KR101589932B1 - 웨이퍼 상의 다이를 검측하는 방법 - Google Patents

웨이퍼 상의 다이를 검측하는 방법 Download PDF

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Publication number
KR101589932B1
KR101589932B1 KR1020140097210A KR20140097210A KR101589932B1 KR 101589932 B1 KR101589932 B1 KR 101589932B1 KR 1020140097210 A KR1020140097210 A KR 1020140097210A KR 20140097210 A KR20140097210 A KR 20140097210A KR 101589932 B1 KR101589932 B1 KR 101589932B1
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KR
South Korea
Prior art keywords
wafer
dicing tape
removable
microscope
laminae
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Application number
KR1020140097210A
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English (en)
Korean (ko)
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KR20150032460A (ko
Inventor
타-웨이 후
춘-웨이 창
Original Assignee
예우 펭 트레딩 코. 엘티디
홍-밍 테크놀로지 코. 엘티디.
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Application filed by 예우 펭 트레딩 코. 엘티디, 홍-밍 테크놀로지 코. 엘티디. filed Critical 예우 펭 트레딩 코. 엘티디
Publication of KR20150032460A publication Critical patent/KR20150032460A/ko
Application granted granted Critical
Publication of KR101589932B1 publication Critical patent/KR101589932B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020140097210A 2013-09-18 2014-07-30 웨이퍼 상의 다이를 검측하는 방법 KR101589932B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW102133840A TWI487896B (zh) 2013-09-18 2013-09-18 檢測晶圓上的晶粒的方法
TW102133840 2013-09-18

Publications (2)

Publication Number Publication Date
KR20150032460A KR20150032460A (ko) 2015-03-26
KR101589932B1 true KR101589932B1 (ko) 2016-01-29

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ID=53025592

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140097210A KR101589932B1 (ko) 2013-09-18 2014-07-30 웨이퍼 상의 다이를 검측하는 방법

Country Status (2)

Country Link
KR (1) KR101589932B1 (zh)
TW (1) TWI487896B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107230647A (zh) * 2016-03-24 2017-10-03 郑竹岚 晶粒检测方法
TWI610380B (zh) * 2016-03-24 2018-01-01 鄭竹嵐 晶粒檢測方法
CN109813725A (zh) * 2019-04-02 2019-05-28 东莞博美特自动化科技有限公司 一种大尺寸胶水缺陷检测方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000014632A (ko) * 1998-08-22 2000-03-15 이구택 슬래그층의 두께측정방법
KR100725289B1 (ko) * 2005-03-17 2007-06-07 엘에스전선 주식회사 반도체 제조용 접착 테이프 제조장치 및 그 제조방법
KR20080015363A (ko) * 2006-08-14 2008-02-19 야마하 가부시키가이샤 웨이퍼 및 반도체 소자의 검사 방법 및 장치
KR100874953B1 (ko) * 2006-09-20 2008-12-19 삼성전자주식회사 반도체 웨이퍼 고정 장치

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Publication number Publication date
TW201512650A (zh) 2015-04-01
KR20150032460A (ko) 2015-03-26
TWI487896B (zh) 2015-06-11

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