KR101318732B1 - Method for cutting glass window of portable terminal - Google Patents
Method for cutting glass window of portable terminal Download PDFInfo
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- KR101318732B1 KR101318732B1 KR1020120011166A KR20120011166A KR101318732B1 KR 101318732 B1 KR101318732 B1 KR 101318732B1 KR 1020120011166 A KR1020120011166 A KR 1020120011166A KR 20120011166 A KR20120011166 A KR 20120011166A KR 101318732 B1 KR101318732 B1 KR 101318732B1
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- South Korea
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- cutting
- tempered glass
- cutting step
- laser beam
- glass disc
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
Abstract
The present invention relates to a method of cutting tempered glass for a portable terminal for cutting a tempered glass for a portable terminal having a straight portion and a curved portion in the outline line from a tempered glass disc, comprising a first cutting step and a second cutting step. The first cutting step moves the first laser beam having the first wavelength at a first speed along the straight portion and cuts the straight portion. The second cutting step cuts the curved portion by moving the second laser beam having a second wavelength shorter than the first wavelength at a second speed slower than the first speed along the curved portion.
Description
The present invention relates to a method for cutting tempered glass for a portable terminal, and more particularly, to a method for cutting tempered glass for a portable terminal for cutting a tempered glass protecting a display screen of a touch screen or a portable terminal into a desired shape using a laser beam. It is about.
Generally, the tempered glass applied to a portable terminal such as a touch screen and a mobile phone corresponds to an outer layer of a display panel, and is installed so as to prevent scratches on a display panel such as an LCD or an OLED or to protect it from an external impact do.
Such a tempered glass has a variety of shapes according to the shapes of the touch screen and the portable terminal. For this purpose, a cutting operation such as cutting a glass plate is essential.
A conventional method of processing tempered glass applied to a touch screen and a portable terminal will be briefly described below.
When a glass plate is inspected, the glass plate is inspected for scratches and various foreign substances, and the glass plate is cut using a mechanical cutter to have the appearance of the protective glass. Here, the glass is separated from the glass disc and has a form of a portable terminal, but the glass before the reinforcing layer is attached is defined as a protective glass. The outer surface of the protective glass separated by the cutting of the glass disc is polished, the through glass to be used for mounting a key button or a camera lens is processed on the finished protective glass, and the formed through hole is polished to process the outer surface. Steps. Then, the surface processing is completed, the surface polishing step, the washing step, the heat treatment step, the step of attaching the reinforcement layer on both sides of the protective glass to perform the post-process to complete the production and production of the tempered glass. .
However, in recent years, in order to improve productivity, a processing method of preparing a tempered glass disc having a reinforcement layer and a touch layer attached to the entire glass disc in advance and cutting the tempered glass for a mobile terminal from the tempered glass disc has been introduced. Accordingly, there is a problem that it is impossible to cut the tempered glass original plate with the reinforcing layer and the touch plate by using a conventional mechanical cutter.
Accordingly, an object of the present invention is to solve such a conventional problem, and is to carry a portable glass based on the tempered glass disc by cutting the tempered glass for the portable terminal from the tempered glass disc using a laser beam without using a mechanical cutter. The present invention provides a method of cutting a tempered glass for a mobile terminal, which enables to perform a processing process of a terminal tempered glass, and improves processability by using laser beams having different wavelengths according to the shape of the outline of the tempered glass for a portable terminal. .
In order to achieve the above object, the method for cutting glass for mobile terminals of the present invention is a method for cutting glass for mobile terminals, which cuts the glass for portable terminals, which has a straight line and a curved portion on an outline, from a glass plate. A first cutting step of moving a first laser beam having a first wavelength at a first speed along the straight portion and cutting the straight portion; And a second cutting step of moving the second laser beam having a second wavelength shorter than the first wavelength at a second speed slower than the first speed along the curved portion, and cutting the curved portion. .
In the method for cutting tempered glass for a portable terminal according to the present invention, Preferably, the tempered glass for the portable terminal further includes a through hole therein, and the second laser beam is formed along the outline of the through hole. And a third cutting step of cutting the through hole while moving at two speeds.
In the tempered glass cutting method for a portable terminal according to the present invention, preferably, the first wavelength of the first laser beam is an infrared wavelength, and the second wavelength of the second laser beam is a visible wavelength or an ultraviolet wavelength.
In the method of cutting a tempered glass for a portable terminal according to the present invention, Preferably, the second laser beam is a nanosecond laser having a nanosecond pulse width, a picosecond laser having a picosecond pulse width and a femtosecond. It is output from any one of femtosecond lasers having a (femtosecond) pulse width.
In the method for cutting a tempered glass for a portable terminal according to the present invention, Preferably, in the second cutting step, the second laser beam along the curved portion in a spiral form or a plurality of circular forms spaced apart while overlapping a predetermined portion. The cutting unit cuts the curved portion, and the movement path of the second laser beam is in contact with the outside of the curved portion.
In the method of cutting the tempered glass for a mobile terminal according to the present invention, Preferably, in the third cutting step, a plurality of spaced apart while overlapping the second laser beam in the form of a spiral or a predetermined portion along the outline of the through hole. The through hole is cut while moving in a circular shape, and the movement path of the second laser beam is in contact with the inside of the outline of the through hole.
In the method of cutting a tempered glass for a portable terminal according to the present invention, Preferably, in the first cutting step, half-cutting a part of the thickness of the original glass sheet with respect to the straight portion, and the second In the cutting step, full-cutting the entire thickness of the tempered glass disc with respect to the curved portion, and after the first cutting step and the second cutting step, the tempered glass disc is cut along the half cut straight part. Breaking
In the method of cutting a tempered glass for a portable terminal according to the present invention, Preferably, in the first cutting step, half-cutting a part of the thickness of the original glass sheet with respect to the straight portion, and the second In the cutting step, full-cutting the entire thickness of the tempered glass disc with respect to the curved portion, and between the first cutting step and the second cutting step, the tempered glass disc along the half cut straight portion. Breaking
In the method of cutting tempered glass for a portable terminal according to the present invention, Preferably, in the first cutting step, the entire thickness of the original glass sheet is full-cutted relative to the straight portion, and the second In the cutting step, the entire thickness of the tempered glass original plate is full-cutted with respect to the curved portion.
In the method of cutting a tempered glass for a portable terminal according to the present invention, Preferably, the second cutting step, the thickness of the tempered glass original plate while moving the second laser beam along the curved portion on the upper surface of the tempered glass original plate A first half cutting step of half-cutting a portion, a flipover step of inverting the tempered glass disc, and a movement of the second laser beam along the curved portion of the bottom surface of the tempered glass disc, By sequentially performing the second half cutting step of half-cutting the remaining part, the entire thickness of the tempered glass original plate is fully cut.
In the method of cutting a tempered glass for a portable terminal according to the present invention, Preferably, the second cutting step, by providing a pair of second laser beam to be irradiated to the upper and lower surfaces of the original glass, respectively, the strengthening A first half cutting step of half-cutting a part of the thickness of the tempered glass disc while moving one second laser beam along the curved portion on the top surface of the glass disc, and a second laser beam different from the bottom surface of the tempered glass disc Simultaneously performing a second half cutting step of moving the beam along the curved portion and half-cutting the remaining portion of the thickness of the tempered glass disc, thereby fully cutting the entire thickness of the tempered glass disc.
According to the method of cutting the tempered glass for a portable terminal of the present invention, it is possible to perform the processing process of the tempered glass for a portable terminal based on the tempered glass disc, it is possible to improve the workability.
In addition, according to the method of cutting the tempered glass for a portable terminal of the present invention, it is possible to effectively perform the cutting process of the tempered glass disc while controlling the shape or length of the path to be cut easily.
In addition, according to the method of cutting the tempered glass for portable terminal of the present invention, it is possible to reduce the time required to cut the tempered glass disc and to improve the processing quality of the cut surface.
1 is a flowchart of a method of cutting tempered glass for a portable terminal according to a first embodiment of the present invention,
FIG. 2 is a view illustrating a first cutting step of the tempered glass cutting method for the portable terminal of FIG. 1,
3 is a view illustrating a second cutting step of the tempered glass cutting method for the portable terminal of FIG.
4 is a view for explaining a third cutting step of the tempered glass cutting method for a mobile terminal of FIG.
5 is a view sequentially illustrating a second cutting step of the tempered glass cutting method for a mobile terminal of FIG.
6 is a flowchart of a method of cutting tempered glass for a mobile terminal according to a second embodiment of the present invention,
FIG. 7 is a view illustrating a second cutting step of the tempered glass cutting method for the portable terminal of FIG. 6.
Hereinafter, embodiments of the tempered glass cutting method for a portable terminal according to the present invention will be described in detail with reference to the accompanying drawings.
1 is a flowchart illustrating a method of cutting tempered glass for a portable terminal according to a first embodiment of the present invention, FIG. 2 is a view illustrating a first cutting step of the method for cutting tempered glass for a portable terminal of FIG. 1, and FIG. 1 is a view illustrating a second cutting step of the tempered glass cutting method for the portable terminal of FIG. 1, FIG. 4 is a view for explaining a third cutting step of the tempered glass cutting method for the portable terminal of FIG. 1, FIG. 2 is a view for sequentially explaining the second cutting step of the tempered glass cutting method for a portable terminal.
1 to 5, a method of cutting tempered glass for a portable terminal according to the present embodiment is to cut a tempered glass protecting a touch screen or a display panel of a portable terminal into a desired shape using a laser beam. The
The method for cutting tempered glass for a portable terminal according to the present invention includes a
In addition, although the name of the present invention described as a tempered glass for a portable terminal, the present invention can be applied to the tempered glass used in the touch screen, such as a cash dispenser of the bank.
In the
In the present embodiment, the first laser beam L1 processing the
Referring to FIG. 2, the first laser beam L1 substantially moves along the
In the
Thereafter, the remaining part of the thickness of the
In the
In the present embodiment, the second laser beam L2 for processing the
On the other hand, the second laser beam L2 is output from any one of a nanosecond laser having a nanosecond pulse width, a picosecond laser having a picosecond pulse width, and a femtosecond laser having a femtosecond pulse width. . When the tempered glass
In general, when the tempered glass
When the
Referring to FIG. 3A, in the
Meanwhile, referring to FIG. 3B, in the
In the
First, in the first
When the second laser beam L2 is irradiated to only one surface of the tempered glass
In the
Referring to FIG. 4A, in the
Meanwhile, referring to FIG. 4B, in the
In the
However, after the first
The method of cutting tempered glass for a mobile terminal according to the present embodiment configured as described above is based on a tempered glass disc by cutting the tempered glass for a portable terminal from the tempered glass disc using a laser beam without using a mechanical cutter. The processing process of the tempered glass for the portable terminal can be performed, and the workability can be improved by using laser beams having different wavelengths according to the shape of the outline of the tempered glass for the portable terminal.
In addition, the method of cutting the tempered glass for a portable terminal according to the present embodiment configured as described above is to cut the tempered glass disc by using a laser beam having a short pulse width for a non-linear curve or a line segment region of limited length, thereby cutting While easily controlling the shape or length of the path to be obtained, the effect of effectively performing the cutting process of the tempered glass disc can be obtained.
In addition, the tempered glass cutting method for a mobile terminal according to the present embodiment configured as described above, by performing a half-cutting process on both sides of the tempered glass disc to perform a full cut to the tempered glass disc, respectively, It is possible to reduce the time required for cutting and to improve the processing quality of the cut surface.
6 is a flowchart illustrating a method of cutting tempered glass for a portable terminal according to a second embodiment of the present invention, and FIG. 7 is a view illustrating a second cutting step of the method for cutting tempered glass for a portable terminal of FIG. 6.
6 and 7, in the method of cutting tempered glass for a mobile terminal according to the present embodiment, a second laser beam may be formed on the
The
First, a pair of second laser beams L2 are provided on the upper side and the lower side of the tempered glass
In the
The tempered glass cutting method for a portable terminal of this embodiment has the mechanical complexity of providing laser beams on both sides of the tempered glass disc, but reduces the time required for the second cutting step and the third cutting step, thereby improving overall productivity. The effect can be obtained.
In the embodiment shown in FIG. 1, the
After separating the tempered
In addition, in the embodiment shown in FIG. 1, it was described as half-cutting the
A pair of first laser beams L1 output from the CO2 laser source is provided, and a cooling unit is disposed between the pair of first laser beams L1. When the first laser beam L1, the cooling unit, and the first laser beam L1 are arranged in a line along the direction in which the
The scope of the present invention is not limited to the above-described embodiments and modifications, but can be implemented in various forms of embodiments within the scope of the appended claims. Without departing from the gist of the invention claimed in the claims, it is intended that any person skilled in the art to which the present invention pertains falls within the scope of the claims described in the present invention to various extents which can be modified.
11: tempered glass disc
12: tempered glass for mobile terminal
13: straight part
14: curved portion
15: through hole
101: first cutting step
102: second cutting step
103: third cutting step
Claims (11)
A first cutting step of moving the first laser beam having a first wavelength along the straight portion at a first speed and cutting the straight portion; And
And a second cutting step of moving the second laser beam having a second wavelength shorter than the first wavelength at a second speed slower than the first speed along the curved portion, and cutting the curved portion. Method of cutting tempered glass for terminals.
The tempered glass for the mobile terminal further includes a through hole therein,
And a third cutting step of moving the second laser beam at the second speed along the outline of the through hole, and cutting the through hole. 2.
The first wavelength of the first laser beam is an infrared wavelength,
And a second wavelength of the second laser beam is a visible light wavelength or an ultraviolet wavelength.
The second laser beam,
Tempered glass cutting for mobile terminals, characterized in that it is output from any one of a nanosecond laser having a nanosecond pulse width, a picosecond laser having a picosecond pulse width and a femtosecond laser having a femtosecond pulse width Way.
In the second cutting step,
The second laser beam is moved along the curved portion in a spiral form or a plurality of circular shapes spaced apart from each other while overlapping a predetermined portion, and cutting the curved portion, and the movement path of the second laser beam is in contact with the outside of the curved portion. Tempered glass cutting method for a mobile terminal.
In the third cutting step,
The second laser beam is moved along a contour of the through hole in a spiral form or in a plurality of circular shapes spaced apart from each other while overlapping a predetermined portion and cutting the through hole, and the movement path of the second laser beam is an outline of the through hole. Tempered glass cutting method for a mobile terminal, characterized in that in contact with the inside of the line.
In the first cutting step, half-cutting a part of the thickness of the tempered glass disc with respect to the straight portion, and in the second cutting step, the entire thickness of the tempered glass disc is pulled with respect to the curved part. Full-cutting,
And after the first cutting step and the second cutting step, breaking the tempered glass disc along a half-cut straight line.
In the first cutting step, half-cutting a part of the thickness of the tempered glass disc with respect to the straight portion, and in the second cutting step, the entire thickness of the tempered glass disc is pulled with respect to the curved part. Full-cutting,
And between the first cutting step and the second cutting step, breaking the tempered glass disc along a half cut straight portion.
In the first cutting step, full-cutting of the entire thickness of the tempered glass disc with respect to the straight portion,
In the second cutting step, characterized in that the full-cutting of the entire thickness of the tempered glass disc with respect to the curved portion (full-cutting), characterized in that for cutting.
The second cutting step,
A first half cutting step of moving the second laser beam along the curved portion on the upper surface of the tempered glass disc and half-cutting a part of the thickness of the tempered glass disc, a flipover step of inverting the tempered glass disc, and By sequentially performing a second half cutting step of moving the second laser beam along the curved portion on the lower surface of the tempered glass disc and half-cutting the remaining portion of the thickness of the tempered glass disc, thereby reducing the overall thickness of the tempered glass disc. Tempered glass cutting method for a mobile terminal, characterized in that the full cut.
The second cutting step,
Providing a pair of second laser beams to be irradiated to the upper and lower surfaces of the tempered glass disc, respectively,
A first half cutting step of moving a second laser beam along the curved portion on the upper surface of the tempered glass disc and half-cutting a part of the thickness of the tempered glass disc; Carrying out the second half cutting step of moving the laser beam along the curved portion and half-cutting the remaining part of the thickness of the tempered glass disc at the same time, thereby carrying out a full cut of the entire thickness of the tempered glass disc. Method of cutting tempered glass for terminals.
Priority Applications (1)
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KR1020120011166A KR101318732B1 (en) | 2012-02-03 | 2012-02-03 | Method for cutting glass window of portable terminal |
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KR1020120011166A KR101318732B1 (en) | 2012-02-03 | 2012-02-03 | Method for cutting glass window of portable terminal |
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KR20130090093A KR20130090093A (en) | 2013-08-13 |
KR101318732B1 true KR101318732B1 (en) | 2013-10-18 |
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Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103435255B (en) * | 2013-08-14 | 2015-09-30 | 深圳光韵达光电科技股份有限公司 | A kind of cutting process method of touch-screen |
US20180257170A1 (en) * | 2017-03-13 | 2018-09-13 | Coherent Lasersystems Gmbh & Co. Kg | Controlled separation of laser processed brittle material |
CN110342806B (en) * | 2019-06-27 | 2021-11-09 | 大族激光科技产业集团股份有限公司 | Processing method of glass cover plate with through hole |
US11883904B2 (en) | 2019-08-06 | 2024-01-30 | Panasonic Intellectual Property Management Co., Ltd. | Dual-wavelength laser systems and material processing utilizing such systems |
US20210387907A1 (en) * | 2020-06-15 | 2021-12-16 | JPT Electronics Pte Ltd | Method and apparatus for machining glass with laser induced chemical reaction |
CN112846533A (en) * | 2020-12-31 | 2021-05-28 | 武汉华工激光工程有限责任公司 | Laser cutting method for beryllium-copper alloy material of 5G connector |
KR102652037B1 (en) * | 2021-08-11 | 2024-04-01 | (주)중우엠텍 | Method for cutting substrate |
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JP2005142303A (en) | 2003-11-05 | 2005-06-02 | Disco Abrasive Syst Ltd | Method of dividing silicon wafer, and apparatus thereof |
JP2005238246A (en) | 2004-02-24 | 2005-09-08 | Towa Corp | Cutting apparatus and method |
KR100666649B1 (en) | 2005-10-19 | 2007-01-09 | 삼성에스디아이 주식회사 | The fabrication method of organic light emitting display |
JP4868950B2 (en) * | 2006-06-08 | 2012-02-01 | アピックヤマダ株式会社 | Semiconductor device cutting system and semiconductor device cutting method |
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2012
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Patent Citations (4)
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JP2005142303A (en) | 2003-11-05 | 2005-06-02 | Disco Abrasive Syst Ltd | Method of dividing silicon wafer, and apparatus thereof |
JP2005238246A (en) | 2004-02-24 | 2005-09-08 | Towa Corp | Cutting apparatus and method |
KR100666649B1 (en) | 2005-10-19 | 2007-01-09 | 삼성에스디아이 주식회사 | The fabrication method of organic light emitting display |
JP4868950B2 (en) * | 2006-06-08 | 2012-02-01 | アピックヤマダ株式会社 | Semiconductor device cutting system and semiconductor device cutting method |
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