KR101439565B1 - 플립 칩 반도체 패키지용 접속 구조, 빌드업층 재료, 봉지 수지 조성물 및 회로 기판 - Google Patents

플립 칩 반도체 패키지용 접속 구조, 빌드업층 재료, 봉지 수지 조성물 및 회로 기판 Download PDF

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Publication number
KR101439565B1
KR101439565B1 KR1020097002046A KR20097002046A KR101439565B1 KR 101439565 B1 KR101439565 B1 KR 101439565B1 KR 1020097002046 A KR1020097002046 A KR 1020097002046A KR 20097002046 A KR20097002046 A KR 20097002046A KR 101439565 B1 KR101439565 B1 KR 101439565B1
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KR
South Korea
Prior art keywords
resin
resin composition
circuit board
layer
semiconductor package
Prior art date
Application number
KR1020097002046A
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English (en)
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KR20100014220A (ko
Inventor
겐야 다치바나
마사히로 와다
다쿠야 하타오
Original Assignee
스미토모 베이클리트 컴퍼니 리미티드
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Priority to JP2007092937 priority Critical
Priority to JPJP-P-2007-092937 priority
Application filed by 스미토모 베이클리트 컴퍼니 리미티드 filed Critical 스미토모 베이클리트 컴퍼니 리미티드
Priority to PCT/JP2008/056069 priority patent/WO2008123414A1/ja
Publication of KR20100014220A publication Critical patent/KR20100014220A/ko
Application granted granted Critical
Publication of KR101439565B1 publication Critical patent/KR101439565B1/ko

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