KR101262135B1 - Multilayer printed wiring board and method for manufacturing same - Google Patents

Abstract

A wiring board having a first insulating layer made of polyimide or a first liquid crystal polymer and a wiring circuit formed on at least one side of the first insulating layer, and a melting point below the heat deformation temperature of the polyimide and / or the first Preparing a conductor layer substrate having a second insulating layer made of a second liquid crystal polymer having a melting point lower than that of the liquid crystal polymer and a conductor layer laminated on one side of the second insulating layer;
And arranging the wiring substrate and the conductor layer substrate so that the second insulating layer side of the conductor layer substrate faces the wiring substrate, and successively laminating the substrate under heating and pressing using a heat pressurizing equipment. Method of manufacturing a printed wiring board.

Description

Multilayer printed wiring board and manufacturing method therefor {MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME}

The present invention relates to a multilayer printed wiring board and a method of manufacturing the same.

In recent years, the high performance of electronic devices has been remarkable, and in particular, communication devices and computers are required to cope with high frequency as well as to improve operation speed, and to further reduce the size and thickness of the device in order to increase the multifunctionality and portability. ) Is also required.

Therefore, high-speed, low-loss signal transmission, high-density wiring, thinning, and weight reduction are also required for printed wiring boards mounted on these devices. These demands for printed wiring boards are directed toward further lowering the dielectric constant of the substrate material, lowering the dielectric constant, thinning, and reducing the weight of the substrate. As a means to solve these demands, it has been a long time since a multilayer printed wiring board by a build up method has been adopted.

Moreover, as an interlayer insulation material of a multilayer printed wiring board, what used thermosetting resins, such as an epoxy resin and a polyimide resin, is widely known. These thermosetting resins have properties such as good heat resistance, which are useful in densified multilayer printed wiring boards. However, since the thermosetting resin does not necessarily have sufficient low dielectric constant and low dielectric loss tangent characteristics, the thermosetting resin did not sufficiently satisfy the high frequency characteristics required for electronic devices.

Therefore, the multilayer printed wiring board which used the liquid crystal polymer which is a thermoplastic resin as an interlayer insulation material is also proposed as what satisfy | fills the said high frequency characteristic. Such a liquid crystal polymer is excellent in the characteristics of low dielectric constant and low dielectric loss tangent, and is excellent in the high speed and low loss signal transmission property in the high frequency area of a multilayer printed wiring board.

As a multilayer printed wiring board using such a liquid crystal polymer as an interlayer insulating material, for example, Japanese Laid-Open Patent Publication No. 8-97565 (Document 1) superimposes a wiring board on which a circuit layer (wiring circuit) is formed. In forming the substrate, it is disclosed that a liquid crystal polymer having a melting point at least 10 ° C. lower than the melting point of the liquid crystal polymer of the wiring board is sandwiched between the wiring boards as an adhesive layer, and in the specification, the laminated body releases the stacked wiring boards. It is described that it is formed by laminating | stacking by laminating | stacking with a pad and a lamination press. Moreover, according to this proposal, it is described that a multilayer printed wiring board can be obtained, without having to heat the liquid crystal polymer component of a circuit layer more than its melting | fusing point.

Further, Japanese Patent Laid-Open No. 2001-244630 (Patent 2) discloses a liquid crystal polymer having a lower heat resistance than a liquid crystal polymer film used as an insulating layer of the wiring circuit board (wiring board) on which the wiring circuit is formed. Disclosed is a method of arranging on the upper and lower surfaces of a film and pressing with a pair of heating rolls. In addition, in the specification, as in the case of using the above laminated press, a liquid crystal polymer film having low heat resistance is used as an adhesive layer, and at this time, a liquid crystal polymer film having lower heat resistance on the outer surface of the wiring circuit board (wiring substrate) is further laminated as a protective film. It is also described. In addition, in this specification, in order to prevent each heating roll from damaging the wiring circuit formed in the surface (outer surface) of each wiring circuit board, it winds around a release sheet between rolls, and this release sheet is wound on the surface of each wiring circuit board. It is described to pressurize with a roll, making contact with. In addition, according to this proposal, it is described that a multilayer wiring circuit board (multilayer printed wiring board) having a good appearance and having sufficient dimensional stability and high adhesion can be obtained at low cost.

Document 1: Japanese Patent Laid-Open No. 8-97565 Document 2: Japanese Unexamined Patent Publication No. 2001-244630

However, in the said prior art, it is well known that lamination | stacking by the lamination | stacking press of the former (document 1) is inferior in productivity compared with lamination | stacking by what is called roll lamination which roll-compresses. Moreover, when laminating at a temperature higher than the liquid crystal polymer melting point at the time of lamination press, there exists a problem that there exists a defect which causes outflow of a circuit and a deformation | transformation.

On the other hand, lamination by the heating roll of the latter (document 2) is superior to lamination by lamination presses in terms of productivity and cost as described above, but the wiring circuit formed on the surface (outer surface) of each wiring circuit board is described above. There was a problem that it was difficult to completely avoid the damage.

That is, according to the method described in Document 2, in the lamination step by the first press roll, the liquid crystal polymer layer having a lower heat resistance (melting point) than the insulating layer on the outside is disposed on the center side away from the press roll, The heating and pressing conditions become more stringent, and there is a fear that a defect such as deformation of the wiring circuit is caused. Similarly, in the case where the first lamination step is actually to be performed, a release sheet such as a glass woven impregnated Teflon (registered trademark) sheet is indispensable to prevent the breakage of the circuit, and in that case, the delicate temperature of the lamination step It may interfere with control and lead to a defect of the multilayer circuit board.

In addition, in the multilayer printed wiring boards described in Documents 1 and 2 above, in order to achieve a higher density and a smaller size, in order to reduce the thickness of the multilayer printed wiring board, the heat resistance of the insulating layer is not necessarily sufficient. There was a problem.

SUMMARY OF THE INVENTION The present invention has been made in view of the problems of the prior art, and in the method of continuously manufacturing a multilayer printed wiring board having an insulating layer made of a liquid crystal polymer, the deformation of the wiring circuit formed on the outermost surface of the multilayer printed wiring board is prevented. It aims at providing the multilayer printed wiring board which can be obtained by the manufacturing method of the multilayer printed wiring board which can be made, and the manufacturing method which can simultaneously implement | achieve heat resistance and the outstanding high frequency characteristic.

MEANS TO SOLVE THE PROBLEM As a result of earnest research in order to achieve the said objective, the present inventors have a 1st insulating layer which consists of a polyimide or a 1st liquid crystal polymer, and the wiring circuit formed in at least one surface of the said 1st insulating layer. One side of the second insulating layer and the second insulating layer made of a wiring substrate and a second liquid crystal polymer having a melting point lower than the heat deformation temperature of the polyimide and / or a melting point lower than the melting point of the first liquid crystal polymer. Preparing a conductor layer substrate having a conductor layer laminated on the substrate;

Arranging the wiring board and the conductor layer substrate so that the second insulating layer side of the conductor layer substrate faces the wiring board, and successively laminating under heating pressure using a heat pressurizing equipment;

By the manufacturing method of the multilayer printed wiring board containing this, what discovered that the deformation | transformation of the wiring circuit formed in the outermost surface of a multilayer printed wiring board can be prevented, and came to complete this invention.

The manufacturing method of the multilayer printed wiring board of this invention is a wiring board which has the 1st insulating layer which consists of polyimide or a 1st liquid crystal polymer, and the wiring circuit formed in at least one surface of the said 1st insulating layer, and the said polyimide A conductor having a second insulating layer made of a second liquid crystal polymer having a melting point below the heat deflection temperature and / or a melting point lower than the melting point of the first liquid crystal polymer and a conductor layer laminated on one side of the second insulating layer. Preparing a layer substrate;

Arranging the wiring board and the conductor layer substrate so that the second insulating layer side of the conductor layer substrate faces the wiring board, and successively laminating under heating pressure using a heat pressurizing equipment;

It is a method including.

In the method for manufacturing a multilayer printed wiring board of the present invention, the wiring board and the two conductor layer substrates are prepared by preparing two conductor layer substrates and laminating the wiring substrate and the conductor layer substrate. It is preferable that the two conductor layer substrates are disposed so as to face the second insulating layer side to the wiring substrate, respectively, and are laminated successively under heating pressurization using a heat pressurizing equipment.

Moreover, in the manufacturing method of the multilayer printed wiring board of this invention, it is preferable that the said 2nd liquid crystal polymer has melting | fusing point 5-60 degreeC lower than melting | fusing point of a 1st liquid crystal polymer.

Moreover, in the manufacturing method of the multilayer printed wiring board of this invention, it is preferable that the said wiring board and the said conductor layer board were respectively wound in roll shape.

Further, in the method for manufacturing a multilayer printed wiring board of the present invention, in laminating the wiring board and the conductor layer substrate, the wiring board and the conductor layer substrate are respectively drawn out and continuously in a roll to roll manner. It is preferable to laminate.

Moreover, in the manufacturing method of the multilayer printed wiring board of this invention, it is preferable that the said heating pressurization installation equipment is a roll laminator.

Moreover, in the manufacturing method of the multilayer printed wiring board of this invention, it is preferable that the roll linear pressure of the said roll laminator is 10-250 kN / m.

Moreover, in the manufacturing method of the multilayer printed wiring board of this invention, it is preferable to further include the process of surface-treating the surface of the said 2nd insulating layer of the said conductor layer board | substrate.

In the method for manufacturing a multilayer printed wiring board of the present invention, in the lamination of the wiring board and the conductor layer substrate, the wiring board and the conductor layer substrate are laminated (preliminarily stacked) under heating and pressing to form a laminate (preliminary laminate). ), It is preferable to perform a high temperature heat treatment by heating the laminate using a heat treatment equipment.

Further, in the manufacturing method of the multilayered printed circuit board of the present invention, it is for performing the high temperature heat treatment, high temperature heat treatment temperature satisfying the condition represented by formula (F1) to the laminate T _1:

(Melting point of the second liquid crystal polymer) -15 ° C? T ₁ ? (F1)

It is preferable to heat with.

Moreover, in the manufacturing method of the multilayer printed wiring board of this invention, when performing the said high temperature heat processing, it is preferable that high temperature heat processing time is the range of 10-180 second.

In the method for manufacturing a multilayer printed wiring board of the present invention, in order to obtain the laminated body, the laminated heat treatment temperature T ₂ for satisfying the condition expressed by the following formula (F2) for the wiring board and the conductor layer substrate:

(Melting point of the second liquid crystal polymer)-100 deg. C < T ₂ ? (Melting point of the second liquid crystal polymer)-20 deg. (F2)

It is preferable to laminate | stack (temporarily laminate) in the process.

The multilayer printed wiring board of the present invention is a multilayer printed wiring board in which a wiring circuit layer and an insulating layer are laminated alternately,

One of the two insulating layers adjacent to each other through the wiring circuit layer is a polyimide resin layer, and the other insulating layer includes a laminated structure unit in which a liquid crystal polymer layer is used.

Moreover, in the multilayer printed wiring board of this invention, it is preferable that the liquid crystal polymer layer is further provided in the said laminated structure unit through the wiring circuit layer on the opposite side to the side which adjoins the polyimide resin layer of the said liquid crystal polymer layer. Do.

Moreover, in the multilayer printed wiring board of this invention, it is preferable that the roughness of the interface of the said polyimide resin layer and the said liquid crystal polymer layer is the range of 4-6 micrometers in the said laminated structure unit.

Moreover, in the multilayer printed wiring board of this invention, in the said laminated structure unit, the roughness of the interface of the said polyimide resin layer and the said liquid crystal polymer layer may be less than 4 micrometers.

According to the present invention, in the method of continuously manufacturing a multilayer printed wiring board having an insulating layer made of a liquid crystal polymer, a method of manufacturing a multilayer printed wiring board which can prevent deformation of the wiring circuit formed on the outermost surface of the multilayer printed wiring board. And it becomes possible to provide the multilayer printed wiring board obtained by the manufacturing method.

1 is a partially enlarged schematic side cross-sectional view showing a copper clad laminate (a) and a wiring board (b) wound in a roll shape used in a first step.
FIG. 2 is a partially enlarged schematic side sectional view showing two conductor layer substrates wound in a roll shape used in a first step. FIG.
FIG. 3: is a schematic side cross-sectional view which shows the periphery of the heat | fever pressurization installation equipment in a 2nd process.
It is a schematic side cross-sectional view which shows the peripheral part of the heat processing equipment in a 2nd process.
FIG. 5: is a schematic side cross-sectional view which shows one suitable embodiment of the post process performed to the outer layer unprocessed multilayer printed wiring board obtained by a 2nd process (FIG. 5A corresponds to a through-hole formation process, FIG. 5B responds to a plating process) 5C corresponds to the circuit formation process and the solder resist formation process).
It is a schematic side cross-sectional view which shows one suitable embodiment of the multilayer printed wiring board of this invention.
It is a schematic side cross-sectional view which shows another suitable embodiment of the multilayer printed wiring board of this invention.
It is a schematic side cross-sectional view which shows the multilayer printed wiring board obtained in Example 7. FIG.
9 is a schematic side cross-sectional view showing a multilayer printed wiring board obtained in Example 8. FIG.
10 is a schematic side cross-sectional view showing a multilayer printed wiring board obtained in Example 9. FIG.
It is a schematic side cross-sectional view which shows the multilayer printed wiring board obtained in Example 10.
It is process drawing for demonstrating the manufacturing process of the multilayer printed wiring board obtained in Example 11. FIG.
It is process drawing for demonstrating the manufacturing process of the multilayer printed wiring board obtained in Example 12. FIG.
It is process drawing for demonstrating the manufacturing process of the multilayer printed wiring board obtained in Example 13. FIG.
It is process drawing for demonstrating the manufacturing process of the multilayer printed wiring board obtained in Example 14. FIG.
It is process drawing for demonstrating the manufacturing process of the multilayer printed wiring board obtained in Example 15. FIG.
17 is a flowchart for explaining a manufacturing step of the multilayer printed wiring board obtained in Example 16. FIG.

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of this invention is described in detail, referring drawings.

(Manufacturing method of a multilayer printed wiring board)

First, the manufacturing method of the multilayer printed wiring board of this invention is demonstrated. The manufacturing method of the multilayer printed wiring board of this invention is a wiring board which has the 1st insulating layer which consists of polyimide or a 1st liquid crystal polymer, and the wiring circuit formed in at least one surface of the said 1st insulating layer, and the said polyimide A conductor having a second insulating layer made of a second liquid crystal polymer having a melting point below the heat deflection temperature and / or a melting point lower than the melting point of the first liquid crystal polymer and a conductor layer laminated on one side of the second insulating layer. Preparing a layer substrate (first process),

Arranging the wiring substrate and the conductor layer substrate so that the second insulating layer side of the conductor layer substrate faces the wiring substrate, and successively laminating the substrate under heating and fair),

It is a method including.

First, the polyimide used for the manufacturing method of the multilayer printed wiring board of this invention, and the 1st and 2nd liquid crystal polymer are demonstrated. The polyimide used for the manufacturing method of the multilayer printed wiring board of this invention has a polyimide and polyamide which have an imide bond in a molecule as a main component, and does not necessarily need to consist only of a single polyimide, A mixture may be sufficient. A polyimide can be obtained by selecting a well-known diamino compound, tetracarboxylic acid, or its anhydride suitably, combining them so that desired characteristics may be obtained, and making it react. Moreover, these polyimides are 0-35x10 <^-6> / degreeC (more preferably, 1x10 <^-6> -25 * 10 <^-6> / degreeC) from a viewpoint of the dimensional precision of the multilayer printed wiring board obtained. It is desirable to have a linear expansion coefficient in the range. In the present invention, for example, such a polyimide resin is used as the first insulating layer, and a wiring board having a wiring circuit formed on at least one side thereof is used. In that case, a commercially available polyimide film or polyimide and copper foil ( It is easy to use the copper clad laminated board which consists of i). When using a polyimide film, it can form a circuit board by circuit formation by well-known methods, such as a sputter | spatter. In the case of using a copper clad laminate, any wiring circuit can be formed by a known method to form a wiring board. As such a polyimide film, Apical AH, NPI (manufactured by Kaneka Corporation), Euphilex S (manufactured by Ube Koyama Co., Ltd.), Kapton (manufactured by Toray DuPont Co., Ltd.) and the like can be used. Moreover, as such a copper clad laminated board, Espanex S series and M series (all are the Shin-Nitetsu Chemical Co., Ltd. make) can be used. Moreover, it is preferable that it is the range of 300-380 degreeC, and, as for the heat distortion temperature of such polyimide, it is preferable that it is the range of 320-360 degreeC.

The 1st and 2nd liquid crystal polymers used for the manufacturing method of the multilayer printed wiring board of this invention mean forming an optically anisotropic molten phase. Although these types of liquid crystal polymers are not particularly limited, so-called all aromatic liquid crystal polymers, that is, liquid crystal polymers containing substantially no aromatic aliphatic long chains, are preferred. Moreover, it is more preferable to use the polyester which consists of 6-hydroxy- 2-naphthoic acid and p-hydroxy benzoic acid among these. Moreover, as these liquid crystal polymers, the mixture which combined the appropriate kind of liquid crystal material can also be used, For example, it can also select suitably from various liquid crystal polymers, such as the liquid crystal polymer used as an insulating layer in a commercial copper clad laminated board, and can use it suitably. . Moreover, it is preferable that these liquid crystal polymers have a linear expansion coefficient of the range of 1 * 10 <^-6> -25 * 10 <^-6> / ^degreeC , for example from a viewpoint of the dimensional precision of the multilayer printed wiring board obtained. In the present invention, for example, such a liquid crystal polymer is used as a second insulating layer, and a wiring board having a wiring circuit formed on at least one side thereof is used. In this case, a commercially available liquid crystal polymer film or liquid crystal polymer and copper foil are used. It is easy to use the copper clad laminated board which consists of. As such a liquid crystal polymer film, BEXSTAR (made by Kuraray Co., Ltd.) etc. can be used. Moreover, as such a copper clad laminated board, Espanex L series (made by Shinnitetsu Chemical Co., Ltd.) can be used. Moreover, it is preferable that melting | fusing point of this 1st liquid crystal polymer exists in the range of 280-350 degreeC, and it is preferable that melting | fusing point of this 2nd liquid crystal polymer exists in the range of 180-280 degreeC.

This polyimide or first liquid crystal polymer is the material of the first insulating layer according to the invention. This second liquid crystal polymer is also the material of the second insulating layer according to the present invention. And in this invention, it is necessary for the said 2nd liquid crystal polymer to have melting | fusing point lower than the heat distortion temperature of the said polyimide, and / or lower than melting | fusing point of the said 1st liquid crystal polymer. Thus, by making melting | fusing point of the said 2nd liquid crystal polymer lower than the heat distortion temperature of the said polyimide, and / or melting | fusing point of the said 1st liquid crystal polymer, the said 1st insulating layer in the 2nd process mentioned later It is possible to prevent deformation of the obtained multilayer printed wiring board while maintaining the filling property of the second liquid crystal polymer between the wiring circuits formed on at least one side of the substrate.

Moreover, in this invention, it is preferable that melting | fusing point of the said 2nd liquid crystal polymer is 5 degreeC or more lower than the heat distortion temperature of the said polyimide, and it is more preferable that it is 5-200 degreeC lower than the heat deformation temperature of the said polyimide. The melting point of the second liquid crystal polymer is preferably 5 to 60 ° C lower than the melting point of the first liquid crystal polymer, more preferably 10 to 60 ° C lower, and particularly preferably 15 to 40 ° C lower. If melting | fusing point of the said 2nd liquid crystal polymer is less than the said minimum, there exists a tendency for the dimensional precision of the multilayer printed wiring board obtained to become inadequate, and when it exceeds the said upper limit, there exists a tendency for the curvature and circuit deformation of the multilayer printed wiring board obtained to become large. In addition, the heat deflection temperature in this invention means the temperature which a film starts to increase rapidly with a load, when a certain load is heated and it heats up. And heat distortion temperature can be measured according to the method described in ASTM D648 or JIS K7191, for example, can be measured by the following method. In other words, by applying a thermomechanical analyzer (TMA) to the sample 5g load, by measuring the dimensional change of the sample when the temperature is raised to 400 ℃ at a temperature increase rate of 10 ℃ / min, the extrapolation of the extension of Tg or less ( The heat deflection temperature can be obtained from the intersection of the external line and the extrapolation of the elongation above Tg. In addition, melting | fusing point means the temperature of the endothermic peak observed when heated up to 360 degreeC with the temperature increase rate of 10 degreeC / min using a differential scanning calorimeter (DSC).

As mentioned above, although the polyimide used for the manufacturing method of the multilayer printed wiring board of this invention, and the 1st and 2nd liquid crystal polymer were demonstrated, the manufacturing method of the multilayer printed wiring board of this invention is hereafter referring FIG. It demonstrates. 1-5 is a schematic side sectional view for demonstrating one suitable embodiment of the manufacturing method of the multilayer printed wiring board of this invention. 1 and 2 correspond to the first process, FIGS. 3 and 4 correspond to the second process, and FIG. 5 corresponds to a later process to be described later.

In the first step, first, the first insulating layer 12 made of the polyimide or the first liquid crystal polymer as shown in FIG. 1B and the first insulating layer 12 are formed on at least one side thereof. The wiring board 18 having the wiring circuit 16 is prepared. Although the wiring board 18 is not specifically limited, As shown in FIG. 1B, it is preferable to be wound in roll shape. By using the thing wound in roll shape in this way, the manufacturing method of a multilayer printed wiring board can be performed by a roll-to-roll system, and further productivity can be aimed at. In addition, the wiring board 18 includes, for example, the first insulating layer 12 wound in a roll shape as shown in FIG. 1A and the copper foil 10 laminated on at least one surface of the first insulating layer 12. About the copper clad laminated board 14 which has a structure, it can manufacture by performing a circuit formation process. As such a circuit formation process, the method of performing etching resist lamination, exposure, image development, an etching, and resist peeling to the copper clad laminated board 14 in order, for example can be employ | adopted. Moreover, it is preferable to perform this circuit formation process by a roll-to-roll system.

Moreover, the 1st insulating layer 12 should just be a layer which consists of said polyimide or said 1st liquid crystal polymer, and is not specifically limited. And as this 1st insulating layer 12, you may select and use the said polyimide film or a commercially available liquid crystal polymer film suitably. As such a liquid crystal polymer film, BEXSTAR (made by Kuraray Co., Ltd.) etc. can be used. Moreover, as the copper clad laminated board 14 which has such a 1st insulating layer 12, Espanex L series (made by Shin-Nitetsu Chemical Co., Ltd.) and Espanex M series (made by Shin-Nitetsu Chemical Co., Ltd.) etc. are mentioned. Can be used.

Moreover, the thickness of the 1st insulating layer 12 can be made into the range of 5-100 micrometers, for example, Preferably it is the range of 10-50 micrometers. The thickness of the wiring circuit 16 can be, for example, in the range of 3 to 35 µm, and preferably in the range of 5 to 25 µm.

In the first step, a second liquid crystal polymer having a melting point that is lower than the heat deformation temperature of the polyimide as shown in FIG. 2 and / or a melting point lower than the melting point of the first liquid crystal polymer is shown. The conductor layer substrate 24 which has the insulating layer 22 and the conductor layer 20 laminated | stacked on the single side | surface of the 2nd insulating layer 22 is prepared. The second insulating layer 22 may be a layer made of the second liquid crystal polymer, and is not particularly limited. And as this 2nd insulating layer 22, you may select a commercially available liquid crystal polymer film suitably. As such a liquid crystal polymer film, BEXSTAR (made by Kuraray Co., Ltd.) etc. can be used. In addition, as a material of the conductor layer 20, a metal having good electrical conductivity can be used, and copper is particularly preferable. As the conductor layer substrate 24 having the second insulating layer 22, Espanex L series (manufactured by Shinnitetsu Chemical Co., Ltd.) or the like can be used.

Moreover, the thickness of the 2nd insulating layer 22 can be made into the range of 5-100 micrometers, for example, Preferably it is the range of 10-50 micrometers. Moreover, the thickness of the conductor layer 20 can be made into the range of 3-35 micrometers, for example, Preferably it is the range of 5-25 micrometers.

Further, at least one conductor layer substrate 24 may be prepared when the wiring substrate 18 has the wiring circuit 16 only on one side, but the wiring substrate 18 has the wiring circuit 16 on both sides. In this case, it is preferable to prepare two.

Moreover, in such a conductor layer board | substrate 24, it is preferable to surface-treat the surface of the said 2nd liquid crystal polymer (the said 2nd insulating layer) before performing the 2nd process mentioned later, and laminating by this The adhesion strength of the surface can be improved. As such a surface treatment method, an etching treatment with an alkali mixed solution or an etching treatment with plasma can be suitably applied.

In the second step, first, the wiring board 18 and the conductor layer substrate 24 are disposed so that the second insulating layer side of the conductor layer substrate 24 faces the wiring board 18. . Here, when the wiring board 18 has the wiring circuit 16 on both sides, as shown in FIG. 3 from a viewpoint of preventing deformation of the wiring circuit formed in the outermost surface of the multilayer printed wiring board obtained, wiring is shown. The substrate 18 and the two conductor layer substrates 24 are arranged so that the two conductor layer substrates 24 are disposed with the wiring substrate 18 therebetween so that the second insulating layer side faces the wiring substrate 18, respectively. It is preferable. In addition, when the wiring board 18 and the conductor layer board 24 are wound in roll shape, they can be taken out and used.

In the second step, the wiring board 18 and the conductor layer substrate 24 are subsequently laminated under a heating pressurization using a heating pressurizing facility 27, and the outermost surface of the multilayer printed wiring board ( Outer layer unprocessed multilayer printed wiring board) (FIG. 3). It is preferable that such a heating and pressing treatment facility 27 can be continuously processed in a roll-to-roll manner from the viewpoint of productivity. Moreover, as such a heating and pressurizing apparatus 27, apparatuses, such as a roll laminator, a double steel belt press, and a continuous press apparatus (for example, the MVLP series by Meiki Seisakusho Co., Ltd.), can be used, but from a viewpoint of productivity, it is a roll laminator. Preference is given to using. Moreover, when using a roll laminator as the heating pressurization equipment 27, it is preferable that roll linear pressure (lamination pressure) by a roll laminator is 10-250 kN / m, and it is more preferable that it is 25-150 kN / m. When roll linear pressure is less than the said minimum, the filling property of the said 2nd liquid crystal polymer between the wiring circuits formed in the at least single side | surface of the said 1st insulating layer, and the adhesiveness of the said wiring circuit and the said 2nd insulating layer will become inadequate. On the other hand, when it exceeds the said upper limit, the curvature of the multilayer printed wiring board obtained will become large, and there exists a tendency for the thickness change of the said 2nd liquid crystal polymer to become large. Moreover, it is preferable that the roll temperature (surface temperature) of a roll laminator is 150-300 degreeC.

In the second step, the wiring board 18 and the conductor layer substrate 24 are laminated in the laminating under heating and pressing (the temporary substrate). Layer) to obtain the laminate 26 (preliminary laminate 26), and then the laminate 26 is heated using a heat treatment facility 29 to heat the laminate 26 as shown in FIG. 4, and the outermost surface is unprocessed. It is preferable to obtain a phosphorus multilayer printed wiring board (outer layer unprocessed multilayer printed wiring board 28).

The method of obtaining an outer layer unprocessed multilayer printed wiring board by performing a high temperature heat treatment after obtaining the provisional laminate in this manner is to obtain the outer layer unprocessed multilayer printed wiring board by laminating the wiring substrate and the conductor layer substrate using only a heating and pressing treatment equipment such as a roll laminator. Compared with the method, it is advantageous at the point described below. That is, when laminating the wiring substrate and the conductor layer substrate using only a heating pressurizing equipment such as a roll laminator to obtain an outer layer unprocessed multilayer printed wiring board, the second liquid crystal between the wiring circuits by a short heating and pressing process is obtained. It is necessary to laminate these layers in such a manner as to satisfy three aspects of the filling properties of the polymer, the adhesion between the wiring circuit and the second insulating layer, and the prevention of deformation of the obtained multilayer printed wiring board. In view of the influence of the same variation in raw material quality, there is a concern that delicate condition management in the lamination step is required. Further, even when good lamination is performed under such condition management, warpage occurs in the multilayer printed wiring board in the subsequent step due to residual stress that is considered to have occurred due to lamination under heating and pressing conditions, and the component is formed as a multilayer printed wiring board. In the case of mounting and using, there exists a possibility that a defect may arise.

On the other hand, when a high temperature heat treatment is performed after obtaining a temporary laminated body as mentioned above and an outer layer raw multilayer printed wiring board is obtained, a residual stress hardly arises in the outer layer raw multilayer printed wiring board obtained. Therefore, the curvature of a multilayer printed wiring board can be fully suppressed in this way. In this case, compared to the case of lamination using only heat-pressing equipment 27 such as a roll laminator, when manufacturing a multilayer printed wiring board, it is possible to easily find a manufacturing condition that satisfies the above three aspects. .

In this way, in the case of obtaining the outer layer unprocessed multilayer printed wiring board 28 by performing a high temperature heat treatment after obtaining the provisional laminate 26, the wiring substrate 18 and the conductor layer substrate 24 are obtained. ) Is a lamination heat treatment temperature (temporary heat treatment temperature) that satisfies the condition expressed by the following formula (F2) T ₂ :

(Melting point of the second liquid crystal polymer)-100 deg. C &lt; T ₂ ? (Melting point of the second liquid crystal polymer)-20 deg. (F2)

It is preferable to laminate | stack (temporarily laminate) in the process. When the temporary heat treatment temperature T ₂ is less than the lower limit, the chargeability of the second liquid crystal polymer between wiring circuits formed on at least one side of the first insulating layer, and the adhesion of the wiring circuit and the second insulating layer. There exists a tendency for a sex to become inadequate, and on the other hand, when it exceeds the said upper limit, there exists a tendency which the curvature of the multilayer printed wiring board obtained cannot fully be suppressed.

In addition, when obtaining the outer layer unprocessed multilayer printed wiring board 28 by performing high temperature heat processing after obtaining the laminated body 26 in this way, in performing the said high temperature heat processing, the laminated body 26 is represented by following formula (F1). High temperature heat treatment temperature satisfying the condition T ₁ :

(Melting point of the second liquid crystal polymer) -15 ° C? T ₁ ? (F1)

It is preferable to heat with. When the high temperature heat treatment temperature T ₁ is less than the lower limit, the filling property of the second liquid crystal polymer between the wiring circuits formed on at least one side of the first insulating layer, and the adhesiveness of the wiring circuit and the second insulating layer. On the other hand, when the upper limit is exceeded, deformation or wrinkles tend to occur in the wiring circuit formed on at least one side of the first insulating layer.

In addition, in performing the said high temperature heat processing, it is preferable to make high temperature heat processing time into 5 second or more, and it is more preferable to set it as the range of 10-180 second. If the high temperature heat treatment time is less than 5 seconds, the filling property of the second liquid crystal polymer between the wiring circuits formed on at least one side of the first insulating layer and the adhesion between the wiring circuit and the second insulating layer are insufficient. On the other hand, when it exceeds 180 second, there exists a possibility that a distortion and a wrinkle may arise in the wiring circuit formed in the at least single side | surface of the said 1st insulating layer.

In addition, it is preferable that such a heat treatment installation 29 can be processed continuously in a roll-to-roll manner from the viewpoint of productivity. Moreover, as this heat processing installation 29, a tunnel furnace, a far infrared furnace, and a hot air drying furnace are mentioned, for example.

In the manufacturing method of the multilayer printed wiring board of this invention, a multilayer printed wiring board can be obtained by performing the post process demonstrated below as needed to the outer layer unprocessed multilayer printed wiring board obtained by the said 2nd process. Moreover, in the manufacturing method of the multilayer printed wiring board of this invention, after cutting an outer layer unprocessed multilayer printed wiring board to the product dimension of a multilayer printed wiring board, you may perform a post process for every cut, and also roll an outer layer unprocessed multilayer printed wiring board as it is. You may process continuously by a two-roll system and perform a post process.

Moreover, in the manufacturing method of the multilayer printed wiring board of this invention, you may wind up the sheet | seat of an outer layer unprocessed multilayer printed wiring board in roll shape, and temporarily store it as needed. In such a case, when the wiring circuit is formed on the surface as in the conventional method, the wiring circuit layer may be damaged. However, according to the present invention, since the outermost surface is a conductor layer, there is no such defect.

Moreover, as a subsequent post process, the through-hole formation process as shown in FIG. 5A, the plating process as shown in FIG. 5B, the circuit formation process as shown in FIG. 5C, and a soldering resist formation process are mentioned, for example. Moreover, as these post-processes, a suitable well-known method can be employ | adopted.

In the manufacturing method of the multilayer printed wiring board of this invention as mentioned above, since the outermost surface of the outer layer unprocessed multilayer printed wiring board obtained by the 2nd process is a conductor layer which has not yet become a wiring circuit, wiring in a 2nd process is carried out. There is no room for the problem of the deformation of the circuit, and since the wiring layer is formed by patterning the conductor layer after the second process, there is little possibility that the wiring circuit formed on the outermost surface of the multilayer printed wiring board is deformed.

Moreover, according to the manufacturing method of the multilayer printed wiring board of this invention, a 2nd process can be performed continuously by a roll-to-roll system, and in that case, it becomes possible to manufacture a multilayer printed wiring board with high productivity.

As mentioned above, although preferred embodiment of the manufacturing method of the multilayer printed wiring board of this invention was described, the manufacturing method of the multilayer printed wiring board of this invention is not limited to the said embodiment. For example, in the manufacturing method of the multilayer printed wiring board of this invention, the said wiring board may have two or more said 1st insulating layers. That is, by using a multilayer wiring board in advance as the wiring board, a multilayer printed wiring board of four or more layers can be manufactured, and the multilayer printed wiring board obtained by the method for producing a multilayer printed wiring board of the present invention can be further multilayered. Moreover, in the manufacturing method of the multilayer printed wiring board of this invention, a metal with favorable electroconductivity other than copper can also be used as a material of a wiring circuit.

(Multilayer printed wiring board)

Next, the multilayer printed wiring board of this invention is demonstrated. The multilayer printed wiring board of the present invention has a structure in which a plurality of wiring circuit layers (wiring circuits, conductor layers) and a plurality of insulating layers are alternately stacked. In the multilayer printed wiring board of the present invention, the laminated structure unit in which one of the two insulating layers adjacent to each other via the wiring circuit layer is a polyimide resin layer and the other insulating layer is a liquid crystal polymer layer. It is necessary to include. In the present invention, the insulating layer of one of two insulating layers adjacent to each other via the wiring circuit layer is a polyimide resin layer, and the other insulating layer includes a laminated structure unit in which a liquid crystal polymer layer is used. It is possible to achieve excellent high frequency characteristics.

Moreover, the multilayer printed wiring board of this invention can be manufactured by the manufacturing method of the multilayer printed wiring board of this invention mentioned above, for example. That is, a wiring board having a first insulating layer made of polyimide or a first liquid crystal polymer and a wiring circuit formed on at least one side of the first insulating layer, and a melting point below the thermal deformation temperature of the polyimide and / or the Preparing a conductor layer substrate having a second insulating layer made of a second liquid crystal polymer having a melting point lower than that of the first liquid crystal polymer and a conductor layer laminated on one side of the second insulating layer;

Arranging the wiring board and the conductor layer substrate so that the second insulating layer side of the conductor layer substrate faces the wiring board, and successively laminating under heating pressure using a heat pressurizing equipment;

In the method comprising, when the at least one wiring board has a first insulating layer (polyimide resin layer) made of polyimide, the multilayer printed wiring board of the present invention can be produced.

For example, as shown in FIG. 6, the multilayer printed wiring board of the present invention has two insulating layers adjacent to each other via the wiring circuit layer 52 in the multilayer printed wiring board 50 having the laminated structure. One of the insulating layers (54a and 54b) is a polyimide resin layer, and the other insulating layer includes a laminated structure unit 56 which is a liquid crystal polymer layer. Such a laminated structure unit 56 may apply to the whole laminated structure of the multilayer printed wiring board 50, and may be provided in one or more in the appropriate site | part of the whole laminated structure.

In addition, it is preferable to use polyimide resin as a material of one insulating layer 54a, but not limited to this, and if the heat resistance of the insulating layer is ensured and each of the characteristics of suitable low dielectric constant and low dielectric loss tangent is different, the thermosetting property is different. You may use resin. Moreover, as this polyimide resin, the thing similar to the polyimide used for the manufacturing method of the multilayer printed wiring board of this invention mentioned above is mentioned.

As the material of the other insulating layer 54b, a liquid crystal polymer is preferably used, but not limited thereto, and other thermoplastic resins may be used as long as they are excellent in characteristics of low dielectric constant and low dielectric loss tangent. Moreover, as this liquid crystal polymer, the thing similar to the liquid crystal polymer used for the manufacturing method of the multilayer printed wiring board of this invention mentioned above is mentioned.

In addition, as a material of the wiring circuit layer (wiring circuit) 52, a metal having good conductivity can be used, and copper foil is particularly preferable.

When the insulating layer 54a is a polyimide resin layer and the insulating layer 54b is a liquid crystal polymer layer, the thickness of the insulating layer 54a can be, for example, about 5 to 100 µm, and the insulating layer ( The thickness of 54b) can be made into about 10-100 micrometers, for example. The thickness of the wiring circuit layer 12 can be, for example, about 3 to 35 µm.

The multilayer printed wiring board of this invention is excellent in the balance of a characteristic by the favorable heat resistance of a polyimide resin, and the outstanding high frequency characteristic of a liquid crystal polymer. Moreover, since the insulating layer which concerns on this invention does not contain reinforcing materials, such as a glass woven fabric and an aramid nonwoven fabric, it is excellent in the density, thinning, and weight reduction of the multilayer printed wiring board obtained, and also the occurrence of the yield loss resulting from powder fall-off is reduced.

In addition, the multilayer printed wiring board of the present invention is, for example, as shown in Fig. 7, in the laminated structure unit 56a, a polyimide resin layer (insulating layer 54a) of the liquid crystal polymer layer (insulating layer 54b). ) And a liquid crystal polymer layer (insulating layer 54c) may be further provided on the side opposite to the side adjacent to each other through the wiring circuit layer 52a.

In the case of a structure in which such liquid crystal polymers are stacked adjacent to each other, since the positional shift of the wiring circuit may be caused by heating and pressing in the manufacturing process of the multilayer printed wiring board, the melting points of the liquid crystal polymers which are adjacent to each other are determined by the liquid crystal polymer layer ( It is preferable that melting | fusing point of 54b) is 5-60 degreeC higher than melting | fusing point of the liquid crystal polymer layer 54c, It is more preferable that it is 10-60 degreeC high, It is especially preferable that it is 15-40 degreeC high. The melting point of the liquid crystal polymer according to the present invention refers to the temperature of the endothermic peak observed when the temperature is raised to 360 ° C. at a temperature rising rate of 10 ° C./min using a differential scanning calorimeter (DSC).

As described above, the multilayer printed wiring board including the laminated structure unit 56a is advantageous in that a higher degree of multilayering of the printed wiring board using the laminated structure unit 56 as a skeleton structure can be easily realized.

Moreover, in the multilayer printed wiring board of this invention, in the said laminated structural unit 56 and 56a, the boundary surface of the polyimide resin layer (insulation layer 54a) and the liquid crystal polymer layer (insulation layer 54b) (in FIG. 6). It is preferable that the roughness Rz of the arrow (A) is in the range of 4 to 6 µm. If the roughness of the interface is within the above range, sufficient interlayer adhesion strength is achieved by tightly adhering between the layers without adversely affecting high speed and low loss signal transmission in a high frequency region which may occur when the roughness of the interface is remarkably large. It can be secured.

Moreover, the roughness Rz of the said interface surface may be less than 4 micrometers, Preferably it is the range of 1-3 micrometers, In this case, the bad influence to the high speed and low loss signal transmission in a high frequency range can be avoided more reliably.

The control of the roughness of the interface is, for example, when the conductor layer laminated in advance on the polyimide resin layer (insulation layer 54a) is formed by etching and patterning the wiring circuit 52 to form the polyimide resin layer ( To a suitable method such as changing the surface roughness of a conductor layer such as copper foil laminated on the insulating layer 54a, in other words, the surface roughness of the surface (laminated surface) on which the liquid crystal polymer layer (insulating layer 54b) is laminated. This can be done by.

In the multilayer printed wiring board of the present invention, in the laminated structural units 56 and 56a, the interface A between the polyimide resin layer (insulating layer 54a) and the liquid crystal polymer layer (insulating layer 54b) is formed. It is preferable that the laminated surface which faces the polyimide resin layer 54a of the liquid crystal polymer layer 54b to comprise, and the laminated surface which faced the liquid crystal polymer layer 54b of the liquid crystal polymer layer 54c are respectively surface-treated previously. In this way, good interlayer adhesion strength can be obtained by making the interlayers adhere tightly.

In particular, when the surface roughness is less than 4 µm as described above, the surface treatment allows balanced reduction of adverse effects on high-speed and low-loss signal transmission in the high frequency range and ensuring interlayer adhesion strength in a balanced manner. Do.

Such surface treatment is performed before the lamination integration process. Moreover, as a method of such a surface treatment process, the etching process by an alkali mixed solution and the etching process by a plasma are preferable.

And in a vacuum heat press process, for example, by controlling a press pressure in the range of 220-300 degreeC in the range of 4-8 Mpa, and also in a lamination process, the maximum temperature is 200-300 degreeC, for example. By controlling the lamination pressure (linear pressure) in the range of 2 to 200 kN / m within the range, it is possible to realize sufficient interlayer adhesion strength by softening or flowing the thermoplastic resin suitably.

Hereinafter, the method of manufacturing the multilayer printed wiring board of this invention is demonstrated.

FIG. 12 is a process chart showing a method of manufacturing a four-layer printed wiring board (corresponding to Example 11 described later) centered on a polyimide resin layer. FIG.

First, the polyimide resin layer is used as an insulating layer, and the double-sided copper clad laminated board 502 in which the copper foil 503 was laminated on both surfaces is prepared (refer FIG. 12A). As the double-sided copper clad laminate 502, a commercially available double-sided copper clad laminate may be used. And the wiring circuit layer 504 is formed in this double-sided copper clad laminated board 502 by arbitrary methods (refer FIG. 12B). For example, the wiring circuit layer 504 may be formed on the polyimide film by sputter plating. In addition, it is preferable that the thickness of a polyimide resin layer, a wiring circuit layer (copper foil), etc. were mentioned above.

Next, the one-side copper clad laminate 506 having the liquid crystal polymer as an insulating layer is heated and pressed on both sides of the double-sided wiring board 505 formed as described above (see FIG. 12C). Reference numeral 507 denotes a hot plate of the vacuum press. Here, it is preferable to use a liquid crystal polymer of the same melting point for heat-pressing both sides of the double-sided wiring board 505 in order to satisfactorily charge the liquid crystal polymer between circuits. It is preferable that melting | fusing point of a liquid crystal polymer is 250-350 degreeC, and the heating temperature at the time of heating and pressurization shall be 0-50 degreeC lower than melting | fusing point of a liquid crystal polymer. Moreover, it is preferable to perform pressurization for 5 to 60 minutes at 4-8 Mpa. Here, when the heating temperature at the time of heating and pressurization with respect to a liquid crystal polymer is 50 degreeC or more lower than melting | fusing point of a liquid crystal polymer, there exists a possibility that the wiring circuit of a wiring board may deform | transform, and when the pressurization range is less than 4 Mpa, the liquid crystal between wiring circuits There is a risk of insufficient filling of the polymer. On the other hand, when the heating temperature at the time of heating and pressurization with respect to a liquid crystal polymer is higher than melting | fusing point of a liquid crystal polymer, or a pressurization range exceeds 8 Mpa, it will leak out of the board | substrate (wiring board) of a liquid crystal polymer more, or in a liquid crystal polymer layer There may be a void.

Subsequently, after heating and pressurizing, the board | substrate is cooled and the laminated body 508 is obtained (refer FIG. 12D, FIG. 12E). These manufacturing conditions are the same also in the similar manufacturing method described below. In addition, the obtained laminated body 508 forms the through-hole 509 by a well-known method, such as an NC drill (refer FIG. 12F), and performs desmear process, and forms panel plating 510 (refer FIG. 12G). . The outermost layer 511 is etched and patterned by a tenting method to form a wiring circuit layer 512, and a solder resist layer 513 is formed to obtain a multilayer printed wiring board 501 (FIG. 12H). Reference).

It is process drawing which shows the method of manufacturing the four-layer printed wiring board (corresponding to Example 12 mentioned later) centering on a polyimide resin layer by the roll-to-roll system.

First, a polyimide resin layer is used as an insulating layer, a double-sided copper clad laminate 602 wound in a roll shape in which copper foils 603 are laminated on both sides thereof is prepared, and the wiring circuit layer 604 is formed in an arbitrary manner to form a roll shape. A wound double-sided wiring board 605 is obtained (see FIG. 13A). The double-sided copper clad laminate 602 may use a commercially available double-sided copper clad laminate. In addition, it is preferable that the thickness of a polyimide resin layer, a wiring circuit layer (copper foil), etc. were mentioned above.

Next, two single-sided copper clad laminates 606 wound in a roll shape having a liquid crystal polymer as an insulating layer were prepared. Then, two single-sided copper clad laminates 606 are heat-compressed on both sides of the double-sided wiring board 605 formed as described above to obtain a laminate 608 (see Figs. 13B and 13C). Also, reference numeral 607 denotes a roll. Here, it is preferable to use the same melting point for the liquid crystal polymer heated and compressed on both sides of the double-sided wiring board 605 in order to satisfactorily charge between the circuits on both sides. Although the melting | fusing point range of the liquid crystal polymer to be used is the same as that of a press process, it is preferable to make heating temperature at the time of heating and pressurization into temperature 0-80 degreeC lower than melting | fusing point of a liquid crystal polymer. Moreover, it is preferable to make pressurization pass a roll at 2 to 200 kN / m of lamination pressure (linear pressure).

These manufacturing conditions are the same also in the similar manufacturing method described below. Here, when the heating temperature at the time of heating and pressurization with respect to a liquid crystal polymer is lower than 80 degreeC below melting | fusing point of a liquid crystal polymer, there exists a possibility that the wiring circuit of a wiring board may deform | transform, and if the pressurization range does not reach 2 kN / m, There exists a possibility that filling of a liquid crystal polymer may become inadequate. On the other hand, when the heating temperature at the time of heating and pressurization with respect to a liquid crystal polymer is higher than melting | fusing point of a liquid crystal polymer, or a pressurization range exceeds 200 kN / m, the liquid crystal polymer will bleed out of the board | substrate more often, or a void may arise in a liquid crystal polymer layer. There is concern.

Subsequently, the obtained laminated body 608 is formed after cutting, thereby forming a through hole 609 (see FIG. 13D), and performing a desmear process to form panel plating 610 (see FIG. 13E). Then, the outermost layer 611 is etched and patterned by the tenting method to form the wiring circuit layer 612, and the solder resist layer 613 can be formed to obtain the multilayer printed wiring board 601 (Fig. 13f).

FIG. 14 is a process chart showing a method of manufacturing a four-layer printed wiring board (corresponding to Example 13 described later) centered on the same polyimide resin layer as in FIG. 12.

First, a polyimide resin layer is used as an insulating layer, and a double-sided copper clad laminate 702 in which copper foils 703-1 and 703-2 are laminated on both surfaces thereof is prepared (see Fig. 14A). As the double-sided copper clad laminate 702, a commercially available double-sided copper clad laminate may be used. Two double-sided copper clad laminates 702 are prepared (the other one denoted by reference numeral 702 '), and the wiring circuit layers 704-1', 704-2) (see FIG. 14B). In addition, it is preferable that the thickness of a polyimide resin layer, a wiring circuit layer (copper foil), etc. were mentioned above.

On the other hand, the copper foil 706 of both surfaces of the double-sided copper clad laminated board 705 which uses the liquid crystal polymer layer 707 of the same size as the double-sided copper clad laminated boards 702 and 702 'as an insulating layer is etched away, and it immersed in alkaline-mixed aqueous solution, and liquid-crystal A polymer layer 707 is obtained (see FIG. 14C).

Next, the surface-treated liquid crystal polymer layer 707 is sandwiched and sandwiched between the double-sided copper clad laminates 702 and 702 'facing the wiring circuit layers 704-2 and 704-1' (see Fig. 14D). Reference numeral 708 also denotes nirvana. After heating and pressurizing, the board | substrate is cooled and the laminated body 709 is obtained (refer FIG. 14E, FIG. 14F).

Subsequently, the obtained laminated body 709 forms through-hole 710 by a well-known method, such as an NC drill (refer FIG. 14G), and performs desmear process, and forms panel plating 711 (refer FIG. 14H). Then, the outermost layer 712 is etched and patterned by the tenting method to form the wiring circuit layer 713, and the solder resist layer 714 is formed to obtain the multilayer printed wiring board 701 (FIG. 14I). Reference).

FIG. 15 is a process chart showing a method of manufacturing a four-layer printed wiring board (corresponding to Example 14 described later) centered on the same polyimide resin layer as in FIG. 14.

First, a polyimide resin layer is used as an insulating layer, and two double-sided copper clad laminates 802 and 802 'wound in rolls in which copper foils 803 and 803' are laminated on both sides thereof are prepared, and the wiring circuit layers 804 and 804 'are formed by any method. ) Is formed to obtain double-sided wiring boards 805 and 805 '(see Fig. 15A).

The double-sided copper clad laminates 802 and 802 'can use commercially available double-sided copper clad laminates. In addition, it is preferable that the thickness of a polyimide resin layer, a wiring circuit layer (copper foil), etc. were mentioned above.

On the other hand, after the copper foils on both sides of the double-sided copper clad laminate 806 having the same sized liquid crystal polymer layers as the insulating layers as the double-sided wiring boards 805 and 805 'are etched away, the exposed surface is subjected to plasma treatment to form the liquid crystal polymer layer 807. (See FIG. 15B).

Next, the surface-treated liquid crystal polymer layer 807 is sandwiched between the double-sided wiring boards 805 and 805 'facing the wiring circuit layers 804 and 804', and thermally crimped (see Fig. 15C). Reference numeral 808 also denotes a roll. The substrate is cooled after heating and pressing to obtain a laminate 809.

Subsequently, the obtained laminated body 809 is formed after the cutting to form the through hole 810 in the same manner as described above (see FIG. 15D), and desmearing to form the panel plating 811. Then, the outermost layer 812 is etched and patterned by the tenting method to form the wiring circuit layer 813, and the solder resist layer 814 can be formed to obtain the multilayer printed wiring board 801 (Fig. 15e, see FIG. 15f).

FIG. 16 is a process chart showing a method of manufacturing an eight-layer printed wiring board (corresponding to Example 15 described later) centered on a polyimide resin layer. FIG.

First, the polyimide resin layer is used as an insulating layer, and two double-sided copper clad laminates 902 in which copper foils 903-1 and 903-2 are laminated on both sides thereof are prepared (see FIG. 16A, where only the double-sided copper clad laminates 902 are provided). Display). As the double-sided copper clad laminates 902 and 902 ', commercially available double-sided copper clad laminates can be used. Wiring circuit layers 904-1, 904-1 ′, 904-2, 904-2 ′ are formed on both surfaces of each of the double-sided copper clad laminates 902, 902 ′ (see FIG. 16B). In addition, it is preferable that the thickness of a polyimide resin layer, a wiring circuit layer (copper foil), etc. were mentioned above.

On the other hand, the copper foil 906 of both surfaces of the double-sided copper clad laminated board 905 which uses the liquid crystal polymer layer 907 of the same size as the double-sided copper clad laminated boards 902 and 902 'as an insulating layer is etched away, and is immersed in an aqueous alkali mixed aqueous solution to give a liquid crystal. A polymer layer 907 is obtained (see FIG. 16C).

Next, the surface-treated liquid crystal polymer layer 907 is sandwiched between the double-sided copper clad laminates 902 and 902 'formed as described above, followed by heat compression (see FIG. 16D). Reference numeral 908 also denotes nirvana. Thereafter, the substrate is cooled after heating and pressing to obtain a laminate 909 (see FIG. 16E).

Next, the single-sided copper clad laminates 910, 910 'having plasma-treated the resin surfaces 911, 911' of the liquid crystal polymer are prepared, and the resin surfaces 911, 911 'are placed on both sides of the laminate 909 so as to face each other (see Fig. 16F), and then heated. Press to obtain the laminate 912 (see FIG. 16G).

Subsequently, the obtained laminate 912 is etched 913 (see FIG. 16H), and then blind via holes 914 are formed (see FIG. 16I). After the desmear process, the plating layer 915 is formed (see FIG. 16J), and the wiring circuit layer 916 is formed (see FIG. 16K). 16F-16I are again performed, the through-hole 918 is formed in the obtained laminated body 917 (refer FIG. 16L), and the desmear process is performed and the panel plating is performed (refer FIG. 16M). ). Then, the outermost layer 920 is etched and patterned by a tenting method to form a wiring circuit layer 919, and a solder resist layer 921 is formed to obtain an eight-layer printed wiring board 901 (see FIG. 16N). .

FIG. 17 is a process chart showing a method of manufacturing an eight-layer printed wiring board (corresponding to Example 16 described later) centered on the same polyimide resin layer as in FIG. 16.

First, two-sided copper-clad laminate 1002 wound in a roll shape in which a polyimide resin layer was used as an insulating layer and copper foils 1003-1,1003-2,1003-1 ', 1003-2' were laminated on both sides thereof. 1002 '), and the wiring circuit layers 1004-1,1004-2,1004-1', 1004-2 'are formed by any method to obtain double-sided wiring boards 1005,1005' (FIG. 17A). Reference). As the double-sided copper clad laminates 1002 and 1002 ', commercially available double-sided copper clad laminates can be used. In addition, it is preferable that the thickness of a polyimide resin layer, a wiring circuit layer (copper foil), etc. were mentioned above.

On the other hand, after the copper foils on both sides of the double-sided copper clad laminate 1006 having a liquid crystal polymer layer of the same size as the double-sided wiring boards 1005 and 1005 'are used as an insulating layer, the surface of the liquid crystal polymer layer 1007 is subjected to plasma treatment. (See FIG. 17B).

Next, the surface-treated liquid crystal polymer layer 1007 is sandwiched between the double-sided wiring boards 1005 and 1005 'to be thermally compressed and cooled to obtain a laminate 1009 (see Fig. 17C). Reference numeral 1008 denotes a roll.

Next, single-sided copper-clad laminates 1010 and 1010 'obtained by plasma-processing the resin surfaces of the liquid crystal polymers 1011 and 1011' are prepared, and the resin surfaces of the liquid crystal polymers 1011 and 1011 'are opposed to both surfaces of the laminate 1009. And laminated | stacked, and it heats and pressurizes and obtains the laminated body 1012 (refer FIG. 17D).

Next, the laminated body 1012 is etched 1014, and the blind via hole 1015 is formed after that (refer FIG. 17E). After the desmear process, the plating layer 1016 electrically connected to the wiring circuit layers 1004-1 and 1004-2 'is formed (see FIG. 17F), and the wiring circuit layer 1017 is formed (see FIG. 17G). . 17D to 17E are again performed, through-holes 1019 are formed in the obtained laminate 1018 (see FIG. 17H), and desmeared to perform panel plating 1020 (see FIG. 17I). ). The outermost layers 1021 and 1021 'are etched and patterned by a tenting method to form a wiring circuit layer 1022, and a solder resist layer 1023 is formed to obtain an eight-layer printed wiring board 1001 (Fig. 17j).

<Examples>

EMBODIMENT OF THE INVENTION Hereinafter, although this invention is demonstrated further more concretely based on an Example and a comparative example, this invention is not limited to a following example.

(Example 1)

The first insulating layer 12 having a thickness of 25 μm and the first laminated layer 12 having a melting point of 295 ° C. (heat deformation temperature: 265 ° C.) and the thickness of the first insulating layer 12 laminated on both surfaces thereof are With respect to the copper clad laminate 14 having the copper foil 10 having a thickness of 9 µm, etching resist lamination, exposure, development, etching, and resist peeling are performed in a roll-to-roll manner, and wiring circuits 16 are formed on both surfaces to form a width. A long wiring board 18 wound in a roll of 300 mm x 200 m in length was produced (see Fig. 1).

Next, the second insulating layer 22 having a thickness of 25 μm and the second insulating layer 22 having a melting point of 280 ° C. (heat deformation temperature: 240 ° C.) are laminated on one side of the second insulating layer 22. Two conductor layer substrates 24 having a conductor layer 20 (copper foil) having a thickness of 9 μm (see FIG. 2) were prepared (see FIG. 2), and a second insulating layer of the two conductor layer substrates 24 ( The surface of 22) was plasma-processed, respectively.

Then, the wiring board 18 and the two conductor layer substrates 24 are drawn out, respectively, and the two insulation layer substrates 24 are sandwiched between the wiring boards 18 and the second insulating layer side. 18), a multilayer printed wiring board (laminated body) having the outermost surface unprocessed by continuously heating and pressing under a condition of a roll temperature of 260 ° C. and a roll linear pressure of 20 kN / m using a roll laminator as the heating pressurizing equipment 27. (26)) (see FIG. 3).

Subsequently, the obtained laminated body 26 was cut to 300 mm x 400 mm, the through-hole 30 of phi 0.15 mm was formed by NC drilling (refer FIG. 5A), and the panel of 8 micrometers thickness after predetermined desmear process was performed. Plating 32 was performed (see FIG. 5B). Then, the outermost surface was etched and patterned by the tenting method to form the wiring circuit 34 on the outermost surface, and the solder resist 36 was formed to produce a multilayer printed wiring board 38 (see Fig. 5C).

Moreover, in the obtained multilayer printed wiring board, it was confirmed that the deformation | transformation of the wiring circuit 34 of the outermost surface can fully be prevented. Furthermore, when the cross-sectional observation of the obtained laminated body 26 was performed, the disconnection and deformation of the wiring circuit of the wiring circuit 16 do not appear, and the charge of the 2nd liquid crystal polymer 22 between wirings is also favorable, The thickness of each resin layer was also almost uniform.

(Example 2)

The multilayering of the multilayer printed wiring board obtained in Example 1 was further planned as follows. That is, first, the multilayer printed wiring board (laminated body 26) whose outermost surface obtained in Example 1 was unprocessed was prepared, and the upper and lower double-sided copper foil 20 was patterned, and the wiring layer (wiring circuit) was formed. Next, the second insulating layer 22 having a thickness of 25 μm and the second insulating layer 22 having a melting point of 260 ° C. (heat deformation temperature: 220 ° C.) are laminated on one side of the second insulating layer 22. Two conductor layer substrates 24 having a conductor layer 20 (copper foil) having a thickness of 9 μm were prepared (see FIG. 2).

And two conductor layer board | substrates are sandwiched between a multilayer printed wiring board (the laminated body 26 in which the wiring layer was formed), and two conductor layer board | substrates 24, and a multilayer printed wiring board (the laminated body 26 in which the wiring layer was formed). The second insulating layer side is disposed so as to face the multilayer printed wiring board (the laminated body 26 on which the wiring layer is formed), and the roll temperature is 240 ° C., using the roll laminator as the heating and pressing equipment 27. Two conductor layer board | substrates 24 were laminated | stacked on the multilayer printed wiring board (the laminated body 26 in which the wiring layer was formed) by heating and pressurizing continuously on the conditions of 20 kN / m linear pressure. Subsequently, the post-process shown in FIG. 5 was performed, and further multilayering of the multilayer printed wiring board (the laminated body 26 in which the wiring layer was formed) was aimed at.

(Example 3)

1st insulating layer 12 whose thickness consists of a 1st liquid crystal polymer of melting | fusing point 295 degreeC is 25 micrometers, and copper foil 10 whose thickness is 9 micrometers laminated | stacked on both surfaces of the 1st insulating layer 12, With respect to the copper-clad laminate 14, etching resist lamination, exposure, development, etching, and resist peeling are performed in a roll-to-roll manner, and wiring circuits 16 are formed on both surfaces, and wound in a roll of 300 mm in width and 200 m in length. An elongated wiring board 18 was produced (see FIG. 1).

Next, the second insulating layer 22 having a thickness of 25 μm and the second liquid crystal polymer having a melting point of 280 ° C., and the conductor layer having a thickness of 9 μm laminated on one side of the second insulating layer 22. Two conductor layer substrates 24 having (20) (copper foil) were prepared (see Fig. 2).

Then, the wiring board 18 and the two conductor layer substrates 24 are drawn out, respectively, and the two insulation layer substrates 24 are sandwiched between the wiring boards 18 and the second insulating layer side. 18), using a roll laminator as the heat pressurizing equipment 27, continuously heating and pressing under conditions of a roll temperature of 210 ° C. and a roll linear pressure of 100 kN / m to produce a laminate (preliminary laminate) 26. (See FIG. 3). Moreover, the peeling strength in the laminated interface of the obtained laminated body 26 was 0.2 kN / m, and when peeling off in roll shape, it did not peel but could be peeled easily by hand etc.

Next, the obtained temporary laminated body 26 was heat-processed at 280 degreeC for 30 second using the heat processing equipment 29, and the outer layer raw multilayer printed wiring board 28 was produced (refer FIG. 4). Moreover, the peeling strength in the laminated interface of the obtained outer layer unprocessed multilayer printed wiring board 28 was 0.8 kN / m, and was not able to peel easily by hand.

Subsequently, the obtained outer layer unprocessed multilayer printed wiring board 28 was cut to 300 mm × 400 mm, and a through hole 30 having a diameter of 0.15 mm was formed by NC drilling (see FIG. 5A), and after predetermined desmear treatment, 8 μm. Panel plating 32 of thickness was performed (see FIG. 5B). Then, the outermost surface was etched and patterned by the tenting method to form the wiring circuit 34 on the outermost surface, and the solder resist 36 was formed to produce a multilayer printed wiring board 38 (see Fig. 5C).

At this time, when the obtained multilayer printed wiring board 38 was cut out to the size of 5 cm square, the curvature of the wiring board was evaluated, and the curvature of the wiring board was small. Furthermore, when cross-sectional observation of the obtained outer layer unprocessed multilayer printed wiring board 28 was carried out, disconnection or deformation of the wiring circuit of the wiring circuit 16 did not appear, and charging of the second liquid crystal polymer 22 between the wirings was also good. The thickness of each resin layer was also almost uniform.

(Example 4)

Instead of the copper clad laminate used in Example 3, the thickness was laminated on both surfaces of the first insulating layer 12 and the first insulating layer 12 having a thickness of 25 μm, which consist of polyimide having a heat deformation temperature of 360 ° C. The outer layer raw multilayer printed wiring board 28 and the multilayer printed wiring board 38 were produced like Example 3 except having used the copper clad laminated board which has the copper foil 10 of 9 micrometers.

At this time, the peeling strength at the laminated interface of the obtained laminated body 26 was 0.2 kN / m, and when peeling it in roll shape, it did not peel but could be peeled easily by hand etc. Moreover, the peeling strength in the laminated interface of the obtained outer layer unprocessed multilayer printed wiring board 28 was 0.9 kN / m, and was not easy to peel off by hand.

Moreover, when the obtained multilayer printed wiring board 38 was cut out to the magnitude | size of 5 cm square, the curvature of the wiring board was evaluated, and the curvature of the wiring board was small. Furthermore, when cross-sectional observation of the obtained outer layer unprocessed multilayer printed wiring board 28 was carried out, disconnection or deformation of the wiring circuit of the wiring circuit 16 did not appear, and charging of the second liquid crystal polymer 22 between the wirings was also good. The thickness of each resin layer was also almost uniform.

(Example 5)

The outer layer unprocessed multilayer printed wiring board 28 and the multilayer printed wiring board were prepared in the same manner as in Example 3 except that the roll temperature of the roll laminator was 275 ° C and the linear pressure was 20 kN / m, and the high temperature heat treatment was not performed as shown in FIG. 38) was produced.

At this time, the peeling strength at the laminated interface of the obtained outer layer unprocessed multilayer printed wiring board 28 was 0.6 kN / m. However, when the obtained multilayer printed wiring board 38 was cut out to the size of 5 cm square, the curvature of the wiring board was evaluated, and the curvature of the wiring board was large. Moreover, when the cross-sectional observation of the obtained outer layer unprocessed multilayer printed wiring board 28 was performed, the fine wrinkles and distortion of the wiring circuit which were considered to be due to the stress at the time of lamination were confirmed.

(Reference Example 1)

The laminated body 26 was produced like Example 3 except having set the roll temperature of the roll laminator to 170 degreeC, and the linear pressure of 100 kN / m.

At this time, the obtained laminated body 26 peeled easily in the lamination | stacking interface, and was not able to wind up in roll shape. Therefore, it cannot use as a temporary laminated body, and also the process after the high temperature heat processing after that was not possible.

(Reference Example 2)

The outer layer unprocessed multilayer printed wiring board 28 and the multilayer printed wiring board 38 were produced like Example 4 except having made process temperature in high temperature heat processing into 250 degreeC, and processing time into 30 second.

At this time, the peeling strength at the laminated interface of the obtained outer layer unprocessed multilayer printed wiring board 28 was 0.3 kN / m, and it was easy to peel off by hand etc., and adhesiveness was inadequate. And when the obtained multilayer printed wiring board 38 was cut out to the magnitude | size of 5 cm square, the curvature of the wiring board was evaluated, and the curvature of the wiring board was small.

(Example 6)

The outer layer unprocessed multilayer printed wiring board 28 and the multilayer printed wiring board 38 were produced like Example 4 except having made processing temperature in high temperature heat processing into 310 degreeC, and processing time into 30 second.

At this time, the peeling strength at the laminated interface of the obtained outer layer unprocessed multilayer printed wiring board 28 was 0.9 kN / m, which could not be easily peeled off by hand. However, when the obtained multilayer printed wiring board 38 was cut out to the size of 5 cm square, the curvature of the wiring board was evaluated, and the curvature of the wiring board was large. Moreover, when cross-sectional observation of the obtained outer layer unprocessed multilayer printed wiring board 28 was carried out, the fine wrinkles and deformation | transformation of a circuit thought to be due to the thermal deformation at the time of high temperature heat processing were confirmed.

<Evaluation Results of Peel Strength, Warp and Cross-sectional Observation of Multilayer Printed Wiring Boards>

The peel strength (peel) at the laminated interface of the laminated body obtained in Examples 3-6 and Reference Examples 1 and 2 and the outer layer multilayer printed wiring board, the evaluation of the warpage of the multilayer printed wiring board, and the outer layer of the multilayer printed wiring board Table 1 shows the results of evaluation or measurement of cross-sectional observation. Moreover, the kind of material of the 1st insulating layer in Examples 3-6 and Reference Examples 1 and 2, and the conditions of provisional lamination and high temperature heat processing are shown in Table 1.

As is apparent from the results shown in Table 1, the wiring board 18 and the conductor layer substrate 24 were laminated (preliminarily stacked) under a specific heating pressure to obtain a laminate 26 (preliminary laminate 26). Subsequently, when the laminated body 26 is heated to specific conditions using the heat treatment equipment 29 to perform high temperature heat treatment to obtain the outer layer unprocessed multilayer printed wiring board 28 (Examples 3 and 4), a roll-to-roll method In the method for manufacturing a multilayer printed wiring board having an insulating layer made of a liquid crystal polymer continuously, the deformation of the wiring circuit formed on the outermost surface of the multilayer printed wiring board can be prevented, and the curvature of the multilayer printed wiring board can be sufficiently suppressed. It was confirmed that it could.

(Example 7)

The multilayer printed wiring board 101 which shows sectional drawing in FIG. 8 is demonstrated.

The multilayer (four-layer) printed wiring board 101 shown in FIG. 8 uses the polyimide resin layer 103 and two liquid crystal polymer layers 104 of one layer as an insulating layer as a basic structure 105, The wiring circuit layer 102 is formed on both sides of the polyimide resin layer 103, and the liquid crystal polymer layer 104 is provided on both sides thereof as an insulating layer. The polyimide resin layer 103 and the wiring circuit layers 102 on both sides thereof are double-sided copper clad laminates (manufactured by Shin-Nitetsu Chemical Co., Ltd., trade name: Espanex S (Spanex is a registered trademark), Part No .: SB12-25-) 12CE). That is, the polyimide resin layer 103 is a polyimide resin layer derived from the double-sided copper clad laminate, and the wiring circuit layer 102 is formed by circuit processing copper foil derived from the double-sided copper clad laminate.

In the multilayer printed wiring board 101 shown in FIG. 8, the liquid crystal polymer layer 104 as a basic structure 105 and the wiring circuit layer 109 provided adjacent to it are circuit-processed the said double-sided copper clad laminated board, for example. Single-sided copper clad laminates (hereinafter referred to as single-sided copper clad laminates (LX)) having copper foils having a thickness of 12 μm on one side of an insulating layer made of a liquid crystal polymer having a thickness of 25 μm on both sides of the obtained double-sided wiring board. It is possible to form by laminating and integrating the C) and circuit processing the copper foil. As shown in FIG. 8, the soldering resist layer 108 formed on the wiring circuit layer 109 has a wiring circuit layer 106 on its surface and electrically connects the layers, and the solder resist layer 108 formed in the outermost layer. Has)

Here, the wiring circuit layer 106 is composed of the wiring circuit layer 109 and the same plating copper 110 as the plating through hole 107. The thickness of the liquid crystal polymer layer 104 is 25 μm, the thickness of the wiring circuit layer 109 is 12 μm, and the thickness of the polyimide resin layer 103 is 25 μm. The through hole 107 has a hole diameter of 0.15 mm, a thickness of the plated copper 110 of 8 μm, and a thickness of the solder resist layer 108 of 25 μm. The basic design rule of the wiring circuit layer is that the wiring circuit layer 102 has a line / space of 50/50 μm, the wiring circuit layer 106 has a 75/75 μm, and the through-hole land 111 of each wiring circuit layer 102, 106. Is 0.3 mm. In addition, the roughness Rz of the two boundary surfaces 112 and 112 formed between the polyimide resin layer 103 and the two liquid crystal polymer layers 104 and 104 was 4.5 µm and 4.9 µm, respectively, as a result of the cross-sectional observation. In addition, the total thickness of this four-layer printed wiring board 101 was about 125 micrometers.

(Example 8)

The multilayer printed wiring board 201 which shows sectional drawing in FIG. 9 is demonstrated.

The multilayer (four-layer) printed wiring board 201 shown in FIG. 9 uses two polyimide resin layers 203 and 203 'and one liquid crystal polymer layer 204 as an insulating layer, and each polyimide resin layer 203 and 203 is used. Wiring circuit layers 208 and 208 'are formed on both sides of'), and the liquid crystal polymer layer 204 is provided as an insulating layer between the polyimide resin layer 203 and the polyimide resin layer 203 '. The polyimide resin layer 203 and the wiring circuit layers 208 and 208 'on both sides thereof are formed of a double-sided copper clad laminate (Shin-Nitetsu Chemical Co., Ltd., trade name: Espanex M, Part No .: MB12-12-12FR). . That is, the polyimide resin layers 203 and 203 'are polyimide resin layers derived from the double-sided copper clad laminate, and the wiring circuit layers 208 and 208' are formed by circuit processing copper foil derived from the double-sided copper clad laminate.

The basic structure 205 of the multilayer printed wiring board 201 shown in FIG. 9 is formed by circuit-processing only one side of a double-sided copper clad laminate having polyimide resin layers 203 and 203 'as insulating layers on both sides of the liquid crystal polymer layer 204. FIG. One wiring circuit layer 202-2, 202-1 'and the liquid crystal polymer layer 204 were laminated integrally so as to face each other, and then an outer wiring circuit layer 208 was formed. Here, the liquid crystal polymer layer 204 has a 50 µm thick liquid crystal polymer layer as an insulating layer, and has a copper foil having a thickness of 12 µm on both surfaces thereof (hereinafter referred to as a double-sided copper clad laminate LY). Melting | fusing point: 300 degreeC) The liquid crystal polymer film which removed the copper foil by etching was used. As shown in FIG. 9, on the outer wiring circuit layer 208, there is a wiring circuit layer 209 on the surface thereof, and a plated through hole 206 for electrically connecting each layer and a solder resist layer formed in the outermost layer. Has (207)

Here, the wiring circuit layers 202-1 and 202-2 'are the wiring circuit layers 208 (Shin-Nitetsu Chemical Co., Ltd. make, brand name: Espanex M, product number: MB12-) derived from the double-sided copper clad laminated board LY. 12-12FR) and the same plated copper 209 as the plated through hole 206. The thickness of the polyimide resin layer is 12 micrometers, and the copper foil thickness derived from Espanex M is 12 micrometers. The through hole 206 has a hole diameter of 0.15 mm, a plated copper 209 having a thickness of 8 μm, and a solder resist film thickness of 20 μm. The basic design rule of the wiring circuit layer is that the wiring circuit layers 202-2 and 202-1 'have a line / space of 50/50 占 퐉 and the wiring circuit layers 202-1 and 202-2' have a line / space of 75. / 75 micrometers and the through-hole land of each layer are (phi) 0.3 mm. Moreover, the roughness Rz of the interface 210 of the polyimide resin layer 203,203 'and the liquid crystal polymer layer 204 was 2.0 micrometers and 1.9 micrometers, respectively, as a result of cross-sectional observation. In addition, the total thickness of this four-layer printed wiring board 201 was about 115 micrometers.

(Example 9)

The multilayer printed wiring board 301 which shows sectional drawing in FIG. 10 is demonstrated.

The multilayer (8-layer) printed wiring board 301 shown in FIG. 10 is formed on both sides of the same basic structure 302 as in the second embodiment (there is no structure corresponding to the through hole 206 and the plated copper 209). The liquid crystal polymer layers 303 and 303 ', the IVH 304', the wiring circuit layers 305 and 305 ', and the liquid crystal polymer layers 317 and 317', BVH 307 and 307 'and the wiring circuit layers 308 and 308'. It is an 8-layer printed wiring board which consists of the plating through-hole 309 which integrally laminates and electrically connects each layer, and the soldering resist layer 310 formed in outermost layer.

The liquid crystal polymer layers 303 and 303 'have a liquid crystal polymer having a thickness of 25 µm as an insulating layer and have a copper foil having a thickness of 9 µm on one side thereof (hereinafter, referred to as a single-sided copper clad laminate (LX2)). : 300 degreeC), and the wiring circuit layers 311,311 'are formed by carrying out the circuit processing of the copper foil of the said single-sided copper clad laminated board. In addition, the liquid crystal polymer layers 317 and 317 'have a 50-micrometer-thick liquid crystal polymer as an insulating layer, and have a copper foil of 9 micrometers on one side (hereinafter, referred to as a single-sided copper clad laminate (LX3)). Melting | fusing point: 280 degreeC), and the wiring circuit layers 313 and 313 'are formed by circuit-processing the copper foil of the said single-sided copper clad laminated board. The IVH 304 'is arbitrarily provided by known means, and enables electrical connection with other wiring circuits.

Here, the wiring circuit layers 305 and 305 'are made of the wiring circuit layers 311 and 311' and the same plated copper 312 as the IVHs 304 and 304 '. Similarly, the wiring circuit layers 308 and 308 'are composed of the wiring circuit layers 313 and 313', the BVHs 307 and 307 ', and the same plating copper 314 as the plating through hole 309.

The thickness of the liquid crystal polymer derived from the single-sided copper clad laminate (LX2) and the single-sided copper clad laminate (LX3) is 25 µm and the thickness of the wiring circuit layers 313,313 'is 9 µm, and is above IVH 304' and BVH (307,307 '). The diameter is 100 μm, the lower diameter is 90 μm, the thickness of the plated copper 314 is 8 μm, the hole diameter of the through hole 309 is 0.15 mm, the thickness of the plated copper 312 is 8 μm, the solder resist layer 310 ) Has a film thickness of 20 μm. The basic design rule of the wiring circuit layer is that the line / space of the wiring circuit layers 305 and 305 'is 50/50 mu m in all layers, the through-hole land 315 is 0.3 mm in all layers, IVH 304' and BVH (307,307). ') Pad is 0.2 mm. Moreover, the roughness Rz of the interface 316 of a polyimide resin layer and a liquid crystal polymer layer was 2.2 micrometers and 2.0 micrometers as a result of sectional observation. In addition, the total thickness of this eight-layer printed wiring board 301 was about 270 micrometers.

(Example 10)

The multilayer printed wiring board 401 which shows sectional drawing in FIG. 11 is demonstrated.

The multilayer (four-layer) printed wiring board 401 shown in FIG. 11 has one layer of polyimide resin layer 403 and two layers of liquid crystal polymer layers 404 and 407 in an insulating layer, and four layers of wiring circuit layers 402, 406, 412 and 414. Have The polyimide resin layer 403 and the wiring circuit layers 402 and 414 on both sides thereof are double-sided copper clad laminates made of a polyimide resin layer as an insulating layer (manufactured by Shinnitetsu Chemical Co., Ltd., trade name: Espanex S, Part No .: SB18- It is a wiring circuit layer formed by circuit-processing the resin layer derived from 25-18CE), and its copper foil. In addition, the liquid crystal polymer layer 404 and the wiring circuit layer 406 adjacent to the polyimide resin layer 403 have a single-sided copper clad laminate having a copper foil having a thickness of 18 μm on one side of the insulating layer of the liquid crystal polymer layer having a thickness of 50 μm (hereinafter This is called a single-sided copper clad laminate (LX4), which is derived from the melting point of the liquid crystal polymer: 290 ° C., and has a thickness of 50 between the liquid crystal polymer layer 407 and the wiring circuit layer 412 adjacent to the liquid crystal polymer layer 404. A resin layer derived from a single-sided copper clad laminate (hereinafter referred to as a single-sided copper clad laminate (LX5)) having a copper foil having a thickness of 18 μm on one side of the insulating layer of the liquid crystal polymer layer having a thickness of 탆. It is a wiring circuit layer formed by circuit-processing the copper foil. The wiring circuit layer 408 is made of the same plating copper 413 as the wiring circuit layer 412, the BVH 409, and the plated-through hole 410, and the wiring circuit layer 402 ′ is formed of the wiring circuit layer 414. And plated copper 413.

Here, the thickness of the liquid crystal polymer of the single-sided copper clad laminate (LX4) and the single-sided copper clad laminate (LX5) is 50 µm, the thickness of the wiring circuit layers 406 and 412 is 18 µm, the thickness of the polyimide resin layer 403 is 25 µm, and the wiring. The thickness of the circuit layers 402 ', 408 is 18 mu m. In addition, the hole diameter of the through hole 410 is 0.15 mm, the upper diameter of the BVH 409 is 80 μm, the lower diameter is 75 μm, the thickness of the plated copper 413 is 8 μm, and the film thickness of the solder resist layer 411. Is 20 µm. In addition, the roughness Rz of the interface 415 of the polyimide resin layer 403 and the liquid crystal polymer layer 404 was 4.7 micrometers and 4.6 micrometers, respectively, as a result of cross-sectional observation. In addition, the total thickness of this four-layer printed wiring board 401 was about 168 micrometers.

(Example 11)

The manufacturing method of the 4-layer printed wiring board 501 of the structure similar to the 4-layer printed wiring board of Example 7 is demonstrated in detail by the process sectional drawing shown to FIG. 12A-FIG. 12H.

First, double-sided copper foil of the double-sided copper clad laminated board (the Shinnitetsu Chemical Co., Ltd. make, brand name: Espanex S, product number: SB12-25-12CE) (502) which uses the polyimide resin layer shown in FIG. 12A as an insulating layer (502) 503) was patterned by a subtractive method to produce a 400 x 300 mm double-sided wiring board 505 having a wiring circuit layer 504 (see FIG. 12B). Next, a single-sided copper clad laminate (LX) 506 of the same size having the liquid crystal polymer layer as an insulating layer was prepared, and the two-sided wiring boards 505 were sandwiched from both sides with the resin surfaces facing each other to be set in a vacuum press as it is ( 12C). Subsequently, mold clamping was performed while evacuating between press hot plates 507 at 1.3 kPa, and the hot plates were heated to 260 ° C. and heated. 5 minutes after the hot plate temperature reached 260 ° C, an adhesion pressure of 6 MPa was added, and after 10 minutes, cooling of the hot plate 507 was started (see FIG. 12D). After 20 minutes, the adhesive pressure was removed, and the hot plate 507 was opened to take out the laminate 508 (see FIG. 12E). A through hole 509 having a diameter of 0.15 mm was formed in the obtained laminate 508 by NC drilling (see FIG. 12F), and a panel plating 510 having a thickness of 8 μm was formed after a predetermined desmear treatment (FIG. 12G). Reference). The outermost layer 511 was etched and patterned by a tenting method to form a wiring circuit layer 512, and a solder resist layer 513 was formed to produce a four-layer printed wiring board 501 (see FIG. 12H). ).

Yield loss due to powder fall in this process was 0%.

(Example 12)

Another manufacturing method of the 4-layer printed wiring board 601 of the structure similar to the 4-layer printed wiring board of Example 11 is demonstrated in detail by the process sectional drawing shown to FIG. 13A-FIG. 13F.

First, the copper foil 603 of both surfaces of the double-sided copper clad laminated board 602 as used in Example 11 was pattern-processed by the subtractive method, and the wiring circuit layer 604 was formed in roll shape of width 300mm x length 100m. The wound long double-sided wiring board 605 was fabricated (see FIG. 13A). The double-sided wiring board 605 is sandwiched by a single-sided copper clad laminate (LX) 606 of the same shape facing the surface of the water from both sides thereof (see Fig. 13B), and is supplied between the rolls 607 at a surface temperature of 260 ° C and continuously. It heated and pressurized to linear pressure 20kN / m (refer FIG. 13C). The obtained continuous laminate 608 was cut to 400 × 30 mm and formed through holes 609 with a diameter of 0.15 mm by NC drilling (see FIG. 13D), and then plated with a thickness of 8 μm after predetermined desmear treatment. 610 was formed (see FIG. 13E). Then, the outermost layer 611 was etched and patterned by a tenting method to form a wiring circuit layer 612, and a solder resist layer 613 was formed to produce a four-layer printed wiring board 601 (see FIG. 13F). ).

Yield loss due to powder fall in this process was 0%.

(Example 13)

The manufacturing method of the 4-layer printed wiring board 701 of the structure similar to the 4-layer printed wiring board of Example 8 is demonstrated in detail by the process sectional drawing shown to FIG. 14A-FIG. 14I.

First, a double-sided copper clad laminated board (made by Shinnitetsu Chemical Co., Ltd., brand name: Espanex M, part number: MB12-12-12FR) (702) which uses the polyimide resin layer of 400x300 mm as an insulating layer (refer FIG. 14A). The copper foil 703-2 of one side of the pattern) was pattern-processed by the subtractive method, and the wiring circuit layer 704-2 was formed. In the same manner, another double-sided copper clad laminate 702 'was patterned (see Fig. 14B). Subsequently, the copper foil 706 of both surfaces of the double-sided copper clad laminated board (LY) 705 which makes a liquid crystal polymer layer of the same size an insulating layer is etched away, and the exposed surface was potassium hydroxide (34 mass%) / ethylene glycol (22). The liquid crystal polymer layer 707 which was immersed at 60 degreeC for 60 second by the alkali mixed aqueous solution of the mass%) / ethylenediamine (11 mass%) was produced (refer FIG. 14C). The surface-treated liquid crystal polymer layer 707 was sandwiched between the single-sided processing substrates 702 and 702 'facing the wiring circuit layers 704-2 and 704-1', and set in a vacuum press as it is (see Fig. 14D). Subsequently, mold clamping was performed while exhausting between the press hot plates 708 at 1.3 kPa, and the hot plates 708 were heated to 300 ° C and heated. 5 minutes after the nibble temperature reached 300 占 폚, an adhesive pressure of 4 MPa was added, and after 10 minutes, cooling of the nibble 708 was started (see FIG. 14E). After 20 minutes, the adhesive pressure was removed, and the hot plate 708 was opened to take out the laminate 709 (see FIG. 14F). Through-hole 710 of 0.15 mm in diameter was formed in the obtained laminated body 709 by NC drill (refer FIG. 14G), and the panel plating 711 of 8 micrometer thickness was formed after predetermined desmear process (FIG. 14H). Reference). Then, the outermost layer 712 was etched and patterned by a tenting method to form a wiring circuit layer 713, and a solder resist layer 714 was formed to produce a four-layer printed wiring board 701 (FIG. 14I). Reference).

Yield loss due to powder fall in this process was 0%.

(Example 14)

Another manufacturing method of the four-layer printed wiring board 801 having the same structure as that of the four-layer printed wiring board of the thirteenth embodiment will be described in detail with the process sectional views shown in Figs. 15A to 15F.

First, copper foil (803,803 ') of two-sided copper clad laminated boards (Shin-Nitetsu Chemical Co., Ltd., brand name: Espanex M, product number: MB12-12-12FR) (802,802') which makes a polyimide resin layer an insulation layer ), The long-sided double-sided wiring boards 805 and 805 'wound in a roll shape having a width of 30 mm x 100 m in length by forming the wiring circuit layers 804 and 804' by the subtractive method (Fig. 15A). Reference). Subsequently, the copper foils on both sides of the double-sided copper clad laminate (LY) 806 having the liquid crystal polymer layer having the same shape as the insulating layer are etched away, and the exposed surface is plasma treated using a gas made of argon, helium, oxygen, and nitrogen. One liquid crystal polymer layer 807 was produced (see FIG. 15B). The liquid crystal polymer layer 807 is sandwiched between two wiring boards 805 and 805 'facing the wiring circuit layers 804 and 804', supplied between the rolls 808 at a surface temperature of 260 DEG C, and continuously at a linear pressure of 100 kN / m. Heated and pressurized (see FIG. 15C). The obtained continuous laminate 809 was cut to 400 × 300 mm and formed through holes 810 with a diameter of 0.15 mm by NC drilling (see FIG. 15D), and then plated with a thickness of 8 μm after a predetermined desmear process. 811 was formed (see FIG. 15E). Then, the outermost layer 812 was etched and patterned by a tenting method to form a wiring circuit layer 813, and a solder resist layer 814 was formed to produce a four-layer printed wiring board 801 (see FIG. 15F). ).

Yield loss due to powder fall in this process was 0%.

(Example 15)

The manufacturing method of the 8-layer printed wiring board 901 of the structure similar to the 8-layer printed wiring board of Example 9 is demonstrated in detail by the process sectional drawing shown to FIG. 16A-FIG. 16J.

First, a double-sided copper clad laminate (a Shinnettetsu Kagaku Co., Ltd. product, brand name: Espanex M, part number: MB12-12-12FR) 902 (FIG. 16A) which makes a polyimide resin layer of 400x300 mm an insulating layer is referred. The copper foils 903-1 and 903-2 of both surfaces of () were pattern-processed by the subtractive method, and the wiring circuit layers 904-1 and 904-2 were formed. One more was produced in the same way (see FIG. 16B). Subsequently, the copper foil 906 of both surfaces of the double-sided copper clad laminated board (LY) 905 which uses the liquid crystal polymer layer of the same size as an insulating layer is etched away, and the exposed surface is potassium hydroxide (34 mass%) / ethylene glycol (22). The liquid crystal polymer layer 907 which was immersed at 80 degreeC for 30 second by the alkali mixed aqueous solution of the mass%) / ethylenediamine (11 mass%) was produced (refer FIG. 16C). The surface-treated liquid crystal polymer layer 907 was sandwiched between the double-sided copper clad laminates 902 and 902 'and set in a vacuum press as it is (see FIG. 16D). Subsequently, mold clamping was performed while exhausting between the press hot plates 908 at 1.3 kPa, and the hot plates 908 were heated to 280 ° C and heated. 5 minutes after the nirvana temperature reached 280 ° C, an adhesion pressure of 5 MPa was added, and cooling of the nirvana 908 was started 10 minutes later (see FIG. 16E). After 20 minutes, the adhesive pressure is removed, the hot plate 908 is opened to take out the laminate 909, and the resin surface of the liquid crystal polymer is placed on both surfaces of the obtained laminate 909 with argon, helium, oxygen, and nitrogen. Using the plasma-treated single-sided copper clad laminate (LX2) (910,910 '), the surface of water (911,911') was overlapped with each other (see Fig. 16F), and vacuum press was conducted under the above conditions to produce a laminate (912) (see Fig. 16G). . The copper foil of the predetermined position of the laminated body 912 was etched 913 (phi FIG. 16H) by (phi) 100 micrometers, and the blind via hole 914 was formed with the carbonic acid laser after that (refer FIG. 16I). After the desmear process, the plating layer 915 electrically connected to the wiring circuit layer 904-2 ′ was formed (see FIG. 16J), and the wiring circuit layer 916 was formed by the subtractive method (see FIG. 16K). ). 11F to 11I were again performed to form a through hole 918 having a diameter of 0.15 mm in the obtained laminated body 917 by NC drilling (see FIG. 16L), and after the predetermined desmear treatment, 8 A panel plating 919 of thickness was formed (see FIG. 16M). 16L, a single-sided copper clad laminate (LX3) was used as the newly laminated single-sided copper clad laminate. The outermost layer 920 was etched and patterned by a tenting method to form a wiring circuit layer 921, and a solder resist layer 922 was formed to produce an eight-layer printed wiring board 901 (see FIG. 16N). ).

Yield loss due to powder fall in this process was 0%.

(Example 16)

Another manufacturing method of the eight-layer printed wiring board 1001 having the same structure as the eight-layer printed wiring board of the fifteenth embodiment will be described in detail with the process cross-sectional views shown in FIGS. 17A to 17F.

First, two sides of two double-sided copper clad laminates (manufactured by Shinnitetsu Chemical Co., Ltd., product name: Espanex M, product number: MB12-12-12FR) (1002,1002 ') each having a polyimide resin layer as an insulating layer. Patterned copper foils (1003-1,1003-2,1003-1 ', 1003-2') by the subtractive method to form a wiring circuit layer (1004-1,1004-2,1004-1 ', 1004-) A long double-sided wiring board 1005, 1005 'wound in a roll of 300 mm in width x 100 m in length 2') was fabricated (see Fig. 17A). Subsequently, the copper foils on both sides of the double-sided copper clad laminate (LY) 1006 having the same shape liquid crystal polymer layer as the insulating layer are etched away, and the exposed surface is plasma treated using a gas made of argon, helium, oxygen, and nitrogen. One liquid crystal polymer layer 1007 was produced (see FIG. 17B). The liquid crystal polymer layer 1007 was sandwiched between two double-sided wiring boards 1005 and 1005 ', fed between the rolls 1008 at a surface temperature of 240 DEG C, and continuously heated and pressed at a line pressure of 100 kN / m (Fig. 17C). Reference). Single-sided copper clad laminate (LX2) having, as an insulating layer, a liquid crystal polymer layer having a width of 300 mm x a length of 100 m obtained by plasma treatment on both surfaces of the obtained continuous laminate 1009 using a gas composed of argon, helium, oxygen, and nitrogen. ) 1010 and 1010 'of the surface of the water (1011, 1011') and the overlapping, overlapping, continuous heating and pressure under the above conditions to produce a continuous laminate (1012) (see Fig. 17d). Subsequently, etching processing 1014 of (phi) 100micrometer was carried out at the predetermined | prescribed position of copper foil 1013,1013 'of outermost layer of continuous laminated body 1012, and the blind via hole 1015 was processed with the carbonate laser continuously (FIG. 17e). After the desmear process, the plating layer 1016 electrically connected to the wiring circuit layer 1004-2 'was formed (see FIG. 17F), and the wiring circuit layer 1017 was formed by the subtractive method (see FIG. 17G). ). Again, the through-hole 1019 of φ 0.15 mm is formed in the obtained continuous laminate 1018 by NC drilling (see FIG. 17H), and after the predetermined desmear treatment, Panel plating 1020 of thickness was formed (see FIG. 17I). However, single-sided copper clad laminated board LX3 was used as the single-sided copper clad laminate laminated newly in FIG. 17H. After cutting to 400 mm x 300 mm, the outermost layers 1021 and 1021 'are etched and patterned by the tenting method to form the wiring circuit layer 1022, and the solder resist layer 1023 is formed. The layer printed wiring board 1001 was formed (see FIG. 17J).

Yield loss due to powder fall in this process was 0%.

(Comparative Example 1)

In the same manner as in Example 11 except that a glass epoxy-based double-sided copper clad laminate (Hitachi Kasei Co., trade name: MCL-E-679, copper foil thickness: 12 µm, insulation substrate thickness: 60 µm) was used instead of Espanex S. A four-layer substrate having a total thickness of 190 μm was prepared. Yield loss due to powder fall in this process was 4.5%.

(Comparative Example 2)

In Example 12, the lamination roll surface temperature was 180 ° C using a copper foil with a resin (manufactured by Matsushita Denko Corporation, trade name: R0880, copper foil thickness: 12 µm, resin thickness: 50 µm) in place of the single-sided copper clad laminate (LX). It carried out similarly except having made into. However, since the copper foil with resin broke in the laminate, the four-layer printed wiring board could not be manufactured.

According to the present invention, in the method of continuously manufacturing a multilayer printed wiring board having an insulating layer made of a liquid crystal polymer, a method of manufacturing a multilayer printed wiring board which can prevent deformation of the wiring circuit formed on the outermost surface of the multilayer printed wiring board. And it becomes possible to provide the multilayer printed wiring board obtained by the manufacturing method.

Claims (12)

A first insulating layer made of polyimide or a first liquid crystal polymer; and a wiring board having a wiring circuit formed on at least one side of the first insulating layer; and a melting point and / or the above-mentioned melting point below a thermal deformation temperature of the polyimide. Preparing a conductor layer substrate having a second insulating layer comprising a second liquid crystal polymer having a melting point lower than that of the liquid crystal polymer of 1, and a conductor layer laminated on one side of the second insulating layer;
And arranging the wiring board and the conductor layer substrate so that the second insulating layer side of the conductor layer substrate faces the wiring board, and successively laminating under heating pressure using a heat pressurizing equipment. The manufacturing method of the multilayer printed wiring board characterized by the above-mentioned. The method of claim 1,
In preparing two said conductor layer board | substrate, and laminating | stacking the said wiring board and the said conductor layer board | substrate, the said two conductor layer board | substrates are made between the said wiring board and two conductor layer boards, and between the said wiring boards. A second insulating layer side is disposed so as to face the wiring board, respectively, and a method of manufacturing a multilayer printed wiring board, which is successively laminated under heating pressure using a heat pressurizing equipment. The method of claim 1,
A method for producing a multilayer printed wiring board, wherein the second liquid crystal polymer has a melting point of 5 to 60 ° C. lower than that of the first liquid crystal polymer. The method of claim 1,
And each of the wiring board and the conductor layer substrate is rolled into a roll shape. 5. The method of claim 4,
In the stacking of the wiring board and the conductor layer substrate, the method of manufacturing a multilayer printed wiring board, wherein the wiring board and the conductor layer substrate are drawn out and stacked in a continuous manner in a roll to roll manner. The method of claim 1,
The method of manufacturing a multilayer printed wiring board, characterized in that the heating pressurization equipment is a roll laminator. The method according to claim 6,
A roll linear pressure of said roll laminator is 10-250 kN / m, The manufacturing method of the multilayer printed wiring board characterized by the above-mentioned. The method of claim 1,
And surface-treating the surface of said second insulating layer of said conductor layer substrate. The method of claim 1,
In laminating the wiring board and the conductor layer substrate, after the wiring board and the conductor layer substrate are laminated under a heating pressure to obtain a laminate, the high temperature heat treatment is performed by heating the laminate using a heat treatment facility. The manufacturing method of the multilayer printed wiring board characterized by the above-mentioned. 10. The method of claim 9,
In performing the high temperature heat treatment, the high temperature heat treatment temperature T _{1 in} which the laminate satisfies the condition expressed by the following formula (F1):
(Melting point of the second liquid crystal polymer) -15 ° C? T ₁ ? (F1)
Method for producing a multilayer printed wiring board characterized in that the heating. The method of claim 10,
In performing the high temperature heat treatment, a high temperature heat treatment time is in a range of 10 to 180 seconds. 10. The method of claim 9,
In obtaining the laminate, a laminate heat treatment temperature T ₂ satisfying a condition expressed by the following formula (F2) for the wiring board and the conductor layer substrate:
(Melting point of the second liquid crystal polymer)-100 deg. C &lt; T ₂ ? (Melting point of the second liquid crystal polymer)-20 deg. (F2)
Lamination | stacking in the manufacturing method of the multilayer printed wiring board characterized by the above-mentioned.

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