KR101881335B1 - 발광 소자 패키지 및 이를 구비한 라이트 유닛 - Google Patents

발광 소자 패키지 및 이를 구비한 라이트 유닛 Download PDF

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Publication number
KR101881335B1
KR101881335B1 KR1020110087406A KR20110087406A KR101881335B1 KR 101881335 B1 KR101881335 B1 KR 101881335B1 KR 1020110087406 A KR1020110087406 A KR 1020110087406A KR 20110087406 A KR20110087406 A KR 20110087406A KR 101881335 B1 KR101881335 B1 KR 101881335B1
Authority
KR
South Korea
Prior art keywords
havng
same
emitting device
device package
light emitting
Prior art date
Application number
KR1020110087406A
Other languages
English (en)
Other versions
KR20130024150A (ko
Inventor
제경민
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020110087406A priority Critical patent/KR101881335B1/ko
Publication of KR20130024150A publication Critical patent/KR20130024150A/ko
Application granted granted Critical
Publication of KR101881335B1 publication Critical patent/KR101881335B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
KR1020110087406A 2011-08-30 2011-08-30 발광 소자 패키지 및 이를 구비한 라이트 유닛 KR101881335B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020110087406A KR101881335B1 (ko) 2011-08-30 2011-08-30 발광 소자 패키지 및 이를 구비한 라이트 유닛

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110087406A KR101881335B1 (ko) 2011-08-30 2011-08-30 발광 소자 패키지 및 이를 구비한 라이트 유닛

Publications (2)

Publication Number Publication Date
KR20130024150A KR20130024150A (ko) 2013-03-08
KR101881335B1 true KR101881335B1 (ko) 2018-07-25

Family

ID=48176270

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110087406A KR101881335B1 (ko) 2011-08-30 2011-08-30 발광 소자 패키지 및 이를 구비한 라이트 유닛

Country Status (1)

Country Link
KR (1) KR101881335B1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102100443B1 (ko) * 2019-02-08 2020-04-13 (주)재진로드 바닥형 보행신호등 보조장치

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100136050A (ko) * 2009-06-18 2010-12-28 서울반도체 주식회사 방열 ｌｅｄ 패키지
JP5370050B2 (ja) * 2009-09-30 2013-12-18 凸版印刷株式会社 Ｌｅｄ発光素子用リードフレーム

Also Published As

Publication number Publication date
KR20130024150A (ko) 2013-03-08

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E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant