KR101947590B1

KR101947590B1 - Cutting Panel with Protecting Circuit and Method of Manufacturing the same

Info

Publication number: KR101947590B1
Application number: KR1020170092993A
Authority: KR
Inventors: 이원규; 이경하; 정영태
Original assignee: 주식회사 토비스
Priority date: 2017-07-21
Filing date: 2017-07-21
Publication date: 2019-02-13
Also published as: KR20190010337A; WO2019017597A1

Abstract

According to the cutting panel having the protection circuit of the present invention and the method of manufacturing the same, the TFT backplane cut by using the laser trimming is processed to form a protection circuit so that the resistance and the circuit caused by the defective external ESD or overcurrent / overvoltage There is an effect that it is possible to fundamentally prevent the reduction of defects due to the accumulated charge.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a cutting panel having a protection circuit,

The present invention relates to a cutting panel formed with a protection circuit and a manufacturing method thereof, and more particularly, to a manufacturing method of a cutting panel formed by forming a protection circuit for processing a cut TFT backplane using laser trimming so as to function as an existing antistatic circuit To a cutting panel and a manufacturing method thereof.

Specific examples of the flat panel display include a liquid crystal display (LCD), an organic light emitting display (PDP), a plasma display panel (PDP), a quantum dot display device ), A field emission display device (FED), and an electrophoretic display device (EPD). The flat display panel, which realizes images in common, is an essential component, The flat panel display panel has a structure in which a pair of transparent insulation substrates are bonded together with inherent light emission, polarization, or other optical material layers interposed therebetween.

Such a display device converts a video signal input from the outside into a data voltage and displays an image corresponding to the video signal in a plurality of pixels in accordance with the data voltage.

Such display devices include a substrate formed with a circuit composed of pads connected to TFTs (thin film transistors), wiring lines, and drive integrated circuits (D-ICs) for driving display devices .

Such a substrate is referred to as an array substrate (back substrate) or a backplane.

A charge can be generated during various processes performed in the manufacturing process of the array substrate of the display device.

For example, a charge due to triboelectrification may occur during the cleaning process using the high-pressure micro jet (HPMJ) or other processes during the manufacturing process of the array substrate.

In addition, when dry etching or various other processes are performed, static electricity may flow into the substrate through various paths. To solve this problem, an ESD (Electrostatic Discharge) structure is applied to the edge of the panel constituting the display device .

However, since the static electricity prevention and protection circuit is cut off after the cutting in the raw material panel, the static electricity introduced during the process and the charge generated by the process are trapped in various organic / inorganic films of the display substrate, There is a problem that the electrical characteristics of the transistors formed on the substrate are influenced and display defects of the display device are caused.

Korean Patent Laid-Open Publication No. 10-2003-0073272

SUMMARY OF THE INVENTION The present invention has been conceived to solve the problems described above, and it is an object of the present invention to provide an electrostatic discharge prevention circuit by processing a TFT backplane cut by laser trimming to form a static electricity prevention circuit, And a protection circuit for preventing a reduction in defects caused by a charge to be prevented from occurring, and a manufacturing method thereof.

According to another aspect of the present invention, there is provided a method of manufacturing a cutting panel for cutting a raw material display panel of a prefabricated product to a desired size, A first step of manufacturing a cut display panel by cutting the data line between the pixel and the pixel in a horizontal direction so as to produce the desired size; A second step of covering the exposed circuit part of the cut surface of the cut-off display panel manufactured through the first step to form a shot preventing seal for preventing a shot due to the inflow of foreign matter, And a third step of forming a potential barrier layer by trimming the data line between the formed pixel and the immediately preceding upper pixel in the horizontal direction.

The step of forming the anti-shot seal in the second step may include applying the curable resin to cover the exposed circuit portion in the cut display panel and curing the curable resin to cure the curable resin.

In the trimming process in the third step, the potential barrier layer is formed so as to have an electrical resistance with respect to a vertical length of one pixel and a vertical ratio of the trimming process to be formed in the data line between the pixel where the anti- And to serve as a primary buffer for capacitance; The pixel on which the anti-shot seal is formed can be formed to block the gate pulse signal to serve as a secondary buffer for electrical resistance and capacitance.

According to another aspect of the present invention, there is provided a cutting panel having a protection circuit formed by cutting a raw material display panel of a ready-made product into a desired size. In order to manufacture the raw material display panel to a desired size, The cutout display panel is manufactured by cutting the data line between the cutout display panel and the cutout display panel so that the cutout preventive seal is formed to completely cover the circuit portion exposed at the cut surface of the cut display panel and prevent a shot due to the inflow of foreign matter, And a potential barrier layer is formed between the data line and the data line between the formed pixel and the immediately preceding upper pixel through a trimming process.

The shot protection seal may be coated with a curable resin to cover the exposed circuitry in the cut display panel and cured to cure the curable resin.

In the trimming process, the potential barrier layer is formed to serve as a primary buffer for electrical resistance and capacitance with respect to the vertical length of one pixel and the interval ratio of the trimming process formed between the horizontal pixel line and the immediately preceding horizontal pixel line ; The horizontal pixel line in which the anti-shot seal is formed can be formed to block the gate pulse signal and serve as a secondary buffer for electrical resistance and capacitance.

According to the cutting panel having the protection circuit of the present invention as described above and the manufacturing method thereof, the TFT backplane cut by using the laser trimming can be processed to form the antistatic circuit, and the defect caused by the external ESD or the overcurrent / overvoltage There is an effect that it is possible to fundamentally prevent the decrease in the defects due to the resin and the charge accumulated in the circuit.

1 is an equivalent circuit diagram illustrating pixels formed on a raw material display panel according to an embodiment of the present invention,
FIG. 2 is an equivalent circuit diagram showing a state in which an anti-static circuit is cut off in a raw material display panel according to an embodiment of the present invention,
3 is an equivalent circuit diagram illustrating a state in which an anti-static circuit is manufactured in a raw material display panel according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to facilitate a person skilled in the art to easily carry out the present invention.

In general, a liquid crystal display device displays an image by injecting liquid crystal between two substrates and adjusting an optical transmittance of the liquid crystal by applying an electric field to the liquid crystal through opposing electrodes through the liquid crystal.

Such a liquid crystal display device displays an image by adjusting the light transmittance of liquid crystal cells according to a video signal, and an active matrix type liquid crystal display device in which a switching element is formed for each liquid crystal cell can actively control a switching device This is advantageous for video implementation.

The present invention relates to a method for manufacturing a cut-off display panel by cutting a liquid crystal display device, which is a raw material display panel of a ready-made product, into a desired size, wherein the display panel includes a substrate capable of selectively driving each pixel of various types of display devices , A display area inside the center, and a dead area in the outside of the display area.

The display area includes a plurality of gate lines and data lines intersecting with each other, and an antistatic circuit is provided at an end of the data line.

A thin film transistor (hereinafter referred to as "TFT") is mainly used as a switching element used in the above-described active matrix type liquid crystal display device, as shown in Fig.

1, an active matrix type liquid crystal display device converts digital input data into an analog data voltage based on a gamma reference voltage and supplies the analog data voltage to a data line DL and simultaneously supplies a gate pulse to a gate line GL Thereby filling the liquid crystal cell Clc.

The gate electrode of the TFT is connected to the gate line GL and the source electrode thereof is connected to the data line DL and the drain electrode of the TFT is connected to the pixel electrode of the liquid crystal cell Clc and one electrode of the storage capacitor Cst Respectively.

Here, the common voltage Vcom is supplied to the common electrode of the liquid crystal cell Clc.

The storage capacitor Cst serves to charge the data voltage applied from the data line DL when the TFT is turned on to maintain the voltage of the liquid crystal cell Clc constant.

When a gate pulse is applied to the gate line GL, the TFT is turned on to form a channel between the source electrode and the drain electrode to apply a voltage on the data line DL to the pixel electrode of the liquid crystal cell Clc Supply.

At this time, the liquid crystal molecules of the liquid crystal cell Clc are changed in arrangement by the electric field between the pixel electrode and the common electrode to modulate the incident light.

In order to manufacture the cut-off display panel according to the present invention, first, a prepared display panel of a ready-made article is fixed to a jig (not shown) which keeps it horizontal, and then a display panel of a desired size such as a desired aspect ratio or a desired resolution The data line between the pixel and the pixel in the position away from the end of the data line is cut in the horizontal direction to manufacture the cut display panel as shown in Fig.

The display panel can be cut by a cutting means such as a diamond wheel, laser, water jet or chemical etching.

When cutting using a laser, a laser such as an argon laser, a He-Ne laser and an excimer laser, a compound laser such as a COIL laser (Chemical Oxygen-Iodine Laser) , A metal gas laser such as a helium-cadmium metal gas laser, a semiconductor laser such as a ruby laser, and the like. The present invention can be used irrespective of the kind of laser as long as it can irradiate sufficient energy to cut wiring. have.

At this time, since the cut display panel includes the end portion of the data line, the static electricity prevention circuit provided at the end portion of the data line is lost.

Then, a conductive foreign matter is generated between the circuits that are cut and exposed due to the nature of the display panel, so that a short circuit occurs. When a display panel in which a short is generated is driven, a noise in which a horizontal stripe- Lt; / RTI >

Accordingly, in the case where noise is generated, the foreign matter may be removed by removing the foreign substance by performing a focused inspection of the noise generated portion, or by cleaning the circuit portion in which the horizontal pixel line is exposed.

When the foreign object is removed, the anti-shot seal 500 is formed to prevent foreign matter from flowing into the circuit unit in which the horizontal pixel line is exposed.

The shot preventing seal 500 can be formed in such a form that the hardening resin is applied to a portion where the shot preventing seal 500 is to be formed and the hardening resin is cured so as to be hardened.

Here, the curable resin may be a natural curable resin or a thermosetting resin, but may be a UV resin cured by ultraviolet light to minimize damage to the pixel due to heat.

However, even if the anti-shot seal 500 is formed, the characteristics of the resin may be changed due to high moisture, high humidity, or high temperature, thereby reducing the resistance of the anti-shot seal 500.

As a result, when the display panel is driven, a noise in which a horizontal stripe-shaped image is not displayed may occur due to a short circuit between cut and exposed circuits and an external static electricity.

3, a data line between the pixel 110 in which the short-circuit protection seal 500 is formed and the immediately preceding upper pixel 100 is formed in a horizontal direction by a laser trimming process in a vertical direction to form a potential barrier layer potential barrier.

At this time, the laser trimming process may not function to completely disconnect the data line between the pixel 110 in which the shot-preventing seal 500 is formed and the immediately preceding upper pixel 100, but may function as a potential barrier layer in a state in which the electrical connection is maintained Is the process of machining to reveal the characteristics of the electrical resistance or capacitance.

If the interval of the laser trimming process to be formed on the data line between the pixel 110 in which the short-circuit protection seal 500 is formed and the immediately preceding upper pixel 100 is denoted by "d" , And the potential barrier layer may be formed of 'D / d'.

In this case, since the interval 'd' of the laser trimming process can be adjusted from a minimum of 1 μm to a vertical length of the pixel, the potential barrier layer length 'D / d' can have a minimum value of 1, Can be adjusted according to.

Therefore, in the laser trimming process, the potential barrier layer is formed at a ratio of the vertical length of one pixel to the spacing ratio of the laser trimming process formed between the data line between the pixel 110 in which the short-prevention seal 500 is formed and the upper pixel 100 immediately before Is configured to serve as a primary buffer 710 for electrical resistance and capacitance.

For reference, a plurality of potential barrier layers can be formed by performing a plurality of laser trimming processes on data lines included in one pixel, and a laser trimming process is applied to a plurality of pixels to continuously block an electrostatic protection circuit You can also get results.

When the gate pulse inputted to the pixel 110 in which the short-prevention seal 500 is formed is turned off, the pixel 110 in which the short-prevention seal 500 is formed, (750).

Therefore, even if static electricity flows through the anti-shot seal 500, static electricity is primarily blocked by the secondary buffer 750, and static electricity is introduced by the potential barrier layer by the primary buffer 710 Is secondly cut off, the anti-static effect is maximized.

That is, the influence of the external static electricity is blocked by the data pulse and the gate pulse input to the upper pixel 100, so that an image free from noise can be provided to the display panel.

According to the cutting panel having the protection circuit of the present invention and the method of manufacturing the same, the TFT backplane cut by using the laser trimming can be processed to constitute the static electricity prevention circuit, and the defective or overcurrent / There is an effect that it is possible to fundamentally prevent the reduction of defects due to resin overcharging due to overvoltage and charge accumulated in the circuit.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It will be readily apparent that various substitutions, modifications, and alterations can be made herein.

100, 110: Horizontal pixel line 500: Short prevention seal
710: first buffer 750: second buffer

Claims

A method of manufacturing a cutting panel for manufacturing a cut display panel by cutting a raw material display panel of a ready-made product into a desired size,
A first step of cutting a data line between a pixel and a pixel in a horizontal direction in order to manufacture the raw material display panel to a desired size, thereby manufacturing a cut display panel;
A second step of forming a short-circuit protection seal for preventing a short circuit due to the inflow of foreign matter by entirely covering the circuit part exposed from the cut surface of the cut-off display panel manufactured through the first step; And
A third step of forming a potential barrier layer through a trimming process in a horizontal direction between the data line formed between the pixel having the short-
;
In the trimming process in the third step, the potential barrier layer is formed so as to have an electrical resistance with respect to a vertical length of one pixel and a vertical ratio of the trimming process to be formed in the data line between the pixel where the anti- And a protective layer formed on the protective layer so as to serve as a primary buffer for electrostatic capacitance.

The method according to claim 1, wherein forming the shot protection seal in the second step includes applying a curable resin to cover the exposed circuit portion in the cut display panel and curing the curable resin to cure the curable resin Wherein the protective circuit is formed on the substrate.

[3] The method of claim 1, wherein the pixel having the anti-shot seal formed in the third step is formed to block the gate pulse signal to serve as a secondary buffer for electrical resistance and capacitance. Way.

A cut display panel is manufactured by cutting a raw material display panel of a ready-made product to a desired size. In order to manufacture the raw material display panel to a desired size, a data line between a pixel and a pixel is horizontally cut to manufacture a cut display panel, A short prevention seal is formed to cover a circuit part exposed from a cut surface of the cut display panel to prevent a shot due to the inflow of a foreign substance and to perform a trimming process horizontally between the data line between the pixel on which the short- &Lt; / RTI > to form a potential barrier layer;
In the trimming process, the potential barrier layer is formed so as to serve as a primary buffer for the electric resistance and the electrostatic capacitance with respect to the vertical length of one pixel and the interval ratio of the trimming process formed between the horizontal pixel line and the immediately preceding horizontal pixel line A cutting panel with a protective circuit formed thereon.

5. The cutting panel according to claim 4, wherein the short-circuit protection seal is coated with a curable resin so as to cover the exposed circuit portion in the cut display panel, and is hardened to harden the curable resin.

The panel according to claim 4, wherein the horizontal pixel line in which the anti-shot seal is formed is formed to block the gate pulse signal to serve as a secondary buffer for electrical resistance and capacitance.