KR101860007B1 - Acceleration sensor apparatus and acceleration sesing method using bondwire's material characteristics - Google Patents

Acceleration sensor apparatus and acceleration sesing method using bondwire's material characteristics Download PDF

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KR101860007B1
KR101860007B1 KR1020160028230A KR20160028230A KR101860007B1 KR 101860007 B1 KR101860007 B1 KR 101860007B1 KR 1020160028230 A KR1020160028230 A KR 1020160028230A KR 20160028230 A KR20160028230 A KR 20160028230A KR 101860007 B1 KR101860007 B1 KR 101860007B1
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bonding
distance
acceleration
bonding wire
change
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KR1020160028230A
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Korean (ko)
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KR20170105253A (en
Inventor
조성환
이종화
박수진
김동인
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한국과학기술원
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P3/00Measuring linear or angular speed; Measuring differences of linear or angular speeds
    • G01P3/42Devices characterised by the use of electric or magnetic means
    • G01P3/44Devices characterised by the use of electric or magnetic means for measuring angular speed
    • G01P3/48Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage
    • G01P3/481Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals
    • G01P3/483Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals delivered by variable capacitance detectors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/003Kinematic accelerometers, i.e. measuring acceleration in relation to an external reference frame, e.g. Ferratis accelerometers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P3/00Measuring linear or angular speed; Measuring differences of linear or angular speeds
    • G01P3/42Devices characterised by the use of electric or magnetic means
    • G01P3/44Devices characterised by the use of electric or magnetic means for measuring angular speed
    • G01P3/48Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage
    • G01P3/481Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals

Abstract

An acceleration sensor device is disclosed. The acceleration sensor device includes a circuit board, first and second bonding pad portions symmetrically formed on one surface of the circuit board, first and second bonding wires connected to the first and second bonding pad portions, And a processor for calculating an acceleration from a change in capacitance between the first and second bonding wires caused by movement of the circuit board.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an acceleration sensor device and an acceleration sensing method using material properties of a bonding wire,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an acceleration sensor device and an acceleration sensing method using material properties of a bonding wire, and more particularly, to an acceleration sensor device and an acceleration sensor device capable of detecting a capacitance change due to a difference in material properties of a bonding wire, Sensing method.

Generally, an acceleration sensor is a sensor that detects dynamic forces such as acceleration, vibration, and shock. It is a sensor that not only includes dynamic systems such as automobiles, ships, and trains, but also various types of devices including wearable healthcare devices, It is widely used in devices.

Conventionally, an acceleration sensor of the type as shown in FIG. 1 has been produced. Since such an acceleration sensor is manufactured using the MEMS process, it has an advantage of being excellent in accuracy. However, since the sensor manufacturing process is very complicated, It was expensive.

Accordingly, in a product group in which price competitiveness is more important than product quality, a need has arisen for a method capable of producing an acceleration sensor at a low cost without using a MEMS process in order to lower the production cost of a product.

It is an object of the present invention to provide an acceleration sensor device and an acceleration sensing method using a bonding wire for calculating an acceleration from a change in capacitance between bonding wires caused by movement of a circuit board .

According to an aspect of the present invention, there is provided an acceleration sensor device including a circuit board, first and second bonding pad portions symmetrically formed on one surface of the circuit board, and first and second bonding pad portions, And a processor for calculating the acceleration from the first and second bonding wires and the capacitance change between the first and second bonding wires caused by the movement of the circuit board.

Here, the processor may further include: a detection unit that detects a variation with respect to the reference capacitance between the first and second bonding wires; a distance calculation unit that calculates a variation in distance between the first and second bonding wires from the capacitance variation; And an acceleration determining unit for calculating an acceleration from the acceleration sensor.

Here, the distance calculating unit may calculate a change in distance between the first and second bonding wires from the capacitance change amount according to at least one of density, Young's modulus and radius of the first and second bonding wires.

Also, at least one of the density and the Young's modulus of the first and second bonding wires may be different from each other.

The acceleration sensor device may further include a third bonding wire having the same material properties as the first bonding wire and having both ends connected to the first and second bonding pad portions, And the second bonding wire may be disposed between the first bonding wire and the third bonding wire.

The first bonding wire is separated from the circuit board by a first distance and is connected to the first and second bonding pad portions. The upper bonding wire is spaced apart from the circuit board by a second distance, And the first and second bonding pads are connected to each other, and the first distance and the second distance may be different.

Also, the first bonding wire has a radius of a first size, the second bonding wire has a radius of a second size, and the first size and the second size may be different.

The first bonding wire may have one end connected to the first bonding pad portion and the other end connected to the second bonding pad portion. The second bonding wire may have one end connected to the first bonding pad portion, 2 bonding pad portion.

The first and second bonding pad portions are symmetrically formed on one surface of the circuit board. The first and second bonding pad portions are connected to the first and second bonding pad portions, respectively. The acceleration sensing method of the acceleration sensor device including the second bonding wire includes calculating the acceleration from the capacitance change between the first and second bonding wires caused by the movement of the circuit board.

Wherein the calculating step includes the steps of: detecting a change amount with respect to the reference capacitance between the first and second bonding wires; calculating a distance change between the first and second bonding wires from the capacitance change amount; And calculating the acceleration from the acceleration sensor.

Here, the step of calculating the acceleration from the distance change may include calculating a distance change between the first and second bonding wires from the capacitance change amount according to at least one of the density, the Young's modulus and the radius of the first and second bonding wires Can be calculated.

Also, at least one of the density and the Young's modulus of the first and second bonding wires may be different from each other.

According to various embodiments of the present invention as described above, since the MEMS process is not required in the production process of the acceleration sensor device, the manufacturing cost can be reduced, and the power consumption of the acceleration sensor device can be reduced.

1 is a view showing a conventional acceleration sensor device.
2 is a diagram illustrating the configuration of an acceleration sensor device according to an embodiment of the present invention.
3 is a block diagram illustrating a detailed configuration of a processor according to an embodiment of the present invention.
4 is a view for explaining a case where one end of a bonding wire according to an embodiment of the present invention is bonded to a bonding pad portion.
5 is a flowchart illustrating an acceleration sensing method according to an embodiment of the present invention.

The following merely illustrates the principles of the invention. Thus, those skilled in the art will be able to devise various apparatuses which, although not explicitly described or shown herein, embody the principles of the invention and are included in the concept and scope of the invention. Furthermore, all of the conditional terms and embodiments listed herein are, in principle, only intended for the purpose of enabling understanding of the concepts of the present invention, and are not to be construed as limited to such specifically recited embodiments and conditions do.

It is also to be understood that the detailed description, as well as the principles, aspects and embodiments of the invention, as well as specific embodiments thereof, are intended to cover structural and functional equivalents thereof. It is also to be understood that such equivalents include all elements contemplated to perform the same function irrespective of currently known equivalents as well as equivalents to be developed in the future.

Thus, for example, it should be understood that the block diagrams herein represent conceptual views of exemplary circuits embodying the principles of the invention. Similarly, all flowcharts, state transition diagrams, pseudo code, and the like are representative of various processes that may be substantially represented on a computer-readable medium and executed by a computer or processor, whether or not the computer or processor is explicitly shown .

The functions of the various elements shown in the drawings, including the functional blocks shown in a processor or similar concept, may be provided by use of dedicated hardware as well as hardware capable of executing software in connection with appropriate software. When provided by a processor, the functions may be provided by a single dedicated processor, a single shared processor, or a plurality of individual processors, some of which may be shared.

Also, the explicit use of terms such as processor, control, or similar concepts should not be interpreted exclusively as hardware capable of running software, and may be used without limitation as a digital signal processor (DSP) (ROM), random access memory (RAM), and non-volatile memory. Other hardware may also be included.

In the claims hereof, the elements represented as means for performing the functions described in the detailed description include all types of software including, for example, a combination of circuit elements performing the function or firmware / microcode etc. , And is coupled with appropriate circuitry to execute the software to perform the function. It is to be understood that the invention defined by the appended claims is not to be construed as encompassing any means capable of providing such functionality, as the functions provided by the various listed means are combined and combined with the manner in which the claims require .

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings, in which: There will be. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

2 is a diagram illustrating the configuration of an acceleration sensor device according to an embodiment of the present invention.

2, an acceleration sensor device 1000 according to an embodiment of the present invention includes a circuit board 100, bonding pads 210 and 220, bonding wires 310, 320 and 330, a processor 400, .

The bonding pad portions 210 and 220 are symmetrically formed on one surface of the circuit board 100. Specifically, the bonding pad portions 210 and 220 are formed of a plurality of bonding pads, the first bonding pad portion 210 is a set of bonding pads formed in a line on one side of the circuit board 100, The bonding pad unit 220 may be a set of bonding pads formed on opposite sides of the bonding pads of the first bonding pad unit 210.

The bonding wires 310, 320 and 330 are connected at both ends to the first bonding pad portion 210 and the second bonding pad portion 220, respectively. For example, one end of the first bonding wire 310 may be connected to one of the bonding pads of the first bonding pad unit 210, and the other end may be connected to one of the bonding pads of the second bonding pad unit 220 . At this time, the bonding pads connected to both ends of the first bonding wire 310 may be bonded to each other.

The second bonding wire 320 is connected to one of the bonding pads of the first bonding pad 210 and the second bonding pad 220 in parallel with the first bonding wire 310, Pads. ≪ / RTI > At this time, at least one of the density and Young's modulus of the second bonding wire 320 may be different from that of the first bonding wire 310. In this case, a capacitance change between the first bonding wire 310 and the second bonding wire 320 may occur due to the difference in density and Young's modulus according to the movement of the circuit board 100, The acceleration can be detected.

The third bonding wire 330 may be formed so that one end of the second bonding wire 320 is disposed between the first bonding wire 310 and the third bonding wire 330, And the other end may be connected to one of the bonding pads of the second bonding pad 220. At this time, the third bonding wire 330 may have the same material properties as the first bonding wire 310. In this case, a first capacitance change occurs between the first bonding wire 310 and the second bonding wire 320 according to the movement of the circuit board 100, and the second bonding wire 320 and the third bonding wire A second capacitance change may occur between the first and second capacitors 330 and 330. Here, the first capacitance change and the second capacitance change may mean a reference capacitance dashed capacitance change amount. And the acceleration can be detected from the first capacitance change and the second capacitance change. When the acceleration is detected using the first to third bonding wires 310, 320 and 330, it is possible to detect the acceleration more accurately than when the acceleration is detected using only the first and second bonding wires 310 and 320 have.

The bonding wires 310, 320, and 330 may be spaced apart from the circuit board 100 by a predetermined distance to be connected to the bonding pads 210 and 220. For example, the first bonding wire 310 may be separated from the circuit board 100 by a first distance, and both ends may be connected to the first bonding pad portion 210 and the second bonding pad portion 220, respectively, The second bonding wires 320 may be spaced apart from the circuit board 100 by a second distance so that both ends of the second bonding wires 320 may be connected to the first bonding pad portion 210 and the second bonding pad portion 220, respectively. Here, the second distance may be a value different from the first distance.

The third bonding wires 330 may be spaced apart from each other by a first distance so that both ends of the third bonding wires 330 may be connected to the first bonding pad portion 210 and the second bonding pad portion 220, respectively. That is, the first and third bonding wires 310 and 330 are spaced apart from each other by the same first distance and connected to the bonding pad portions 210 and 220, and the second bonding wire 320 is spaced apart from the first distance by a second distance So that they can be connected to the bonding pad portions 210 and 220. In this case, a capacitance change between the first bonding wire 310 and the second bonding wire 320 may occur in accordance with the movement of the circuit board 100, and the acceleration can be detected using such a capacitance change.

Also, the first bonding wire 310 may be a wire having a radius of a first size, and the second bonding wire 320 may be a wire having a radius of a second size. Here, the first size and the second size may be different. At this time, the third bonding wire 330 may be a wire having a radius of a first size. That is, the first bonding wire 310 and the third bonding wire 330 may be wires having a radius of the same first size, and the second bonding wire 320 may have a radius of a second size different from the first size. . In this case, a capacitance change between the first bonding wire 310 and the second bonding wire 320 may occur due to a difference in radius depending on the movement of the circuit board 100, Can be detected.

In the embodiment of the present invention, the difference in at least one of the density, the Young's modulus, the radius, and the distance from the circuit board 100 of the bonding wires 310, 320, Can be detected.

In addition, the acceleration sensor device 1000 according to an embodiment of the present invention includes a converter (not shown) capable of converting the detected acceleration into a digital value and an interface (not shown) capable of outputting the converted digital value Time).

2, the first bonding wire 310 and the third bonding wire 330 have the same material properties and the same distance and radius as the circuit board 100. However, But is not limited to.

The processor 400 can calculate the acceleration from the capacitance change between the first bonding wire 310 and the second bonding wire 320 generated according to the movement of the circuit board. The acceleration calculation process of the specific processor 400 will be described later with reference to FIG.

3 is a block diagram illustrating a detailed configuration of a processor according to an embodiment of the present invention.

3, the processor 400 includes a detector 410, a distance calculator 420, and an acceleration determiner 430.

The detecting unit 410 detects a variation amount of the first bonding wire 310 and the second bonding wire 320 with respect to a reference capacitance. Specifically, the first bonding wire 310 and the second bonding wire 320 are spaced apart from each other by a predetermined distance, and both ends of the first bonding wire 310 and the second bonding wire 320 are connected to the first and second bonding pad portions 210 and 220, respectively. Value. However, when the circuit board 100 moves, the capacitance between the first bonding wire 310 and the second bonding wire 320 is increased due to a difference in distance between the first bonding wire 310 and the second bonding wire 320. [ A change occurs. At this time, the detecting unit 410 detects a change amount of the capacitance between the first bonding wire 310 and the second bonding wire 320.

The distance calculating unit 420 may calculate a change in distance between the first bonding wire 310 and the second bonding wire 320 based on the amount of change in capacitance between the first bonding wire 310 and the second bonding wire 320 have. In this case, the distance calculating unit 420 can calculate the distance variation value corresponding to the variation amount of the capacitance detected using the pre-stored look-up table.

The acceleration determining unit 430 may calculate an acceleration from a change in distance between the first bonding wire 310 and the second bonding wire 320. Specifically, the acceleration g can be expressed by the following equation (1).

Figure 112016022788200-pat00001

here,

Figure 112016022788200-pat00002
Is a distance change,
Figure 112016022788200-pat00003
Where R is the distance between the circuit board 100 and the bonding wires 310, 320 and 330, E is the Young's modulus, r is the density of the bonding wires 310, 320 and 330, 0.0 > 310, < / RTI >

The acceleration determining unit 430 can calculate the acceleration based on the density, the Young's modulus, the radius, and the distance from the circuit board 100 of the bonding wires 310, 320, and 330, as shown in Equation (1). The density, Young's modulus and radius of the bonding wires 310, 320 and 330 and the distance from the circuit board 100 are stored in the external device and provided to the acceleration sensor device 1000 or the acceleration sensor device 1000 is connected to the bonding wire 310, 320, 330), the density, the Young's modulus, the radius, and the distance from the circuit board 100 are stored. The density, Young's modulus, and radius of the bonding wires 310, 320, and 330 and the distance from the circuit board 100 may be detected or set by the acceleration sensor device 1000 and stored in the internal memory.

The detecting unit 410 may detect a variation in the reference capacitance between the second bonding wire 320 and the third bonding wire 330 and the distance calculating unit 420 may detect the amount of change in the second bonding wire 320 and the third bonding wire 330, The change in distance between the second bonding wire 320 and the third bonding wire 330 can be calculated from the change amount with respect to the reference capacitance between the bonding wires 330.

Thereafter, the acceleration sensor device 430 changes the distance between the second bonding wire 320 and the third bonding wire 330 and the density of the second bonding wire 320 and the third bonding wire 330, 100, the Young's modulus, and the radius.

4 is a view for explaining a case where one end of a bonding wire according to an embodiment of the present invention is bonded to a bonding pad portion.

4, one end of the first bonding wire 310 is connected to the bonding pad 211 of the first bonding pad unit 210 and the other end of the first bonding wire 310 is connected to the bonding pad 221 of the second bonding pad unit 220 . The second bonding wire 320 has one end connected to the bonding pad 212 of the first bonding pad portion 210 and the other end connected to the bonding pad 221 of the second bonding pad portion 220 in a detachable manner . As shown in FIG. 4, the second bonding wires 320 are detachably connected, and may be separated or connected to the bonding pads 211 in some cases. Particularly, when the second bonding wire 320 is separated from the bonding pad 211, a change in the distance of the second bonding wire 320 due to the movement of the circuit board 100 may be larger than that when the second bonding wire 320 is connected .

As a result, a difference in the distance between the first bonding wire 310 and the second bonding wire 320 is increased due to the movement of the circuit board 100, so that the first bonding wire 310 and the second bonding wire 320, The acceleration can be easily calculated from the capacitance change between the capacitor 320 and the capacitor 320.

5 is a flowchart illustrating an acceleration sensing method according to an embodiment of the present invention.

According to the acceleration sensing method shown in FIG. 5, first, a variation amount of the first and second bonding wires relative to a reference capacitance generated according to movement of the circuit board is detected (S510). Here, the first and second bonding wires may be different in either density or Young's modulus. In addition, the first and second bonding wires may be separated from each other by a distance different from the circuit board, and may be connected to the bonding pad portion. Further, the first and second bonding wires may each be a wire having a different radius.

Subsequently, a change in the distance between the first and second bonding wires is calculated from the amount of capacitance change (S520). Specifically, the distance change corresponding to the amount of capacitance change can be calculated using the pre-stored look-up table.

Next, the acceleration is calculated from the distance change between the first and second bonding wires (S530). In this case, the acceleration can be calculated using at least one of the distance between the first and second bonding wires, the density of the first and second bonding wires, the distance from the circuit board, the radius, and the Young's modulus.

Then, the calculated acceleration is outputted (S540). The acceleration outputted here may be a value obtained by converting the acceleration calculated from the distance change into a digital value.

The embodiment of the present invention described above can be applied to the unidirectional direction according to the configuration of the bonding wires 310, 320, and 330. However, a plurality of the same acceleration sensor devices are provided to sense accelerations in three or more axes directions May be used. Therefore, the present invention can be easily applied to acceleration sensors having various schemes and various axes.

According to various embodiments of the present invention as described above, since the MEMS process is not required in the production process of the acceleration sensor device, the manufacturing cost can be reduced, and the power consumption of the acceleration sensor device can be reduced.

Meanwhile, the method according to various embodiments of the present invention described above may be implemented in program code and provided to each server or devices in a state stored in various non-transitory computer readable media.

A non-transitory readable medium is a medium that stores data for a short period of time, such as a register, cache, memory, etc., but semi-permanently stores data and is readable by the apparatus. In particular, the various applications or programs described above may be stored on non-volatile readable media such as CD, DVD, hard disk, Blu-ray disk, USB, memory card, ROM,

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It should be understood that various modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention.

1000: Acceleration sensor device
100: circuit board
210: first bonding pad portion
220: second bonding pad portion
310: first bonding wire
320: second bonding wire
330: third bonding wire
400: processor

Claims (12)

A circuit board;
First and second bonding pad portions symmetrically formed on one surface of the circuit board;
First and second bonding wires having opposite ends connected to the first and second bonding pad portions; And
And a processor for calculating an acceleration from a change in capacitance between the first and second bonding wires caused by movement of the circuit board,
The first and second bonding wires are electrically connected to each other,
Wherein at least one of density and Young's modulus is different from each other.
The method according to claim 1,
The processor comprising:
A detection unit for detecting a change amount with respect to a reference capacitance between the first and second bonding wires;
A distance calculating unit for calculating a distance change between the first and second bonding wires from a change amount with respect to the reference capacitance; And
And an acceleration determining unit for calculating an acceleration from the distance change.
3. The method of claim 2,
The distance calculating unit calculates,
And calculates the change in distance between the first and second bonding wires from the capacitance change according to at least one of density, Young's modulus and radius of the first and second bonding wires.
delete The method according to claim 1,
Further comprising a third bonding wire having the same material properties as the first bonding wire and having both ends connected to the first and second bonding pad portions,
And the third bonding wire is formed such that the second bonding wire is disposed between the first bonding wire and the third bonding wire.
The method according to claim 1,
Wherein the first bonding wire is spaced apart from the circuit board by a first distance and is connected to the first and second bonding pad portions,
The upper second bonding wire is separated from the circuit board by a second distance and is connected to the first and second bonding pad portions,
Wherein the first distance and the second distance are different.
The method according to claim 1,
Wherein the first bonding wire is a wire having a radius of a first size,
Wherein the second bonding wire is a wire having a radius of a second size,
Wherein the first magnitude and the second magnitude are different.
The method according to claim 1,
Wherein the first bonding wire has one end connected to the first bonding pad portion and the other end connected to the second bonding pad portion,
Wherein the second bonding wire has one end connected to the first bonding pad portion and the other end detachably connected to the second bonding pad portion.
An acceleration sensor device, comprising: a circuit board; first and second bonding pad portions symmetrically formed on one surface of the circuit board; and first and second bonding wires connected to the first and second bonding pad portions, The acceleration sensing method comprising:
And computing an acceleration from a capacitance change between the first and second bonding wires caused by movement of the circuit board,
The first and second bonding wires are electrically connected to each other,
Wherein at least one of density and Young's modulus is different from each other.
10. The method of claim 9,
Wherein the calculating comprises:
Detecting a change amount with respect to a reference capacitance between the first and second bonding wires;
Calculating a change in distance between the first and second bonding wires from a change amount with respect to the reference capacitance; And
And calculating an acceleration from the distance change.
11. The method of claim 10,
Calculating the acceleration from the distance change comprises:
Wherein the change in distance between the first and second bonding wires from the capacitance change is calculated according to at least one of a density, a Young's modulus and a radius of the first and second bonding wires.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110049505A1 (en) * 2009-08-31 2011-03-03 Johannes Grabowski Devices and method for manufacturing a device
JP2012122772A (en) 2010-12-06 2012-06-28 Rohm Co Ltd Mems sensor, manufacturing method thereof and mems package

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110049505A1 (en) * 2009-08-31 2011-03-03 Johannes Grabowski Devices and method for manufacturing a device
JP2012122772A (en) 2010-12-06 2012-06-28 Rohm Co Ltd Mems sensor, manufacturing method thereof and mems package

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