KR101796098B1 - 열관리 - Google Patents

열관리 Download PDF

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Publication number
KR101796098B1
KR101796098B1 KR1020127021693A KR20127021693A KR101796098B1 KR 101796098 B1 KR101796098 B1 KR 101796098B1 KR 1020127021693 A KR1020127021693 A KR 1020127021693A KR 20127021693 A KR20127021693 A KR 20127021693A KR 101796098 B1 KR101796098 B1 KR 101796098B1
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KR
South Korea
Prior art keywords
thermal
transmission line
conductors
conductor
internal
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Expired - Fee Related
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KR1020127021693A
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English (en)
Korean (ko)
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KR20120138750A (ko
Inventor
케네쓰 벤힐
데이비드 셰어
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누보트로닉스, 인크.
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Publication of KR20120138750A publication Critical patent/KR20120138750A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/30—Auxiliary devices for compensation of, or protection against, temperature or moisture effects ; for improving power handling capability
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/005—Manufacturing coaxial lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/06—Coaxial lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/10—Wire waveguides, i.e. with a single solid longitudinal conductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Waveguides (AREA)
  • Communication Cables (AREA)
KR1020127021693A 2010-01-22 2011-01-22 열관리 Expired - Fee Related KR101796098B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29771510P 2010-01-22 2010-01-22
US61/297,715 2010-01-22
PCT/US2011/022173 WO2011091334A2 (en) 2010-01-22 2011-01-22 Thermal management

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020177031855A Division KR101917052B1 (ko) 2010-01-22 2011-01-22 열관리

Publications (2)

Publication Number Publication Date
KR20120138750A KR20120138750A (ko) 2012-12-26
KR101796098B1 true KR101796098B1 (ko) 2017-11-10

Family

ID=44307629

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020127021693A Expired - Fee Related KR101796098B1 (ko) 2010-01-22 2011-01-22 열관리
KR1020177031855A Expired - Fee Related KR101917052B1 (ko) 2010-01-22 2011-01-22 열관리

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020177031855A Expired - Fee Related KR101917052B1 (ko) 2010-01-22 2011-01-22 열관리

Country Status (5)

Country Link
US (1) US8717124B2 (https=)
EP (1) EP2524413B1 (https=)
JP (1) JP5639194B2 (https=)
KR (2) KR101796098B1 (https=)
WO (1) WO2011091334A2 (https=)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004079795A2 (en) 2003-03-04 2004-09-16 Rohm And Haas Electronic Materials, L.L.C. Coaxial waveguide microstructures and methods of formation thereof
CN101274734A (zh) 2006-12-30 2008-10-01 罗门哈斯电子材料有限公司 三维微结构及其形成方法
EP3104450A3 (en) 2007-03-20 2016-12-28 Nuvotronics, LLC Integrated electronic components and methods of formation thereof
US7898356B2 (en) 2007-03-20 2011-03-01 Nuvotronics, Llc Coaxial transmission line microstructures and methods of formation thereof
JP5616338B2 (ja) * 2008-07-07 2014-10-29 キルダル アンテナ コンサルティング アクティエボラーグ 平行な伝導表面間のギャップにおける導波管と伝送ライン
US8659371B2 (en) * 2009-03-03 2014-02-25 Bae Systems Information And Electronic Systems Integration Inc. Three-dimensional matrix structure for defining a coaxial transmission line channel
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
US8917150B2 (en) 2010-01-22 2014-12-23 Nuvotronics, Llc Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels
JP5639194B2 (ja) 2010-01-22 2014-12-10 ヌボトロニクス，エルエルシー 熱制御
US8866300B1 (en) 2011-06-05 2014-10-21 Nuvotronics, Llc Devices and methods for solder flow control in three-dimensional microstructures
US8814601B1 (en) 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
KR101982887B1 (ko) 2011-07-13 2019-05-27 누보트로닉스, 인크. 전자 및 기계 구조체들을 제조하는 방법들
US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
WO2015109208A2 (en) 2014-01-17 2015-07-23 Nuvotronics, Llc Wafer scale test interface unit: low loss and high isolation devices and methods for high speed and high density mixed signal interconnects and contactors
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
US10511073B2 (en) 2014-12-03 2019-12-17 Cubic Corporation Systems and methods for manufacturing stacked circuits and transmission lines
US9478494B1 (en) 2015-05-12 2016-10-25 Harris Corporation Digital data device interconnects
US9472365B1 (en) * 2015-05-19 2016-10-18 Lear Corporation Relay system having dual relays configured as heat sinks for one another
US9437911B1 (en) 2015-05-21 2016-09-06 Harris Corporation Compliant high speed interconnects
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
US11367948B2 (en) 2019-09-09 2022-06-21 Cubic Corporation Multi-element antenna conformed to a conical surface
US11757166B2 (en) 2020-11-10 2023-09-12 Aptiv Technologies Limited Surface-mount waveguide for vertical transitions of a printed circuit board
US11749883B2 (en) 2020-12-18 2023-09-05 Aptiv Technologies Limited Waveguide with radiation slots and parasitic elements for asymmetrical coverage
US11901601B2 (en) 2020-12-18 2024-02-13 Aptiv Technologies Limited Waveguide with a zigzag for suppressing grating lobes
US11444364B2 (en) 2020-12-22 2022-09-13 Aptiv Technologies Limited Folded waveguide for antenna
US12058804B2 (en) 2021-02-09 2024-08-06 Aptiv Technologies AG Formed waveguide antennas of a radar assembly
US11616306B2 (en) 2021-03-22 2023-03-28 Aptiv Technologies Limited Apparatus, method and system comprising an air waveguide antenna having a single layer material with air channels therein which is interfaced with a circuit board
EP4084222A1 (en) 2021-04-30 2022-11-02 Aptiv Technologies Limited Dielectric loaded waveguide for low loss signal distributions and small form factor antennas
US11962085B2 (en) 2021-05-13 2024-04-16 Aptiv Technologies AG Two-part folded waveguide having a sinusoidal shape channel including horn shape radiating slots formed therein which are spaced apart by one-half wavelength
US11616282B2 (en) 2021-08-03 2023-03-28 Aptiv Technologies Limited Transition between a single-ended port and differential ports having stubs that match with input impedances of the single-ended and differential ports
US12224502B2 (en) 2021-10-14 2025-02-11 Aptiv Technologies AG Antenna-to-printed circuit board transition
US12456816B2 (en) 2022-05-02 2025-10-28 Aptiv Technologies AG Waveguide with slot antennas and reflectors
US12265172B2 (en) 2022-05-25 2025-04-01 Aptiv Technologies AG Vertical microstrip-to-waveguide transition
US12424767B2 (en) 2022-11-15 2025-09-23 Aptiv Technologies AG Planar surface features for waveguide and antenna
US12537308B2 (en) 2023-01-24 2026-01-27 Aptiv Technologies AG Symmetrical two-piece waveguide
US12148992B2 (en) 2023-01-25 2024-11-19 Aptiv Technologies AG Hybrid horn waveguide antenna
US12506272B2 (en) 2023-05-16 2025-12-23 Aptiv Technologies AG Production-tolerant multi-part antenna system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002533954A (ja) * 1998-12-28 2002-10-08 テレポス・インコーポレーテッド 同軸構造の信号線及びその製造方法
JP2008306701A (ja) * 2007-03-20 2008-12-18 Rohm & Haas Electronic Materials Llc 集積電子部品およびその形成方法

Family Cites Families (153)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2812501A (en) 1954-03-04 1957-11-05 Sanders Associates Inc Transmission line
US2914766A (en) 1955-06-06 1959-11-24 Sanders Associates Inc Three conductor planar antenna
US2997519A (en) 1959-10-08 1961-08-22 Bell Telephone Labor Inc Multicoaxial line cables
US3335489A (en) 1962-09-24 1967-08-15 North American Aviation Inc Interconnecting circuits with a gallium and indium eutectic
US3311966A (en) 1962-09-24 1967-04-04 North American Aviation Inc Method of fabricating multilayer printed-wiring boards
US3352730A (en) 1964-08-24 1967-11-14 Sanders Associates Inc Method of making multilayer circuit boards
US3309632A (en) 1965-04-13 1967-03-14 Kollmorgen Corp Microwave contactless coaxial connector
US3464855A (en) 1966-09-06 1969-09-02 North American Rockwell Process for forming interconnections in a multilayer circuit board
FR1573432A (https=) 1967-07-06 1969-07-04
DE2020173C3 (de) 1970-04-24 1981-01-08 Spinner-Gmbh Elektrotechnische Fabrik, 8000 Muenchen Isolierstützenanordnung in Koaxialleitungen
US3775844A (en) 1970-06-25 1973-12-04 Bunker Ramo Method of fabricating a multiwafer electrical circuit structure
US3791858A (en) 1971-12-13 1974-02-12 Ibm Method of forming multi-layer circuit panels
DE7221114U (de) 1972-06-06 1972-10-19 Felten & Guilleaume Kabelwerk Luftraumisoliertes koaxiales H.F.Kabel mit gewellten Leitern und einzelnen auf dem Innenleiter angeordneten Abstandhaltern aus Kunststoff
US3963999A (en) 1975-05-29 1976-06-15 The Furukawa Electric Co., Ltd. Ultra-high-frequency leaky coaxial cable
US4021789A (en) 1975-09-29 1977-05-03 International Business Machines Corporation Self-aligned integrated circuits
SE404863B (sv) 1975-12-17 1978-10-30 Perstorp Ab Forfarande vid framstellning av ett flerlagerkort
US4275944A (en) 1979-07-09 1981-06-30 Sochor Jerzy R Miniature connector receptacles employing contacts with bowed tines and parallel mounting arms
JPS5772721U (https=) 1980-10-20 1982-05-04
FR2496996A1 (fr) 1980-12-18 1982-06-25 Thomson Csf Ligne de transmission hyperfrequence, du type triplaque a air et ses utilisations
US4417393A (en) 1981-04-01 1983-11-29 General Electric Company Method of fabricating high density electronic circuits having very narrow conductors
US4365222A (en) 1981-04-06 1982-12-21 Bell Telephone Laboratories, Incorporated Stripline support assembly
US4348253A (en) 1981-11-12 1982-09-07 Rca Corporation Method for fabricating via holes in a semiconductor wafer
US4591411A (en) 1982-05-05 1986-05-27 Hughes Aircraft Company Method for forming a high density printed wiring board
US4663497A (en) 1982-05-05 1987-05-05 Hughes Aircraft Company High density printed wiring board
US4521755A (en) 1982-06-14 1985-06-04 At&T Bell Laboratories Symmetrical low-loss suspended substrate stripline
US4641140A (en) 1983-09-26 1987-02-03 Harris Corporation Miniaturized microwave transmission link
US4581301A (en) 1984-04-10 1986-04-08 Michaelson Henry W Additive adhesive based process for the manufacture of printed circuit boards
US4876322A (en) 1984-08-10 1989-10-24 Siemens Aktiengesselschaft Irradiation cross-linkable thermostable polymer system, for microelectronic applications
US4673904A (en) 1984-11-14 1987-06-16 Itt Corporation Micro-coaxial substrate
US4700159A (en) 1985-03-29 1987-10-13 Weinschel Engineering Co., Inc. Support structure for coaxial transmission line using spaced dielectric balls
US4785805A (en) * 1985-05-28 1988-11-22 Surgical Laser Technologies, Inc. Two-piece disposable laser delivery system
DE3623093A1 (de) 1986-07-09 1988-01-21 Standard Elektrik Lorenz Ag Verfahren zur herstellung von durchverbindungen in leiterplatten oder multilayern mit anorganischen oder organisch-anorganischen isolierschichten
US5069749A (en) 1986-07-29 1991-12-03 Digital Equipment Corporation Method of fabricating interconnect layers on an integrated circuit chip using seed-grown conductors
US4771294A (en) 1986-09-10 1988-09-13 Harris Corporation Modular interface for monolithic millimeter wave antenna array
US4857418A (en) 1986-12-08 1989-08-15 Honeywell Inc. Resistive overlayer for magnetic films
FR2619253B1 (fr) 1987-08-03 1990-01-19 Aerospatiale Dispositif pour le raccord de deux structures pour hyperfrequences, coaxiales et de diametres differents
US4880684A (en) 1988-03-11 1989-11-14 International Business Machines Corporation Sealing and stress relief layers and use thereof
US4808273A (en) 1988-05-10 1989-02-28 Avantek, Inc. Method of forming completely metallized via holes in semiconductors
US4856184A (en) 1988-06-06 1989-08-15 Tektronix, Inc. Method of fabricating a circuit board
FR2640083B1 (fr) 1988-12-06 1991-05-03 Thomson Csf Support pour ligne de transmission hyperfrequence, notamment du type triplaque
US4969979A (en) 1989-05-08 1990-11-13 International Business Machines Corporation Direct electroplating of through holes
US5100501A (en) 1989-06-30 1992-03-31 Texas Instruments Incorporated Process for selectively depositing a metal in vias and contacts by using a sacrificial layer
US4975142A (en) 1989-11-07 1990-12-04 General Electric Company Fabrication method for printed circuit board
JP3027587B2 (ja) 1989-11-07 2000-04-04 株式会社リコー ファクシミリ装置
GB2249862B (en) 1990-10-01 1994-08-17 Asahi Optical Co Ltd Device and method for retrieving audio signals
EP0485831A1 (de) 1990-11-13 1992-05-20 F. Hoffmann-La Roche Ag Automatisches Analysengerät
US5406235A (en) 1990-12-26 1995-04-11 Tdk Corporation High frequency device
US5119049A (en) 1991-04-12 1992-06-02 Ail Systems, Inc. Ultraminiature low loss coaxial delay line
US5381157A (en) 1991-05-02 1995-01-10 Sumitomo Electric Industries, Ltd. Monolithic microwave integrated circuit receiving device having a space between antenna element and substrate
US5227013A (en) 1991-07-25 1993-07-13 Microelectronics And Computer Technology Corporation Forming via holes in a multilevel substrate in a single step
US5334956A (en) 1992-03-30 1994-08-02 Motorola, Inc. Coaxial cable having an impedance matched terminating end
US5430257A (en) 1992-08-12 1995-07-04 Trw Inc. Low stress waveguide window/feedthrough assembly
US5363550A (en) * 1992-12-23 1994-11-15 International Business Machines Corporation Method of Fabricating a micro-coaxial wiring structure
WO1994018812A1 (en) 1993-02-02 1994-08-18 Ast Research, Inc. A circuit board arrangement including shielding grids, and constructing thereof
US5454161A (en) 1993-04-29 1995-10-03 Fujitsu Limited Through hole interconnect substrate fabrication process
NL9400165A (nl) 1994-02-03 1995-09-01 Hollandse Signaalapparaten Bv Transmissielijnnetwerk.
JPH07235803A (ja) * 1994-02-25 1995-09-05 Nec Corp 同軸形高電力用低域フィルタ
US5466972A (en) 1994-05-09 1995-11-14 At&T Corp. Metallization for polymer-dielectric multichip modules including a Ti/Pd alloy layer
JP3587884B2 (ja) 1994-07-21 2004-11-10 富士通株式会社 多層回路基板の製造方法
DE69627235T2 (de) * 1995-02-24 2003-12-04 Sumitomo Wiring Systems, Ltd. Strahlender Draht
US5682062A (en) 1995-06-05 1997-10-28 Harris Corporation System for interconnecting stacked integrated circuits
US5814889A (en) 1995-06-05 1998-09-29 Harris Corporation Intergrated circuit with coaxial isolation and method
US5633615A (en) 1995-12-26 1997-05-27 Hughes Electronics Vertical right angle solderless interconnects from suspended stripline to three-wire lines on MIC substrates
KR100216839B1 (ko) 1996-04-01 1999-09-01 김규현 Bga 반도체 패키지의 솔더 볼 랜드 메탈 구조
US5712607A (en) 1996-04-12 1998-01-27 Dittmer; Timothy W. Air-dielectric stripline
US5793272A (en) 1996-08-23 1998-08-11 International Business Machines Corporation Integrated circuit toroidal inductor
TW380772U (en) 1996-09-26 2000-01-21 Hon Hai Prec Ind Co Ltd Miniature connector
JP3218996B2 (ja) 1996-11-28 2001-10-15 松下電器産業株式会社 ミリ波導波路
US5860812A (en) 1997-01-23 1999-01-19 Litton Systems, Inc. One piece molded RF/microwave coaxial connector
JP3269827B2 (ja) 1997-04-04 2002-04-02 ユニバーシティ・オブ・サザン・カリフォルニア 電気化学製造のための物品、方法、および装置
JP3346263B2 (ja) 1997-04-11 2002-11-18 イビデン株式会社 プリント配線板及びその製造方法
US5925206A (en) 1997-04-21 1999-07-20 International Business Machines Corporation Practical method to make blind vias in circuit boards and other substrates
US6180261B1 (en) 1997-10-21 2001-01-30 Nitto Denko Corporation Low thermal expansion circuit board and multilayer wiring circuit board
US6724958B1 (en) * 1998-01-23 2004-04-20 Science & Engineering Associates, Inc. Handheld laser system emitting visible non-visible radiation
US6324754B1 (en) 1998-03-25 2001-12-04 Tessera, Inc. Method for fabricating microelectronic assemblies
US6213998B1 (en) * 1998-04-02 2001-04-10 Vanderbilt University Laser surgical cutting probe and system
US6008102A (en) 1998-04-09 1999-12-28 Motorola, Inc. Method of forming a three-dimensional integrated inductor
US5977842A (en) 1998-07-01 1999-11-02 Raytheon Company High power broadband coaxial balun
KR20000011585A (ko) 1998-07-28 2000-02-25 윤덕용 반도체소자및그제조방법
US6514845B1 (en) 1998-10-15 2003-02-04 Texas Instruments Incorporated Solder ball contact and method
US6045973A (en) 1998-12-11 2000-04-04 Morton International, Inc. Photoimageable compositions having improved chemical resistance and stripping ability
US6388198B1 (en) 1999-03-09 2002-05-14 International Business Machines Corporation Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality
US6294965B1 (en) 1999-03-11 2001-09-25 Anaren Microwave, Inc. Stripline balun
JP2000286549A (ja) 1999-03-24 2000-10-13 Fujitsu Ltd バイアコネクションを備えた基板の製造方法
US6210221B1 (en) 1999-10-13 2001-04-03 Maury Microwave, Inc. Microwave quick connect/disconnect coaxial connectors
DE60109339T2 (de) 2000-03-24 2006-01-12 Texas Instruments Incorporated, Dallas Verfahren zum Drahtbonden
US6535088B1 (en) 2000-04-13 2003-03-18 Raytheon Company Suspended transmission line and method
JP4023076B2 (ja) 2000-07-27 2007-12-19 富士通株式会社 表裏導通基板及びその製造方法
US6851869B2 (en) * 2000-08-04 2005-02-08 Cool Options, Inc. Highly thermally conductive electronic connector
US6350633B1 (en) 2000-08-22 2002-02-26 Charles W. C. Lin Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint
US6589594B1 (en) 2000-08-31 2003-07-08 Micron Technology, Inc. Method for filling a wafer through-via with a conductive material
US6600395B1 (en) 2000-12-28 2003-07-29 Nortel Networks Limited Embedded shielded stripline (ESS) structure using air channels within the ESS structure
US6603376B1 (en) 2000-12-28 2003-08-05 Nortel Networks Limited Suspended stripline structures to reduce skin effect and dielectric loss to provide low loss transmission of signals with high data rates or high frequencies
CN1209321C (zh) 2001-02-08 2005-07-06 住友电气工业株式会社 多孔性陶瓷及其制造方法,以及微波传输带基片
US6722197B2 (en) 2001-06-19 2004-04-20 Honeywell International Inc. Coupled micromachined structure
JP2003032007A (ja) * 2001-07-19 2003-01-31 Nippon Dengyo Kosaku Co Ltd 同軸給電管
US6749737B2 (en) 2001-08-10 2004-06-15 Unimicron Taiwan Corp. Method of fabricating inter-layer solid conductive rods
US6457979B1 (en) 2001-10-29 2002-10-01 Agilent Technologies, Inc. Shielded attachment of coaxial RF connector to thick film integrally shielded transmission line on a substrate
US7252861B2 (en) 2002-05-07 2007-08-07 Microfabrica Inc. Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids
AU2002360464A1 (en) 2001-12-03 2003-06-17 Memgen Corporation Miniature rf and microwave components and methods for fabricating such components
US7239219B2 (en) 2001-12-03 2007-07-03 Microfabrica Inc. Miniature RF and microwave components and methods for fabricating such components
US6710680B2 (en) 2001-12-20 2004-03-23 Motorola, Inc. Reduced size, low loss MEMS torsional hinges and MEMS resonators employing such hinges
US6648653B2 (en) 2002-01-04 2003-11-18 Insert Enterprise Co., Ltd. Super mini coaxial microwave connector
JP3969523B2 (ja) * 2002-02-25 2007-09-05 独立行政法人産業技術総合研究所 プリント配線基板の製造方法
US20030221968A1 (en) 2002-03-13 2003-12-04 Memgen Corporation Electrochemical fabrication method and apparatus for producing three-dimensional structures having improved surface finish
CN100567581C (zh) 2002-05-07 2009-12-09 微制造公司 电化学制造结构的多步释放方法
JP2005532015A (ja) 2002-06-27 2005-10-20 マイクロファブリカ インク 小型のｒｆおよびマイクロ波の構成要素とそのような構成要素を製造するための方法
US6696666B2 (en) 2002-07-03 2004-02-24 Scimed Life Systems, Inc. Tubular cutting process and system
TW200405363A (en) 2002-08-06 2004-04-01 Ube Nitto Kasei Co Thin-diameter coaxial cable and method of producing the same
US6827608B2 (en) 2002-08-22 2004-12-07 Corning Gilbert Inc. High frequency, blind mate, coaxial interconnect
US6992544B2 (en) 2002-10-10 2006-01-31 Agilent Technologies, Inc. Shielded surface mount coaxial connector
US20050250253A1 (en) 2002-10-23 2005-11-10 Cheung Kin P Processes for hermetically packaging wafer level microscopic structures
US6733324B1 (en) * 2002-12-06 2004-05-11 Com Dev Ltd. Coaxial heat sink connector
US6888427B2 (en) 2003-01-13 2005-05-03 Xandex, Inc. Flex-circuit-based high speed transmission line
WO2004079795A2 (en) 2003-03-04 2004-09-16 Rohm And Haas Electronic Materials, L.L.C. Coaxial waveguide microstructures and methods of formation thereof
US7288723B2 (en) 2003-04-02 2007-10-30 Sun Microsystems, Inc. Circuit board including isolated signal transmission channels
WO2004101856A2 (en) 2003-05-07 2004-11-25 Microfabrica Inc. Methods for electrochemically fabricating structures using adhered masks, incorporating dielectric sheets, and/or seed layers that are partially removed via planarization
US7145414B2 (en) 2003-06-30 2006-12-05 Endwave Corporation Transmission line orientation transition
TWI234258B (en) 2003-08-01 2005-06-11 Advanced Semiconductor Eng Substrate with reinforced structure of contact pad
EP1517166B1 (en) 2003-09-15 2015-10-21 Nuvotronics, LLC Device package and methods for the fabrication and testing thereof
KR100538470B1 (ko) 2003-09-15 2005-12-23 한국과학기술원 유전체 박막을 이용한 동축선 구조의 전송선 시스템, 그제조 방법 및 그를 이용한 패키지 방법
KR100555680B1 (ko) 2003-12-17 2006-03-03 삼성전자주식회사 높이 단차를 가지는 금속 구조물의 제조방법
US20050156693A1 (en) 2004-01-20 2005-07-21 Dove Lewis R. Quasi-coax transmission lines
US7128604B2 (en) 2004-06-14 2006-10-31 Corning Gilbert Inc. High power coaxial interconnect
US6971913B1 (en) 2004-07-01 2005-12-06 Speed Tech Corp. Micro coaxial connector
TWI237886B (en) 2004-07-06 2005-08-11 Himax Tech Inc Bonding pad and chip structure
US7077697B2 (en) 2004-09-09 2006-07-18 Corning Gilbert Inc. Snap-in float-mount electrical connector
US7165974B2 (en) 2004-10-14 2007-01-23 Corning Gilbert Inc. Multiple-position push-on electrical connector
US7217156B2 (en) 2005-01-19 2007-05-15 Insert Enterprise Co., Ltd. RF microwave connector for telecommunication
US7615476B2 (en) 2005-06-30 2009-11-10 Intel Corporation Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
USD530674S1 (en) 2005-08-11 2006-10-24 Hon Hai Precision Ind. Co., Ltd. Micro coaxial connector
US7471052B2 (en) * 2005-08-23 2008-12-30 Jefferson Science Associates Cryogenic vacuumm RF feedthrough device
JP2007115771A (ja) 2005-10-18 2007-05-10 Nec System Technologies Ltd Ｌｓｉピン
US7658831B2 (en) 2005-12-21 2010-02-09 Formfactor, Inc Three dimensional microstructures and methods for making three dimensional microstructures
US7705238B2 (en) * 2006-05-22 2010-04-27 Andrew Llc Coaxial RF device thermally conductive polymer insulator and method of manufacture
US8147413B2 (en) * 2006-10-12 2012-04-03 Innoscion, Llc Image guided catheter having deployable balloons and pericardial access procedure
CN101274735B (zh) 2006-12-30 2012-11-21 罗门哈斯电子材料有限公司 三维微结构及其形成方法
CN101274734A (zh) 2006-12-30 2008-10-01 罗门哈斯电子材料有限公司 三维微结构及其形成方法
JP2008188754A (ja) 2006-12-30 2008-08-21 Rohm & Haas Electronic Materials Llc 三次元微細構造体およびその形成方法
JP2008211159A (ja) * 2007-01-30 2008-09-11 Kyocera Corp 配線基板およびそれを用いた電子装置
US7898356B2 (en) 2007-03-20 2011-03-01 Nuvotronics, Llc Coaxial transmission line microstructures and methods of formation thereof
US7920042B2 (en) 2007-09-10 2011-04-05 Enpirion, Inc. Micromagnetic device and method of forming the same
TWI358799B (en) 2007-11-26 2012-02-21 Unimicron Technology Corp Semiconductor package substrate and method of form
JP4506824B2 (ja) 2007-12-13 2010-07-21 富士ゼロックス株式会社 回収現像剤搬送装置および画像形成装置
US8242593B2 (en) 2008-01-27 2012-08-14 International Business Machines Corporation Clustered stacked vias for reliable electronic substrates
US7575474B1 (en) 2008-06-10 2009-08-18 Harris Corporation Surface mount right angle connector including strain relief and associated methods
EP2319134A1 (en) 2008-07-15 2011-05-11 Corning Gilbert Inc. Low-profile mounted push-on connector
TWI393490B (zh) 2008-12-31 2013-04-11 Ind Tech Res Inst 多組同軸導線於基材之單一通孔中之結構與其製作方法
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
JP5639194B2 (ja) 2010-01-22 2014-12-10 ヌボトロニクス，エルエルシー 熱制御
US8917150B2 (en) 2010-01-22 2014-12-23 Nuvotronics, Llc Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels
TWM389380U (en) 2010-05-19 2010-09-21 Advanced Connectek Inc Miniature high frequency plug connector
US8786515B2 (en) 2011-08-30 2014-07-22 Harris Corporation Phased array antenna module and method of making same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002533954A (ja) * 1998-12-28 2002-10-08 テレポス・インコーポレーテッド 同軸構造の信号線及びその製造方法
JP2008306701A (ja) * 2007-03-20 2008-12-18 Rohm & Haas Electronic Materials Llc 集積電子部品およびその形成方法

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