KR101458288B1 - 열 경화성 수지 조성물 및 인쇄 배선판 - Google Patents

열 경화성 수지 조성물 및 인쇄 배선판 Download PDF

Info

Publication number
KR101458288B1
KR101458288B1 KR1020127025361A KR20127025361A KR101458288B1 KR 101458288 B1 KR101458288 B1 KR 101458288B1 KR 1020127025361 A KR1020127025361 A KR 1020127025361A KR 20127025361 A KR20127025361 A KR 20127025361A KR 101458288 B1 KR101458288 B1 KR 101458288B1
Authority
KR
South Korea
Prior art keywords
resin composition
thermosetting resin
compound
aromatic ring
carboxyl group
Prior art date
Application number
KR1020127025361A
Other languages
English (en)
Korean (ko)
Other versions
KR20120132534A (ko
Inventor
요시토모 아오야마
가즈노리 니시오
Original Assignee
다이요 홀딩스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이요 홀딩스 가부시키가이샤 filed Critical 다이요 홀딩스 가부시키가이샤
Publication of KR20120132534A publication Critical patent/KR20120132534A/ko
Application granted granted Critical
Publication of KR101458288B1 publication Critical patent/KR101458288B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/06—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
    • C08L101/08—Carboxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062—Copolymers with monomers not covered by C08L33/06
    • C08L33/064—Copolymers with monomers not covered by C08L33/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
KR1020127025361A 2010-03-31 2011-03-31 열 경화성 수지 조성물 및 인쇄 배선판 KR101458288B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010083850 2010-03-31
JPJP-P-2010-083850 2010-03-31
PCT/JP2011/058179 WO2011125821A1 (ja) 2010-03-31 2011-03-31 熱硬化性樹脂組成物及びプリント配線板

Publications (2)

Publication Number Publication Date
KR20120132534A KR20120132534A (ko) 2012-12-05
KR101458288B1 true KR101458288B1 (ko) 2014-11-04

Family

ID=44762759

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127025361A KR101458288B1 (ko) 2010-03-31 2011-03-31 열 경화성 수지 조성물 및 인쇄 배선판

Country Status (4)

Country Link
JP (1) JP5542915B2 (ja)
KR (1) KR101458288B1 (ja)
CN (1) CN102834456B (ja)
WO (1) WO2011125821A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103320808A (zh) * 2013-05-31 2013-09-25 孙挺 一种金属表面清洗剂

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007322546A (ja) * 2006-05-30 2007-12-13 Taiyo Ink Mfg Ltd 光硬化性・熱硬化性ソルダーレジスト組成物およびそれを用いたプリント配線板
JP2008266531A (ja) * 2007-04-24 2008-11-06 Matsushita Electric Works Ltd ハロゲンフリーエポキシ樹脂組成物、カバーレイフィルム、ボンディングシート、プリプレグ、プリント配線板用積層板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4839934B2 (ja) * 2005-05-13 2011-12-21 日立化成工業株式会社 硬化性樹脂組成物、プリプレグ、基板、金属箔張積層板、樹脂付金属箔及びプリント配線板
TWI357536B (en) * 2006-10-24 2012-02-01 Taiyo Ink Mfg Co Ltd Photosetting and thermosetting solder resist ink c
JP4538484B2 (ja) * 2006-10-24 2010-09-08 太陽インキ製造株式会社 光硬化性熱硬化性樹脂組成物およびそれを用いたプリント配線板
JP4983341B2 (ja) * 2007-03-30 2012-07-25 住友ベークライト株式会社 銅箔付き絶縁樹脂シート、多層プリント配線板、多層プリント配線板の製造方法および半導体装置
JP2009194222A (ja) * 2008-02-15 2009-08-27 Denki Kagaku Kogyo Kk 白色のアルカリ現像型光硬化性・熱硬化性ソルダーレジスト組成物、及びそれを用いた金属ベース回路基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007322546A (ja) * 2006-05-30 2007-12-13 Taiyo Ink Mfg Ltd 光硬化性・熱硬化性ソルダーレジスト組成物およびそれを用いたプリント配線板
JP2008266531A (ja) * 2007-04-24 2008-11-06 Matsushita Electric Works Ltd ハロゲンフリーエポキシ樹脂組成物、カバーレイフィルム、ボンディングシート、プリプレグ、プリント配線板用積層板

Also Published As

Publication number Publication date
JP5542915B2 (ja) 2014-07-09
WO2011125821A1 (ja) 2011-10-13
JPWO2011125821A1 (ja) 2013-07-11
KR20120132534A (ko) 2012-12-05
CN102834456A (zh) 2012-12-19
CN102834456B (zh) 2016-03-30

Similar Documents

Publication Publication Date Title
KR20110095095A (ko) 솔더 레지스트 조성물 및 인쇄 배선판
JP6054012B2 (ja) 硬化性樹脂組成物およびそれを用いたプリント配線板と反射板
JP6399905B2 (ja) 硬化性樹脂組成物、ソルダーレジスト形成用硬化性樹脂組成物、硬化塗膜およびプリント配線板
JP5479821B2 (ja) ソルダーレジスト層及びプリント配線板
KR20090068305A (ko) 광 경화성ㆍ열 경화성 솔더 레지스트 조성물 및 이것을사용한 인쇄 배선판
TW200830047A (en) Photocurable thermosetting resin composition and printed wiring board using the same
WO2016157587A1 (ja) 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
US20240061334A1 (en) Solder resist composition, dry film, printed wiring board, and methods for manufacturing same
JP5636209B2 (ja) ソルダーレジスト組成物およびプリント配線板
JP5734722B2 (ja) 難燃性熱硬化性樹脂組成物、その硬化物及びそれを用いたプリント配線板
KR20140050550A (ko) 경화성 수지 조성물, 솔더 레지스트 형성용 경화성 수지 조성물, 경화 도막 및 프린트 배선판
KR101708987B1 (ko) 솔더 레지스트 조성물 및 인쇄 배선판
KR20160079681A (ko) 경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판
KR101458288B1 (ko) 열 경화성 수지 조성물 및 인쇄 배선판
JP6019065B2 (ja) ソルダーレジスト組成物およびプリント配線板
JP5663506B2 (ja) ソルダーレジスト組成物
JP2011215384A (ja) ソルダーレジスト組成物およびプリント配線板
JP2015212841A (ja) 硬化性樹脂組成物およびそれを用いたプリント配線板と反射板
KR20240123967A (ko) Led용 격벽재 조성물 및 이로부터 유도된 각종 물품
KR20230057928A (ko) 경화성 투명 수지 조성물 및 이로부터 유도된 각종 물품
KR20230169710A (ko) 경화성 투명 수지 조성물 및 이로부터 유도된 각종 물품
JP2023062784A (ja) 感光性樹脂組成物、その積層体および硬化物、ならびにその硬化物を有する透明材料
JP2014102524A (ja) ソルダーレジスト層及びプリント配線板

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20171020

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20181023

Year of fee payment: 5