KR101196441B1 - Repair Method for Electrostatic Chuck - Google Patents

Abstract

PURPOSE: A method for repairing an electrostatic chuck is provided to prevent a reactive source from reaching a junction between a top plate and a bottom plate by processing a wafer when the junction between the top plate and the bottom plate is closed by a body. CONSTITUTION: A first electrode(320) is formed between a first top plate(310) and a bottom plate. A defective electrostatic chuck is provided to the first top plate. The first top plate and the first electrode are removed. A first step is formed in the edge of the bottom plate. A second top plate with a second electrode is made.

Description

Repair Method for Electrostatic Chuck

TECHNICAL FIELD The present invention relates to semiconductor manufacturing equipment, and more particularly, to a repair method of an electrostatic chuck (ESC).

An electrostatic chuck (ESC) refers to a plate that adsorbs an object using static electricity. In particular, the electrostatic chuck is used for clamping the wafer during the manufacturing process of the semiconductor device, and is a key semiconductor component capable of attaching and detaching a wafer without directly contacting the wafer using electrostatic power.

The manufacturing method of the electrostatic chuck is largely divided into anodizing, thermal spray, and ceramic plate methods. Among these, anodization is a method of oxidizing an aluminum body to form a dielectric layer. The electrostatic chuck of the anodic oxidation method has advantages of strong durability and high dielectric constant, but has a disadvantage in that a thin coating layer is formed at an edge portion of the electrostatic chuck and cracks occur.

The heating spray method is manufactured by spray coating an electrode material on an aluminum body to form an electrode layer, and spraying coating ceramic powder on the electrode layer to form a dielectric layer. The heated spray method has the advantage of being able to recover from partial cracks and the like that occur during use due to its manufacturing principle. That is, when a partial crack occurs, the coating may be regenerated by thermal spray coating of ceramic powder. However, since the ceramic dielectric layer is hardly densified, there is a high risk of exposure to the process gas, and the dielectric layer may be peeled off as the service life increases.

The plate-type electrostatic chuck is manufactured by sintering ceramic powder in the form of a plate to form a ceramic plate and attaching it to an aluminum body. More specifically, it is as follows.

1A and 1B are views for explaining a method of manufacturing a general plate type electrostatic chuck.

Referring to FIG. 1A, first and second plates 10 and 12 are prepared. Then, the electrode 12 is formed on the second plate 12.

In this state, as shown in FIG. 1B, the first plate 10 and the second plate 12 are compressed. In this case, an adhesive 16 may be used to compress the first and second plates 10 and 12, and the adhesive 16 may be a silicon oxide (SiO 2) adhesive, a thermosetting silicone, an epoxy, a glass for bonding, or the like. This can be used.

The electrostatic chuck thus manufactured is mounted on a body installed in the process chamber to control the detachment of the wafer.

In the plate type electrostatic chuck, the thickness of the upper plate, that is, the second plate 12, is very thin (300-1000 μm). As the service life of the electrostatic chuck increases, cracks may occur in the upper plate. Furthermore, because the top plate is very thin, the electrode 14 can be exposed to the outside, resulting in process errors. Therefore, the electrostatic chuck in which a defect such as a crack occurs has no choice but to be disposed of.

The electrostatic chuck is a consumable that needs to be replaced after 3 to 6 months of use and its life is very short. However, the manufacturing cost is high, the heater plate for controlling the process temperature is most often embedded in the lower plate of the electrostatic chuck, and the manufacturing cost increases further.

Therefore, if a crack occurs in the top plate, the electrostatic chuck itself has to be disposed of, so the economic benefit is weak.

Republic of Korea Patent Publication No. 10-0943360

Embodiments of the present invention provide a repair method of an electrostatic chuck that can repair a defect.

In the repairing method of an electrostatic chuck according to an embodiment of the present invention for achieving the above technical problem, a first electrode is installed between a first upper plate and a lower plate, and the electrostatic chuck having a defect in the first upper plate is provided. Becoming; Removing the first top plate; And manufacturing a second upper plate, and combining the lower plate.

Here, after removing the first upper plate, further comprising the step of forming a first stepped portion in the edge portion of the lower plate, wherein the second top plate has a second stepped portion to be engaged with the first stepped portion It can manufacture.

The method may further include removing the edge portion of the lower plate plate to a predetermined width after removing the first upper plate plate, and the second upper plate plate may be manufactured in a concave shape to fasten the lower plate plate in a confined structure. Can be.

According to the present technology, when a part of the electrostatic chuck, for example, a top plate, is defective, it can be repaired, thereby increasing the life of the electrostatic chuck. Thereby, the manufacturing cost of an electrostatic chuck can be reduced and unnecessary waste of raw materials can be prevented.

1A and 1B are views for explaining a method of manufacturing a general electrostatic chuck,
2a to 2d are views for explaining the electrostatic chuck repair method according to an embodiment of the present invention,
3A to 3D are views for explaining an electrostatic chuck repair method according to another embodiment of the present invention;
4A to 4D are diagrams for describing the electrostatic chuck repair method according to another embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention in more detail.

2A to 2D are diagrams for describing an electrostatic chuck repair method according to an embodiment of the present invention.

First, FIG. 2A shows a state in which a crack A has occurred in an electrostatic chuck manufactured by a plate method. The electrostatic chuck manufactured by the plate method includes a lower plate 210, an upper plate 220, an electrode layer 230 embedded between the lower plate 210 and the upper plate 220. In addition, the lower plate 210 and the upper plate 220 are bonded to each other by the adhesive 240.

When cracks A occur in the electrostatic chuck, the top plate 220 and the electrode layer 230 in which the cracks are removed are removed.

2B illustrates a state after the upper plate 220 and the electrode layer 230 are removed. The upper plate 220 and the electrode layer 230 may be removed by a polishing process, and the adhesive 240 may be removed together.

In addition, it is preferable to selectively remove only the upper plate 220, the electrode layer 230, and the adhesive 240, but a portion of the upper layer of the lower plate 210 may also be removed.

2C shows the newly manufactured top plate 310. The electrode layer 320 is formed on one surface of the upper plate 310. The electrode layer 320 is formed on one surface of the upper plate 310, and may be formed by adopting any one of electrode pattern forming methods such as low temperature baking, high temperature baking, etching, plating, and sputtering.

The new upper plate 310 having the electrode layer 310 may be combined with the remaining lower plate 210 as shown in FIG. 2B.

FIG. 2D illustrates a state in which the lower plate 210 shown in FIG. 2B and the upper plate 310 newly manufactured in FIG. 2C are combined. The lower plate 210 and the upper plate 310 may be coupled by an adhesive 330. In addition, the adhesive 330 may be adopted among thermosetting silicone, epoxy, and bonding glass, and may select and use an adhesive resistant to the pressing temperature according to the pressing temperature of the lower plate 210 and the upper plate 310. have. For example, thermosetting silicone is suitable for processing temperatures of about 300 ° C, and epoxy is suitable for processing temperatures of about 500 ° C. In addition, the bonding glass has a wide range of processing temperatures from a low temperature of 150 ° C to a high temperature of 1400 ° C.

As described above, in the present invention, when a defect such as crack A occurs in the upper plate 220, after removing the upper plate 220 in which the defect occurs, the newly formed upper plate 310 and the remaining lower plate 210 are removed. ). In addition, when removing the upper plate plate 220 in which a defect occurs, the electrode layer 230 may be removed together to sufficiently exclude a defect generating element.

On the other hand, in the electrostatic chuck manufactured by the plate method may be embedded in the lower plate 210 the temperature control unit 250. In the past, when a defect occurred in the electrostatic chuck, all components including the top plate / bottom plate were discarded.

However, in the present invention, only a portion where a defect occurs, for example, a top plate, is removed, and the newly manufactured top plate is joined to the bottom plate. Therefore, it is not necessary to dispose the bottom plate in which the temperature control part 250 is embedded, and the manufacturing cost of the electrostatic chuck can be reduced.

3A to 3D are diagrams for describing an electrostatic chuck repair method according to another embodiment of the present invention.

The electrostatic chuck illustrated in FIG. 3A is a plate-type electrostatic chuck, which includes a lower plate 410 and an upper plate 420, and further includes an electrode layer 430 embedded between the two plates 410 and 420. do. In addition, the two plates 410 and 420 are press-bonded by the adhesive 440.

It is assumed that a crack A has occurred in such an electrostatic chuck. Conventionally, when a defect such as crack A occurs, the entire electrostatic chuck is discarded. However, in the present invention, the defective upper plate 420, preferably the upper plate 420 and the electrode layer 430, are removed and replaced. Replace with conservative layer.

3B shows the top plate 420 and the electrode layer 430, preferably the bottom plate 410 remaining after removal to the adhesive 440.

The upper plate 420, the electrode layer 430, and the adhesive 440 may be removed by a polishing process. After the polishing process, the first stepped portion 460 is formed at the edge portion of the lower plate 410. That is, the edge portion of the remaining lower plate 410 forms the first stepped portion 460 having a lower height than the other portions.

FIG. 3C shows the configuration of a new top plate 510 to be bonded to the remaining bottom plate 410 as shown in FIG. 3B.

The new upper plate 510 may be manufactured in a cap shape so as to be coupled to the first stepped portion of the lower plate 410. That is, the new top plate 510 is formed such that the edge portion has a second stepped portion 530 extending in a vertical direction from the flat surface.

In addition, an electrode layer 520 may be formed at the bottom of the recess formed by the second stepped portion 530. The electrode layer 530 may be formed by adopting any one of electrode pattern forming methods such as low temperature firing, high temperature firing, etching, plating, and sputtering.

3D illustrates a state in which the lower plate 410 of FIG. 3B and the new upper plate 510 of FIG. 3C are coupled.

The first stepped portion 460 of the remaining lower plate 410 and the second stepped portion 530 of the newly manufactured upper plate 510 are coupled in such a manner as to be mutually fastened (B), and the two plates 410, 510 is press-bonded by adhesive 540. In the preferred embodiment of the present invention, the height and width of the step must be determined so that the first step 460 and the second step 530 can be fastened to each other.

The adhesive 540 may be adopted among thermosetting silicone, epoxy, and bonding glass, and may select and use an adhesive resistant to the pressing temperature according to the pressing temperature of the upper plate 510 and the lower plate 410. For example, thermosetting silicone is suitable for processing temperatures of about 300 ° C, and epoxy is suitable for processing temperatures of about 500 ° C. In addition, the bonding glass has a wide range of processing temperatures from a low temperature of 150 ° C to a high temperature of 1400 ° C.

Meanwhile, in the plate type electrostatic chuck illustrated in FIGS. 3A to 3D, the temperature controller 450 may be embedded in the lower plate 410. In addition, when a defect occurs in the electrostatic chuck, the lower plate 410 in which the temperature controller 450 is embedded may not be disposed of, and unnecessary waste of resources may be prevented.

Further, in the electrostatic chuck repair method according to the present embodiment, the upper plate 510 and the lower plate 410 are fastened in a cap structure. Therefore, it is possible to prevent the plasma generated during the process from penetrating into the electrostatic chuck.

4A to 4D are diagrams for describing the electrostatic chuck repair method according to another embodiment of the present invention.

First, FIG. 4A illustrates a state in which a crack A is generated in the upper plate 620 in the plate type electrostatic chuck.

In this case, as illustrated in FIG. 4B, the upper plate 620, the electrode layer 630, and the adhesive 640 are removed by a polishing process or the like. And, accordingly, the edge portion 660 of the remaining lower plate 610 is removed to a specified width.

4C shows the structure of a new top plate 710 to couple to the remaining bottom plate 610.

The new top plate 710 has a substantially U shape and includes an electrode layer 720 formed on the bottom of the recess. The electrode layer 720 may be formed using any one of baking (low temperature, high temperature), nicking, and plating.

More specifically, the upper plate 710 may include a cap portion 730 extending in a vertical direction from the flat plate portion. In addition, the diameter of the top plate 710 may be formed to correspond to the diameter of the remaining plate 610, the height of the cap 730 formed on the top plate 710 is the electrode layer 720 and the bottom plate ( The height of the 610 and the interposition thickness of the adhesive used to join the upper and lower plates 710 and 610 may be formed to a height capable of covering both.

4D illustrates the structure of the electrostatic chuck repaired by combining the lower plate 610 illustrated in FIG. 4B and the upper plate 710 illustrated in FIG. 4C.

The edge portion of the lower plate 610 is left to be removed to a predetermined thickness, and as the new upper plate 710 is formed in a cap shape, the upper plate 710 and the lower plate 610 are mutually coupled to each other. Accordingly, the longitudinal section of the cap 730 and the exposed surface of the lower plate 610 may exist on the same plane (C). In other words, the lower plate 610 is repaired in the upper plate 710 to be fastened in a confined structure.

Therefore, the wafer can be processed with the bonding surface of the upper plate 710 and the lower plate 610 closed by the body, so that a reaction source such as plasma is formed on the upper plate 710 and the lower plate 610 during wafer processing. Reaching the joining surface of) can be prevented at the source.

In the electrostatic chuck according to the present embodiment, the upper plate 710 and the lower plate 610 are press-bonded by the adhesive 740. In addition, of course, it may further include a temperature control unit 650 embedded in the lower plate 610.

Thus, those skilled in the art will appreciate that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the embodiments described above are to be considered in all respects only as illustrative and not restrictive. The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.

210, 410, 610: lower plate
310, 510, 710: top plate
320, 520, 720: electrode layer
330, 540, 740: adhesive
250, 450, 650: temperature control unit

Claims (9)

A first electrode is provided between the first upper plate and the lower plate, and the electrostatic chuck having a defect formed on the first upper plate is provided;
Removing the first top plate and the first electrode;
Forming a first step portion at an edge portion of the lower plate; And
Manufacturing a second upper plate including a second electrode, wherein the second upper plate is manufactured to have a second stepped portion engaged with the first stepped portion, and coupled to the lower plate;
Repair method of the electrostatic chuck comprising a. The method of claim 1,
The lower plate further includes a temperature control unit embedded therein. delete delete delete A first electrode is provided between the first upper plate and the lower plate, and the electrostatic chuck having a defect formed on the first upper plate is provided;
Removing the first top plate and the first electrode;
Removing the edge portion of the lower plate to a specified width; And
Preparing a second upper plate including a second electrode, and manufacturing the second upper plate in a concave shape so as to fasten the lower plate into a confinement structure, and combining the lower plate with the lower plate;
Repair method of the electrostatic chuck comprising a. The method according to claim 6,
The lower plate further includes a temperature control unit embedded therein. The method according to claim 6,
The second top plate includes a cap portion extending in a vertical direction from the flat plate portion,
The lower plate is a repair method of the electrostatic chuck is fastened to the inner surface of the cap portion. The method of claim 8,
The end of the cap portion and the exposed surface of the lower plate is repairing method of the electrostatic chuck is in the same plane.

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