KR101590039B1 - Switchgear apply composite sensor for integrated mold - Google Patents

Switchgear apply composite sensor for integrated mold Download PDF

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Publication number
KR101590039B1
KR101590039B1 KR1020150162104A KR20150162104A KR101590039B1 KR 101590039 B1 KR101590039 B1 KR 101590039B1 KR 1020150162104 A KR1020150162104 A KR 1020150162104A KR 20150162104 A KR20150162104 A KR 20150162104A KR 101590039 B1 KR101590039 B1 KR 101590039B1
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South Korea
Prior art keywords
switchgear
mold
composite sensor
detecting
temperature
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KR1020150162104A
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Korean (ko)
Inventor
양정일
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한양전공주식회사
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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02BBOARDS, SUBSTATIONS, OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B13/00Arrangements of switchgear in which switches are enclosed in, or structurally associated with, a casing, e.g. cubicle
    • H02B13/02Arrangements of switchgear in which switches are enclosed in, or structurally associated with, a casing, e.g. cubicle with metal casing
    • H02B13/025Safety arrangements, e.g. in case of excessive pressure or fire due to electrical defect
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H1/00Measuring characteristics of vibrations in solids by using direct conduction to the detector
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/02Special applications of indicating or recording means, e.g. for remote indications

Abstract

The present invention relates to a switchgear where a mold integrated composite sensor is applied, which is capable of checking the state of the switchgear using communication between a complex sensor and an external mobile device and which has the complex sensor detecting the state such as vibration, arc and overheating on the surface of a three-dimensional mold. In order to deal with the issue, the switchgear where a mold integrated composite sensor is applied comprises: a composite sensor detecting vibration, electromagnetic waves and temperature, installed inside the switchgear; and a switchgear including a mobile device which displays the internal state of the switchgear through communication with the composite sensor through a communication network. The composite sensor comprises: a composite sensor unit which includes a temperature detecting module for detecting the inner temperature of the switchgear, a vibration detecting module for detecting the vibration applied to the switchgear and an electromagnetic wave detecting module for detecting the electromagnetic waves generated by the arc; a control unit for checking if the detected values exceed a predetermined value based on the sensing values detected by the composite sensor unit and for outputting alarming messages if the detected values exceed the predetermined value; and a communication unit for transmitting the alarming messages outputted by the control unit to the mobile device where a switchgear management application is installed through the communication network. The composite sensor unit, the control unit and the communication unit are integrated on the surface of the three-dimensional molding.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a switch-

More particularly, the present invention relates to a composite sensor for detecting a state of overheating and vibration on the surface of a mold having a three-dimensional shape, The present invention relates to a switchgear to which a mold-integrated type sensor capable of confirming a state of a switchgear through communication of a switch is applied.

The switchboard is a device that receives high-voltage or extra-high voltage electricity supplied from a power plant or substation, converts it to a voltage used by the customer, and distributes it to the load facility.

This switchgear is a cubicle structure on the surface, and inside the switchgear, power devices such as high-voltage switchgear, instrumental current transformer, high-voltage switchgear, transformer, low-voltage distribution circuit breaker and protective relays and instruments for power system protection and monitoring And the like. Inside the cubicle, besides electric power equipment, wiring for measurement and monitoring of booth bar and power equipment is connected, which connects power equipment according to the power system.

However, in the process of distributing the electric power supplied from the outside, such a switchgear generates heat from various electric devices installed therein. In addition, in the case of an outdoor type outdoor switchboard installed outside, the temperature rise inside the enclosure due to solar heat is further accelerated.

In addition, when external vibrations or shocks due to crustal fluctuations occur in the above-mentioned switchgear, electrical components such as power devices inside the switchgear, wires connecting the power devices, and protection relays are likely to be damaged or damaged. Failure to follow may result in interruption of power supply and fire. In addition, when an external vibration (for example, an earthquake or the like) occurs at a predetermined level or more, it is necessary to control the electric power to be cut off to prevent electric shock and fire due to electricity.

On the other hand, Japanese Patent Application Laid-Open No. 10-1264344 discloses a digital control system for monitoring an abnormal condition inside an ASSEMBLY.

In the conventional technique, a temperature sensing device is installed in a non-contact manner at a connection portion between a circuit breaker and a bus bar located on a secondary side of a switchboard transformer to measure a temperature of the connection portion and input measured temperature data to a temperature measurement terminal. An operation detecting device for detecting operation data in accordance with a motion of a field worker approaching the front and rear of the switchboard or working inside the switchboard and inputting the detected operation data to the operation input terminal; A flame detecting device for detecting a flame generated inside the switchboard and inputting the detected flame data to a flame detection terminal; A digital controller for monitoring an abnormal state inside the switchboard based on data received from the temperature sensing device, the motion sensing device, and the flame sensing device, and for activating an alarm announcement and automatic fire extinguishing device when an abnormal condition occurs; And an automatic fire extinguishing system in which a secondary alarm is issued according to data sensed through the temperature sensing device and the flame sensing device, and the automatic fire extinguishing device is operated after a predetermined delay time of the automatic fire extinguishing device.

However, since the above-described technology includes sensors such as a temperature sensing device for detecting the temperature inside the switchboard, a flame detection device for detecting flames, and an operation sensing device for sensing the operation of the operator, Wiring is complicated, and a plurality of sensors for detecting different states arises.

KR 10-1264344 B1 (Registered on 05. 08. 2013.)

SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems of the prior art, and it is an object of the present invention to provide a composite sensor by constituting each sensor for detecting temperature and vibration in one mold, And the like are formed on the inside or the surface of the molding according to the shape of the molding, and are implemented in various shapes.

Another problem to be solved by the present invention is to implement the shape of the mold corresponding to the installation position inside the switchgear and to reduce the size of the complex sensor by integrating the circuit and the chip in the implemented shape, The present invention is to provide a switchgear to which a combined molding integrated type sensor capable of increasing the space utilization inside the switchgear can be constructed.

In order to solve the above-described problems, the present invention provides a hybrid switchgear integrated with a molding integrated type sensor according to the present invention, which is installed inside a switchgear and communicates with a hybrid sensor and a communication network to detect temperature and vibration, A hybrid sensor unit including a temperature detection module for detecting the temperature inside the switchgear and a vibration detection module for detecting the vibration applied to the switchgear; A controller for determining whether the sensed value exceeds a set value for each detected value based on the sensing value detected by the complex sensor unit and outputting a warning message when it is determined that the detected value exceeds the set value; And a communication unit for transmitting a warning message output from the control unit to a mobile device equipped with a management and management application via a communication network, wherein the composite sensor unit, the control unit, and the communication unit are integrated on a surface of a three- .

Here, the composite sensor may be a mold, a circuit, and a circuit formed by integrating chips after the plating process in a state that a pattern is processed selectively using a laser on a mold of a thermoplastic resin and then a plating process is performed. .

The mold is injection-molded in a shape corresponding to a space in which the composite sensor is disposed in the switchgear.

According to the present invention, since the composite sensor can be configured in a shape corresponding to the shape of the empty space inside the switchgear, it is possible to easily secure the space inside the switchboard in which the composite sensor is installed, and the sensor can be configured on the surface of the mold. The sensor can be manufactured in a very small size.

In addition, since the state of the switchboard is transmitted from the hybrid sensor to the user's mobile device, the change of the internal state of the switchboard can be checked from time to time, so that malfunctions and defects of the switchboard can be confirmed or prevented.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a switchboard to which a mold-integrated composite sensor according to the present invention is applied; FIG.
FIG. 2 is a block diagram of a composite sensor in a switchboard to which a mold-integrated type sensor according to the present invention is applied.
FIG. 3 is a drawing showing an alternative embodiment of a process for manufacturing a composite sensor in a switchboard in which a mold-integrated composite sensor according to the present invention is applied.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The present invention relates to a mold integrated composite sensor capable of detecting the state of over-heating and vibration on the surface of a mold having a three-dimensional shape and capable of confirming the state of a switchboard through communication between the composite sensor and an external mobile device To which the present invention is applied.

FIG. 1 is a schematic diagram of a switchboard to which a mold-integrated composite sensor according to the present invention is applied, and FIG. 2 is a block diagram of a composite sensor in a switchboard to which the mold-integrated composite sensor according to the present invention is applied.

Referring to the accompanying drawings, a switchboard to which a mold-integrated composite sensor according to the present invention is applied comprises an enclosure 10, a composite sensor 20, and a mobile device 30.

The enclosure 10 includes a basic frame forming a switchboard, and may be formed of a frame that is easy to connect the panel to the outer surface. Although the enclosure 10 is not shown in the drawing, it includes a horizontal frame arranged in the horizontal direction, a vertical frame arranged in the vertical direction, and a vertical frame arranged in the vertical direction, A plurality of compartment spaces are provided inside the partition plate.

A door is provided at one side or both sides of the housing 10, and a plurality of spaced apart spaces are provided with an automatic breaker switch, a transformer formed in the lower space, a breaker and a wiring breaker provided in the front space, A power fuse formed at a rear upper portion, a lightning arrester, and a meter transformer formed at a lower portion thereof.

In addition, the inside of the housing 10 can be partitioned into partition walls having a predetermined thickness so as to separate the high-pressure side and the low-pressure side. The wall constituting the housing 10 is made of a high- . The housing 10 is connected to the input side terminal of the fault section automatic switch through an insulative connecting member formed on the upper portion of the housing 10 from an inlet formed in the front lower side of the housing 10. A connection cable is installed on the output side terminal of the automatic breaker of the fault section so that high voltage electricity is applied to the high voltage side of the transformer through a lightning arrester, a current-like power fuse and a transformer for a meter.

In the above-configured switchgear, the connecting portion and the supporting portion of the power equipment are covered with an insulator, which causes deterioration or mechanical damage depending on the service life, installation environment and operating conditions. As the insulator is damaged, the degree of damage is deepened due to the high voltage discharge phenomenon in a short period of time, and when it is left to stand, an arc is generated, which may lead to insulation breakdown and fire.

In addition, short-circuiting and disconnection of the connecting portion may be caused by an external force such as an external vibration, such as an earthquake.

The composite sensor 20 performs a function of detecting vibration including overheating and an arc due to such deterioration. The composite sensor 20 includes a composite sensor unit 100, a control unit 200, a communication unit 300, and a memory unit 400). At this time, a plurality of the composite sensors may be installed to detect temperature and vibration at main points.

The composite sensor unit 100 includes a temperature detection module 110 for detecting the temperature inside the switchgear and a vibration detection module 120 for detecting the vibration applied to the switchgear.

The temperature detecting module 110 detects a temperature inside the switchgear based on a set period. When a contact failure occurs, the temperature detecting module 110 generates an overheating due to a contact portion failure. The heat generated by the overheating inside the switchgear is periodically detected.

The vibration detecting module 120 performs a function of detecting a vibration applied from the outside of the switchboard, and receives the vibration signal measured by the vibration sensor through a sensor input terminal and stores the pattern and intensity of the vibration signal. And outputs it.

In addition to the temperature detection module 110 and the vibration detection module 120 constituting the composite sensor unit 100, an electromagnetic wave detection module capable of detecting an electromagnetic wave caused by an arc may be further included.

An arc occurs when electricity passes through a space, when electricity flows through a damaged insulation path using ambient dust, debris, and moisture as a conduction medium, or when electricity is leaked from a high voltage transmission line, It is generated when the signal is generated. When such an arc is generated, the fault current is induced due to the high temperature of the fault current, which causes a lot of damage to the power system. The magnitude of the arc fault current is limited by the resistance of the arc and the impedance to the grounding ears. That is, a low level of fault current is not enough to trip an overcurrent device installed near the arc fault instantaneously, resulting in amplification of the arc fault, and the amplified arc enhances the damage of the power system.

Accordingly, the generation of an arc generates an electromagnetic wave, and an arc can be detected through the electromagnetic wave detecting module which detects the electromagnetic wave generated by the arc.

In other words, the inside of the switchgear can cause a composite, short-circuit, and arc due to contact failure. The path along the single-phase ground fault includes an arc filling a part of the insulation gap. At the time of arc generation, avalanche ionization occurs first do. The nonlinear current due to the arc generation generates electromagnetic waves ranging from a very low frequency (VLF) band to a microwave (UHF) band.

Accordingly, the composite sensor unit 100 may further include an electromagnetic wave detecting module for detecting an electromagnetic wave caused by an arc.

The control unit 200 determines whether the set value of the detected value exceeds the set value based on the sensed value detected by the compound sensor unit 100 and outputs a warning message when it is determined that the detected value exceeds the set value Function.

That is, the composite sensor unit 100 detects the temperature and the vibration caused by external shaking by the temperature detection module 110 and transmits the detected vibration to the control unit 200, And compares the received value with the set value. If a value exceeding the set value is received, it is determined that there is an error, and a warning message is output.

The temperature detection module 110 and the vibration detection module 120 provided in the composite sensor unit 100 may be configured to be transmitted to the control unit 200 only when the detected value satisfies the condition have. For example, the detected value may be deleted when the temperature inside the switchgear is 40 DEG C or lower, the detected electromagnetic wave is below the very low frequency (VLF) band, or the detected vibration is below 2 degrees. Or if the detected value is less than or equal to a preset temperature and sensitivity through the sensitivity adjustment, transmission to the controller 200 may not be performed.

The communication unit 300 transmits a warning message output from the control unit to a mobile device equipped with a management and management application through a communication network. The communication unit 300 is connected to a wireless network and transmits a warning message to the user mobile device.

The memory unit 400 stores and manages a set value as a reference value for generating an alarm message, which is an abnormal signal in the controller 200, and identification code information for the user's mobile device. Here, the identification code may be configured to include a telephone number, a name, a position, and the like.

According to the design conditions, when a plurality of switchboards are managed by a single mobile device, an ID corresponding to the switchboard or an IP (IP) of the composite sensor can be stored and managed in the memory unit 400 , The ID (or IP) may be included in the alert message and transmitted.

Meanwhile, the mobile device 30 may be a mobile communication terminal of a user (administrator), and may include a smart phone, a PDA or the like capable of installing the server management application according to the installation of a server management application in the mobile device 30 .

The mobile device 30 receives and displays an alarm message transmitted from the composite sensor 20 in a state of being connected to a communication network.

Here, the server management application may be installed in an operating system such as an Android and an iOS, and may be manufactured as software that is operable.

The manufacturing process of the composite sensor having such a structure is schematically described as follows. A pattern is processed selectively by using a laser on a mold of a thermoplastic resin, and chips are integrated after the plating process with the plating process being performed. Thus, the mold, the circuit, and the chip are integrally formed.

The above process will be described in more detail.

FIG. 3 is a photograph of a process for manufacturing a composite sensor in a switchboard to which a mold-integrated composite sensor according to the present invention is applied, according to an embodiment of the present invention.

Referring to the accompanying drawings, the process for fabricating the composite sensor includes an injection process, a laser pattern forming process, a plating process, and an SMT (Surface Mount Technology) process.

1. Injection process

The injection process is a process in which the mold is injected into a shape corresponding to the space in which the complex sensor is disposed within the switchgear.

The mold, which is an injection mold, can be made of thermoplastics, and various kinds of polymers capable of plastic injection molding can be used. For example, semi-aromatic polyamide (PA6 / 6T), thermoplastic ester (PBT, PET), cross-linked polybutylene terephthalate (PBT), liquid crystal polymer, polycarbonate Can be used.

The injection product includes a laser reaction agent.

The laser reactant includes a Wheeler and a metal component. Preferably, a metalorganic or heavy metal component may be used, and the metal component may be separated from other atomic bonds through a physical-chemical reaction by a laser, and may remain in a portion where the laser passes.

A three-dimensional molding such as an injection molding is formed by injection molding, and the shape of the molding is injected corresponding to the shape of the space in which the composite sensor is disposed in the switchboard.

2. Laser pattern forming process

The laser pattern forming step is a step of forming a predetermined pattern on the surface of the mold, which is an injection molded article, by using a laser.

The laser moves along a preprogrammed pattern path and is configured to move a predetermined section repeatedly or to operate along a predetermined path according to the shape and thickness of the pattern. At this time, when the laser passes through the mold which is partially bent or protruded three-dimensionally, the jig holding the plastic injection molding is rotated or moved together with the plastic injection molding so that the laser is effectively irradiated to the three-dimensionally formed portion . And may be configured to move the laser in three dimensions according to design conditions to form a pattern.

As the laser, electromagnetic radiation from a UV laser, an excimer laser or a UV emitter may be used.

Here, at the surface through which the laser passes, the atomic bonds connected to the metal component are disassociated, and the surrounding atoms can react with other surrounding components while leaving a metal component through a physical reaction or a chemical reaction. Some may evaporate and some may combine with other atoms to form other molecules. In general, some components of the surface are removed through evaporation, and only metallic components can remain.

Through the above process, since the wheeler is not decomposed by the UV radiation applied to the mode surface, only part of the resin is removed, and the wheeler is exposed. That is, the metal component of the laser-reactive agent is exposed to only a certain pattern by the laser pattern forming process.

3. Plating process

Forming a coating film on a pattern in which the metal component is exposed according to the laser pattern forming process, wherein the plating process is subdivided into a dynamical strike process, a copper plating process, and a nickel plating process, and is electroless plating.

The dynamic strike step is a step of forming a coating film on a circuit pattern on a mold which is an injection mold.

The plating solution used in the strike process is prepared by dissolving 90 to 100 ml / l of the copper plating solution and the supplement (QP-50-Cu-A) and the alkali supplement (QP-50-Cu- (QP-50-Cu-stabilizer) of 30 to 50 ml / l and a stabilizer (QP-50-Cu stabilizer) in an amount of 30 to 90 ml /

The mold is immersed in the plating liquid at a temperature of 40 to 70 DEG C for 20 to 30 minutes to fix the plating.

The copper bath and the supplement (QP-50-Cu-A) are mixed with 6-12 parts by weight of copper sulfate, 5-7 parts by weight of formaldehyde (HcHo), 1-1.5 parts by weight of polyethylene glycol (QP-50-Cu-B) may be composed of 40 to 50 parts by weight of sodium hydroxide (NaOH), 0.01 to 0.02 parts by weight of a stabilizer, 0.01 to 0.02 parts by weight of a stabilizer, And 50 to 60 parts by weight of water.

The complexing agent (QP-50-Cu-C) is composed of 20-25 parts by weight of edetate (EDTA-4NA), 0.01-0.02 parts by weight of stabilizer and 75-80 parts by weight of water, QP-50-Cu stabilizer) can be composed of 3 to 5 parts by weight of potassium cyanide, 5 to 10 parts by weight of sodium hydroxide (NaOH) and 85 to 90 parts by weight of DI water.

The copper plating step is a step of forming copper plating to a uniform thickness on the coating film formed in the strike step in the nickel plating step.

The plating solution used in the copper plating process was prepared by adding 55 to 65 ml / l of copper plating bath and supplement (QP-85-Cu-A) and 55 to 65 ml of alkali supplement (QP-85-Cu-B) to pure water 850 to 860 ml / (QP-85-Cu stabilizer) and formaldehyde (HcHo) in an amount of 15 to 20 ml / l, a stabilizer (QP-85-Cu stabilizer) and 8 to 10 ml / The mold is immersed in the plating liquid at a temperature of 43 to 48 DEG C at a deposition rate of 0.5 to 0.7 mu m / 10 minutes.

The nickel plating step is a step of forming a nickel metal film on the circuit pattern.

The plating solution used in this step was a mixture of 55 to 60 ml / l of a first electroless nickel plating solution (QP60 Ni-A) and a second electroless nickel plating solution And a plating solution (QP60 Ni-B) of 140 to 150 ml / l.

The plating solution is adjusted to a temperature of 57 to 80 캜 (preferably 65 캜), a pH of 5.5 to 6 (preferably 6) and a nickel metal concentration of 5.0 to 6.0 g / ℓ (preferably, 5.8 g / This is done by immersing the mold.

At this time, the tank in which the mold is immersed may be a tank made of polypropylene, FRP or Teflon, a tank coated with the tank, or a tank made of stainless steel.

Further, the first and second electroless nickel plating solutions (QP60 Ni-A and QP60 Ni-B) can be used for a long time by continuous replenishment and are excellent in bath stability, .

Also, the first electroless nickel plating solution has a smoothness of 5 to 6 탆 / hr at a low temperature under a dry condition, and the phosphorus flow rate is 3 to 6 parts by weight. The electroless nickel plating solution (QP60 Ni -A) is composed of 15 to 30 parts by weight of nickel sulfate, 1 to 10 parts by weight of stabilizers and 70 to 80 parts by weight of water, and the second electroless nickel plating solution contains 1 to 10 parts by weight of ammonia 10 to 20 parts by weight of hypophosphite, 10 to 20 parts by weight of stabilizer and 70 to 80 parts by weight of pure water.

4. SMT process

The SMT (Surface Mount Technology) process is a process for automatically mounting components including semiconductors, diodes, and chips on a mold where the circuit is formed by using the equipment. In order to electrically connect the parts, a bond or a cream solder .

According to the present invention, since the composite sensor can be configured in a shape corresponding to the shape of the empty space inside the switchgear, it is possible to easily secure the space inside the switchboard in which the composite sensor is installed, and the sensor can be configured on the surface of the mold. The sensor can be manufactured in a very small size.

In addition, since the state of the switchboard is transmitted from the hybrid sensor to the user's mobile device, the change of the internal state of the switchboard can be checked at any time, so that malfunctions and defects of the switchboard can be confirmed or prevented.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

10: Enclosure 20: Composite sensor
30: Mobile devices
100:
110: temperature detection module 120: vibration detection module
200: control unit 300: communication unit
400:

Claims (3)

  1. A multifunctional sensor installed inside a switchboard for detecting temperature and vibration, and a mobile device for communicating with the multifunctional sensor via a communication network to display an internal state of the switchboard,
    In the composite sensor,
    A composite sensor unit including a temperature detection module for detecting a temperature inside the switchgear and a vibration detection module for detecting vibration applied to a switchboard;
    A controller for determining whether the sensed value exceeds a set value for each detected value based on the sensing value detected by the complex sensor unit and outputting a warning message when it is determined that the detected value exceeds the set value; And
    A communication unit for transmitting a warning message output from the control unit to a mobile device installed in the server management application through a communication network;
    Lt; / RTI >
    The composite sensor unit, the control unit, and the communication unit are integrated on a molding surface of a three-dimensional shape,
    In the composite sensor,
    A mold, a circuit, and the chip are integrally formed after a plating process is performed after a pattern of a thermoplastic resin is selectively processed using a laser, and the chip is integrated after the plating process.
    An injection step of injecting a mold having a three-dimensional shape corresponding to a space in which the complex sensor is disposed in the switchgear using an injection material containing a laser reactant containing a metal component;
    The mold injected through the injection step is rotated or moved to irradiate laser light onto the surface of the mold formed in three dimensions to remove a part of the surface of the mold while leaving a metal component through a physical reaction or a chemical reaction, A laser pattern forming step of forming a predetermined pattern on a surface of the mold;
    A plating step of forming a coating film on a pattern in which a metal component is exposed in the laser pattern forming step to form a circuit, in an electroless state; And
    An SMT (Surface Mount Technology) process in which a semiconductor, a diode, and a component including a chip are mounted on a mold in which the circuit is formed to electrically connect the component and the circuit;
    Wherein the first and second sensors are connected to each other.
  2. The method according to claim 1,
    In the plating step,
    (QP-50-Cu-B) in an amount of 70 to 90 ml / l and a complexing agent (QP-50-Cu-A) in an amount of 750 to 780 ml / A mold was immersed in a plating solution containing 30 to 50 ml / l of a stabilizer (QP-50-Cu-C) and 2 to 4 ml / l of a stabilizer (QP-50-Cu stabilizer) at a temperature of 40 to 70 ° C for 20 to 30 minutes A strike step of forming a coating film on the circuit pattern on the mold, which is the injection product; And
    (QP60 Ni-A) of 55 to 60 ml / l and a second electroless nickel plating solution (QP60 Ni-A) with pure water or ion exchanged water 750 to 780 ml / B) a plating solution containing 140 to 150 ml / l is heated to a temperature of 57 to 80 ° C, a pH of 5.5 to 6, and a metal nickel concentration of 5.0 to 6.0 g / l to immerse the mold to form a nickel metal film on the circuit pattern Plating process;
    Wherein the first and second sensors are connected to each other.
  3. The method according to claim 1,
    Wherein the temperature detection module and the vibration detection module comprise:
    And transmits the detected value to the control unit only when the detected value satisfies the condition.
KR1020150162104A 2015-11-18 2015-11-18 Switchgear apply composite sensor for integrated mold KR101590039B1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120013838A (en) * 2010-08-06 2012-02-15 삼성전기주식회사 Electronic device having antenna pattern embeded in case and method for manufacturing the same
KR101264344B1 (en) 2012-11-23 2013-05-14 (주) 동보파워텍 Digital controlling system for monitoring internal abnormal state of switchgear
KR101365398B1 (en) * 2013-04-29 2014-02-20 김나운 Earthquake disaster prevention system built-in switchgear and control method thereof
KR20140122771A (en) * 2013-04-10 2014-10-21 지투파워 (주) A high voltage panel, low voltage panel, distribution panel and motor control panel for fire sensing function using multiple condition monitoring and diagnosis sensor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120013838A (en) * 2010-08-06 2012-02-15 삼성전기주식회사 Electronic device having antenna pattern embeded in case and method for manufacturing the same
KR101264344B1 (en) 2012-11-23 2013-05-14 (주) 동보파워텍 Digital controlling system for monitoring internal abnormal state of switchgear
KR20140122771A (en) * 2013-04-10 2014-10-21 지투파워 (주) A high voltage panel, low voltage panel, distribution panel and motor control panel for fire sensing function using multiple condition monitoring and diagnosis sensor
KR101365398B1 (en) * 2013-04-29 2014-02-20 김나운 Earthquake disaster prevention system built-in switchgear and control method thereof

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