KR101335435B1 - Cooling apparatus for semiconductor manufacturing equipment - Google Patents

Cooling apparatus for semiconductor manufacturing equipment Download PDF

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Publication number
KR101335435B1
KR101335435B1 KR1020120106602A KR20120106602A KR101335435B1 KR 101335435 B1 KR101335435 B1 KR 101335435B1 KR 1020120106602 A KR1020120106602 A KR 1020120106602A KR 20120106602 A KR20120106602 A KR 20120106602A KR 101335435 B1 KR101335435 B1 KR 101335435B1
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KR
South Korea
Prior art keywords
temperature
thermoelectric module
wafer chuck
refrigerant circulation
refrigerant
Prior art date
Application number
KR1020120106602A
Other languages
Korean (ko)
Inventor
이명환
Original Assignee
유니셈(주)
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Publication date
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Priority to KR1020120106602A priority Critical patent/KR101335435B1/en
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Publication of KR101335435B1 publication Critical patent/KR101335435B1/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67248Temperature monitoring
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Abstract

The present invention relates to a cooling apparatus for semiconductor manufacturing facilities, specifically, to a cooling apparatus for semiconductor manufacturing facilities that is in direct contact with a wafer chuck to control the temperature of the wafer chuck, improves the response of temperature control and thermal efficiency, and saves power consumption. The invention provides a cooling apparatus for semiconductor manufacturing facilities comprising a thermoelectric module installed on the lower surface of a wafer chuck; a refrigerant circulation pipe installed on the lower surface of the thermoelectric module; a temperature control unit that supplies a power source to the thermoelectric module, controls the temperature of the wafer chuck by the heat generate from the thermoelectric module, and controls the temperature of the thermoelectric module by circulating refrigerant along the refrigerant circulation pipe to directly control the temperature of the wafer chuck by the thermoelectric module and to control the temperature of the thermoelectric module by the refrigerant circulation pipe.

Description

Cooling apparatus for semiconductor manufacturing equipment

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling apparatus for semiconductor manufacturing equipment. In detail, the semiconductor manufacturing equipment is capable of saving power while increasing the responsiveness and thermal efficiency of temperature control by directly controlling the temperature of the wafer chuck in direct contact with the wafer chuck. It relates to a cooling device for.

In general, the equipment for manufacturing a semiconductor device has its own structure for performing each process, and these equipments must be designed to strictly maintain the process environment.

Processes such as etching, diffusion, and chemical vapor deposition in a semiconductor device manufacturing process perform a process of reacting on a wafer in a process chamber by introducing a process gas under a predetermined portion in a closed process chamber.

In the semiconductor manufacturing process, a temperature control system is configured to maintain a wafer chuck on which a wafer in a process chamber is seated at a constant temperature. A representative example of the temperature control system is a chiller.

A chiller is a device that supplies and circulates facility coolant at a constant temperature to maintain the chuck or chamber walls of a semiconductor manufacturing facility at a constant temperature.

In the conventional cooling apparatus for semiconductor manufacturing equipment, a thermoelectric module is installed by attaching a cooling plate to a wafer chuck, and installing a thermoelectric module unit to contact the cooling plate to transfer heat to the cooling plate to control the temperature of the cooling plate. The unit is configured to cool the wafer chuck to cool the wafer chuck.

As described above, the cooling plate for cooling the wafer chuck is controlled by the thermoelectric module unit, so that the indirect cooling structure for cooling the wafer chuck has a problem in that the response to the temperature control of the wafer chuck and the thermal efficiency are low.

In addition, since the thermal efficiency is low, there is a problem that a lot of power is required for temperature control.

The present invention is to solve the problems of the prior art as described above, by directly contacting the wafer chuck to control the temperature of the wafer chuck, semiconductor manufacturing equipment that can reduce the power while increasing the responsiveness and thermal efficiency of the temperature control An object of the present invention is to provide a cooling device.

The present invention for achieving the above object is a thermoelectric module installed on the lower surface of the wafer chuck; A refrigerant circulation tube installed on a bottom surface of the thermoelectric module; And supplying power to the thermoelectric module so that the temperature of the wafer chuck is controlled by heat generated from the thermoelectric module, and circulating a coolant in the refrigerant circulation tube so that the temperature of the thermoelectric module is controlled. By the temperature of the wafer chuck is directly controlled, and provides a cooling device for a semiconductor manufacturing equipment comprising a temperature control means for controlling the temperature of the thermoelectric module by the refrigerant circulation pipe.

In this case, the thermoelectric module may be formed in a single plate shape, the thermoelectric module is formed of a plurality of modules, each of the plurality of modules is connected to the temperature control means, respectively corresponding to the plurality of modules It may be configured to supply different temperatures for each region of the wafer chuck.

On the other hand, the thermoelectric module includes a first module located in the center; And a second module located outside the circumference of the first module.

On the other hand, the thermoelectric module may have a circular shape in which the third and fourth modules of the semicircle are connected to each other.

In addition, the temperature control means is connected to the thermoelectric module through a power line, a power supply for supplying power; A refrigerant circulation unit connected to the refrigerant circulation pipe through a refrigerant circulation line to circulate the refrigerant; And a control unit connected to the power supply unit and the refrigerant circulation unit to control the power supply unit and the refrigerant circulation unit.

In addition, the cooling apparatus for a semiconductor manufacturing apparatus according to the present invention may further include thermoelectric temperature measuring means for measuring the temperature of the thermoelectric module and transmitting the temperature to the controller.

In this case, the control unit controls the power supply unit according to the temperature of the thermoelectric module transmitted from the thermoelectric temperature measuring means.

In addition, the cooling apparatus for semiconductor manufacturing equipment according to the present invention may further include a refrigerant temperature measuring means which is installed in the refrigerant circulation line to measure the temperature of the refrigerant flowing along the refrigerant circulation line, and transmits the temperature to the controller. .

In addition, the cooling apparatus for a semiconductor manufacturing apparatus according to the present invention may further include a heat exchanger installed in the refrigerant circulation unit, connected to the control unit, and controlling a temperature of the refrigerant through heat exchange with the refrigerant.

At this time, the control unit controls the heat exchanger in accordance with the temperature of the refrigerant transmitted from the refrigerant temperature measuring means.

According to the present invention, by installing a thermoelectric module on the wafer chuck to supply heat directly to the wafer to control the temperature of the wafer chuck, it is possible to increase the responsiveness and thermal efficiency of the temperature control and save power.

In addition, by forming the thermoelectric module into a plurality of modules, it is possible to control the temperature differently for each region of the wafer chuck.

In addition, by measuring the temperature of the thermoelectric module and the refrigerant in real time, based on this it is possible to control the temperature of the thermoelectric module and the refrigerant, it is possible to precise temperature control for the thermoelectric module and the refrigerant.

1 is a block diagram showing the configuration of a cooling apparatus for semiconductor manufacturing equipment according to the present invention.
2 and 3 are plan views illustrating various configurations of a thermoelectric module provided in a cooling apparatus for a semiconductor manufacturing apparatus according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a block diagram showing the configuration of a cooling apparatus for semiconductor manufacturing equipment according to the present invention, Figures 2 and 3 are plan views showing various configurations of thermoelectric modules provided in the cooling apparatus for semiconductor manufacturing equipment according to the present invention. admit.

Referring to FIG. 1, a cooling apparatus for a semiconductor manufacturing apparatus according to the present invention includes a thermoelectric module 20 installed on one surface of a wafer chuck 10, a refrigerant circulation tube 30 installed on the thermoelectric module 20, and the It includes a thermoelectric module 20 and the temperature control means 40 connected to the refrigerant circulation pipe (30).

Accordingly, one surface of the thermoelectric module 20 is in contact with the wafer chuck 10, and the other surface of the thermoelectric module 20 is in contact with the refrigerant circulation tube 30, by the thermoelectric module 20. The temperature of the wafer chuck 10 is adjusted by the heat supplied.

At this time, the temperature control means 40 is connected to the thermoelectric module 20 via the power line 50 to the thermoelectric module 20 to supply power, while circulating the refrigerant in the refrigerant circulation pipe (30) Is connected via a line 60 to circulate the refrigerant through the refrigerant circulation pipe 30 and the refrigerant circulation line (60).
Meanwhile, a heat transfer material may be further disposed between the wafer chuck 10 and the thermoelectric module 20 and / or between the thermoelectric module 20 and the refrigerant circulation pipe 30 to improve heat transfer. In this case, the heat transfer material may be thermal grease.

In detail, the thermoelectric module 20 may be installed on one surface of the wafer chuck 10 by a mechanical method or a metallurgical method. For example, the thermoelectric module 20 may be installed by a bolt coupling method or a brazing method. It may be installed to contact one surface.

The thermoelectric module 20 is a device using a thermoelectric phenomenon according to the Peltier effect. The thermoelectric module 20 is configured to generate an exothermic reaction on one side and an endothermic reaction on the other side of the thermoelectric module according to the Peltier effect. Thermoelectric phenomena are applied in various fields, which will not be described in detail.

In this case, the thermoelectric module 20 is formed in a single plate shape, and supplies the same temperature to the entire wafer chuck 10 under the control of the temperature controller 40, so that the entire wafer chuck 10 is the same. It can be configured to maintain the temperature.

However, the thermoelectric module 20 may be configured to maintain different temperatures for each region of the wafer chuck 10.

That is, the wafer chuck 10 is appropriately selected to have different temperatures and divided into a plurality of regions, and the thermoelectric module 20 is formed of a plurality of modules to correspond to the plurality of regions of the wafer chuck 10. And installed, the plurality of modules may be independently controlled by the temperature control means 40.

Accordingly, in a state in which the temperature control means 40 is connected to each module, the respective modules supply different temperatures to the wafer chuck 10 under the control of the temperature control means 40, thereby providing the wafer chuck. Multiple regions of (10) can each be maintained at different temperatures.

For example, as shown in FIG. 2, the thermoelectric module 20 includes a first module 21 located at a central portion thereof and a second module 22 located outside the circumference of the first module 21. It may be made of a) may be installed on one surface of the wafer chuck 10.

Accordingly, the first module 21 and the second module 22 are connected to the temperature control unit 40, respectively, and different temperatures are controlled by the temperature control unit 40. And the regions of the wafer chuck 10 corresponding to the first and second modules 21, 22 may maintain different temperatures.

In another embodiment, as shown in FIG. 3, the thermoelectric module 20 has a circular shape in which a semicircular third module 23 and a fourth module 24 are connected to each other to form one surface of the wafer chuck 10. Can be installed on

Accordingly, the third module 23 and the fourth module 24 are connected to the temperature control unit 40, respectively, so that the wafer chuck 10 may have different temperatures under the control of the temperature control unit 40. The area of the wafer chuck 10 corresponding to the third and fourth modules 23 and 24 may be maintained at different temperatures.

It will be appreciated by those skilled in the art from the above embodiments that the thermoelectric module 20 may be formed and applied in various ways.

Meanwhile, in order to control the temperature supplied by the thermoelectric module 20 to the wafer chuck 10, it is preferable to accurately measure the temperature of the thermoelectric module 20.

Moreover, when the thermoelectric module 20 is composed of a plurality of modules and controlled to supply different temperatures for each region of the wafer chuck 10, each module is affected by the temperatures of other adjacent modules. The temperature supplied to the wafer chuck 10 may be different from the temperature to be supplied by the control of the temperature control means 40.

Therefore, it is necessary to detect the temperature of the thermoelectric module 20 and the modules constituting the thermoelectric module 20 in real time, and adjust the power applied appropriately according to the temperature change.

Thus, the cooling apparatus for semiconductor manufacturing equipment according to the present invention is connected to the temperature control means 40, thermoelectric temperature measuring means for measuring and transmitting the temperature of the thermoelectric module 20 or the modules of the thermoelectric module 20 70 may further include.

At this time, the thermoelectric temperature measuring means 70 may be any position that can accurately measure the temperature of the thermoelectric module 10 or the modules of the thermoelectric module 20, for example, the thermoelectric module 20 Alternatively, the thermoelectric module 20 may be installed or adjacent to the modules of the thermoelectric module 20.

Thus, the temperature of the thermoelectric module 20 or the modules of the thermoelectric module 20 measured by the thermoelectric temperature measuring means 70 is transmitted to the temperature control means 40.

Meanwhile, the temperature control means 40 includes a power supply unit 41, a refrigerant circulation unit 42, and a control unit 43, and may further include other components.

In this case, the power supply unit 41 is connected to the thermoelectric module 10 through the power line 50 to supply power to the thermoelectric module 10, and the refrigerant circulation unit 42 circulates the refrigerant. Connected to the refrigerant circulation pipe 30 through a line 60 to circulate the refrigerant, and the control unit 43 is connected to the power supply unit 41 and the refrigerant circulation unit 42 to supply the power supply unit ( 41) and the refrigerant circulation section 42.

The power supply unit 41 may be an external power supply, for example, an AC power supply, converts into DC to supply power, and may be a power supply capable of changing the polarity of the supplied power.

On the other hand, the coolant circulation pipe 30 is installed on one surface of the thermoelectric module 20, in detail, is installed on the other surface facing one surface of the thermoelectric module 20 in contact with the wafer chuck 10.

In this case, the coolant circulation unit 42 circulates the coolant through the coolant circulation line 50 and the coolant circulation pipe 30, and controls temperature on the other surface of the thermoelectric module 20 by the circulated coolant. You can do it.

That is, the other surface of the thermoelectric module 20 in which the refrigerant circulation pipe 30 is installed is not a position for directly controlling the temperature of the wafer chuck 10, but due to the polarity of the power supplied due to the characteristics of the thermoelectric module 20. Therefore, it is exothermic or endothermic.

When one surface of the thermoelectric module 20 is affected by the temperature of the other surface of the thermoelectric module 20, heat supplied to the wafer chuck 10 is canceled or interfered to provide proper heat to the wafer chuck 10. It may not be possible to supply.

 Therefore, it is preferable to properly adjust the other surface of the thermoelectric module 20 so that the temperature is not too high or too low, and such temperature control is performed through the refrigerant passing through the refrigerant circulation pipe 30.

In this case, as the refrigerant, various materials may be selected and used according to a user. For example, the refrigerant may be selected from a non-conductive solution, a conductive solution, or a non-conductive silicon-based solution, and more specifically, DI water. , Galden, Fluorinert, Ethylene Glycol, etc. may be used.

On the other hand, the refrigerant circulated through the refrigerant circulation pipe 30, the temperature of the refrigerant is changed by the heat of the thermoelectric module 20.

When the temperature of the coolant is changed, stable temperature control of the other surface of the thermoelectric module 20 is impossible, and thus the temperature of the coolant must also be controlled.

Thus, the cooling apparatus for semiconductor manufacturing equipment according to the present invention is installed in the refrigerant circulation line 60, is connected to the temperature control unit 40, the refrigerant measuring the temperature of the refrigerant to transmit to the temperature control unit 40 It is installed in the temperature measuring means 80 and the refrigerant circulation section 42, and is connected to the control unit 43, further comprises a heat exchange unit 90 for controlling the temperature of the refrigerant through heat exchange with the refrigerant. .

On the other hand, the temperature control of the refrigerant may be made using process water (PCW: Process Cooling Water), in this case, the heat exchange unit 90 is supplied with the process water from the outside.

At this time, the refrigerant temperature measuring means 80 is connected to the control unit 43 of the temperature control unit 40, and transmits the temperature of the measured refrigerant to the control unit 43, the control unit 43 is the transmitted temperature As such, the heat exchanger 90 is controlled to adjust the refrigerant to maintain a constant temperature.

In addition, the control unit 43 of the temperature control unit 40 is connected to the thermoelectric temperature measuring means 70, the temperature of the thermoelectric module or the modules of the thermoelectric module measured by the thermoelectric temperature measuring means 70 By receiving the transmission, the power supply unit 41 is controlled based on this, so that the appropriate power is applied to the thermoelectric module 20.

Although the cooling apparatus for a semiconductor manufacturing apparatus according to the present invention has been described according to a limited embodiment, the scope of the present invention is not limited to the specific embodiment, and the scope of the present invention is obvious to those skilled in the art. Many alternatives, modifications and changes can be made.

Therefore, the embodiments described in the present invention and the accompanying drawings are intended to illustrate rather than limit the technical spirit of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments and accompanying drawings . The scope of protection of the present invention should be construed according to the claims, and all technical ideas within the scope of equivalents should be interpreted as being included in the scope of the present invention.

10 wafer chuck 20 thermoelectric module
30: refrigerant circulation pipe 40: temperature control means
41: power supply unit 42: refrigerant circulation unit
43: control unit 50: power line
60: refrigerant circulation line 70: thermoelectric temperature measuring means
80: refrigerant temperature measuring means 90: heat exchanger

Claims (11)

  1. A thermoelectric module installed on the lower surface of the wafer chuck;
    A refrigerant circulation tube installed on a bottom surface of the thermoelectric module; And
    By supplying power to the thermoelectric module, the temperature of the wafer chuck is controlled by the heat generated from the thermoelectric module, by circulating a refrigerant in the refrigerant circulation pipe to adjust the temperature of the thermoelectric module, by the thermoelectric module A temperature control means for directly controlling a temperature of the wafer chuck and adjusting a temperature of the thermoelectric module by the refrigerant circulation pipe;
    The temperature control means is connected to the thermoelectric module through a power line, a power supply for supplying power; A refrigerant circulation unit connected to the refrigerant circulation pipe through a refrigerant circulation line to circulate the refrigerant; And a control unit connected to the power supply unit and the refrigerant circulation unit to control the power supply unit and the refrigerant circulation unit.
    And a thermoelectric temperature measuring means for measuring the temperature of the thermoelectric module and transmitting the temperature to the controller.
  2. The method of claim 1,
    The thermoelectric module is a cooling device for a semiconductor manufacturing equipment is formed in one plate form.
  3. The method of claim 1,
    The thermoelectric module is formed of a plurality of modules,
    Each of the plurality of modules is connected to the temperature control means, the cooling apparatus for a semiconductor manufacturing equipment for supplying different temperatures for each region of the wafer chuck corresponding to the plurality of modules.
  4. The method of claim 3, wherein
    The thermoelectric module includes a first module located at the center; And
    Cooling apparatus for semiconductor manufacturing equipment comprising a second module located on the outside along the circumference of the first module.
  5. The method of claim 3, wherein
    The thermoelectric module is a cooling device for a semiconductor manufacturing equipment consisting of a circular shape in which the third and fourth modules of the semicircle are connected to each other.
  6. delete
  7. delete
  8. The method of claim 1,
    And the control unit controls the power supply unit according to the temperature of the thermoelectric module transmitted from the thermoelectric temperature measuring unit.
  9. The method of claim 1,
    And a coolant temperature measuring unit installed in the coolant circulation line to measure a temperature of the coolant flowing along the coolant circulation line and transmitting the measured temperature to the control unit.
  10. The method of claim 9,
    And a heat exchanger installed in the coolant circulation unit and connected to the control unit to adjust a temperature of the coolant through heat exchange with the coolant.
  11. 11. The method of claim 10,
    And the control unit controls the heat exchanger in accordance with the temperature of the coolant transmitted from the coolant temperature measuring means.
KR1020120106602A 2012-09-25 2012-09-25 Cooling apparatus for semiconductor manufacturing equipment KR101335435B1 (en)

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Application Number Priority Date Filing Date Title
KR1020120106602A KR101335435B1 (en) 2012-09-25 2012-09-25 Cooling apparatus for semiconductor manufacturing equipment

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060003124A (en) * 2004-07-05 2006-01-10 삼성전자주식회사 Cooling device of semiconductor production device
KR100746231B1 (en) * 2006-08-18 2007-07-30 삼성전자주식회사 Cooling apparatus having auxiliary chiller and semiconductor fabricating method using the same
KR20080093825A (en) * 2007-04-18 2008-10-22 세메스 주식회사 Cooling plate and apparatus for cooling wafer containing the same
KR100905897B1 (en) * 2005-03-31 2009-07-02 도쿄엘렉트론가부시키가이샤 Device and method for controlling temperature of a mounting table, a program therefor, and a processing apparatus including same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060003124A (en) * 2004-07-05 2006-01-10 삼성전자주식회사 Cooling device of semiconductor production device
KR100905897B1 (en) * 2005-03-31 2009-07-02 도쿄엘렉트론가부시키가이샤 Device and method for controlling temperature of a mounting table, a program therefor, and a processing apparatus including same
KR100746231B1 (en) * 2006-08-18 2007-07-30 삼성전자주식회사 Cooling apparatus having auxiliary chiller and semiconductor fabricating method using the same
KR20080093825A (en) * 2007-04-18 2008-10-22 세메스 주식회사 Cooling plate and apparatus for cooling wafer containing the same

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