KR101403423B1 - Material supply device for organic light-emitting diode manufacturing process - Google Patents

Abstract

A supplying unit of a metal material supply device for an organic light emitting diode manufacturing process is disclosed. The supplying unit of the present invention comprises: a lower disc in which an injection hole is formed on the outer circumference thereof; and a plurality of upper discs which is coupled to rotate on the lower disc, forms a plurality of through-holes along the outer circumference which successively forms a communication state with the injection hole as the lower disc rotates, and stores deposition material inside the through-holes. The plurality of upper discs is driven to be able to rotate individually around the same axis of rotation as the lower disc, is arranged along the axial direction of the axis of rotation with respect to the lower disc, and is arranged to not be communicated with the plurality of through-holes formed on the adjacent upper discs.

Description

[0001] The present invention relates to a material supply device for an organic light emitting diode

The present invention relates to a supply part of a material supply device for an organic light emitting diode manufacturing process.

In general, organic light emitting diodes (OLEDs) are also referred to as organic diodes and organic ELs. In addition to their rapid response speed, they can be made to be light and thin, And it is attracting attention as a next generation display.

In an organic electroluminescent device provided in a general organic electroluminescent display device, an intermediate layer including at least a light emitting layer is formed between the electrodes facing each other. The intermediate layer may include various layers such as a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, or an electron injection layer. In the case of an organic electroluminescent device, these intermediate layers are organic thin films formed of organic materials.

Metal layers and organic layers, such as a charge transport layer and a charge injection layer, are mainly formed using thermal physical vapor deposition (PVD).

In this process, the organic material is heated to the evaporation point (or sublimation point), and the evaporated organic material is ejected from the deposition source and then coated on the substrate. A typical PVD process utilizes a vapor deposition apparatus comprising a crucible having a high thermal resistance and chemical stability in an evaporation chamber.

The deposition method generally comprises depositing a substrate in a vacuum chamber, and then heating the heating vessel containing the substance to be deposited to evaporate or sublimate the substance to be deposited therein to produce a thin film.

In the process of manufacturing the organic electroluminescent device, the electrodes provided on the upper and lower portions of the intermediate layer may be formed by a deposition method using a deposition apparatus. Needless to say, other wiring and the like can also be formed by a deposition method.

The material of the electrode and the wiring of the organic electroluminescent device generally evaporates at a high temperature, and the evaporation temperature varies depending on the kind of the material. Generally, magnesium (Mg) evaporates at 500 to 600 ° C, silver (Ag) evaporates at 1000 ° C or higher, aluminum (Al) evaporates at around 1000 ° C, and lithium (Li) evaporates at about 300 ° C.

In order to perform such deposition, a material to be evaporated or sublimated (hereinafter, referred to as 'deposition material') must be supplied to a boat or a crucible in which evaporation or sublimation occurs. Conventionally, an evaporation source using a boat is mainly used. A deposition material to be supplied to an evaporation source is supplied in the form of a ball or a pellet, and is supplied to a plurality of evaporation sources by supplying a metal material We need a device.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems of the prior art described above, and it is an object of the present invention to provide an evaporation source which can easily adjust the supply amount of the evaporation material, There is provided a supply part of a metal material supply apparatus for an organic light emitting diode manufacturing process which continuously supplies a metal material in order to enable continuous deposition without exposing the metal (Al) chamber to the atmosphere for a long period of time.

The supply unit of the metal material supply apparatus for manufacturing the organic light emitting diode according to the preferred embodiment of the present invention includes a lower circular plate 102 having a charging hole 105 formed in the outer peripheral portion thereof; And a plurality of through holes successively communicating with the injection holes (105) as they rotate on the lower circular plate (102) so as to be in a communicating state are formed in the outer peripheral portion along the circumferential direction And a plurality of upper circular plates 110, 120, and 130 for storing a deposition material in the through holes, wherein the upper circular plates 110, 120, (190), and are arranged along the axial direction of the rotary shaft (190) with respect to the lower circular plate (102), wherein a plurality of through holes formed in adjacent upper circular plates are not communicated with each other .

The plurality of upper circular plates may include a first upper circular plate 110 disposed on the lower circular plate 102 and a second upper circular plate 120 disposed on the first upper circular plate 110, The first upper disk 110 and the second upper disk 120 are integrally rotated with respect to the lower disk 102. As the first and second upper disks 110 and 120 rotate, A part of the plurality of through holes 112 formed in the upper circular plate 110 is in communication with the lower hole 105 so that the deposition material stored in the through hole 112 can pass through the lower hole 105 And is discharged downward of the lower disk 102.

In addition, the second upper circular plate 120 may be formed in such a manner that after all of the evaporation material stored in the plurality of through holes 112 of the first upper circular plate 110 is discharged downward of the lower circular plate 102, And the coupling with the first upper circular plate 110 is released.

After the evaporation material stored in the plurality of through holes 112 of the first upper circular plate 110 is exhausted, one of the plurality of through holes 112 of the first upper circular plate 110 As the second upper circular plate 120 rotates with respect to the first upper circular plate 110 and the lower circular plate 102 while the second upper circular plate 120 rotates with respect to the first circular plate 110 and the lower circular plate 102, The deposition material stored in the plurality of through holes 122 of the circular plate 120 passes through the through holes 112 of the first upper circular plate 110 in communication with the injection holes 105 and the injection holes 105, To the lower side of the lower disk 102 in order.

The plurality of upper discs may include a third upper disc 130 disposed on the second upper disc 120 and a plurality of through holes 122 formed in the second upper disc 120, One of the plurality of through holes 122 of the second upper circular plate 120 is connected to the upper hole 120 of the first upper plate 120 through the injection hole 105, And the third upper disk 130 is connected to the lower disk 102 and the first and second upper disks 110 and 120 in a state of being connected and fixed together with the through holes 112 of the disk 110. [ As the third upper circular plate 130 rotates, deposition materials stored in the plurality of through holes 132 formed in the third upper circular plate 130 are sequentially transferred through the injection holes 105 And is discharged downward of the lower disk 102.

Further, the driving unit (114, 124, 134) for rotating the upper circular plate is provided separately for each of the plurality of upper circular plates.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to this, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may appropriately define the concept of a term in order to best describe its invention The present invention should be construed in accordance with the spirit and scope of the present invention.

The supply part of the metal material supply device for manufacturing the organic light emitting diode according to the present invention can easily adjust the supply amount of the ball or pellet and the granular deposition material to the evaporation source.

In addition, it is possible to continuously supply the evaporation material in the chamber, since a plurality of the upper disks are provided for storing and supplying the evaporation material, so that it is possible to continuously supply the evaporation material in the chamber without exposing the chamber to the atmosphere for a long time. It is possible to do.

In addition, since the plurality of upper master discs are rotatably driven individually and the deposition material stored in the upper master disc is driven to sequentially exhaust, it is possible to supply the deposition material without interference between the upper master discs in the limited chamber space.

1 is a plan view of a metal material supply apparatus for manufacturing an organic light emitting diode according to an embodiment of the present invention.
2 is a perspective view of the supply unit, the transfer unit, and the deposition unit of FIG. 1;
3 is a cross-sectional view of the metal material feeder for the organic light emitting diode manufacturing process of FIG.
FIG. 4 is a perspective view of the transfer part and the deposition part of FIG. 1;

BRIEF DESCRIPTION OF THE DRAWINGS The objects, particular advantages and novel features of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. It should be noted that, in the present specification, the reference numerals are added to the constituent elements of the drawings, and the same constituent elements are assigned the same number as much as possible even if they are displayed on different drawings. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a plan view of a metal material supply device for manufacturing an organic light emitting diode according to an embodiment of the present invention. FIG. 2 is a perspective view of a supply part, Fig. 4 is a perspective view of the transfer part and the deposition part of Fig. 1; Fig.

Referring to FIG. 1, a metal material supply apparatus for manufacturing an organic light emitting diode according to an exemplary embodiment of the present invention includes a supply unit 100 for supplying a predetermined amount of granular deposition material made of a metal material, A deposition unit 200 installed with a plurality of evaporation sources 210, 220 and 230 rotatably arranged in a circular shape and an evaporation material supplied from the supply unit 100 onto one evaporation source of the deposition unit 200 And a feeding unit 300 for feeding and feeding.

Here, the supply unit 100, the deposition unit 200, and the transfer unit 300 are installed in the base plate 400. The supplying unit 100 discharges a predetermined amount of the evaporation material to the lower part of the supplying unit 100 and the feeding unit 300 receives the evaporation material from the supplying unit 100 and inputs the evaporation material to the evaporation unit 200. The deposition material is introduced into the deposition unit 200 by the transfer unit 300 in a predetermined amount and is heated in the deposition source and deposited on the substrate placed on the deposition sources 210, 220, and 230 of the deposition unit 200 .

Therefore, according to an embodiment of the present invention, the deposition material may be supplied to the deposition unit 200 by a predetermined amount by the supply unit 100 and the transfer unit 300, and may be supplied to the substrate.

First, a specific configuration of the supply unit 100 will be described.

2 and 3, the supply unit 100 includes a lower disk 102 and a plurality of upper disks 110, 120, and 130 spaced apart from each other on a base plate 400 Illustratively showing three upper disks).

An insertion hole 105 is formed in the outer peripheral portion of the lower disk 102, and is fixedly disposed on the base plate 400. The injection holes 105 of the lower disk 102 are arranged to coincide with at least one through hole of an upper disk described later.

The plurality of upper circular disks 110 are coupled and driven on the lower circular disk 102 so as to be individually rotatable about the same rotary shaft 190 with respect to the lower circular disk 102, A plurality of through holes sequentially communicating with the injection holes 105 of the disk 102 are formed along the circumferential direction on the outer circumferential portion and the deposition material is stored in the through holes.

Each of the plurality of upper circular plates is provided with driving portions 114, 124, and 134 for rotating the upper circular plate, so that each of the plurality of upper circular plates can be rotationally driven individually and independently.

The first upper circular plate 110 is rotatably coupled to the upper surface of the lower circular plate 102 and the second upper circular plate 120 is rotatably coupled to the upper surface of the first upper circular plate 110. [ do.

The through holes 112, which are circularly arranged in the first upper disk 110, are temporarily closed by the lower disk 102 (non-burned state). Since the first upper circular plate 110 can be rotated on the lower circular plate 102 so that the first upper circular plate 110 rotates and the through holes 112 of the first upper circular plate 110 and the lower circular plate 102 The deposition material filled in the through hole 112 can be discharged downward of the lower original plate 102 through the injection hole 105 when the hole 105 is communicated (communicated state). At this time, the deposition material is seated on the transfer unit 300 through the injection hole 105.

In the meantime, the present invention is characterized in that the deposition material stored in the through holes of each of the plurality of upper discs is sequentially supplied to the transfer unit. That is, after all the evaporation material stored in the upper disk (for example, the first upper disk) 110 disposed on the lower disk 102 among the plurality of upper disks is exhausted, the upper disk (for example, The second upper original plate 120 and the second upper original plate 120. After the evaporation material stored in the second upper original plate 120 is supplied and the evaporation material stored in the upper original plate 120 is exhausted, (For example, the third upper original plate 130) formed on the upper substrate (e.g.

The plurality of upper circular plates 110, 120 and 130 are disposed on the rotary shaft 190 with respect to the lower circular plate 102 in order to discharge and supply the deposition material in the order of the upper circular plate arranged along the axial direction of the rotary shaft 190, And the plurality of through holes formed in the adjacent upper disk are arranged so as not to communicate with each other. In other words, the through-holes for storing the evaporation material of each upper disk are temporarily closed by the upper disk disposed below.

A method of supplying the deposition material according to the present invention will be described below.

end. The supply of deposition material stored in the first upper disk

The plurality of upper circular plates include a first upper circular plate 110 disposed on the lower circular plate 102 and a second upper circular plate 120 disposed on the first upper circular plate 110. The first upper disk 110 and the second upper disk 120 are integrally rotated with respect to the lower disk 102. The first upper disk 110 and the second upper disk 120 are rotated together, A part of the plurality of through holes 112 formed communicates with the input hole 105 so that the deposition material stored in the through hole is dropped to the lower side of the lower disk 102 through the input hole 105.

The first upper circular plate 110 is integrated with the second upper circular plate 120 and rotates with respect to the lower circular plate 102. In order to sequentially supply the deposition materials in the plurality of upper circular plates, The through hole 122 of the upper circular plate 120 is temporarily closed by the upper surface of the first upper circular plate 110.

In this state, the first upper circular plate 110 and the second upper circular plate 120 become integral with each other and rotate with respect to the fixed lower circular plate 102, and a plurality of through holes (112) sequentially communicate with the injection hole (105). In other words, as the first upper circular plate 110 rotates, the plurality of through holes 112 and the lower hole 105 of the first upper circular plate 110 repeat the communicating state and the non-communicating state.

The deposition material stored in the through hole 112 is introduced into the lower circular plate 102 through the injection hole 105 when the through hole 112 and the injection hole 105 of the first upper circular plate 110 are communicated with each other. And is introduced into the hopper 320 of the transporting unit 300, which will be described later.

As described above, the plurality of through holes 112 of the first upper disk 110 are alternately repeated in the communicating state and the non-communicating state with respect to the input holes 105, and all of the deposition materials stored in the plurality of through holes 112 The supply of the evaporation material stored in the first upper disk 110 is completed.

I. The supply of the deposition material stored in the second upper disk

After the evaporation material stored in the plurality of through holes 112 of the first upper circular plate 110 is exhausted, one of the plurality of through holes 112 of the first upper circular plate 110 is inserted into the injection holes 105 And is fixed together with the lower original plate 102. [0064] The specific through hole 112 of the first upper circular plate 110 and the lower circular hole 102 of the lower circular plate 102 maintain the communication state and the supply passage of the evaporation material from the second upper circular plate 120 do.

Thereafter, the supply of the evaporation material stored in the second upper circular plate 120 is started. The second upper circular plate 120 temporarily connected to the first upper circular plate 110 and rotated while supplying the deposition material stored in the first upper circular plate 110 passes through the plurality of through holes of the first upper circular plate 110, The deposition material stored in the holes 112 is discharged to the lower side of the lower disk 102 to be exhausted and then released from the first upper disk 110 and then separated from the first upper disk 110 , And independently rotate.

As the second upper circular plate 120 rotates with respect to the first upper circular plate 110 and the lower circular plate 102, the evaporation material stored in the plurality of through holes 122 of the second upper circular plate 120 is injected Through the through holes 112 of the first upper circular plate 110 communicating with the upper circular plate 105 and the lower circular plate 102 communicating with the lower circular plate 102 and the transfer hole 300, The hopper 320 of FIG.

The plurality of through holes 122 of the second upper circular plate 120 are alternately repeated in the communicating state and the non-communicating state with respect to the specific through hole 112 and the lower hole 105 of the first upper circular plate 110, , The deposition material stored in the second upper circular plate 120 is completed by exhausting the deposition materials stored in the plurality of through holes 122. [

All. The supply of the deposition material stored in the third upper disk

The plurality of upper disks of the present invention may include a third upper disk 130 disposed on the second upper disk 120.

After the evaporation material stored in the plurality of through holes 122 of the second upper disk 120 is exhausted, one through hole of the plurality of through holes 122 of the second upper disk 120 is inserted into the holes 105 And is coupled and fixed together with the through hole 112 of the first upper circular plate 110 connected to the lower circular plate 102 and the first upper circular plate 110, . Thus, the injection hole 105 of the lower disk 102, the specific through-hole 112 of the first upper disk 110, and the specific through-hole 122 of the second upper disk 120 maintain a communicated state, And becomes a supply passage for the evaporation material from the third upper disk 130.

Then, the supply of the evaporation material stored in the third upper disk 130 is started. The third upper circular plate 130 which is temporarily coupled to the second upper circular plate 120 and rotated while the second upper circular plate 120 is inserted into the second upper circular plate 120, The deposition material stored in the holes 122 is released to the lower side of the lower disk 102 and exhausted, and then released from the second upper disk 120. Thereafter, the deposition material separated from the second upper disk 120 , And independently rotate.

As the third upper disk 130 rotates with respect to the lower disk 102 and the first and second upper disks 110 and 120, the third upper disk 130 is stored in the plurality of through holes 132 of the third upper disk 130 The deposition material is sequentially supplied to the lower side of the lower circular plate 102 through the through holes 122 of the second upper circular plate 120 in communication with the injection holes 105 and the through holes 112 of the first upper circular plate And is introduced into the hopper 320 of the transporting unit 300 to be described later.

As described above, the plurality of through holes 132 of the third upper circular plate 130 are in a communicating state and a non-communicating state with respect to the specific through holes 122 of the injection hole 105, the first and second upper circular plates 120, The deposition material stored in the third upper disk 130 is completely supplied by exhausting all of the deposition materials stored in the plurality of through holes 132. [

Next, a specific configuration of the transfer unit 300 and the deposition unit 200 will be described.

The transfer unit 300 includes a rotary arm 310 rotated between the supply unit 100 and the deposition unit 200, a hopper 320 installed at the end of the rotary arm 310 to receive the deposition material from the lower part of the supply unit 100, And a shutter 330 rotatably coupled to the bottom surface of the hopper 320 to open and close the opening of the hopper 320.

The rotary arm 310 provides a turning radius in which the hopper 320 can be placed below the injection hole 105 of the lower original plate 102 and on the evaporation sources 210, 220, 230 of the deposition unit 200 . At this time, the rotary arm 310 may be connected to the rotary shaft 190 of the motor disposed on the bottom surface of the base plate 400, although not shown. The hopper 320 has a shape that can be filled with the evaporated material dropped from the supply unit 100 and is configured to open and close the bottom of the shutter 330 by the shutter 330. The hopper 320 is connected to the evaporation sources 210, The deposition material can be input.

2 and 4, the shutter 330 blocking the open bottom of the hopper 320 may be automatically rotated by a motor installed on the rotary arm 310 and fixed in position . In addition, in a state in which a rotational force is applied by a spring that provides a rotational force in one direction, rotation can be restrained to the stopper 340 and may be located at the bottom of the hopper 320.

The shutter 340 is formed on the bottom surface of the rotary arm 310 so that the shutter 330 is positioned on the bottom surface of the hopper 320, Can be located at the bottom. The spring is not shown but is provided inside the cylindrical body 350 to provide a rotational force to the shutter 330 on the bottom of the rotary arm.

In addition, a holding plate 500 for opening the shutter 330 by contacting the shutter 330 is provided around the vapor deposition unit 200. The locking plate 500 presses the shutter 330 to rotate the shutter 330 in a direction opposite to the spring rotational force when the rotary arm 310 is rotated toward the evaporation source side. At this time, the shutter 330 is rotated so that the hopper 320 is opened and the deposition material charged into the hopper 320 is injected into the evaporation source. When the rotary arm 310 is rotated toward the supply unit 100, the bottom portion of the hopper 320 is blocked by the shutter 330 returned to the original position by the spring.

Referring to FIGS. 1 and 2, the deposition unit 200 includes three evaporation sources included in any one of a process of supplying and evaporating a deposition material, a process of supplying a deposition material in a gaseous state to a substrate, 210, 220, 230).

That is, the deposition unit 200 is configured to be rotatable on the base by a motor, and the deposition source, which is circularly arranged in the deposition unit 200, performs each process while rotating.

When the first deposition source 121 of the deposition unit 200 receives the deposition material from the hopper 320 and performs the deposition process on the substrate, the second deposition source 122 in the counterclockwise direction performs the deposition process And the third evaporation source 123 is in a preheating state for preparing the deposition process.

As described above, the three evaporation sources are formed by sequentially supplying the evaporation material from the hopper 320 while being rotated by the evaporation unit 200, performing deposition on the substrate, cooling the evaporation process, The deposition material is supplied.

100: Supply unit 102: Lower disk
105: input hole 110: first upper disk
120: second upper plate 130: third upper plate
112, 122, 132: through holes 114, 124, 134:
190: rotation axis 210, 220, 230: evaporation source
200: deposition part 300: transfer part
310: rotary arm 320: hopper
330: shutter 340: latch
350: Cylinder body 400: Base plate
500:

Claims (6)

A lower disk 102 on which an injection hole 105 is formed in an outer peripheral portion; And
A plurality of through holes 112, 122 and 132 which are connected to the lower circular plate 102 so as to be rotatable and communicate with the lower and upper circular plates 102 and 103 in order to communicate with the lower and upper circular plates 102, And a plurality of upper disks (110, 120, 130) formed along the through holes and storing the deposition material in the through holes,
The plurality of upper discs 110, 120 and 130 are individually rotatable about the same rotary shaft 190 with respect to the lower disc 102. The upper discs 110 are rotatable about the rotation axis 190 with respect to the lower disc 102, Wherein a plurality of through holes formed in the adjacent upper disk are arranged so as not to communicate with each other,
Wherein the plurality of upper circular plates
A first upper circular plate 110 disposed on the lower circular plate 102 and a second upper circular plate 120 disposed on the first upper circular plate 110,
The first upper disk 110 and the second upper disk 120 are integrally rotated with respect to the lower disk 102. As the first and second upper disks 110 and 120 rotate, A part of the plurality of through holes 112 formed in the upper main plate 110 is communicated with the above-mentioned input hole 105 so that the deposition material stored in the through hole 112 can pass through the above- To the lower side of the lower disk 102,
After the evaporation material stored in the plurality of through holes 112 of the first upper circular plate 110 is exhausted, one of the plurality of through holes 112 of the first upper circular plate 110 is inserted into the through- Is held in engagement with the hole (105)
As the second upper circular plate 120 rotates with respect to the first upper circular plate 110 and the lower circular plate 102, The material is discharged sequentially downward through the through hole 112 of the first upper disk 110 communicating with the charging hole 105 and the charging hole 105 (100) of a material supply device for an organic light emitting diode manufacturing process.
delete The method according to claim 1,
After the deposition material stored in the plurality of through holes 112 of the first upper circular plate 110 is discharged to the lower side of the lower circular plate 102 to be exhausted, And the upper plate (110) is disconnected from the upper plate (110). The supply unit (100) of the material supply apparatus for the organic light emitting diode manufacturing process.
delete The method according to claim 1,
The plurality of upper circular plates include a third upper circular plate 130 disposed on the second upper circular plate 120,
After the evaporation material stored in the plurality of through holes 122 of the second upper circular plate 120 is exhausted, one of the plurality of through holes 122 of the second upper circular plate 120 is inserted into the through- A hole 105 and a through hole 112 of the first upper circular plate 110 communicating with the lower hole 105 to communicate with each other,
The third upper circular plate 130 rotates with respect to the lower circular plate 102 and the first and second upper circular plates 110 and 120. As the third upper circular plate 130 rotates, The deposition material stored in the plurality of through holes 132 formed in the circular plate 130 is sequentially discharged downward of the lower circular plate 102 through the injection holes 105. [ (100).
The method according to claim 1,
And a driving unit (114, 124, 134) for rotating the upper circular plate are individually provided for each of the plurality of upper circular plates.

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