KR101640289B1 - Laminate structure for manufacturing substrate and device comprising substrate manufactured by using same - Google Patents

Laminate structure for manufacturing substrate and device comprising substrate manufactured by using same Download PDF

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KR101640289B1
KR101640289B1 KR1020130116947A KR20130116947A KR101640289B1 KR 101640289 B1 KR101640289 B1 KR 101640289B1 KR 1020130116947 A KR1020130116947 A KR 1020130116947A KR 20130116947 A KR20130116947 A KR 20130116947A KR 101640289 B1 KR101640289 B1 KR 101640289B1
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layer
glass layer
substrate
adhesive layer
transparent polymer
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KR20150037401A (en
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정혜원
윤철민
김경준
신보라
박항아
임미라
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주식회사 엘지화학
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Abstract

The present invention relates to a laminate and a device including the substrate manufactured using the laminate, wherein the laminate has excellent adhesion to a flexible substrate having a transparent polymer layer having excellent heat resistance and optical characteristics formed on at least one surface of the thin glass layer And having a structure laminated on the support glass layer at an optimized thickness, it is possible to exhibit improved heat resistance and optical properties as well as improved processability.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a laminate and a substrate including the laminate,

The present invention relates to a device comprising a laminate and a substrate made using the same, which makes it possible to more easily manufacture an element having a flexible substrate, such as a flexible display element, with improved heat resistance and optical properties as well as improved processability .

The display device market is rapidly changing to flat panel displays (FPDs), which are large-sized, thin and lightweight. Such a flat panel display includes a liquid crystal display (LCD), an organic light emitting display (OLED) or an electrophoretic device.

In particular, in order to further extend the application and use of such a flat panel display, attention has been focused on a so-called flexible display device in which a flexible substrate is applied to the flat panel display. Such a flexible display device is mainly being applied to a mobile device such as a smart phone, and its application field is being gradually expanded.

Meanwhile, a process of forming and handling a display device structure such as a thin film transistor (TFTs on Plastic) on a plastic substrate is a key process in manufacturing a flexible display device. However, due to the flexibility of a substrate provided with such a flexible display device, there are still many process problems in forming a device structure by directly applying a flexible plastic substrate to an existing glass substrate device manufacturing process.

In particular, in the case of a thin glass contained in a flexible substrate, the substrate is easily broken due to impact, so that a manufacturing process of a display substrate is carried out with a thin glass on a carrier glass. Fig. 1 schematically shows a manufacturing process of a device (for example, a flexible display device) having a flexible substrate according to this conventional technique.

1, conventionally, a sacrificial layer 2 made of a-silicon or the like is formed on a carrier substrate 1 such as a glass substrate, and then a flexible substrate 3 is formed thereon. Then, a device structure such as a thin film transistor is formed on the flexible substrate 3 supported by the carrier substrate 1 through an existing glass substrate device manufacturing process. Then, the sacrificial layer 2 is broken by irradiating the carrier substrate 1 with a laser or light, and the flexible substrate 3 on which the device structure is formed is separated to finally form a flexible substrate 3) was prepared.

However, in such a conventional manufacturing method, there is a fear that the device structure is affected by the laser or the light irradiation to cause a defect or the like, and the equipment for laser or light irradiation and the separate process progress There is a disadvantage that the entire device manufacturing process becomes complicated and the manufacturing cost is also greatly increased.

1, the adhesion between the sacrificial layer 2 made of a-Si or the like and the flexible substrate 3 is insufficient, so that it is necessary to form a separate adhesive layer between the sacrificial layer and the flexible substrate , Which not only complicates the entire process but also increases the concern that laser or light irradiation may be required under more severe conditions and adversely affect the reliability of the device.

International Patent Publication No. WO 2000-066507 (published on November 11, 2000)

An object of the present invention is to provide a laminate and a method of manufacturing the same which can more easily manufacture an element including a flexible substrate such as a flexible display element, with improved heat resistance and optical properties as well as improved processability.

Another object of the present invention is to provide a substrate for an element manufactured using the above-mentioned laminate and a method of manufacturing the same.

It is still another object of the present invention to provide a device including a substrate manufactured using the above-described laminate.

According to an aspect of the present invention, there is provided a laminate for producing a substrate for an element, comprising: a flexible substrate including a transparent polymer layer and a thin glass layer positioned on the back side of the transparent polymer layer; An adhesive layer positioned on a rear surface of the thin film glass layer in the flexible substrate; And a support glass layer located on the backside of the adhesive layer.

In the above-mentioned laminate, the thickness of the thin glass layer is 10 to 200 占 퐉, the thickness of the transparent polymer layer is 0.5 to 20 占 퐉, the thickness of the adhesive layer is 0.1 to 5 占 퐉, The thickness may be 0.1 to 50 mm.

The transparent polymer layer may include a polyimide having an optical transmittance of 80% or more at 400 to 800 nm and an optical isotropy of 10 nm or less in the plane direction and 300 nm or less in the thickness direction.

The polyimide contained in the transparent polymer layer may have a glass transition temperature of 200 ° C or higher and a decomposition temperature (Td) of 400 ° C or higher.

The adhesive layer may include a thermoplastic polyimide having a glass transition temperature of 300 ° C or lower and a 1% heating weight loss temperature (Td 1%) of 400 ° C or higher.

The above-mentioned laminate may further comprise a second transparent polymer layer between the thin film glass layer and the adhesive layer.

According to another aspect of the present invention, there is provided a method of manufacturing a laminated body, comprising the steps of: forming an adhesive layer on one side of a supporting glass layer; and forming a flexible substrate on which a transparent polymer layer is formed on one side of the thin glass layer, And then laminating the adhesive layer on the support glass layer on which the adhesive layer is formed.

In the above-described method for producing a laminate, the lamination of the flexible substrate may be carried out by heat treatment at a temperature of 100 to 300 캜.

The method may further include forming a second transparent polymer layer on the side of the thin film glass layer facing the adhesive layer before the thin film glass layer and the adhesive layer are adhered to each other.

The bonding of the flexible substrate may be performed by heat treatment at a temperature of 100 to 300 캜.

According to another aspect of the present invention, there is provided a method of manufacturing a substrate for a device, comprising: forming an adhesive layer on one side of a supporting glass layer; bonding a flexible substrate, on which a transparent polymer layer is formed, And then laminating the laminate on the supporting glass layer on which the adhesive layer is formed to form a laminate, and separating the supporting glass layer from the laminate.

The method for manufacturing a substrate for a device described above may further include forming a second transparent polymer layer on the side of the thin glass layer surface facing the adhesive layer before the thin glass layer and the adhesive layer are bonded.

The lamination of the flexible substrate can be carried out by heat treatment at a temperature of 100 to 300 캜.

The separation of the thin film glass layer can be carried out by energy ray irradiation.

A substrate for a device according to still another aspect of the present invention is manufactured by the manufacturing method described above.

A device according to another aspect of the present invention includes a substrate manufactured by the above manufacturing method.

The device may be selected from the group consisting of a solar cell, an organic light emitting diode (LED) light, a semiconductor device, and a flexible display device.

The flexible display device may be a flexible organic electroluminescent device.

Other specific embodiments of various aspects of the present invention are included in the detailed description below.

The laminate according to the present invention has a structure in which a flexible substrate on which a transparent polymer layer having excellent heat resistance and optical characteristics is formed on a thin film glass layer is laminated on a supporting glass layer via a polyimide layer having excellent adhesiveness, Heat resistance and optical properties as well as improved processability. Accordingly, a device including a flexible substrate such as a flexible display device can be manufactured more easily by using the above-mentioned laminate.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a process schematic diagram briefly showing a manufacturing process of a device including a conventional flexible substrate,
2 is a cross-sectional view schematically showing a structure of a laminate according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

Where a section of a layer, film, film, substrate, or the like is referred to herein as being "on" another part, it includes not only the case where it is "directly on" another part but also the case where there is another part in between. On the contrary, when a portion such as a layer, a film, a film, a substrate, or the like is referred to as being 'under' another portion, it includes not only a case where the other portion is 'directly below' but also a case where there is another portion in between.

The present invention relates to a flexible substrate comprising a transparent polymer layer and a thin glass layer positioned on the back side of the transparent polymer layer; An adhesive layer positioned on a rear surface of the thin film glass layer in the flexible substrate; And a supporting glass layer located on the back surface of the adhesive layer.

The present invention also relates to a method of manufacturing a semiconductor device, comprising: forming an adhesive layer on one side of a supporting glass layer; positioning a flexible substrate on which a transparent polymer layer is formed on one side of the thin glass layer, And laminating the laminate on a glass layer.

The present invention also relates to a method for manufacturing a glass substrate, comprising the steps of: forming an adhesive layer on one side of a supporting glass layer; positioning a flexible substrate on which a transparent polymer layer is formed on one side of the thin glass layer, Forming a laminate by laminating the support glass layer on the substrate, and separating the support glass layer from the laminate.

The present invention also provides a substrate for a device manufactured by the above manufacturing method.

The present invention also provides an element comprising a substrate produced by the above-described manufacturing method.

Hereinafter, a laminate according to an embodiment of the invention and a method of manufacturing the same, a substrate for a device manufactured using the laminate, a method of manufacturing the same, and a device including the substrate will be described in detail.

According to an embodiment of the present invention, there is provided a flexible substrate comprising: a transparent polymer layer; and a thin glass layer positioned on the back side of the transparent polymer layer; An adhesive layer positioned on a back surface of the flexible substrate; And a supporting glass layer positioned on the back surface of the adhesive layer.

2 is a cross-sectional view schematically showing a structure of a laminate according to an embodiment of the present invention. 2 is only one example for illustrating the present invention, but the present invention is not limited thereto.

2, the laminate 100 according to the present invention includes a flexible substrate 10, a supporting glass layer 20, and an adhesive layer 30 for bonding the supporting substrate and the supporting glass layer ).

The flexible substrate 10 includes a thin glass layer 11 and a transparent polymer layer 12a located on the surface of the thin glass layer and a second transparent polymer layer 12b.

The thin film glass layer 11 can be used without particular limitation as long as it is a glass material generally used for display devices. Specifically, soda lime glass, neutral borosilicate glass, and alkali-free glass non-alkali glass, and the like. The material of the thin-film glass layer 11 may be appropriately selected according to the display device to which it is applied. In the case of a display device requiring a low heat shrinkage ratio, an alkali-free glass may be preferable. In a display device requiring high transparency, Soda lime glass having excellent light transmittance may be preferable.

More preferably, the thin film glass layer 11 has an average coefficient of linear expansion (hereinafter, simply referred to as an "average linear thermal expansion coefficient ) Of 0 to 200 x 10 < -7 > / deg. C, preferably 0 to 50 x 10 < -7 > / [deg.] C and a visible light transmittance of 90% Lt; / RTI >

The thickness and size of the thin film glass layer 11 may be appropriately selected depending on the kind of the device to be applied. However, considering the transparency of the substrate, the thin film glass layer 11 has a thickness of 10 to 200 탆 May be desirable. When such a thickness range is used, flexibility can be exhibited with appropriate mechanical strength, which is preferable.

The thin film glass layer 11 may be pretreated with an ozone atmosphere such as a corona treatment, a flaming treatment, a sputtering treatment, an ultraviolet ray irradiation, an electron beam irradiation or the like in order to increase adhesion with the transparent polymer layer.

On the other hand, in the flexible substrate 10, the transparent polymer layer 12a and the second transparent polymer layer 12b have high transparency and serve to improve the transparency and optical characteristics of the substrate and device for devices.

The transparent polymer layer 12a and the second transparent polymer layer 12b include a transparent polyimide resin. Specifically, the transparent polymer layer 12a and the second transparent polymer layer 12b each have an average transmittance of 80% or more at 400 to 800 nm, And a polyimide resin having optical isotropy of 300 nm or less. By having an average transmittance and optical isotropy in the same range as described above, the substrate can exhibit significantly improved transparency and optical properties. Preferably, the polyimide-based resin may have an optical transmittance at 400 to 800 nm of 90% or more, an optical isotropy of 10 nm or less in the plane direction, and 300 nm or less in the thickness direction.

The polyimide resin may have a glass transition temperature (Tg) of 200 ° C or more and a decomposition temperature (Td) of 400 ° C or more in addition to the above-mentioned transmittance and optical isotropy. Since such Tg and Td exhibit excellent heat resistance, there is no fear of deformation in the heating process for the production of the laminate or substrate for devices, and the heat resistance of the substrate and the device can be improved.

The polyimide resin having such physical properties as mentioned above can be produced by appropriately controlling the kind and content ratio of the monomers used in the production of the polyimide resin, or a process and a reaction condition for the production thereof.

Specifically, the polyimide resin is obtained by reacting a tetracarboxylic acid dianhydride and a diamine in an organic solvent such as N, N-dimethylacetamide (DMAc), N, N-dimethylformamide or N-methylpyrrolidone Or by imidizing a polyimide precursor prepared by a polymerization reaction in a solvent.

Of these monomers, specific examples of the tetracarboxylic dianhydride compound include pyromellitic anhydride, pyromellitic dianhydride, 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, butane-1 , 2,3,4-tetracarboxylic acid dianhydride, 3,3 ', 4,4'-benzophenonetetracarboxylic acid dianhydride, 3,3', 4,4'-diphenyl ether tetracarboxylic acid Dianhydride, 3,3 ', 4,4'-diphenylsulfone tetracarboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) hexafluoroisopropylidene dianhydride, 3,3' , 4,4'-biphenyltetracarboxylic dianhydride, 3,3 ', 4,4'-benzophenonetetracarboxylic acid dianhydride, 4,4'-hexafluoroisopropylidenediphthalic anhydride, 3,3 ', 4,4'-diphenylsulfone tetracarboxylic dianhydride, 1,2,3,4-cyclobutane tetracarboxylic dianhydride, 1,2-dimethyl-1,2,3,4 -Cyclobutane tetracarboxylic acid dianhydride, 1,2,3,4-tetramethyl-1,2,3,4-cyclobutane 1,2,4-cyclopentanetetracarboxylic acid dianhydride, 1,2,4,5-cyclohexanetetracarboxylic acid dianhydride, 3,4-dicarboxy-1, 2,3,4-tetrahydro-1-naphthalenesuccinic dianhydride, 5- (2,5-dioxotetrahydrofuryl) -3-methyl-3-cyclohexene-1,2-dicarboxylic acid dianhydride, 2,3,5-tricarboxy-2-cyclopentane acetic acid dianhydride, bicyclo [2.2.2] oct-7-ene-2,3,5,6-tetracarboxylic dianhydride, 2,3,4 , 5-tetrahydrofuran tetracarboxylic acid dianhydride, and 3,5,6-tricarboxy-2-norbornane acetic acid dianhydride, and derivatives thereof, and the like. , It is needless to say that various tetracarboxylic dianhydride compounds can be used.

Specific examples of the diamine compound among the above monomers include phenylenediamine, m-phenylenediamine, 2,4,6-trimethyl-1,3-phenylenediamine, 2,3,5,6-tetramethyl 1,4-phenylenediamine, 4,4'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl ether, 4,4'-diaminodi Phenyl sulfide, 4,4'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 3,3'-diaminodiphenylmethane, 4,4'-methylene-bis (2- ), 4,4'-methylene-bis (2,6-dimethylaniline), 4,4'-methylene- Methylene-bis (2,6-diisopropylaniline), 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, benzidine, bis (trifluoromethyl) benzidine, 1,4-bis (4-aminophenoxy) benzoic acid, 2,2'- Benzene, 1,3-bis (4-aminophenoxy) benzene, 1,3-bis Bis (4-aminophenoxy) phenyl] sulfone, bis [4- (4-aminophenoxy) ) Phenyl] propane, 2,2-bis [4- (3-aminophenoxy) phenyl] propane, 2,2- Bis (trifluoromethyl) -4,4'-diaminobiphenyl (2,2'-TFDB), 3,3'-bis (trifluoromethyl) -4,4'-diaminobiphenyl (3,3'-TFDB), 4,4'-bis (3-aminophenoxy) diphenyl sulfone (DBSDA), bis (3-aminophenyl) sulfone (3DDS), bis 4DDS), 1,3-bis (3-aminophenoxy) benzene (APB-133), 1,4-bis (4-aminophenoxy) benzene (APB-134), 2,2'- 4-aminophenoxy) phenyl] hexafluoropropane (3-BDAF), 2,2'-bis [ Bis (3-aminophenyl) hexafluoropropane (3,3'-6F), 2,2'-bis (4-aminophenyl) hexafluoropropane At least one aromatic diamine selected from the group consisting of aniline (ODA); (Aminomethyl) cyclohexane, 1,3-bis (aminomethyl) cyclohexane, 1,4-cyclohexane diamine, 1,4-cyclohexane diamine, 4'-diaminodicyclohexylmethane, and 4,4'-diamino-3,3'-dimethyldicyclohexylmethane 4,4'-diamino-3,3'-dimethyldicyclohexylmethane, 1, Bis (3-aminopropoxy) ethane, bis (3-aminopropyl) ether, 1,4-bis And at least one aliphatic diamine selected from the group consisting of 4,8,10-tetraoxaspiro [5.5] undecane, 1,3-bis (3-aminopropyl) tetramethyldisiloxane, and the like.

The kind of the above-mentioned tetracarboxylic acid dianhydride compound and the diamine compound is not particularly limited, but it is preferable to use a tetracarboxylic dianhydride in order to suitably satisfy the above-mentioned physical properties and to exhibit excellent transparency and heat resistance .

These monomers are polymerized in a polar organic solvent to prepare the above-mentioned polyamic acid-based resin, and the polyamic acid-based resin is imidized in the presence or absence of an imidization catalyst such as an amine-based catalyst under the above- Based resin and an adhesive layer containing the same can be formed.

However, in addition to the above-mentioned conditions, other conditions for the production of the polyamic acid resin or the polyimide resin may be in accordance with conventional conditions and methods well known to those skilled in the art, and a further explanation thereof will be omitted.

The molecular weight of the polyimide to be produced can also be controlled by adjusting the reaction ratio of the tetracarboxylic dianhydride and diamine used in the polymerization reaction. Accordingly, in the present invention, it may be preferable to use diamine in a molar ratio of 0.9 to 1.1 with respect to 1 mol of the tetracarboxylic dianhydride in view of the production of polyimide satisfying the above physical property requirements.

It is preferable that each of the transparent polymer layer 12a and the second transparent polymer layer 12b having the above-described physical property properties independently has a thickness of 0.5 to 20 占 퐉.

The flexible substrate 10 comprising the thin film glass layer 11, the transparent polymer layer 12a and optionally the second transparent polymer layer 12b is bonded to the support glass layer 20 by the adhesive layer 30, / RTI >

The adhesive layer 30 can increase the adhesion between the flexible substrate 10 and the supporting glass layer 20 so that the flexible substrate can be separated from the supporting glass layer during manufacturing of the element substrate or element, Layer of the flexible substrate and to prevent cracking of the thin film glass layer in the flexible substrate so that after the substrate or the device is manufactured, the support glass layer is decomposed by laser irradiation to easily separate the supporting glass layer from the laminate It plays a role.

The adhesive layer 20 includes a thermoplastic polyimide, specifically, a thermoplastic polyimide having a Tg of 300 DEG C or lower and a Td of 1% or higher of 400 DEG C or higher. The 1% heating weight loss temperature means a temperature at which a weight loss of about 1% occurs when heating about 10 mg of a sample at a temperature raising rate of 10 캜 / minute by differential thermal expansion.

Accordingly, the adhesive layer and the laminate including the adhesive layer exhibit better heat resistance, and are suitably maintained during the manufacturing process of a device to which high temperature heat is applied, and the device manufacturing process can be preferably performed on the laminate. If the glass transition temperature of the thermoplastic polyimide exceeds 300 캜 or Td 1% is less than 400 캜, it is difficult to form a multilayered structure, and the adhesive layer and the laminate are thermally deflected during the manufacturing process of the device, Degradation of the characteristics of the device may occur. Preferably, the thermoplastic polyimide may have a Tg of 300 占 폚 or less and a Td of 1% at 400 占 폚 or higher.

The thermoplastic polyimide having such physical properties as described above can be produced by appropriately controlling the kind and content ratio of the monomers used in the production of the polyimide resin, or a process and a reaction condition for the production thereof.

Specifically, the above-mentioned thermoplastic polyimide is preferably an aromatic tetracarboxylic acid dianhydride, more preferably an aromatic tetracarboxylic acid dianhydride, more preferably a tetracarboxylic dianhydride, Aromatic tetracarboxylic acid dianhydride having a linear structure rather than a branched structure and having no linker structure between the aromatic groups, for example, an aromatic tetracarboxylic dianhydride as a diamine compound and an aromatic diamine compound having a linear structure And may be one prepared by polymerization and imidization of a diamine compound.

Examples of the aromatic tetracarboxylic acid dianhydride include pyromellitic dianhydride or 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, and examples of the aromatic diamine compound include m - or p-phenylenediamine, benzidine, o- or m-tolidine, 2,2'-bis (trifluoromethyl) -4,4'-diaminobiphenyl (2,2'-TFDB) .

As described above, since the adhesive layer includes a polyimide resin having excellent heat resistance, it can exhibit excellent heat resistance to high temperature heat added during the device manufacturing process. As a result, it is possible to suppress the occurrence of warpage in the device manufacturing process on the laminate, and the reliability of other devices to be lowered. As a result, the manufacture of a device having a flexible substrate such as a flexible display device .

The adhesive layer may further include an organic or inorganic filler, a flame retardant, or the like as a conventional additive for improving adhesion performance of the adhesive layer together with the above-mentioned thermoplastic polyimide.

The adhesive layer may preferably have a thickness of 0.1 to 5 mu m. If the thickness of the adhesive layer is less than 0.1 탆, it is difficult to provide a sufficient adhesion force between the supporting glass layer and the flexible substrate, and if the thickness exceeds 5 탆, there is a fear of deterioration of optical characteristics as the thickness of the display substrate increases.

On the other hand, in the laminate according to the present invention, the supporting glass layer 20 is disposed on the back surface of the adhesive layer 30.

The supporting glass layer 20 serves to support the flexible substrate 10 and supports the flexible substrate 10 so that the manufacturing process of the device and the like can proceed easily on the supporting glass layer 20. [ Can be used without any particular limitation. The concrete material and the manufacturing method thereof are the same as those described above.

The thickness and the size of the support glass layer 20 may be appropriately selected according to the kind of the display device to be applied. However, considering the transparency of the display substrate, the support glass layer 20 has a thickness of 0.1 to 50 mm Lt; / RTI > With such a thickness range, excellent mechanical strength can be obtained, and excellent support characteristics can be exhibited for a flexible substrate.

The support glass layer 20 may be subjected to an etching treatment such as corona treatment, flaming treatment, sputtering treatment, ultraviolet ray irradiation, or electron beam irradiation in an ozone atmosphere in order to improve adhesion with the adhesive layer 30.

The laminate having the above-described laminated structure is obtained by forming an adhesive layer on one side of a supporting glass layer (step 1), and forming a flexible substrate having a transparent polymer layer on one side of the thin glass layer, (Step 2) of laminating the adhesive layer on the supporting glass layer on which the adhesive layer has been formed, after positioning the adhesive layer to face the adhesive layer.

Describing each step in detail, Step 1 is a step of forming an adhesive layer on one side of the supporting glass layer.

The supporting glass layer is the same as that described above, and can be produced according to a conventional manufacturing method. Specifically, the glass raw material is mixed and melted and then formed into a plate shape by a method such as a float method, a slot-down draw method, an overflow downdraw method, a fusion method, a lead-out method, or a roll-out method, .

Further, in order to increase the adhesion with the adhesive layer formed on the supporting glass layer, it can be pre-treated by an etching treatment such as corona treatment, flaming treatment, sputtering treatment, ultraviolet ray irradiation, electron beam irradiation or the like in an ozone atmosphere.

Meanwhile, the adhesive layer may be formed on one side of the support glass layer by a dry method or a wet method, which is a conventional film production method.

Examples of the dry method include a high-intensity plasma using chemical vapor deposition, ion beam assisted deposition (IBAD), plasma enhanced chemical vapor deposition (PECVD), expanded thermal plasma CVD (ETPCVD), inductively coupled plasma (ICP), or electron cyclotron resonance Chemical vapor deposition (HIPCVD), and the like. The dry method can be formed in a film state at the same time as vapor deposition, so that there is no need for a separate polymerization step, and the thickness and characteristics of the adhesive layer formed over the entire surface of the support glass layer are uniform, and the ultra thin film can be manufactured with a small thickness.

Examples of the wet method include a spin coating method, a dip coating method, a bar coating method, and a casting method, a rolling method, and a spray coating method suitable for a continuous process.

For example, in the case of forming the adhesive layer by the wet method, the adhesive layer-forming polymer, that is, the composition comprising the thermoplastic polyimide or the precursor thereof is applied to one side of the supporting glass layer, and then the drying and curing process is performed Whereby a film can be formed.

The coating method of the composition containing the thermoplastic polyimide or a precursor thereof may be carried out according to a conventional method, and specifically, a casting method suitable for a spin coating method, a dip coating method, a bar coating method, A spray coating method or the like can be used.

The drying process for the composition on the coated film after application may be carried out according to a conventional drying process, preferably at a temperature of 140 ° C or lower.

The curing step may be performed by a heat treatment at a temperature of 200 ° C or higher, and may be performed by a multi-step heat treatment at various temperatures within the temperature range.

Step 2 is a step of laminating a flexible substrate including a thin-film glass layer and a transparent polymer layer located on one side of the thin-film glass layer on the supporting glass layer on which the adhesive layer formed in step 1 is formed.

At this time, the lamination of the flexible substrate and the supporting glass layer can be performed by heat treatment after positioning the thin glass layer and the adhesive layer to face each other.

The flexible substrate can be manufactured by forming a transparent polymer layer on one side of the thin glass layer.

The thin film glass layer is the same as that described above. In order to increase the adhesion with the transparent polymer layer located on one side or both sides of the thin film glass layer, etching such as corona treatment, flaming treatment, sputtering treatment, ultraviolet ray irradiation, Treatment or the like.

The transparent polymer layer may be formed by the same method as the above-described method for forming an adhesive layer, except that a transparent polymer is used.

Specifically, it can be formed by applying a composition comprising a polyimide or a polyamic acid-based resin as a precursor thereof as a transparent polymer on the thin film glass layer, followed by curing. When a polyamic acid is used in the production of the transparent polymer layer, imidization of the polyamic acid resin proceeds together with the curing process.

The composition containing the polyimide resin or the polyamic acid resin may further contain a commonly used binder, solvent, crosslinking agent, initiator, dispersant plasticizer, viscosity modifier, ultraviolet absorber, photosensitive monomer and sensitizer .

The method of applying the composition containing the polyimide or a precursor thereof may be carried out according to a conventional method, and specific examples thereof include a casting method suitable for a spin coating method, a dip coating method or a bar coating method, and a continuous method, a rolling method Or a spray coating method.

Further, the drying step may be further performed to remove the organic solvent in the composition prior to the curing step. Specifically, the drying step may be performed at a temperature of 140 ° C or lower.

The curing step may be performed by a heat treatment at a temperature of 200 ° C or higher, and may be performed by a multi-step heat treatment at various temperatures within the temperature range.

The flexible substrate manufactured according to the method described above is placed on the supporting glass layer having the adhesive layer formed in Step 1 so that the thin glass layer in the flexible substrate faces the adhesive layer and is bonded by heat treatment.

Specifically, the heat treatment may be performed at 100 to 300 ° C.

Since the laminate produced by the above method can appropriately fix and support the flexible substrate to the supporting glass layer during the device manufacturing process by including the adhesive layer between the flexible substrate and the supporting glass layer, It is possible to easily manufacture a substrate of an element including a ghost substrate. In addition, by including a transparent polyimide polymer layer having excellent heat resistance and optical characteristics, excellent heat resistance and optical characteristics can be exhibited.

According to another embodiment of the present invention, there is provided a substrate for a device manufactured using the above-described laminate and a method of manufacturing the same.

The step of forming an adhesive layer on one surface of the supporting glass layer includes positioning the flexible substrate on which a transparent polymer layer is formed on one side of the thin glass layer so that the thin glass layer faces the adhesive layer, (Step 2) of preparing a laminate, and separating the support glass layer from the laminate, wherein the production process is optionally carried out before the adhesion of the thin film glass layer and the adhesive layer And forming a second transparent polymer layer on the side of the thin film glass layer on which the polymer layer is not formed.

In the above production process, the step prior to the separation step of the thin film glass layer may be carried out in the same manner as in the production method of the laminate.

Separation of the supporting glass layer from the laminate thus produced can be carried out by irradiating energy rays such as ultraviolet rays, electron beams, X-rays or lasers.

The energy ray irradiation method may be performed according to a conventional method, and the intensity and time of the energy ray to be irradiated may be adjusted to separate the support glass layer from the flexible substrate.

The substrate for an element manufactured by the above method is characterized in that the flexible substrate is stably supported on the supporting glass layer during the manufacturing process of the substrate and after the production of the substrate stack is completed, The supporting glass layer can be completely separated and removed, thereby improving the characteristics and reliability of the manufactured device.

Accordingly, according to another embodiment of the present invention, an element including the substrate can be provided.

Specifically, the device can be any solar cell having a flexible substrate (e.g., a flexible solar cell), organic light emitting diode (OLED) lighting (e.g., flexible OLED lighting) An organic electroluminescent device having a flexible substrate, a flexible display device such as an electrophoretic device or an LCD device, or an organic electroluminescent device.

The device includes a step of forming a device structure on the flexible substrate of the laminate after the adhesive layer and the flexible substrate are sequentially formed on the supporting glass layer to obtain a laminate of one embodiment, And then separating the supporting glass layer from the flexible substrate on which the element structure is formed by laser or light irradiation.

The device structure may include a semiconductor device structure including a gate electrode, a display device structure including a thin film transistor array, a diode device structure having a P / N junction, an OLED structure including an organic light emitting layer, The device structure may be a conventional device structure depending on the type of device to be formed. For example, when the device structure is an organic electroluminescent device structure, a transparent electrode is disposed on the surface of the flexible substrate in the substrate and includes indium tin oxide (ITO) or the like; A light emitting portion located on the rear surface of the transparent electrode and including an organic compound; And a metal electrode located on the rear surface of the light emitting portion and including a metal such as aluminum.

As described above, the device according to the present invention can exhibit improved and reliable device characteristics by using a laminate in which a flexible substrate is stably supported on a supporting glass layer.

While the present invention has been particularly shown and described with reference to specific embodiments thereof, those skilled in the art will appreciate that such specific embodiments are merely preferred embodiments and that the scope of the present invention is not limited thereby. something to do. It is therefore intended that the scope of the invention be defined by the claims appended hereto and their equivalents.

10 flexible substrate
11 thin film glass layer
12a, 12b A transparent polymer layer
20 support glass layer
30 adhesive layer
100 laminate

Claims (17)

  1. A transparent polymer layer having a thickness of 0.5 to 20 占 퐉 and a thin film glass layer having a thickness of 10 to 200 占 퐉 which is located on the back surface of the transparent polymer layer;
    An adhesive layer having a thickness of 0.1 to 5 占 퐉 on the back surface of the thin glass layer in the flexible substrate; And
    A supporting glass layer having a thickness of 0.1 to 50 mm,
    , Wherein:
    Wherein the transparent polymer layer has an optical transmittance at 400 to 800 nm of 80% or more, an optical isotropy in a plane direction of 10 nm or less and a thickness direction of 300 nm or less, a glass transition temperature of 200 캜 or more and a decomposition temperature (Td) of 400 Lt; 0 > C or more,
    Wherein the adhesive layer comprises a thermoplastic polyimide having a glass transition temperature of 300 占 폚 or less and a 1% heating weight loss temperature (Td 1%) of 400 占 폚 or more.
  2. delete
  3. delete
  4. delete
  5. delete
  6. The method according to claim 1,
    And a second transparent polymer layer between the thin film glass layer and the adhesive layer.
  7. delete
  8. delete
  9. delete
  10. An element manufacturing process step of forming a device structure on a flexible substrate of the laminate of claim 1, and
    And separating the supporting glass layer from the laminate.
  11. 11. The method of claim 10,
    Further comprising the step of forming a second transparent polymer layer on the side of the thin film glass layer side facing the adhesive layer before the thin film glass layer and the adhesive layer are adhered to each other.
  12. 11. The method of claim 10,
    Wherein the flexible substrate is laminated by heat treatment at a temperature of 100 to 300 占 폚.
  13. 11. The method of claim 10,
    Wherein the thin film glass layer is separated by energy ray irradiation.
  14. A substrate for an element manufactured by the manufacturing method according to any one of claims 10 to 13.
  15. An element comprising a substrate produced by a manufacturing method according to any one of claims 10 to 13.
  16. 16. The method of claim 15,
    A solar cell, an organic light emitting diode (LED) light, a semiconductor device, and a flexible display device.
  17. 17. The method of claim 16,
    Wherein the flexible display device is a flexible organic electroluminescent device.
KR1020130116947A 2013-09-30 2013-09-30 Laminate structure for manufacturing substrate and device comprising substrate manufactured by using same KR101640289B1 (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003306560A (en) * 2002-04-12 2003-10-31 Toyobo Co Ltd Optical polyamideimide film, transparent conductive film, and transparent touch panel

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10330616A (en) * 1997-05-30 1998-12-15 Hitachi Chem Co Ltd Paste of heat-resistant resin
EP1048628A1 (en) 1999-04-30 2000-11-02 CARL-ZEISS-STIFTUNG trading as Schott Glas Polymer coated glassfoil substrate
KR101238009B1 (en) * 2006-10-26 2013-03-04 엘지디스플레이 주식회사 Fabricating Method of Flexible Display
JP5822352B2 (en) * 2012-02-10 2015-11-24 新日鉄住金化学株式会社 Transparent flexible laminate and laminate roll

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003306560A (en) * 2002-04-12 2003-10-31 Toyobo Co Ltd Optical polyamideimide film, transparent conductive film, and transparent touch panel

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