KR101319588B1 - Led module and method for manufacturing the same - Google Patents

Led module and method for manufacturing the same Download PDF

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Publication number
KR101319588B1
KR101319588B1 KR1020120027253A KR20120027253A KR101319588B1 KR 101319588 B1 KR101319588 B1 KR 101319588B1 KR 1020120027253 A KR1020120027253 A KR 1020120027253A KR 20120027253 A KR20120027253 A KR 20120027253A KR 101319588 B1 KR101319588 B1 KR 101319588B1
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KR
South Korea
Prior art keywords
thermal base
bonding member
formed
heat dissipation
led module
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Application number
KR1020120027253A
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Korean (ko)
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KR20130105107A (en
Inventor
이상철
Original Assignee
아이스파이프 주식회사
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Priority to KR1020120027253A priority Critical patent/KR101319588B1/en
Publication of KR20130105107A publication Critical patent/KR20130105107A/en
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Publication of KR101319588B1 publication Critical patent/KR101319588B1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00Point-like light sources

Abstract

An LED module and a method of manufacturing the same are disclosed. According to an aspect of the invention, the thermal base (thermal base) made of a thermally conductive material; A bonding member coupled to the thermal base and made of a thermally conductive material; A printed circuit board laminated on the thermal base such that the bonding member is exposed; And an LED package including an LED package mounted on a thermal base by forming a heat dissipation pad and an electrode pad on a lower surface thereof, wherein the heat dissipation pad is bonded to the bonding member and the electrode pad is bonded to the circuit pattern of the printed circuit board. LED module) is provided.

Description

LED module and its manufacturing method {LED MODULE AND METHOD FOR MANUFACTURING THE SAME}

The present invention relates to an LED module and a method of manufacturing the same.

In the LED lighting device, a large amount of heat is generated due to the heat of the LED. Generally, when the LED illumination device is overheated, an operation error may be generated or damaged, and a heat dissipation structure for preventing overheating is indispensably required. Also, there is a problem in that a power source device that supplies power to the LEDs generates a lot of heat, and when the device is overheated, the lifespan is shortened.

In the case of an LED lighting device according to the related art, the LED chip is composed of a packaged LED package, a metal PCB on which an LED package is mounted, and a heat sink mounted on a lower surface of the metal PCB.

According to the prior art, heat generated in the LED chip is transferred to the heat sink through the package substrate and the metal PCB of the LED package. However, according to the related art, since a plurality of components are present on the heat transfer path, and all of the thermal resistances of the components are acted on, there is a problem in that heat generated from the LED chip is not effectively released.

Korean Utility Model Model No. 20-2009-0046370 (2009. 05. 11. disclosure)

The present invention provides an LED module having a high heat dissipation performance and a method of manufacturing the same.

According to an aspect of the invention, the thermal base (thermal base) made of a thermally conductive material; A bonding member coupled to the thermal base and made of a thermally conductive material; A printed circuit board laminated on the thermal base such that the bonding member is exposed; And an LED package including an LED package mounted on a thermal base by forming a heat dissipation pad and an electrode pad on a lower surface thereof, wherein the heat dissipation pad is bonded to the bonding member and the electrode pad is bonded to the circuit pattern of the printed circuit board. LED module) is provided.

The thermal base is made of a different material from the heat dissipation pad, and the bonding member may be made of the same material as the heat dissipation pad.

The bonding member and the heat dissipation pad may be bonded by a soldering method.

A space portion may be provided between the pair of electrodes and the surface of the thermal base such that a printed circuit board is interposed therebetween.

The joining member may protrude from the surface of the thermal base.

A protruding portion may be formed in a portion of the thermal base to which the bonding member is coupled.

The surface of the bonding member may be located at the same height as the surface of the printed circuit board.

An insertion hole may be formed in the thermal base such that the joining member may be inserted therein.

The thermal base has a columnar shape in which an air flow passage is formed to allow the inflow and outflow of external air, and the joining member may have an annular structure to be inserted into the outer circumferential surface of the thermal base.

The thermal base protrudes outward of the thermal base to form an inclined portion having a surface inclined with respect to the central axis of the thermal base, and the joining member may be coupled to the inclined surface of the inclined portion.

The printed circuit board may be a flexible printed circuit board.

According to another aspect of the invention, the step of coupling the bonding member made of a thermally conductive material to the thermal base made of a thermally conductive material; Stacking a printed circuit board on the thermal base such that the bonding member is exposed; Bonding the heat dissipation pad formed on the bottom surface of the LED package to the bonding member; And bonding the electrode pad formed on the bottom surface of the LED package to the circuit pattern of the printed circuit board.

The thermal base is made of a different material from the heat dissipation pad, and the bonding member may be made of the same material as the heat dissipation pad.

Bonding the heat dissipation pad to the bonding member may be performed by a soldering method.

An insertion hole is formed in the thermal base, and the step of coupling the joining member to the thermal base may include inserting the joining member into the insertion hole by a pressing process.

The thermal base has a columnar shape in which air flow passages are formed to allow the inflow and outflow of external air, the joining member has an annular structure, and the joining of the joining member to the thermal base includes inserting the joining member into the outer peripheral surface of the thermal base. It may include.

Joining the joining member to the thermal base, after inserting the joining member to the outer peripheral surface of the thermal base, by a tube expanding process, protrudes out of the thermal base to the thermal base to the central axis of the thermal base The method may further include coupling the joining member to the inclined surface of the inclined portion while forming the inclined portion having the inclined surface with respect to the inclined portion.

According to the present invention, it is possible to implement an LED module having a high heat dissipation performance.

1 is a cross-sectional view showing a first embodiment of the LED module according to an aspect of the present invention.
2 is a cross-sectional view showing a second embodiment of the LED module according to an aspect of the present invention.
3 is a perspective view showing a third embodiment of the LED module according to an aspect of the present invention.
4 is a sectional view showing a third embodiment of the LED module according to an aspect of the present invention.
5 is a sectional view showing a fourth embodiment of the LED module according to an aspect of the present invention.
6 is a sectional view showing a fifth embodiment of the LED module according to an aspect of the present invention.
Figure 7 is a cross-sectional view showing the LED lighting apparatus is mounted with an LED module according to an aspect of the present invention.
8 is a flow chart showing an embodiment of an LED module manufacturing method according to another aspect of the present invention.
9 to 12 are cross-sectional views showing each process of one embodiment of an LED module manufacturing method according to another aspect of the present invention.
13 and 14 are cross-sectional views showing each step of another embodiment of the LED module manufacturing method according to another aspect of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

Hereinafter, the LED module 100 and a method of manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings, and in the following description with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals and Duplicate explanations will be omitted.

1 is a cross-sectional view showing a first embodiment of the LED module 100 according to an aspect of the present invention.

According to the present embodiment, as shown in FIG. 1, an LED module 100 having a thermal base 110, a bonding member 120, a printed circuit board 130, and an LED package 140 is provided. .

According to the present exemplary embodiment, a separate metal printed circuit board (PCB) for mounting the LED package 140 to the thermal base 110 is omitted, and the LED package 140 is attached using the bonding member 120. By directly bonding on the thermal base 110, the heat dissipation performance of the LED module 100 may be dramatically increased.

In addition, since the material cost can be reduced by omitting the metal PCB, the LED module 100 having a high heat dissipation performance can be realized at a lower cost.

Hereinafter, each configuration of the LED module 100 according to the present embodiment will be described in more detail with reference to FIG. 1.

The thermal base 110 is made of a thermally conductive material, for example, aluminum, and may function as a heat sink for dissipating heat generated from the LED package 140 to the outside. As shown in FIG. 1, the thermal base 110 may have a structure of a flat substrate.

In this case, the thermal base 110 may be made of a material different from that of the heat dissipation pad 142 of the LED package 140. That is, since the heat dissipation pad 142 of the LED package 140 may be made of copper, the material is different from that of the thermal base 110 made of aluminum, and thus the LED package 140 may be formed on the surface of the thermal base 110. Difficulties in directly bonding the heat radiating pad 142 of the 140.

Accordingly, in the present embodiment, the bonding member 120 is inserted onto the thermal base 110 to correspond to the position of the heat dissipation pad 142 of the LED package 140.

The bonding member 120 may be made of the same thermal conductive material as that of the heat dissipation pad 142, that is, copper, and is coupled to the insertion hole 116 formed in the thermal base 110 as shown in FIG. 1. The bonding member 120 may have a pin or ball shape, and one end thereof may be fixed to the thermal base 110 by being inserted into the insertion hole 116 by a pressing process or the like.

As such, the bonding member 120 having the same material as the heat radiation pad 142 is installed on the thermal base 110, so that the heat radiation pad 142 of the LED package 140 is soldered onto the bonding member 120. It can be effectively bonded by.

By using the bonding member 120 as described above, since the LED package 140 may be directly mounted on the thermal base 110 without going through a separate metal PCB, the heat generated from the LED package 140 is transferred. The path may be shortened and thermal resistance may be reduced, and thus the heat dissipation performance of the LED module 100 may be effectively improved.

A pair of electrode pads 144 may be formed on the bottom surface of the LED package 140 together with the heat dissipation pad 142. Unlike the heat dissipation pad 142 bonded to the thermal base 110, the electrode pad 144 may be formed. In this case, it is necessary to secure an electrical connection with an external device through the printed circuit board 130.

In the present embodiment, a predetermined space 150 is provided between the electrode pad 144 and the thermal base 110 of the LED package 140, as shown in Figure 1, the printed circuit in the space 150 The substrate 130 may be interposed to secure an electrical connection between the LED package 140 and the external device.

More specifically, the space 150 may be formed by the bonding member 120. That is, the bonding member 120 protrudes from the surface of the thermal base 110 as shown in FIG. 1, so that a step is formed between the surface of the thermal base 110 and the bonding member 120. When the heat radiating pad 142 of the 140 is bonded on the bonding member 120, the thickness of the printed circuit board 130 corresponds to the thickness of the electrode pad 144 of the LED package 140 and the surface of the thermal base 110. The space 150 may be formed.

The printed circuit board 130 may be formed of an insulating layer such as FR-4 and a circuit pattern 132 formed thereon. The printed circuit board 130 may be stacked on the thermal base 110 as illustrated in FIG. 1, and the bonding member 120 may be exposed. An opening having a diameter larger than that of the bonding member 120 is formed. As described above, since the end portion of the printed circuit board 130 is located in the space 150, the electrode pad 144 of the LED package 140 is formed on the circuit pattern 132 of the printed circuit board 130. It can be bonded by soldering or the like.

In this case, as shown in FIG. 1, the surface of the bonding member 120 is positioned at the same height as the surface of the printed circuit board 130. That is, the surface of the bonding member 120 and the surface of the printed circuit board 130, that is, the surface of the circuit pattern 132 of the printed circuit board 130 are positioned on the same plane.

Accordingly, when the printed circuit board 130 is stacked on the thermal base 110 and then the LED package 140 is mounted using a soldering process, the heat dissipation pad 142, the bonding member 120, and the electrode pad 144. ) And the circuit reliability of the circuit pattern 132 can be further improved.

The LED package 140 may be formed of a package substrate made of ceramic, an LED chip mounted on an upper surface thereof, and a phosphor coated to cover the LED chip. 1, the heat dissipation pad 142 and the electrode pad 144 may be formed on the bottom surface of the LED package 140, respectively. As described above, the heat dissipation pad 142 and the electrode pad 144 may be formed. The bonding member 120 and the circuit pattern 132 of the printed circuit board 130 may be bonded by a soldering process or the like.

Next, referring to FIG. 2, a second embodiment of the LED module 100 according to an aspect of the present invention will be described.

2 is a cross-sectional view showing a second embodiment of the LED module 100 according to an aspect of the present invention.

In the present embodiment, since the structure, function, and coupling relationship of the printed circuit board 130 and the LED package 140 are the same or similar to those of the first embodiment, detailed descriptions of these configurations will be omitted. The present embodiment will be described based on the thermal base 110, the bonding member 120, and the space 150, which are different from the examples.

As illustrated in FIG. 2, a protrusion 112 may be formed in a portion of the thermal base 110 to which the bonding member 120 is coupled.

In the present embodiment, the joining member 120 is not formed to protrude from the thermal base 110, but a protrusion 112 is formed in a portion of the thermal base 110 to form a step on the surface of the thermal base 110. As a result, the space 150 between the electrode pad 144 of the LED package 140 and the surface of the thermal base 110 is provided.

In this case, the protrusion 112 may etch the remaining regions of the surface of the thermal base 110 having a flat substrate structure in accordance with the thickness of the printed circuit board 130 except for a region in which the bonding member 120 is inserted. By removing it.

In addition, the bonding member 120 may have a ball shape and has a volume corresponding to the volume of the insertion hole 116 formed in the thermal base 110, so that the bonding member 120 does not protrude to the surface of the thermal base 110. In addition, when the bonding member 120 protrudes to the surface of the thermal base 110 as in the first embodiment, the protruding end may be removed by performing a separate polishing process.

3 and 4, a third embodiment of the LED module 100 according to an aspect of the present invention will be described.

3 is a perspective view showing a third embodiment of the LED module 100 according to an aspect of the present invention. 4 is a cross-sectional view showing a third embodiment of the LED module 100 according to an aspect of the present invention.

In the present embodiment, since the structure, function, and coupling relationship of the LED package 140 is the same as or similar to the first embodiment, a detailed description thereof will be omitted. Hereinafter, the thermal base 110 different from the first embodiment, This embodiment will be described based on the bonding member 120, the space part 150, and the printed circuit board 130.

As illustrated in FIGS. 3 and 4, the thermal base 110 has a columnar shape in which an air flow passage 118 is formed to allow inflow and outflow of external air. Specifically, the thermal base 110 has a large diameter part having a sufficient diameter to accommodate the power supply, etc., the small diameter part having a diameter smaller than the large diameter part, and formed in communication with the large diameter part at the lower part of the large diameter part. And it may be composed of a connecting portion for connecting the small diameter.

Since the joining member 120 may have an annular structure to be inserted into the outer circumferential surface of the thermal base 110 as illustrated in FIGS. 3 and 4, the joining member 120 of the annular structure is formed on the outer circumferential surface of the thermal base 110. By inserting the bonding member 120, the outer peripheral surface of the thermal base 110 can be fixed.

Then, the bonding member 120 and the heat dissipation pad 142 of the LED package 140 are bonded to each other by soldering, so that the LED package 140 is connected to the outer circumferential surface of the bonding member 120 so that the active surface faces outward. Can be mounted.

In this case, the space 150 may be provided between the electrode pad 144 and the outer circumferential surface of the thermal base 110 to expose the electrode pad 144. That is, a step may be formed at an end portion at which the electrode pad 144 of the LED package 140 is located among the outer circumferential surfaces of the bonding member 120, so that the heat dissipation pad 142 of the LED package 140 is bonded to the bonding member ( Even when bonded to the outer circumferential surface of the 120, the space part 150 may be formed between the electrode pad 144 and the thermal base 110.

The electrode pad 144 exposed by the space part 150 may be bonded to the circuit pattern 132 of the printed circuit board 130 by soldering to secure an electrical connection with an external device. In the present embodiment, a flexible printed circuit board having a circuit pattern 132 formed on a polyimide film may be used as the printed circuit board 130.

As shown in FIG. 3, a plurality of connections are formed in the printed circuit board 130, and the electrode pads 144 of the plurality of LED packages 140 may be electrically bonded to the plurality of connections. The main body of the printed circuit board 130 may be wound around and fixed to the outer circumferential surface of the thermal base 110.

Next, a fourth embodiment of the LED module 100 according to an aspect of the present invention will be described with reference to FIG. 5.

5 is a cross-sectional view showing a fourth embodiment of the LED module 100 according to an aspect of the present invention.

In the present embodiment, since the structure, function and coupling relationship of the LED package 140 and the printed circuit board 130 is the same or similar to the third embodiment, a detailed description thereof will be omitted. Different embodiments of the thermal base 110, the bonding member 120, and the space 150 will be described.

As shown in FIG. 5, an inclined portion 114 may be formed on the thermal base 110 to protrude outward of the thermal base 110 and have a surface inclined with respect to a central axis of the thermal base 110. The inclined portion 114 may be integrally formed with the thermal base 110 by an expansion method.

The bonding member 120 is coupled to the outer circumferential surface of the thermal base 110, specifically, the inclined surface of the inclined portion 114. The bonding member 120 has an annular structure to be inserted into the outer circumferential surface of the thermal base 110.

In this case, the bonding member 120 may be coupled to the outer circumferential surface of the thermal base 110 simultaneously with the formation of the inclined portion 114 by the expansion method. That is, in the state where the thermal base 110 and the bonding member 120 are disposed in the mold 20 in which the intaglio pattern 22 having a shape corresponding to the inclination portion 114 and the bonding member 120 is formed, various pressing means are applied. By pressing the inside of the thermal base 110 toward the intaglio pattern 22 of the mold 20 to enlarge the diameter of the thermal base 110 and a part of the joining member 120, the shape of the intaglio pattern 22 is increased. The corresponding inclined portion 114 and the bonding member 120 may be formed.

As such, the inclined portion 114 and the bonding member 120 are simultaneously molded according to the expansion method, so that the printed circuit board 130 may be inserted between the electrode pad 144 and the outer circumferential surface of the thermal base 110. 150 may be provided.

That is, the gap between the electrode pad 144 and the thermal base 110 is formed by inserting the bonding member 120 on the outer circumferential surface of the thermal base 110 to form a step between the surfaces of the bonding member 120 and the thermal base 110. The formed space portion 150 is formed.

The LED package 140 may be bonded to the bonding member 120 and the printed circuit board 130. The LED package 140 may be disposed to be inclined outside the thermal base 110. In addition, the LED package 140 is disposed in a pair along the length direction (up and down direction based on the drawing) of the thermal base 110, and the pair of LED packages 140 are generated in the pair of LED packages 140. The longitudinal radiation angles of the light may be inclined in the opposite directions (ie, the upper LED package 140 is upward and the lower LED package 140 is downward) so as to increase the longitudinal emission angle.

Specifically, the upper LED package 140 may be disposed to be inclined upward by an angle of less than 90 degrees with respect to the outer circumferential surface of the thermal base 110, the lower LED package 140 is the outer circumferential surface of the thermal base 110 Can be inclined downward by an angle of less than 90 degrees. Accordingly, the active surfaces of the upper LED package 140 and the lower LED package 140 face the upper diagonal direction and the lower diagonal direction, respectively.

Since the LED package 140 has a radiation angle of 120 degrees, for example, according to the arrangement of the LED package 140, the LED module 100 may have a sum of the radiation angles of each of the upper and lower LED packages 140. It is possible to emit light widely at similar longitudinal radiation angles.

In addition, the LED package 140 may be disposed in plurality at regular intervals along the outer circumferential surface of the thermal base 110. For example, four LED packages 140 may be arranged at regular intervals, and thus, similar to the above-described principle, the lateral radiation angle may also be extended to a radiation angle similar to the sum of the radiation angles of each of the LED packages 140. Can be.

Next, a fifth embodiment of the LED module 100 according to an aspect of the present invention will be described with reference to FIG. 6.

6 is a cross-sectional view showing a fifth embodiment of the LED module 100 according to an aspect of the present invention.

In the present embodiment, since the structure, function, and coupling relationship of the thermal base 110, the LED package 140, and the printed circuit board 130 are the same as or similar to those of the third embodiment, a detailed description thereof will be omitted. The present embodiment will be described based on the bonding member 120 and the space portion 150 which are different from the third embodiment.

As illustrated in FIG. 6, a plurality of joining members 120 may be configured, and the plurality of joining members 120 may be disposed at regular intervals along the circumferential direction on the connecting portion of the thermal base 110. In addition, as the bonding member 120 and the heat dissipation pad 142 of the LED package 140 are bonded by a soldering method or the like, the plurality of LED packages 140 and 10 are formed on the plurality of bonding members 120. It can be combined to face downward in the vertical direction.

The bonding member 120 may be coupled to the thermal base 110 by drilling the insertion hole 116 and pressing the bonding member 120 similarly to the first embodiment. That is, the insertion hole 116 is drilled in the connection portion of the thermal base 110, the joining member 120 is disposed on the drilled insertion hole 116, and then the joining member 120 is inserted into the insertion hole 116. 6, the bonding member 120 may be inserted into the insertion hole 116 as shown in FIG. 6.

As shown in FIG. 6, the bonding member 120 may be formed to protrude beyond the surface of the thermal base 110, and thus, may be formed between the electrode pad 144 of the LED package 140 and the outer circumferential surface of the thermal base 110. The printed circuit board 130, that is, a space 150 for inserting the flexible printed circuit board may be provided.

Next, with reference to FIG. 7, the LED lighting apparatus 10 equipped with the LED module 100 according to an aspect of the present invention will be described.

7 is a cross-sectional view of the LED lighting device 10 is mounted with the LED module 100 according to an aspect of the present invention.

Inside the LED lighting device 10 illustrated in FIG. 7, the LED module 100 according to the fifth embodiment is installed.

The base cover 500 is coupled to the thermal base 110. The base cover 500 has a vent hole connected to the air flow passage 118 of the thermal base 110. Heat generated in the LED package 140 may be discharged to the outside through the air flow passage 118 and the vent hole. This base may be made of an insulating material such as synthetic resin.

An end portion of the base cover 500 may be coupled to an electrical connection 400 electrically connected to the LED package 140 through the printed circuit board 130 of the power supply unit 300. It may have a hemispherical structure in which the space 150 is formed. Here, the electrical connection 400 may be a socket having a structure such as Edison type, swan type or the like.

Since vent holes are formed in all directions on the spherical surface of the base cover 500, the air flowing in the transverse direction around the base cover 500 also passes through the base cover 500, thereby improving heat dissipation performance.

The thermal base 110 may provide an air flow passage 118 required for heat dissipation of the LED package 140. That is, an opening is formed at one side of the thermal base 110, the other side of the thermal base 110 is coupled to the base cover 500, and an air flow connecting the openings and the ventilation holes to the inside of the thermal base 110. Since the passage 118 may be formed, air entering the opening or the vent hole may thus form a flow along the air flow passage 118.

The thermal base 110 has a hollow cylindrical structure in which an opening is formed toward an object of illumination. In addition, the thermal base 110 has an open structure on the other side coupled to the base cover 500, and is connected to the space 150 of the base cover 500 at an opening in the cylindrical thermal base 110. An air flow passage 118 is formed.

Air introduced into the air flow passage 118, which is an empty space therein, through the opening of the thermal base 110 is generated in the LED package 140 and transferred through the bonding member 120 and the inner wall of the thermal base 110. It is heated by heat and naturally rises and is discharged into the vent hole.

When the air inside the air flow passage 118 rises as described above, external cool air is introduced through the opening of the thermal base 110 to fill the empty space. That is, the external cold air is introduced through the opening of the thermal base 110, and the flow of air discharged by being heated by the LED package 140 is continuously generated.

In this case, since the thermal base 110 is made of a material such as a metal having excellent thermal conductivity (for example, aluminum), the heat dissipation performance of the LED lighting apparatus 10 may be further improved.

In the exemplary embodiment, a reflective surface may be formed on the thermal base 110 to reflect and diffuse at least a portion of the light generated from the LED package 140. That is, the outer surface of the thermal base 110 may be used as a reflector to diffuse light.

On the other hand, in order to further increase the heat dissipation performance, the heat dissipation that absorbs the heat generated from the LED package 140 on the air flow passage 118 of the thermal base 110 to discharge to the air flowing through the air flow passage 118 The member may further be installed.

As such a heat dissipation member, a vibrating tubular heat pipe formed in a tubular shape and into which a working fluid is injected may be used. Specifically, the heat dissipation member is a heat pipe loop having a heat absorbing portion that is in contact with the inner wall of the LED package 140 side of the thermal base 110 to receive heat and a heat dissipating portion spaced apart from the heat absorbing portion to release the heat absorbed by the heat absorbing portion. May be arranged repeatedly.

That is, the plurality of heat pipe loops may have a helical structure that repeatedly reciprocates between portions of the LED package 140 in the space inside the air flow passage 118 and portions spaced upwardly therefrom. Accordingly, since the surface area required for heat dissipation in a limited space can be secured as much as possible, through the space between the spiral structures of the plurality of heat pipe loops, the air can freely move and absorb the heat of the LED package 140.

In addition, the plurality of heat pipe loops may be disposed radially about a central axis of the thermal base 110. That is, the plurality of heat pipe loops having a helical structure may be rolled in an annular shape so that the heat radiating portion may be disposed radially. In other words, the heat dissipation unit that performs heat dissipation is disposed radially about the central axis of the annular structure. Therefore, the flow of air required for heat dissipation can be freed and heat dissipation with higher efficiency can be achieved.

The power supply unit 300 is accommodated at least partially inside the thermal base 110 so as to be located in the air flow passage 118 of the thermal base 110, and supplies power to the LED package 140. In this case, the power supply unit 300 may include a housing coupled to the base cover 500, and a printed circuit board 130 accommodated in the housing. The printed circuit board 130 may include a converter and various active and passive elements.

As such, since the power supply unit 300 is embedded in the air flow passage 118 of the thermal base 110, heat generated in the power supply unit 300 may be effectively discharged to the outside through the air flowing through the air flow passage 118. Can be. As described above, since a continuous flow of air is formed in the air flow passage 118, the power supply unit 300 may be prevented from overheating and deterioration in performance.

In this case, a through hole for air flow may be formed in the housing of the power supply unit 300. Accordingly, air flowing through the vent may be introduced into the housing, and thus heat dissipation performance of the power supply 300 may be further improved.

The LED package 140 may be disposed outside the thermal base 110 and radiated by air flowing through the air flow passage 118. The LED package 140 may emit light using electrical energy.

The cover member 200 may induce efficient air flow together with protection of the internal parts. The cover member 200 may be made of a transparent material to transmit light. The cover member 200 is coupled to the base cover 500 to cover the thermal base 110 and the LED package 140. The air flow hole is formed to correspond to the position of the opening. Is formed.

The cover member 200 is formed in a form surrounding the side and the bottom of the LED lighting device 10 to cover the LED package 140 and the thermal base 110, the LED package 140 and the thermal from external impact and contamination Protect the base 110.

Next, with reference to Figures 8 to 12, it will be described an embodiment of a method for manufacturing the LED module 100 according to another aspect of the present invention.

8 is a flowchart illustrating an embodiment of a method of manufacturing an LED module 100 according to another aspect of the present invention. 9 to 12 are cross-sectional views showing each process of an embodiment of the LED module 100 manufacturing method according to another aspect of the present invention.

According to the present embodiment, as shown in FIGS. 8 to 12, the bonding member 120 made of the thermally conductive material is coupled to the thermal base 110 made of the thermally conductive material (S110) and the bonding member 120. Stacking the printed circuit board 130 on the thermal base 110 so that the light is exposed (S120), and bonding the heat dissipation pad 142 formed on the bottom surface of the LED package 140 to the bonding member 120 (S130). And bonding the electrode pad 144 formed on the bottom surface of the LED package 140 to the circuit pattern 132 of the printed circuit board 130 (S140).

According to the present exemplary embodiment, a separate metal printed circuit board (PCB) for mounting the LED package 140 to the thermal base 110 is omitted, and the LED package 140 is attached using the bonding member 120. By directly bonding on the thermal base 110, material cost can be reduced, and as a result, it is possible to implement the LED module 100 having a high heat dissipation performance at a lower cost.

Hereinafter, with reference to FIGS. 8 to 12, each process of the LED module 100 manufacturing method according to the present embodiment will be described in more detail.

In the present embodiment, since the structure, function and coupling relationship of the thermal base 110, the bonding member 120, the printed circuit board 130, and the LED package 140 are the same as or similar to the fifth embodiment described above, Detailed description thereof will be omitted, and the present embodiment will be described below with reference to the manufacturing process itself.

First, as shown in FIGS. 9 and 10, the bonding member 120 made of a different thermal conductive material from the thermal base 110 is coupled to the thermal base 110 made of the thermal conductive material (S110).

First, as shown in FIG. 9, a thermal base 110 including a large diameter part, a connection part, and a small diameter part is prepared, and the insertion hole 116 is drilled in the thermal base 110 as shown in FIG. 10. Subsequently, the bonding member 120 is disposed in the insertion hole 116, and then the end of the bonding member 120 is inserted into the insertion hole 116 and fixed by a pressing process or the like.

Next, as shown in FIG. 11, the printed circuit board 130 is stacked on the thermal base 110 so that the bonding member 120 is exposed (S120). The main body of the printed circuit board 130, which is a flexible printed circuit board, may be wound and fixed on the outer circumferential surface of the thermal base 110, and the connection portion of the printed circuit board 130 is disposed on the connection portion of the thermal base 110.

Next, as shown in FIG. 12, the heat radiation pad 142 formed on the bottom surface of the LED package 140 is bonded to the bonding member 120 (S130), and an electrode pad formed on the bottom surface of the LED package 140 ( 144 is bonded to the circuit pattern 132 of the printed circuit board 130 (S140).

After the LED package 140 is disposed on the bonding member 120 and the circuit pattern 132 of the printed circuit board 130, the heat dissipation pad 142, the bonding member 120, and the electrode using a soldering process or the like. The pad 144 and the circuit pattern 132 may be bonded to each other, and thus the LED package 140 may be directly mounted on the thermal base 110 without a separate metal PCB.

Meanwhile, according to the shifting of the process, before performing the process of stacking the printed circuit board 130 on the thermal base 110 (S120), the electrode pad 144 of the LED package 140 is printed on the printed circuit board 130. Of course, the step (S140) of bonding to the circuit pattern 132 may be performed first.

According to the present embodiment, even when the materials of the thermal base 110 and the heat dissipation pad 142 are different, soldering is performed by inserting the bonding member 120 made of the same material as the heat dissipation pad 142 into the thermal base 110. The heat dissipation pad 142 of the LED package 140 may be more effectively bonded to the bonding member 120 by a process such as the above.

Next, with reference to FIGS. 13 and 14, another embodiment of the method for manufacturing the LED module 100 according to another aspect of the present invention.

13 and 14 are cross-sectional views showing each process of another embodiment of the LED module 100 manufacturing method according to another aspect of the present invention.

According to the present embodiment, the step of bonding the bonding member 120 made of the thermal conductive material to the thermal base 110 made of the thermally conductive material (S110), and printing the thermal base 110 so that the bonding member 120 is exposed. Stacking the circuit board 130 (S120), bonding the heat dissipation pad 142 formed on the bottom surface of the LED package 140 to the bonding member 120 (S130), and the bottom surface of the LED package 140. Provided is a method of manufacturing an LED module 100 including bonding the formed electrode pad 144 to a circuit pattern 132 of the printed circuit board 130 (S140).

In the case of the present embodiment, since the processes S120 to S140 have already been described through the above-described embodiment, the present embodiment will be described based on the S110 process, which is different from the above-described embodiment.

In addition, the present embodiment relates to a method of manufacturing the LED module 100 of the same or similar structure as the above-described fourth embodiment, the detailed description of the structure is omitted, this embodiment centering on the manufacturing process itself Explain about.

13 and 14, a process (S110) of joining the bonding member 120 to the thermal base 110 is performed by using an expansion process.

First, as shown in FIG. 13, the bonding member 120 is inserted into the outer circumferential surface of the thermal base 110. In FIG. 13, the inner diameter of the bonding member 120 is greater than the outer diameter of the thermal base 110, but the present invention is not limited thereto, and the inner diameter of the bonding member 120 is the same as the outer diameter of the thermal base 110. The joining member 120 may be coupled to the thermal base 110 by an Edo expansion process.

The thermal base 110 and the bonding member 120 are thus formed in the mold 20 in which the intaglio pattern 22 of the shape corresponding to the shape of the inclined portion 114 and the bonding member 120 of the thermal base 110 is formed. Place it.

Next, as shown in FIG. 14, the inclined portion 114 protrudes out of the thermal base 110 to the thermal base 110 and is inclined with respect to the central axis of the thermal base 110 by an expanding process. ), The bonding member 120 is coupled to the inclined surface of the inclined portion 114.

That is, the inside of the thermal base 110 may be pressed toward the intaglio pattern 22 of the mold 20 by using various pressing means such as compressed air to expand the diameter of the thermal base 110 and a part of the joining member 120. Accordingly, the inclined portion 114 is formed on the thermal base 110, and the joining member 120 is plastically deformed to a shape corresponding to the inclined portion 114 on the inclined surface of the inclined portion 114. Can be combined.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

10: LED lighting device
20: template
22: engraved pattern
100: LED module
200: cover member
300:
400: electrical connection
500: base
110: thermal base
112: protrusion
114: slope
116: insertion hole
118: airflow passage
120: joining member
130: printed circuit board
132: circuit pattern
140: LED package
142: heat dissipation pad
144: electrode pad
150: space part

Claims (17)

  1. A thermal base made of a thermally conductive material;
    A bonding member coupled to the thermal base and made of a thermally conductive material;
    A printed circuit board laminated on the thermal base such that the bonding member is exposed; And
    A heat dissipation pad and an electrode pad are formed on a lower surface thereof, and the heat dissipation pad is bonded to the bonding member and the electrode pad is bonded to a circuit pattern of the printed circuit board to include an LED package mounted on the thermal base. ,
    The thermal base is made of aluminum,
    The bonding member and the heat dissipation pad is made of copper,
    The bonding member and the heat dissipation pad is bonded by a soldering (soldering) method, LED module, characterized in that a solder interposed between the bonding member and the heat dissipation pad.

  2. delete
  3. delete
  4. The method of claim 1,
    LED module, characterized in that the space portion is provided between the electrode pad and the surface of the thermal base so that the printed circuit board is interposed.
  5. 5. The method of claim 4,
    And the joining member protrudes from the surface of the thermal base.
  6. 5. The method of claim 4,
    LED module, characterized in that the protrusion is formed in a portion of the thermal base to which the bonding member is coupled.
  7. 5. The method of claim 4,
    The LED module, characterized in that the surface of the bonding member is located at the same height as the surface of the printed circuit board.
  8. The method of claim 1,
    LED module, characterized in that the insertion hole is formed in the thermal base so that the joining member can be inserted.
  9. The method of claim 1,
    The thermal base has a columnar shape in which an air flow passage is formed to allow inflow and outflow of external air,
    The joining member has an LED module, characterized in that it has an annular structure to be inserted into the outer peripheral surface of the thermal base.
  10. 10. The method of claim 9,
    The thermal base is formed with an inclined portion protruding outward of the thermal base and having a surface inclined with respect to a central axis of the thermal base.
    The joining member is an LED module, characterized in that coupled to the inclined surface of the inclined portion.
  11. The method of claim 1,
    The printed circuit board is an LED module, characterized in that the flexible printed circuit board.
  12. Coupling a joining member made of a thermally conductive material to a thermal base made of a thermally conductive material;
    Stacking a printed circuit board on the thermal base such that the bonding member is exposed;
    Bonding the heat dissipation pad formed on the bottom surface of the LED package to the bonding member; And
    Bonding an electrode pad formed on a bottom surface of the LED package to a circuit pattern of the printed circuit board,
    The thermal base is made of aluminum,
    The bonding member and the heat dissipation pad is made of copper,
    The bonding member and the heat dissipation pad is bonded by a soldering (soldering) method, LED module manufacturing method, characterized in that the solder interposed between the bonding member and the heat dissipation pad.

  13. delete
  14. delete
  15. The method of claim 12,
    An insertion hole is formed in the thermal base,
    Coupling the bonding member to the thermal base,
    And inserting the bonding member into the insertion hole by a pressing process.
  16. The method of claim 12,
    The thermal base has a columnar shape in which an air flow passage is formed to allow inflow and outflow of external air,
    The joining member has an annular structure,
    Coupling the bonding member to the thermal base,
    And inserting the joining member into the outer circumferential surface of the thermal base.
  17. 17. The method of claim 16,
    Coupling the bonding member to the thermal base,
    After inserting the joining member to the outer peripheral surface of the thermal base,
    The inclined surface of the inclined portion is formed by the tube expanding process, forming the inclined portion having a surface protruding outward of the thermal base and inclined with respect to a central axis of the thermal base. LED module manufacturing method further comprises the step of coupling to.
KR1020120027253A 2012-03-16 2012-03-16 Led module and method for manufacturing the same KR101319588B1 (en)

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KR101768908B1 (en) * 2015-04-16 2017-08-30 주식회사 람파스 Metal printed circuit board and method for manufacturing same and light emitting diode package structure and method for manufacturing same
KR101868063B1 (en) * 2017-10-17 2018-07-19 주식회사 퍼스트전자 Apparatus for preventing damage by a surge of led element

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08125287A (en) * 1994-10-28 1996-05-17 Toshiba Corp Manufacture of printed wiring board for multichip module
KR20080018035A (en) * 2006-08-23 2008-02-27 자화전자(주) Board for an electronic parts and lighting unit included the board
KR20110101789A (en) * 2010-03-09 2011-09-16 김현민 Lighting cover having air pipe and led lighting apparatus using the same
KR20110129614A (en) * 2010-05-26 2011-12-02 주식회사 루미맥스테크놀러지 Electric/electronic apparatus and led apparatus which has high heat-release efficiency

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08125287A (en) * 1994-10-28 1996-05-17 Toshiba Corp Manufacture of printed wiring board for multichip module
KR20080018035A (en) * 2006-08-23 2008-02-27 자화전자(주) Board for an electronic parts and lighting unit included the board
KR20110101789A (en) * 2010-03-09 2011-09-16 김현민 Lighting cover having air pipe and led lighting apparatus using the same
KR20110129614A (en) * 2010-05-26 2011-12-02 주식회사 루미맥스테크놀러지 Electric/electronic apparatus and led apparatus which has high heat-release efficiency

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