hole include: It may be provided through the reinforcing material on both sides of the magnetic material.

After the preparing of the second conductive layer, the first conductive layer is formed in the width direction of the internal magnetic antenna, and the plurality of first unit patterns are formed to be spaced apart from each other along the longitudinal direction of the internal magnetic antenna. step; And forming a plurality of second unit patterns spaced apart from each other along the length direction of the magnetic embedded antenna, in the second conductive layer in the width direction of the embedded magnetic antenna, wherein the first unit pattern and The second unit pattern may be electrically connected to the periphery of the magnetic material through the first via hole and the second via hole.

According to the disclosed embodiment, by forming the magnetic body accommodating hole in the reinforcing material having the same thickness as the magnetic body and accommodating the magnetic body, the magnetic built-in antenna can maintain uniform flatness. Then, a step is not generated between the reinforcing material and the magnetic body, and no empty space is generated around the magnetic body. In addition, when manufacturing a magnetic embedded antenna through a hot press process, it is possible to prevent damage to the via hole.

In addition, as the via holes penetrate the reinforcing material on both sides of the magnetic material, it is possible to prevent the microcurrent from leaking to the magnetic material through the via holes.

In addition, since the magnetic body is surrounded by the reinforcing material, the magnetic body is not exposed to the outside, thereby maintaining reliability even when performing various tests such as a salt water test.

1 is a cross-sectional view showing a magnetic built-in antenna according to an embodiment of the present invention
2 is a view showing a method of manufacturing a magnetic built-in antenna according to an embodiment of the present invention
Figure 3 is a plan view showing a state in which a plurality of magnetic body receiving holes formed in the reinforcement in an embodiment of the present invention
4 illustrates a conductive pattern according to an embodiment of the present invention.

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. The following detailed description is provided to assist in a comprehensive understanding of the methods, devices, and / or systems described herein. However, this is only an example and the present invention is not limited thereto.

In describing the embodiments of the present invention, when it is determined that the detailed description of the known technology related to the present invention may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted. In addition, terms to be described below are terms defined in consideration of functions in the present invention, which may vary according to the intention or custom of a user or an operator. Therefore, the definition should be made based on the contents throughout the specification. The terminology used in the description is for the purpose of describing embodiments of the invention only and should not be limiting. Unless expressly used otherwise, the singular forms “a,” “an,” and “the” include plural forms of meaning. In this description, expressions such as "comprises" or "equipment" are intended to indicate certain features, numbers, steps, actions, elements, portions or combinations thereof, and one or more than those described. It should not be construed to exclude the presence or possibility of other features, numbers, steps, actions, elements, portions or combinations thereof.

In the following description, the terms "transfer", "communication", "transmit", "receive" and other similar meanings of signals or information are not only meant to directly convey the signal or information from one component to another. It also includes passing through other components. In particular, "transmitting" or "transmitting" a signal or information to one component indicates the final destination of the signal or information and does not mean a direct destination. The same is true for the "reception" of a signal or information. In addition, in this specification, "relating" two or more pieces of data or information means that if one data (or information) is obtained, at least a portion of the other data (or information) can be obtained based thereon.

Meanwhile, directional terms such as upper side, lower side, one side, the other side, and the like are used in connection with the orientation of the disclosed drawings. Since the components of the embodiments of the present invention can be positioned in various orientations, the directional terminology is used for the purpose of illustration and not limitation.

In addition, terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms may be used for the purpose of distinguishing one component from another component. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

1 is a cross-sectional view showing a magnetic internal antenna according to an embodiment of the present invention.

Referring to FIG. 1, the magnetic embedded antenna 100 may include a first conductive layer 102, a second conductive layer 104, and a magnetic structure 106.

In an exemplary embodiment, the magnetic embedded antenna 100 may be any one of a magnetic secure transmission (MST) antenna, a near field communication (NFC) antenna, and a wireless power charge (WPC) antenna. However, the present invention is not limited thereto, and the magnetic internal antenna 100 may be applied to various kinds of antennas including magnetic materials.

The first conductive layer 102 may be made of a conductive material (eg, copper). The first conductive layer 102 may be formed on one surface of the magnetic structure 106 (the lower surface of the magnetic structure 106 in FIG. 1). A portion of the first conductive layer 102 may be etched on one surface of the magnetic structure 106 to form a pattern of a predetermined shape. A protective layer (not shown) may be formed on the bottom surface of the first conductive layer 102 to protect the first conductive layer 102 from the external environment.

The second conductive layer 104 may be made of a conductive material (eg, copper). The second conductive layer 104 may be formed on the other surface of the magnetic structure 106 (upper surface of the magnetic structure 106 in FIG. 1). A portion of the second conductive layer 104 may be etched from the other surface of the magnetic structure 106 to form a pattern of a predetermined shape. A protective layer (not shown) may be formed on the top surface of the second conductive layer 104 to protect the second conductive layer 104 from the external environment.

The magnetic structure 106 may be provided between the first conductive layer 102 and the second conductive layer 104. The magnetic structure 106 may include a first insulating layer 111, a magnetic body 113, a reinforcing material 115, and a second insulating layer 117.

The first insulating layer 111 may be provided on the first conductive layer 102. An adhesive layer 111a may be formed on the top surface of the first insulating layer 111. The first insulating layer 111 may serve to insulate the magnetic body 113 and the first conductive layer 102. In addition, the first insulating layer 111 may serve to protect the lower surface of the magnetic body 113.

The magnetic body 113 may be provided on the first insulating layer 111. One surface of the magnetic body 113 may be adhered to the first insulating layer 111 through the adhesive layer 111a. The magnetic body 113 may include at least one of a silicon steel sheet, ferrite, nano crystal, amorphous, permoloy, and polymer metal. The magnetic body 113 may be provided to correspond to the central area of the first insulating layer 111.

The reinforcing material 115 may be provided on the first insulating layer 111. One surface of the reinforcing material 115 may be adhered to the first insulating layer 111 through the adhesive layer 111a. The reinforcing material 115 may be provided to surround the side of the magnetic body 113 on the upper portion of the first insulating layer 111. The reinforcing member 115 may be provided to have the same thickness as the magnetic body 113. The reinforcing member 115 may be made of, for example, an insulating material such as polyimide (PI), FR4, and polyethylene terephthalate (PET).

In an exemplary embodiment, a magnetic body accommodating hole 115a penetrating through the reinforcement 115 may be formed at the central portion of the reinforcement 115. The magnetic body 113 may be stored in the magnetic body accommodating hole 115a. The magnetic body accommodating hole 115a may be formed in a size corresponding to the magnetic body 113. Here, the reinforcing member 115 is provided with the same thickness as the magnetic body 113, the magnetic body 113 is accommodated in the magnetic body receiving hole 115a of the size corresponding to the magnetic body 113, thereby the reinforcing material 115 and the magnetic body 113 Steps do not occur between the), and no empty space is formed around the magnetic body 113.

The second insulating layer 117 may be provided on the magnetic material 113 and the reinforcing material 115. An adhesive layer 117a may be formed on the bottom surface of the second insulating layer 117. The other surfaces of the magnetic body 113 and the reinforcing member 115 may be adhered to the second insulating layer 117 through the adhesive layer 117a, respectively. The second insulating layer 117 may serve to insulate the magnetic body 113 and the second conductive layer 104. In addition, the second insulating layer 117 may serve to protect the upper surface of the magnetic body 113.

Here, the first conductive layer 102 and the second conductive layer 104 may be electrically connected through the via hole 108. In an exemplary embodiment, the via hole 108 may include a first via hole 108-1 and a second via hole 108-2. The first via hole 108-1 and the second via hole 108-2 form a through hole penetrating the second conductive layer 104, the magnetic structure 106, and the first conductive layer 102. It may be provided by forming a plating layer on the inner wall of the through hole.

The first via hole 108-1 may be formed by electrically connecting the first conductive layer 102 and the second conductive layer 104 at one side of the magnetic embedded antenna 100. A plurality of first via holes 108-1 may be provided to be spaced apart from each other along one side of the magnetic embedded antenna 100. The second via hole 108-2 may be formed by electrically connecting the first conductive layer 102 and the second conductive layer 104 to the other side of the magnetic embedded antenna 100. A plurality of second via holes 108-2 may be provided to be spaced apart from each other along the other side of the magnetic embedded antenna 100.

The first via hole 108-1 may pass through the reinforcing material 115 at one side of the magnetic body 113. The second via hole 108-2 may be provided through the reinforcing material 115 at the other side of the magnetic body 113.

According to the disclosed embodiment, by forming the magnetic body receiving hole 115a in the reinforcement member 115 having the same thickness as the magnetic body 113 and the magnetic body 113 is accommodated, the internal magnetic antenna 100 has a uniform flatness It can be maintained. Then, a step does not occur between the reinforcing member 115 and the magnetic body 113, and an empty space does not occur around the magnetic body 113. In addition, when the magnetic embedded antenna 100 is manufactured through a hot press process, damage to the via hole 108 may be prevented.

In addition, as the via hole 108 is formed while penetrating the reinforcing material 115 at both sides of the magnetic body 113, the micro current may be prevented from leaking to the magnetic body 113 through the via hole 108.

In addition, since the magnetic body 113 is surrounded by the reinforcing material 115, the magnetic body 113 is not exposed to the outside, thereby maintaining the reliability even when performing a variety of tests, such as salt testing.

2 is a view showing a method of manufacturing a magnetic embedded antenna according to an embodiment of the present invention.

Referring to FIG. 2, a first insulating layer 111 is formed on the first conductive layer 102 (FIG. 2A). In an exemplary embodiment, the first conductive layer 102 and the first insulating layer 111 may be adhered through an adhesive means provided between the first conductive layer 102 and the first insulating layer 111. An adhesive layer 111a may be formed on one surface of the first insulating layer 111.

Next, a reinforcing material 115 is formed on the first insulating layer 111 (FIG. 2B). The reinforcing material 115 may be adhered to one surface of the first insulating layer 111 by the adhesive layer 111a. The reinforcing member 115 may have a plurality of magnetic body accommodating holes 115a spaced apart from each other. 3 is a plan view illustrating a state in which a plurality of magnetic body accommodating holes 115a are formed in the reinforcement 115 in the embodiment of the present invention. Referring to FIG. 3, the plurality of magnetic body accommodating holes 115a may be formed through the reinforcing member 115. In addition, the plurality of magnetic body accommodating holes 115a may be formed at regular intervals in the reinforcing member 115.

Next, the magnetic body 113 is accommodated in the plurality of magnetic body accommodating holes 115a (FIG. 2C). Here, the reinforcing material 115 may be made of the same thickness as the magnetic body 113. In addition, the magnetic body accommodating hole 115a may be provided in a size corresponding to the magnetic body 113.

Next, the second insulating layer 117 is formed on the reinforcing material 115 (FIG. 2D). In this case, the second insulating layer 117 is formed to cover the magnetic body 113. An adhesive layer 117a may be formed on the bottom surface of the second insulating layer 117. The magnetic body 113 and the reinforcing member 115 may be adhered to the second insulating layer 117 by the adhesive layer 117a.

Next, the second conductive layer 104 is formed on the second insulating layer 117 (FIG. 2E). In an exemplary embodiment, the second insulating layer 117 and the second conductive layer 104 may be adhered through an adhesive means provided between the second insulating layer 117 and the second conductive layer 104.

Next, via holes 108-1 and 108-2 that electrically connect the first conductive layer 102 and the second conductive layer 104 are formed (FIG. 2F). Here, the via holes 108-1 and 108-2 may be formed through the reinforcing material 115 at both sides of the magnetic body 113. Thereafter, the laminated structure may be thermally compressed through a hot press process.

Here, since the via holes 108-1 and 108-2 penetrate the reinforcing material 115 on both sides of the magnetic body 113, the via holes 108-1 and 108-2 and the magnetic body 113 during the hot pressing process. ) Can be prevented from being damaged. In addition, since the reinforcing material 115 is disposed between the via holes 108-1 and 108-2 and the magnetic body 113, leakage current from the via holes 108-1 and 108-2 to the magnetic body 113 is increased. The flow can be prevented.

Each of the first conductive layer 102 and the second conductive layer 104 may have a pattern having a predetermined shape. In addition, a connection terminal (not shown) may be formed in the first conductive layer 102 or the second conductive layer 104 for electrical connection with the outside. In addition, a protective layer (not shown) may be formed below the first conductive layer 102 and above the second conductive layer 104. Thereafter, the magnetic embedded antenna 100 may be cut or press-punched to a size of a predetermined unit to be formed as a separate product.

4 is a view showing a conductive pattern according to an embodiment of the present invention. 4A illustrates a first conductive pattern formed on the first conductive layer 102, and FIG. 4B illustrates a second conductive pattern formed on the second conductive layer 104. to be.

Referring to FIGS. 4A and 4B, a first conductive pattern 121 may be formed on the first conductive layer 102. The first conductive pattern 121 may include a plurality of first unit patterns 121a spaced apart from each other. The first unit pattern 121a may be formed in the width direction of the magnetic embedded antenna 100. The first unit patterns 121a may be spaced apart from each other along the longitudinal direction of the magnetic embedded antenna 100. That is, the first unit patterns 121a may be spaced apart from each other along the longitudinal direction of the built-in antenna 100 from the upper side to the lower side of the magnetic built-in antenna 100. First and second via holes 108-1 and 108-2 may be formed at both sides of the first unit pattern 121a, respectively.

The second conductive pattern 123 may be formed on the second conductive layer 104. The second conductive pattern 123 may include a plurality of second unit patterns 123a spaced apart from each other. The second unit pattern 123a may be formed in the width direction of the magnetic embedded antenna 100. The second unit patterns 123a may be spaced apart from each other along the longitudinal direction of the magnetic embedded antenna 100. That is, the second unit patterns 123a may be spaced apart from each other along the longitudinal direction of the built-in antenna 100 from an upper side to a lower side of the magnetic built-in antenna 100. First and second via holes 108-1 and 108-2 may be formed at both sides of the second unit pattern 123a, respectively.

In addition, the first connection terminal 125 and the second connection terminal 127 may be formed in the second conductive layer 104, respectively. The first connection terminal 125 may be connected to the first second unit pattern 123a-1. The first connection terminal 125 may extend from one side of the first second unit pattern 123a-1. The first via hole 108-1 may not be formed at one side of the first second unit pattern 123a-1.

The second connection terminal 127 may be connected to the last second unit patterns 123a-n. The second connection terminal 127 is formed along the longitudinal direction of the magnetic internal antenna 100 at the other side of the last second unit pattern 123a-n, and is formed to be spaced apart from each other to face the first connection terminal 125. Can be. The second via hole 108-2 may not be formed at the other side of the last second unit pattern 123a-n.

Here, the first second unit pattern 123a-1 is formed through the second via hole 108-2 formed on the other side of the first second unit pattern 123a-1. And can be electrically connected. The first first unit pattern 121a-1 is connected to the second second unit pattern 123a-2 through the first via hole 108-2 formed at one side of the first first unit pattern 121a-1. Can be electrically connected. The second second unit pattern 123a-2 is formed through the second via hole 108-2 formed on the other side of the second second unit pattern 123a-2. ) Can be electrically connected. As such, the first unit pattern 121a and the second unit pattern 123a may be electrically connected in a screw form through the first via hole 108-1 and the second via hole 108-2. In other words, the first unit pattern 121a and the second unit pattern 123a may have a solenoid shape while winding the magnetic structure 106 through the first via hole 108-1 and the second via hole 108-2. Can be formed.

While the exemplary embodiments of the present invention have been described in detail above, those skilled in the art will appreciate that various modifications can be made to the above-described embodiments without departing from the scope of the present invention. . Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined by the claims below and equivalents thereof.

100: magnetic substance built-in antenna
102: first conductive layer
104: second conductive layer
106: magnetic structure
108: via hole
108-1: First Via Hole
108-2: second via hole
111: first insulating layer
111a: adhesive layer
113: magnetic material
115: reinforcement
115a: magnetic material storage hole
117: second insulating layer
117a: adhesive layer
121: first conductive pattern
121a: first unit pattern
123: second conductive pattern
123a: second unit pattern
125: first connection terminal
127: second connection terminal

Claims (11)

Magnetic substance built-in antenna,
Magnetic structure;
A first conductive layer provided on a bottom surface of the magnetic structure; And
A second conductive layer provided on an upper surface of the magnetic structure;
The magnetic structure is,
A first insulating layer provided on the first conductive layer;
A second insulating layer provided under the second conductive layer;
A magnetic material provided between the first insulating layer and the second insulating layer;
A reinforcing member provided surrounding the side surface of the magnetic material between the first insulating layer and the second insulating layer;
A first via hole provided at one side of the magnetic embedded antenna to electrically connect the first conductive layer and the second conductive layer;
A second via hole formed on the other side of the magnetic embedded antenna to electrically connect the first conductive layer and the second conductive layer;
A first unit pattern formed on the first conductive layer and formed in a width direction of the magnetic embedded antenna, and spaced apart from each other along a length direction from an upper side to a lower side of the magnetic embedded antenna; And
A second unit pattern formed on the second conductive layer and formed in the width direction of the internal magnetic antenna, and a plurality of second unit patterns spaced apart from each other in a longitudinal direction from an upper side to a lower side of the internal magnetic antenna;
A first connection terminal extending from one side of a first second unit pattern positioned above the magnetic embedded antenna; And
A second connection terminal formed along the longitudinal direction of the magnetic embedded antenna at the other side of the last second unit pattern located below the magnetic embedded antenna, and spaced apart from and facing the first connection terminal;
The first unit pattern and the second unit pattern are electrically connected to each other by winding the magnetic structure through the first via hole and the second via hole.
The first via hole and the other side of the last second unit pattern, the first via hole and the second via hole are not formed, respectively.
The method according to claim 1,
The reinforcing material is made of an insulating material,
And a magnetic body accommodating hole formed through the reinforcement and having the magnetic body accommodated therein and having a size corresponding to that of the magnetic body.
The method according to claim 2,
The reinforcing material,
Magnetic body built-in antenna, made of the same thickness as the magnetic material.
delete delete As a manufacturing method of a magnetic body built-in antenna,
Providing a first insulating layer on top of the first conductive layer;
Providing a reinforcing member formed on the first insulating layer with a plurality of magnetic material receiving holes spaced apart from each other;
Storing magnetic materials in the plurality of magnetic material receiving holes;
Providing a second insulating layer covering the magnetic material on the reinforcing material;
Providing a second conductive layer on the second insulating layer;
Providing a first via hole by electrically connecting the first conductive layer and the second conductive layer at one side of the magnetic embedded antenna;
Providing a second via hole by electrically connecting the first conductive layer and the second conductive layer on the other side of the magnetic embedded antenna
Forming a plurality of first unit patterns on the first conductive layer in a width direction of the internal magnetic antenna, and spaced apart from each other in a length direction from an upper side to a lower side of the internal magnetic antenna;
Forming a plurality of second unit patterns on the second conductive layer in a width direction of the internal magnetic antenna, wherein the plurality of second unit patterns are spaced apart from each other in a length direction from an upper side to a lower side of the internal magnetic antenna;
Forming a first connection terminal by extending from one side of a first second unit pattern positioned above the magnetic embedded antenna; And
And forming a second connection terminal facing the first connection terminal while being spaced apart from the first connection terminal on the other side of the last second unit pattern located below the magnetic embedded antenna. and,
The first unit pattern and the second unit pattern are electrically connected to each other by winding a magnetic structure through the first via hole and the second via hole.
The first via hole and the second via hole are not formed on one side of the first second unit pattern and the other side of the last second unit pattern, respectively.
The method according to claim 6,
The reinforcing material,
It is made of an insulating material, the magnetic body receiving hole is provided with a size corresponding to the magnetic body, a manufacturing method of a magnetic body embedded antenna.
The method according to claim 7,
The reinforcing material,
The manufacturing method of the magnetic body built-in antenna which consists of thickness same as the thickness of the said magnetic body.
delete delete The radio | wireless apparatus provided with the magnetic body built-in antenna of any one of Claims 1-3.

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