KR101698166B1 - A method of forming a fluororesin layer on the pipe and the devices - Google Patents

Abstract

The present invention relates to a method and apparatus for forming a fluororesin layer of a pipe for semiconductor equipment, in which a fluororesin layer inside a pipe for semiconductor equipment is formed to be straight and a special element which may obstruct a flow of fluid is not formed, with the result that a high-quality pipe can be obtained and, particularly, productivity can be increased, thereby providing an economic benefit. The method for forming a fluororesin layer of a pipe for semiconductor equipment comprises: a film formation step (S100) of forming a ring-shaped film in which a diameter of an outer circumferential surface thereof is the same as an outer diameter of a flange provided at an end of a straight pipe and a diameter of an inner circumferential surface thereof is the same as an inner diameter in a state where a fluororesin layer has been formed on an inner circumferential surface of the straight pipe; a film fastening step (S200) of fastening the film, which has been obtained via the film formation step (S100), onto a jig rotatable around an axis; a straight pipe fastening step (S300) of fastening the flange of the straight pipe onto the jig, onto which the film has been fastened via the film fastening step (S200), so that the flange of the straight pipe appropriately comes into close contact with the film; a fluororesin powder coating step (S400) of applying fluororesin powder onto an inside of the straight pipe which has been fastened onto the jig via the straight pipe fastening step (S300); and a plastic hardening step (S500) of, once the application of the fluororesin powder onto the inside of the straight pipe has been completed via the fluororesin powder coating step (S400), performing plastic hardening of the fluororesin powder and the film inside the straight pipe by rotating the straight pipe through rotation of the jig and providing an environment in which fluororesin can be subjected to plastic hardening.

Description

TECHNICAL FIELD [0001] The present invention relates to a method of forming a fluororesin layer of a pipe for a semiconductor device,

The present invention relates to a molding method in which a fluororesin layer is coated on an inner circumferential surface of a pipe to be applied to a semiconductor facility and a molding apparatus thereof and more particularly to a molding method in which a fluororesin layer formed in a pipe is formed linearly The present invention relates to a method of forming a fluororesin layer of a piping for a semiconductor device and a molding apparatus for the same which are capable of obtaining a high quality piping without forming a spatial element that interferes with the flow of the fluid, .

Generally, in the semiconductor manufacturing process and the LCD manufacturing process, gas piping for various gas supply facilities for supplying stable and safe various kinds of reaction gases in a certain quality state to a process chamber in a clean room section is essential Respectively.

Typically, the gas supplied through the gas supply facility of the semiconductor and LCD manufacturing processes includes a generic gas called the "bulk gas" and a special material gas called the "process gas".

For example, the bulk gas is predominantly a common gas that is consumed in a relatively large amount, such as dry air, nitrogen, oxygen, hydrogen, argon, helium, etc., and the process gas is a gas such as monosilane, phosphine, nitrogen trifluoride, Special material gas is dominant.

Particularly, in the case of the process gas, unreacted gas and subsidiary gas are discharged. Therefore, toxicity, corrosiveness and flammability are very strong, so that a harmful gas such as a vacuum pump or an exhaust gas treatment device (scrubber) It must be purified into a harmless state and released into the atmosphere.

Therefore, the gas supply facilities of the semiconductor and LCD manufacturing processes require special piping facilities with sufficient cleanliness, corrosion resistance and strength to prevent contamination and leakage while maintaining the high purity of the gas while reaching the process equipment.

Such piping facilities are selected in consideration of quality, stability, maintenance, and economical efficiency. In general, stainless steel pipes having excellent corrosion resistance due to toxicity and corrosiveness of exhaust gas are mainly used.

However, the process exhaust gas of the semiconductor and LCD manufacturing process contains a large amount of reaction products and fine particles such as dust, so that the exhaust gas is rapidly powdered due to external temperature change during the process of moving to the vacuum pump or the exhaust gas treatment device, And is immersed or adhered to the inside.

In order to minimize this phenomenon, the pipe of the process gas which is more toxic and corrosive than the general gas has a special coating layer such as 'fluorine resin layer' called Teflon on the inner circumferential surface for protecting the surface of the stainless steel pipe Is generally used.

When the pipe having the fluororesin layer coated on the inner circumferential surface is molded as described above, the fluororesin powder is rotated in a state of being deposited in the pipe to form a uniform coating layer, and at the same time, And a method in which a fluorine resin tube made of a fluorine resin is fixed inside the pipe to form a double pipe structure can be applied.

 Korean Patent Registration No. 10-0770315 entitled " Inner Diameter Coating Apparatus and Method for Small Diameter Piping "), and the above apparatus and method can be applied to a metal material having an arbitrary inner diameter A power supply means Guiding means provided on both sides of the material for guiding the conveyance of the powder; Electrostatic coating means connected to the guide means for spraying and spraying the powder as the adherend therein; A blowing means connected to the electrostatic painting means for providing blowing at an arbitrary pressure; Rotating means for driving the material so as to be rotatable by 360 degrees; And a thermosetting means for curing the powder deposited on the inner diameter by providing a heat source to the material; and a first step of supplying the powder to the electrostatic organs through the hopper; A second step of operating the compressor to supply a blowing force to the powder nozzle at an arbitrary pressure; A third step of placing the workpiece on a rotating device and connecting one side of the jig for a long period of electrostatic force; A fourth step of jetting the powdered powder to one of the jigs provided at both ends of the material having an arbitrary inner diameter from the electrostatic organs by using the wind power; And a fifth step of applying a power source to the material to induce positively charged powder and positive and negative charges to deposit the powder passing through the material on the inner surface of the material, After completion of the deposition, the material is rotated by 180 °, and the spraying process of the pre-charged powder in the fourth step and the charging step in the fifth step are re-executed. have.

In the Korean Patent Registration No. 10-1160509 entitled " Fluorine resin coating method for inner surface of piping for semiconductor manufacturing facility ", as is known in the art, a method for smoothing the welding surface of a pipe for a semiconductor manufacturing facility A process; An inner surface treatment step of spraying a gold stonewall on the inner surface of the pipe subjected to the above-mentioned finishing treatment; A foreign matter removing step of spraying air into the pipe twice or more times to remove foreign matters adhering to the pipe subjected to the internal surface treatment; A first heat treatment step of placing the pipeline from which the foreign substances have been removed in a closed heating device and performing heat treatment; A first coating step of coating the inner surface of the heat-treated pipe with a fluororesin; A second heat treatment step of placing the coated pipe in a closed heating device and performing heat treatment; A secondary coating step of coating the inner surface of the pipe subjected to the secondary heat treatment with a fluororesin; The secondary coated pipe is placed in a closed heating device having an internal temperature of 270 to 310 ° C. for 20 to 50 minutes to heat the pipe. The pipe is removed from the heating device, and the process of heat treatment and extraction is performed 4-5 times A repeating third heat treatment step; And a cooling step of air-cooling the heat-treated pipe, wherein the first heat treatment step is a method in which the internal temperature of the heating device is 150 to 200 DEG C and the heat treatment is performed for 5 to 10 minutes at the internal temperature, .

In addition, in Korean Patent Registration No. 10-1606204 (name: powder coating apparatus of piping), as known in the art, there are provided an installation plate in which a plurality of fixing grooves are formed, An embossing means having a base plate on which the seat plate is fixed, and a moving wheel provided on a lower portion of the base plate for driving; A plurality of spray nozzles having lengths adapted to spray a coating powder liquid into the pipe and spaced horizontally and spaced apart from each other, An injection means having a fixing plate for fixing the injection nozzles; A retractable motor which is adapted to generate a rotational force by being supplied with power so as to reciprocate forward and backward in a direction in which the fixing means is inserted and positioned; A forward / backward belt that is fixed on a part of the forward / backward belt and moves back and forth in a reciprocating manner and has a forward / backward plate on which the injection means is provided; A lifting and lowering belt for lifting and lowering the fixing plate in a vertical direction and generating a rotating force by receiving power, a lifting belt adapted to rotate in a direction of lifting and lowering of the fixing plate in response to the rotational force of the lifting motor, A lifting means having a lifting plate fixed on a part of the lifting belt and moving up and down and fixed on a part of the lifting plate; A horizontal motor which is reciprocated in the horizontal direction and which is adapted to generate a rotational force by being supplied with electric power, a horizontal belt which is rotated in the horizontal direction of the forward / And horizontally moving means including a horizontal plate fixed on a part of the horizontal belt and horizontally reciprocating and fixed on a part of the advancing and retreating means.

That is, the fluororesin powder is thermally fired in a state where the fluororesin powder is deposited inside the pipe to form a coating film.

On the other hand, in Korean Patent Laid-Open Publication No. 10-2016-0068682 (name: resin-equipped double pipe with excellent chemical resistance), as is known in the art, an outer appearance formed of a metal material, And an inner pipe made of a synthetic resin material, the inner pipe being joined to the inner circumferential surface of the flange portion to form a double layer structure, and bent portions extending respectively at both ends to surround the inner rim of the flange portion.

That is, since the outer tube and the inner tube are manufactured separately and then assembled separately, there is a problem in that the productivity is reduced and mass production is difficult, resulting in a non-economic problem.

In the method of forming the coating film by thermally firing the fluorine resin powder in the inside of the pipe as described above, when the flange is formed at both ends of the pipe, there is a problem .

Accordingly, in recent years, there have been proposed methods for forming a fluorine resin layer on a pipe inner wall having an inner circumferential surface of a straight pipe and a fluorine resin layer formed on the surface of the flange, the flange being formed at the end portion while improving productivity through plastic working.

1, the inside of the straight pipe 10 constituting the pipe and the surface of the flange 11 are tightly fixed to the outside, and the center of the straight pipe 10 is fixed by a separate rotating means, The fluororesin powder is thermally fired in a state where the fluororesin powder is uniformly adhered to the inner peripheral surface of the straight pipe 10 and the surface of the flange 11 by the inner side of the straight pipe There is a molding method in which a jig device 100 is formed and adapted to be molded.

1, Korean Patent Registration No. 10-0770315 2, Korean Patent Registration No. 10-1160509 3, Korean Patent Registration No. 10-1606204 4, Korean Patent Publication No. 10-2016-0068682

However, in the conventional method of forming a fluorine resin layer of a pipe and the apparatus of the present invention, the pipe to be molded is moved to a portion on the boundary line between the straight portion of the straight pipe 10 and the flange 11 by the centrifugal force, The bare minority layer 12 is formed with a round shape and constitutes a recess forming part when the fluid flows in the joint space between the pipe and the pipe as shown in FIG.

As a result, the fluid can not be smoothly transferred according to the resistance pressure formed inside the pipe, resulting in an unstable problem.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems of the prior art, and an object of the present invention is to provide a fluorine resin layer formed in a cost pipe for semiconductor equipment, The present invention is to provide a method for forming a fluorine resin layer of a piping for a semiconductor facility and a molding apparatus for the same which are capable of achieving economic benefits by increasing productivity.

According to another aspect of the present invention, there is provided a method for molding a fluorine resin layer of a piping for a semiconductor device, the method comprising the steps of coating a fluorine resin layer on an inner circumferential surface of a straight pipe having a flange at an end thereof, A method for forming a layer; Like film 2 having the same inner diameter as the diameter of the outer peripheral surface of the flange and the inner diameter of which is equal to the inner diameter of the fluorine resin layer 12 formed on the inner peripheral surface of the straight tube 10, Step SlOO; A film fixing step S200 of fixing the film to the jig provided rotatably through the film forming step S100; An intuitive fixing step S300 of fixing the flange of the straight pipe to the jig to which the film is fixed through the film fixing step (S200) such that the flange is closely contacted to the film; A fluorocarbon resin powder application step (S400) of applying fluoric resin powder inside the straight pipe fixed to the jig through the straight pipe fixing step (S300); When the application of the fluororesin powder into the straight pipe is completed through the fluororesin powder application step (S400), the straight pipe is rotated through the rotation of the jig, and an environment in which the fluororesin is heated and hardened is provided A plastic hardening step (S500) in which the fluororesin powder and the film are plastic-hardened inside the straight tube; And a post-treatment step (S600) of separating the straight pipe from the jig after the fluorine resin layer is coated and formed in the straight pipe through the firing and curing step (S500).

According to an aspect of the present invention, there is provided an apparatus for molding a fluorine resin layer of a piping for a semiconductor device, the apparatus comprising: a machine body; a motor adapted to generate a rotational force by receiving power; A pair of brackets arranged to be spaced apart from each other in a vertical direction in the machine body and rotatably fixed to the rotary shaft to which the jig is fixed at one end, And a power transmitting means for connecting a rotating shaft and an axis of the motor to transmit rotational force, the apparatus comprising: The jig includes a body having a ring-shaped coating made of a fluororesin material and having a receiving groove in which a flange of the straight pipe is received and fixed while being in close contact with the coating; The body is integrally formed with a fastening pipe formed with a through hole to which the rotation shaft is inserted and coupled.

The fluorine resin layer forming method and the molding apparatus of the piping for semiconductor equipment according to the present invention as described above are characterized in that when the fluorine resin layer to be formed in the pipe is molded, a separately formed film is attached to the flange of the straight pipe, A fluorine resin layer formed on the straight pipe and the flange is linearly formed so that a spatial element is formed which interrupts the flow of the fluid in the inside of the straight pipe because the end portion of the fluorine resin layer coated on the inner circumferential surface is linearly aligned with the inner circumferential surface of the film. It is possible to obtain a high-quality piping for semiconductor equipment.

In addition, since the work of molding the fluorine resin layer on the inner circumferential surface of the piping for the semiconductor equipment is performed by the rotary firing, the productivity is increased and the economical benefit is realized.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a schematic view showing a conventional method of forming a fluorine resin layer in a pipe; FIG.
2 is a schematic view showing a conventional pipe in which a fluororesin layer is formed;
3 is a schematic view showing a method of forming a fluorine resin layer of a piping for a semiconductor facility according to an embodiment of the present invention.
FIG. 4 and FIG. 5 are schematic views showing a pipe to be formed through a method of forming a fluorine resin layer of a pipe for semiconductor equipment according to an embodiment of the present invention. FIG.
6 is a schematic perspective view showing an apparatus for molding a fluorine resin layer of a piping for semiconductor equipment according to an embodiment of the present invention.
Fig. 7 is a schematic plan view showing a fluorine resin layer molding apparatus of a piping for a semiconductor facility according to this embodiment. Fig.
8 is a schematic frontal view showing a fluororesin layer forming apparatus of a piping for a semiconductor facility according to the present embodiment.
9 is a schematic side view showing an apparatus for molding a fluorine resin layer of a piping for a semiconductor facility according to the present embodiment.
10 is a schematic view showing a part of the fluorine resin layer molding apparatus of the piping for semiconductor equipment according to the present embodiment.
Fig. 11 and Fig. 12 are schematic explanatory schematic views showing a jig constituting the fluorine resin layer molding apparatus of the piping for semiconductor equipment according to the present embodiment. Fig.

Hereinafter, with reference to the accompanying drawings, a method of forming a fluorine resin layer and a molding apparatus of a piping for semiconductor equipment according to a preferred embodiment of the present invention will be described in detail.

The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the embodiments described in detail below. This embodiment is provided to more fully describe the present invention to those skilled in the art. Therefore, the shapes and the like of the elements in the drawings can be exaggeratedly expressed to emphasize a clearer description. It should be noted that in the drawings, the same members are denoted by the same reference numerals. Detailed descriptions of well-known functions and constructions which may be unnecessarily obscured by the gist of the present invention are omitted.

FIG. 3 is a view showing a method of forming a fluorine resin layer of a piping for semiconductor equipment according to an embodiment of the present invention. In the method of forming a fluorine resin layer of a pipe according to this embodiment, a flange 11 A fluorine resin layer 12 is coated on the inner circumferential surface of the straight pipe 10 to form a molded product. Particularly, a semiconductor device such as a piping of a process gas, which is more toxic and corrosive than general gas, It is applied to the manufacture of piping for facilities.

The diameter of the outer circumferential surface is equal to the diameter of the flange and the diameter of the inner circumferential surface is smaller than the diameter of the fluorine resin layer 12 formed on the inner circumferential surface of the straight pipe 10 according to the present embodiment (S100) for forming a ring-shaped coating film (2) having the same inner diameter as that of the ring-shaped coating film (2).

That is, the fluorine resin layer is formed on the surface of the flange 11 by fusing the coating 2 made of a fluororesin material to the flange 11 of the straight pipe 10 through a subsequent process.

When the film 2 is formed through the film forming step S100 as described above, the film 2 is fixed to the jig 3 (Step S200).

In addition, the flange 11 of the straight pipe 10 is fitted to the jig 3 to which the film 2 is fixed through the film fixing step S200 so that the flange 11 is brought into close contact with the film 2, The fixing step S300 is performed.

That is, the film 2 and the flange 11 of the straight pipe 10 are inserted and fixed in order to the jig 3 so that the flange 11 and the film 2 are brought into contact with each other , And fixes the center of the straight pipe (10) so as to coincide with the rotation center of the jig (3).

The method of forming a fluorine resin layer of a pipe for a semiconductor device according to the present embodiment as described above is characterized in that the jig 3 is fixed to the flange of the pipe 2 and the flange (S400) of applying a fluorine resin powder to the inside of the straight pipe 10 fixed to the jig 3 when the fixing roller 11 is fixed.

At this time, a suitable amount of the fluororesin powder may be applied to the inner circumferential surface of the straight pipe 10 according to the thickness of the fluororesin layer 12 to be formed.

Generally, the thickness of the fluororesin layer formed in the piping for semiconductor equipment is usually 2 mm or more, and accordingly, a proper amount of the fluororesin powder is charged. Usually, about 1 to 2 kg of the fluororesin powder is added. However, It is most preferable to apply it according to the user's choice.

When the fluororesin powder is applied to the inside of the straight pipe 10 through the fluororesin powder application step S400 as described above, the straight pipe 10 is rotated through the rotation of the jig 3, (S500) in which the fluororesin powder and the film (2) are fired and cured in the interior of the straight pipe (10) by applying an environment in which the resin is fired and cured.

At this time, the straight pipe 10 is rotated about the longitudinal direction of the straight pipe 10 about the longitudinal direction and rotated so that the centrifugal force is evenly distributed on the inner circumferential face of the straight pipe 10.

It is preferable that the fluororesin layer is baked and cured in a temperature environment of 20 to 30 ° C, which is the melting point of the fluororesin, for 1 to 2 hours, but the present invention is not limited thereto and is suitably applied according to the user's selection Most preferred.

In the method of forming a fluorine resin layer of a piping for a semiconductor device according to the present embodiment as described above, when the fluorine resin layer 12 is coated with the inside of the straight pipe 10 through the firing and curing step (S500) And a post-treatment step S600 for separating the straight pipe 10 from the jig 3 and then post-treating it.

That is, when a step is formed between the fluorine resin layer 12 coated on the inside of the straight pipe 10 and the coating 2, a process such as removal of the tip is performed to remove the step, The fluororesin layer 12 of high quality is formed by performing the process of securing the linearity of the resin layer 12.

As shown in FIGS. 4 and 5, the fluorine resin layer 12 is uniformly coated on a large number of pipes to perform a molding operation of a pipe for a semiconductor device having a linearity. .

The fluorine resin layer molding apparatus of the piping for semiconductor equipment according to the present invention in which the fluorine resin layer 12 is formed on the inner circumferential surface of the pipe by applying the fluorine resin layer forming method of the piping for semiconductor equipment according to this embodiment 1) will be described as follows.

6 to 12 are views showing an apparatus 1 for molding a fluorine resin layer according to an embodiment of the present invention. The apparatus 1 for molding a fluorine resin layer of a piping for a semiconductor equipment according to the present embodiment is a machine A jig 3 to be rotated by receiving the rotational force generated by the motor 5 and fixed to the end of the straight pipe 10, A pair of brackets 7 arranged at intervals in a vertical direction in the machine body 4 and rotatably fixed to a rotary shaft 6 to which the jig 3 is fixed at one end, And a power transmitting means (8) for connecting the rotating shaft (6) and the shaft of the motor (5) to transmit rotational force.

That is, the rotation force of the motor 5 is transmitted through the power transmitting member 8 in a state where the end of the straight pipe 10 and the flange 11 are fixed to the jig 3, By rotating about the center in the longitudinal direction, an environment in which the centrifugal force is evenly distributed on the inner peripheral surface of the straight pipe 10 is formed.

Accordingly, when the fluororesin powder is applied to the inside of the straight pipe 10, the fluororesin powder is distributed with a uniform thickness inside the straight pipe 10 due to the centrifugal force.

The fluororesin layer forming apparatus 1 of the piping for semiconductor equipment according to the present embodiment is applied to the inside of the not shown firing furnace where the melting point of the fluororesin is set to be 20 to 30 캜 However, the present invention is not limited to this, but it is possible to put it into the firing furnace through another conveying means 9, and it is most preferable to apply it according to the user's selection.

In this case, the moving means 9 preferably comprises a plate-shaped base 91 and a wheel 92 rotatably fixed on the bottom surface of the main body.

The jig 3 includes a ring 2 of the fluororesin material and a flange 11 of the straight pipe 10 which is received and fixed in close contact with the film 2, And a body (32) having a groove (31).

That is, while the body 32 is fixed to the rotary shaft 6, the film 2 and the flange 11 of the straight pipe 10 are tightly fixed through the receiving groove 31.

The body 32 is integrally formed with a fastening pipe 34 having a through-hole 33 through which the rotation shaft is inserted and coupled.

The exhaust gas generated during the sintering heating of the fluorine resin layer 12 through the through holes 33 can be discharged in real time and the fluorine The firing operation is stably performed without causing damage such as air bubbles to the resin layer 12. [

In addition, it is possible to stably perform the operation of injecting the fluorine resin powder into the inside of the straight pipe 10 through the through hole 33.

The power transmitting member 8 includes a main pulley 81 axially coupled to the shaft of the motor 5, a driven pulley 82 axially coupled to the rotating shaft 6, And a belt 83 connected to the driven pulley 82 so as to circulate and transmit the rotational force; The main pulley 81 and the driven pulley 82 are formed of a chain sprocket and the belt 83 is most preferably formed of a chain belt but is not limited thereto. Do.

The rotary shaft 6 may be rotatably fixed to the brackets 7 with a space therebetween so as to work on a plurality of straight tubes 10, And the other spur gear 84 is gear-engaged with the spur gear 84 that is axially coupled to the other spur gear 6 on the rotation shaft 6 to which the spur gear 82 is fixed. It is preferable that the gears 84 are rotated to receive the rotational force.

The two sets of brackets 7 are arranged in series and parallel to the machine body 4 with a plurality of pairs of spacing therebetween, and each of the brackets 7 is provided with power transmission The members 8 are preferably connected to the shaft of the motor 5 so as to receive power.

Accordingly, the operation of a large number of straight tubes 10 can be performed at the same time, thereby maximizing the productivity.

As described above, the fluorine resin layer forming method and the molding apparatus 1 of the piping for semiconductor equipment according to the present embodiment are characterized in that the film 2 separately molded and formed on the flange 12 of the straight pipe 10 is welded And the end of the fluororesin layer 12 coated on the inner circumferential surface of the straight pipe 2 is formed so as to be linearly aligned with the inner circumferential surface of the film 2. [

It will be apparent to those skilled in the art that various modifications and equivalent arrangements may be made therein without departing from the scope of the present invention as defined by the appended claims and their equivalents. . Therefore, it is to be understood that the present invention is not limited to the above-described embodiments. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims. It is also to be understood that the invention includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.

1: forming device 10: intuitive
11: Flange 12: Fluorine resin layer
100: jig device 2: coating film
3: jig 31: receiving groove
32: body 33: through-hole
34: fastening pipe 4: machine body
5: Motor 6:
7: Bracket 8: Power transmission member
81: main pulley 82: driven pulley
83: Belt 84: Spur gear
9: moving means 91; Base
92: Wheels

Claims (2)

A fluorine resin layer forming method of a piping for a semiconductor facility, which is formed by coating a fluorine resin layer on an inner circumferential surface of a straight pipe provided with a flange at an end portion thereof, the method comprising:
Like film 2 having the same inner diameter as the diameter of the outer peripheral surface of the flange and the inner diameter of which is equal to the inner diameter of the fluorine resin layer 12 formed on the inner peripheral surface of the straight tube 10, Step SlOO;
A film fixing step S200 of fixing the film to the jig provided rotatably through the film forming step S100;
An intuitive fixing step S300 of fixing the flange of the straight pipe to the jig to which the film is fixed through the film fixing step (S200) such that the flange is closely contacted to the film;
A fluorocarbon resin powder application step (S400) of applying fluoric resin powder inside the straight pipe fixed to the jig through the straight pipe fixing step (S300);
When the coating of the fluororesin powder is completed in the inside of the straight pipe through the fluororesin powder application step (S400), the straight pipe is rotated through the rotation of the jig, and an environment in which the fluororesin is hardened by baking is provided, (S500) in which the fluororesin powder and the coating are fired and cured in the inside of the furnace;
And a post-treatment step (S600) of separating the straight pipe from the jig after the fluorine resin layer is coated and formed inside the straight pipe through the firing and curing step (S500) A method of forming a fluorine resin layer in a piping for a facility.
A jig that is rotated to receive a rotational force generated from the motor and is fixed to an end of the straight pipe; and a jig And a power transmitting means for connecting the rotation shaft and the shaft of the motor to transmit a rotational force, wherein the rotation of the rotation shaft is transmitted to the shaft of the motor, A ground layer forming apparatus comprising:
The above-
And a body having a receiving groove for receiving and fixing the flange of the straight pipe in close contact with the film, wherein the ring-shaped film is made of a fluororesin material;
In the body,
And a fastening pipe formed with a through hole through which the rotating shaft is inserted and coupled is integrally formed.

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