KR101407116B1 - Electronic control apparatus for vehicle using overmolding and manufacturing method thereof - Google Patents

Abstract

The present invention provides an electronic control apparatus for a vehicle using overmolding to ensure excellent heat radiation effects by radiating heat directly to the atmosphere through a radiation fin exposed to the outside as the radiation fin is attached to the opposite side to a part of electronic control elements to radiate heat into a form of a surface mounted device (SMD) and the electronic control elements are overmolded to make the radiation fin partially exposed to the outside, to simplify the manufacturing process by forming a housing using a molding resin after the attachment of the radiation fin into a form of an SMD, and to ensure excellent waterproofing performance by covering the electronic control elements with the molding resin; and a manufacturing method for the same.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an electronic control apparatus for a vehicle using overmolding,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic control unit for a vehicle, and more particularly, to an electronic control unit having a heat dissipation and waterproof structure using an overmolding in an electronic control unit such as an engine ECU .

Generally, an electronic control device such as an ECU for electronically controlling various devices is mounted on a vehicle. Such an electronic control device is provided with information from sensors or switches installed in each part of the vehicle. The electronic control unit processes the information thus provided to improve ride comfort and safety of the vehicle or to perform various electronic controls to provide drivers and passengers with various conveniences.

For example, electronic control devices such as ECUs that control the state of an engine, an automatic transmission, and an ABS (Anti-Lock Brake System) of a vehicle with a computer are developed not only with the development of automobiles and computers but also with automatic transmission control, Braking system, steering system and so on.

An electronic control device such as an ECU or the like includes a case composed of an upper cover and a lower base, a printed circuit board (PCB) accommodated in the case, a connector coupled to the front end of the PCB for external socket connection .

In addition, the case covers the PCB and covers the PCB, and the case is assembled together. Particularly, when assembled between the cover and the base, the connector interposed therebetween has a sealing structure with the cover side and the base side.

Such an electronic control unit requires a predetermined sealing structure capable of preventing moisture and foreign substances from entering into the inside of the electronic control unit because it has a high degree of integrated control circuit means, A sealing structure for protecting a PCB and the like inside a method of assembling a cover and a base together with a connector in a state of inserting a sealing material is mainly applied.

On the other hand, in the electronic control device, a heating element is formed on the upper surface of the PCB, and a heat dissipation paste is attached to the lower surface of the PCB. The cover and base are then screwed together. Here, the structure joined by the screw method can be loosened and there is a possibility that the contaminants or moisture may enter from outside. Further, in the conventional electronic control apparatus, heat generated in the heat generating element is emitted by the cover surrounding the PCB. To this end, the cover may include a portion capable of emitting heat. However, the heat generated from the heating element of the PCB may not be directly discharged to the outside through the base of the metal material, so that the heat radiation performance may be deteriorated.

In the embodiments of the present invention, a heat dissipation fin is attached to the opposite surface of the electronic control element in the form of a surface mount device (SMD), and a part of the heat dissipation fin is exposed By the molding, the heat is radiated directly to the atmosphere through the heat-dissipating fins externally exposed, the heat radiation effect is excellent, the heat dissipation fins are attached in the form of surface mount elements, and the housing is formed of the resin for the mold, The present invention is to provide an electronic control device for a vehicle using an overmolding and a method of manufacturing the same, which is excellent in waterproof function by wrapping a control element with a mold resin.

According to a first aspect of the present invention, there is provided an electronic control device comprising: an electronic control element consisting of an electronic control board electrically controlling each part of an automobile and a heating element located on one surface of the electronic control board; A heat dissipation fin attached to the other surface portion of the other surface of the electronic control substrate opposite to the one surface portion where the heat generating element is disposed, for dissipating heat of the heat dissipation element; A connector having a connector pin, the connector coupled with the electronic control element; And an overmold housing for overmolding the electronic control element with the heat dissipation fin by overmolding the heat dissipation fin with the resin for molding by exposing a part of the heat dissipation fin attached to the other surface portion of the electronic control board. An electronic control device of the present invention can be provided.

The heat dissipation fin is attached to the other surface portion opposite to the one surface portion where the heat generating element is disposed, in the form of a surface mounted device (SMD).

The heat dissipation fin is attached in the form of a surface mount element after solder paste is applied in advance on the other surface portion opposite to the one surface portion where the heat generating element is located or under the adhesion portion of the heat dissipation fin.

The heat dissipation fin is characterized in that the fin and the fin of the metal material are filled with the heat dissipation material or the mold material.

The heat dissipation fin is characterized in that a plurality of heat dissipation fins are attached to the heat dissipation fin in the form of a surface mount element on the other surface portion opposite to the one surface portion on which the heat dissipation element is disposed.

The plurality of heat dissipation fins are attached to the heat dissipation fins in the form of surface mount elements, the plurality of heat dissipation fins having different heights or widths on the other surface portion opposite to the one surface portion of the heat dissipation element.

Wherein the overmold housing is injection-molded in a state in which it is maintained at a predetermined critical temperature and pressure of the electronic control board or the heating element.

According to a second aspect of the present invention, there is provided an electronic control unit comprising: an electronic control board electrically controlling each part of an automobile; and a connector having an electronic control element having a heating element located on one side of the electronic control board, step; Attaching a heat dissipation fin to the other surface portion of the other surface of the electronic control substrate opposite to the one surface portion where the heat generating element is disposed; And an electronic control element having the radiating fins attached thereto in an upper mold and a lower mold which are overmolded so that a part of the radiating fin attached to the other surface of the electronic control board is exposed, Wherein the electronic control device includes:

The manufacturing method may further include a step of applying a solder paste to a surface of the heat dissipation fin before the step of attaching the heat dissipation fin, a surface of the dissimilar portion opposite to the surface of the heat dissipation device, or an adhesive portion of the heat dissipation fin.

The manufacturing method may further include the step of filling a heat dissipation material or a molding material into the inside of the heat dissipation fin.

The step of attaching the heat dissipation fins may include attaching a plurality of heat dissipation fins in the form of surface mount elements to the other surface portion opposite to the one surface portion where the heat generating element is disposed, in order to improve the heat dissipation performance.

Wherein the overmolding step is performed by injection-molding the electronically controlled element to which the heat-radiating fin is attached in a state in which the mold is maintained at a predetermined critical temperature and pressure of the electronic control board or the heating element.

Embodiments of the present invention are directed to a method of manufacturing a semiconductor device having a structure in which heat generated in a heat generating element is directly discharged to the atmosphere through a part of a heat dissipating fin attached in the form of a surface mount element (SMD) It is effective. In particular, the embodiments of the present invention can be applied to a mold resin that overmolds a part of the heat-radiating fins to the outside so that heat generated in the heat-generating element can be directly discharged to the atmosphere as a part of the heat- .

In addition, embodiments of the present invention can simplify the manufacturing process of the electronic control device by attaching the heat dissipation fin in the form of a surface mount element, then inserting the electronic control element having the heat dissipation fin into the mold and forming the housing with the mold resin There is an effect.

In addition, embodiments of the present invention have an effect of excelling in the waterproof function by covering the electronic control element including the heating element and the PCB and the connector with the resin for the mold.

In addition, the embodiments of the present invention have the effect that the electronic control device can be made lighter than other housings because the housing is formed of the overmolded housing.

1A and 1B are perspective views showing an electronic control unit of an automobile according to an embodiment of the present invention.
2 is a cross-sectional view illustrating an electronic control unit for an automobile according to an embodiment of the present invention.
3A to 3C are process diagrams for a method of manufacturing an electronic control device for a vehicle using overmolding according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The configuration of the present invention and the operation and effect thereof will be clearly understood through the following detailed description. Before describing the present invention in detail, the same components are denoted by the same reference symbols as possible even if they are displayed on different drawings. In the case where it is judged that the gist of the present invention may be blurred to a known configuration, do.

FIG. 1A and FIG. 1B are perspective views showing an electronic control apparatus for an automobile according to an embodiment of the present invention, and FIG. 2 is a sectional view showing an electronic control apparatus for an automobile according to an embodiment of the present invention.

As shown in Figs. 1A and 1B, an electronic control unit is an electronic control unit that electrically controls each part of an automobile, for example, an integrated control circuit unit such as a PCB 110, A heat dissipating structure for discharging the heat generated from the heat generating element 111 located in the housing 110 to the atmosphere and a housing structure for preventing moisture and foreign substances from entering the outside. The electronic control unit has an overmolded housing 100 having an overmolding structure while accommodating the PCB 110 and the like therein. The connector 120 is coupled to the front portion of the overmold housing 100.

To prevent moisture or foreign matter from entering the outside, the overmolded housing 100 is overmolded in the form of surrounding the electronic control element. The overmolded housing 100 includes a heating element portion 101 that is overmolded to surround the heating element 111. In order to release heat generated from the heat generating element 111, the overmold housing 100 is molded so that a part of the heat radiating fin 112 is exposed. The overmolded housing 100 may be molded so that only a part of the heat radiating fin 112 is exposed to the outside.

2, an automotive electronic control device according to an embodiment of the present invention includes an electronic control element including a PCB 110 and a heating element 111 of the PCB 110, a heat radiating fin 112, A connector 120 and an overmolded housing 100.

The electronic control element comprises a PCB 110 for electrically controlling each part of the automobile and a heating element 111 located on one side of the PCB 110. Here, the PCB 110 may be a surface mounting substrate.

The heat dissipation fins 112 may be formed in the form of a surface mount device (SMD) on the other surface opposite to the surface of the PCB 110 where the heat generating element 112 is located, 201, respectively. Here, the heat radiating fin 112 may be directly mounted on the surface of the PCB 110 and attached thereto. Solder paste may be applied to the other surface portion opposite to the one surface portion of the heat generating element 112 before the heat dissipation fin 112 is attached. Here, the solder paste is a cream-like lead used to print lead on the PCB 110, and the solder powder and the flux are mixed. The solder paste printed by the screen printer can be melted in the heater and the heat dissipation fin 112 can be bonded to the PCB 110. The components of the solder paste are solder alloy powder and the remainder are flux, and most of the flux is resin and solvent, and may contain trace amounts of activator and activator. The heat dissipation fin 112 is not limited to a specific shape having a concavo-convex shape shown in Fig. For example, the heat dissipation fin 112 may have various shapes such as a square shape, a circular shape, and a polygonal shape.

In addition, the heat dissipation fin 112 can be advantageously applied to manufacture the heat dissipation fin 112 such that the width, height, and the like of the fin exposed to the outside are kept constant. However, the width and height of the heat radiating fin 112 may be different from each other depending on the temperature of the heat generated in the heat generating element 111, and may be attached to the other surface portion of the PCB 110 as the surface mount element 201.

The heat radiating fin 112 may be made of a metal material or a material having excellent heat radiation performance. For example, as shown in FIG. 1B, the heat dissipation fin 112 may be formed in such a form that a pin and a pin of a metal material are filled with a heat dissipation material or a mold material. The shape of the heat dissipation fin 112 filled with the heat dissipation resin or the mold resin is better than that in which the heat dissipation fin 112 is emptied.

Here, the heat generating element 111 may be located on the top side or the bottom side of the PCB 110. When the heat generating element 111 is located on the upper surface of the PCB 110, the heat radiating fin 112 is attached to the lower surface of the PCB 110 as a surface mount element type 201. Conversely, when the heat generating element 111 is located on the lower surface of the PCB 110, the heat dissipating fin 112 is attached to the upper surface of the PCB 110 as a surface mount element type 201.

The connector 120 has a connector pin 121 and is coupled to an electronic control element. The connector 120 is connected to the electronic control element via the connector pin 121. The connector pin 121 may have a plurality of pins for connection with the PCB 110 and a plurality of pins for connection with the outside. The connector 120 may be coupled together in an interlocking manner with the electronic control element. The connector 120 may be formed integrally with a front end portion and a rear end portion which are exposed to the outside.

The overmolded housing 100 is configured to overmold the electronic control element with the heat dissipation fin 112 to a mold resin. At this time, the overmolded housing 100 is overmolded so that a part of the heat dissipation fin 112 is exposed to the air while the entire PCB 110 is overmolded.

The overmold housing 100 may be formed by overmolding the entire PCB 110 to which the heat dissipation fin 112 is attached so that a portion of the heat dissipation fin 112 Is exposed to the outside. This can protect the electronic control element including the PCB 110 and the heat generating element 111 from moisture inflow when the whole of the PCB 110 except the part of the heat dissipation fin 112 is covered with the mold resin. Further, heat can be directly discharged into the air through a part of the heat radiating fin 112.

On the other hand, the overmolded housing 100 can be overmolded with a resin material which is injection molded below a preset temperature and pressure. This is to prevent the occurrence of a failure in the heat generating element 111 or the like due to high-temperature or high-pressure injection molding. The overmolded housing 100 may be made of a hardened plastic such as a thermosetting material. The overmolded housing 100 may also be made of an elastic plastic material such as a thermoplastic elastomeric material.

The heating element 111 is located on the upper surface of the PCB 110. The heat radiating fin 112 is attached to the lower surface which is the opposite surface of the portion where the heat generating element 111 is located, in the form of surface mount element 201. The overmold housing 100 encapsulates and surrounds the heating element 111 and the PCB 110. The heat generated in the heat generating element 111 is directly discharged to the atmosphere 302 through a part of the heat dissipation fin 112 exposed to the outside through the PCB 110. [ As described above, the electronic control device emits heat directly to the atmosphere through a part of the heat radiating fin 112 exposed to the outside, so that the heat radiating effect is excellent.

3A to 3C are process diagrams for a method of manufacturing an electronic control device for a vehicle using overmolding according to an embodiment of the present invention.

A manufacturing method of an electronic control apparatus for a vehicle according to an embodiment of the present invention is manufactured in the order of FIGS. 3A to 3C.

3A, the manufacturing process of the electronic control apparatus includes an electronic control element having a PCB 110 electrically controlling each part of the automobile and a heating element located on one side of the PCB 110, and a connector pin 121 (Not shown).

In the manufacturing process of the electronic control unit, the heat dissipation fin 112 is attached to the other surface portion formed on the lower surface portion of the PCB 110 in the form of a surface mount device. At this time, in the manufacturing process of the electronic control device, the solder paste is applied to the lower surface portion of the PCB 110 opposite to the upper surface portion where the heat generating element 111 is located, or under the adhesive portion of the heat dissipating fin 112 The heat dissipation fin 112 can be attached in the form of a surface mount element.

Here, when a plurality of heating elements 111 are present on the PCB 110, the manufacturing process of the electronic control apparatus may correspond to the heat dissipation fin 112 so as to cover the respective heating elements 111. When the heat generated by the heat generating element 111 is higher than the predetermined temperature, the manufacturing process of the electronic control apparatus is such that a plurality of And the heat radiating fins 112 can be respectively attached. At this time, in the manufacturing process of the electronic control device, the solder paste is applied to the lower surface of the PCB 110 or the bonding portion of the heat-radiating fin 112 so that a plurality of heat- The heat dissipation fin 112 can be attached in the form of an element.

3B, the manufacturing process of the electronic control device includes the steps of attaching the heat-radiating fins 112 in the upper and lower dies 301 and 302 and attaching the heat-generating elements 111, the connector 120, and the PCB 110, Into the electronic control element. Here, the upper mold 301 may have a concave portion corresponding to a portion where the heat generating element 111 is located. The lower mold 302 has a structure in which a part of the heat dissipation fin 112 is overmolded in the lower surface of the PCB 110 so as to be exposed to the outside. That is, the lower mold 302 has a structure in which the molding resin is overmolded so that only a part of the heat dissipation fin 112 attached to the PCB 110 is overmolded and a part of the remaining heat dissipation fin 112 is exposed to the outside . The upper and lower dies 301 and 302 have a shape in which a part of the connector 120 is located outside the mold.

The manufacturing process of the electronic control device then injects the resin for the mold through the injection port between the upper and lower molds 301 and 302 for injection to overmold the electronic control element. At this time, the manufacturing process of the electronic control device maintains the inside of the upper and lower dies 301 and 302 at a predetermined critical temperature and pressure of the PCB 110 or the heating element 111, The electronic control element is injection molded.

As shown in FIG. 3C, the manufacturing process of the electronic control device removes the upper and lower dies 301 and 302 after overmolding of the electronic control element. Then, the electronic control unit has a heat generating element portion 101 where the heat generating element 111 is located, and a part of the heat radiating fin 112 is exposed to the outside. The molding operation of the overmolded housing 100 having the structure in which a part of the heat radiating fin 112 is exposed to the outside and the remaining part of the heat radiating fin 112 is overmolded is completed.

The foregoing description is merely illustrative of the present invention, and various modifications may be made by those skilled in the art without departing from the spirit of the present invention. Accordingly, the embodiments disclosed in the specification of the present invention are not intended to limit the present invention. The scope of the present invention should be construed according to the following claims, and all the techniques within the scope of equivalents should be construed as being included in the scope of the present invention.

The present invention is characterized in that a radiating fin is attached in the form of a surface mount element on the opposite surface of a part requiring heat radiation in an electronic control element and the radiating fin exposed to the outside is overmolded by exposing a part of the radiating fin to the outside The heat dissipation effect is excellent and the heat dissipation fins are attached in the form of surface mount elements and the housing is formed by the resin for the mold to simplify the manufacturing process and the electronic control element is wrapped with the resin for the mold, The function can be excellent. In this respect, it is not only the use of the related technology but also the possibility of commercialization or operation of the applied device, as it exceeds the limit of the existing technology.

100: overmold housing 101: heating element part
110: PCB 111: heating element
112: heat sink pin 120: connector
121: Connector pin 301: Upper mold
302: Lower mold

Claims (12)

An electronic control element comprising an electronic control board electrically controlling each part of the vehicle and a heating element located on one side of the electronic control board;
A heat dissipation fin attached to the other surface portion of the other surface of the electronic control substrate opposite to the one surface portion where the heat generating element is disposed, for dissipating heat of the heat dissipation element;
A connector having a connector pin, the connector coupled with the electronic control element; And
An overmold housing for overmolding the electronic control element with the heat dissipation fin by overmolding the heat dissipation fin with resin for molding by exposing a part of the heat dissipation fin attached to the other surface portion of the electronic control board,
And an electronic control unit for controlling the electronic control unit of the vehicle.
The method according to claim 1,
The heat-
(SMD) mounted on the other surface portion opposite to the one surface portion on which the heat generating element is disposed.
The method according to claim 1,
The heat-
Wherein a solder paste is preliminarily applied to the other surface portion opposite to the one surface portion on which the heat generating element is disposed or under an adhesive portion of the heat dissipation fin and then attached in the form of a surface mount device.
The method according to claim 1,
The heat-
Wherein the pins and the pins of the metal material are filled with a material for heat dissipation or a material for a mold.
The method according to claim 1,
The heat-
Wherein a plurality of heat dissipation fins are attached in the form of surface mount elements to the other surface portion opposite to the one surface portion where the heat generating element is disposed, in order to improve the heat dissipation performance.
6. The method of claim 5,
The heat-
Wherein a plurality of heat dissipation fins having different heights or widths are attached in the form of surface mount elements to the other surface portion opposite to the one surface portion on which the heat generating element is disposed, in order to increase the heat dissipation performance.
The method according to claim 1,
The overmolded housing comprises:
Wherein the injection molding is performed in a state in which the predetermined critical temperature and pressure of the heating control device or the heating control device are maintained at a predetermined value or less.
Coupling a connector having an electronic control element and a connector pin with an electronic control board electrically controlling each part of the vehicle and a heating element located on one side of the electronic control board;
Attaching a heat dissipation fin to a surface of the other surface of the electronic control substrate opposite to a surface of the heat dissipation device; And
Placing an electronic control element having the heat dissipation fin in the upper and lower molds which are overmolded so that a part of the heat dissipation fin attached to the other surface of the electronic control substrate is exposed,
Wherein the electronic control device comprises:
9. The method of claim 8,
Before the step of attaching the heat-radiating fin, when the solder paste is applied onto the other surface portion opposite to the one surface portion where the heat-generating element is located or under the adhesive portion of the heat-
Further comprising the steps of:
9. The method of claim 8,
Filling the inside of the attached heat dissipation fin with a heat dissipation material or mold material
Further comprising the steps of:
9. The method of claim 8,
The step of attaching the heat-
Wherein a plurality of heat dissipation fins are attached in the form of surface mount elements to the other surface portion opposite to the one surface portion where the heat generating element is disposed, in order to improve the heat dissipation performance.
9. The method of claim 8,
Wherein the overmolding comprises:
Wherein the electronic control element having the heat dissipation fin is injection-molded in a state in which the mold is maintained at a predetermined critical temperature and pressure of the electronic control substrate or the heating element.

Images