KR101193855B1 - 레이저 가공장치 - Google Patents

레이저 가공장치 Download PDF

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Publication number
KR101193855B1
KR101193855B1 KR1020080077828A KR20080077828A KR101193855B1 KR 101193855 B1 KR101193855 B1 KR 101193855B1 KR 1020080077828 A KR1020080077828 A KR 1020080077828A KR 20080077828 A KR20080077828 A KR 20080077828A KR 101193855 B1 KR101193855 B1 KR 101193855B1
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KR
South Korea
Prior art keywords
mirror
laser
concave
circumferential
laser beam
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Expired - Fee Related
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KR1020080077828A
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English (en)
Korean (ko)
Other versions
KR20090032955A (ko
Inventor
노리후미 아리마
히데키 모리타
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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Publication of KR20090032955A publication Critical patent/KR20090032955A/ko
Application granted granted Critical
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
KR1020080077828A 2007-09-27 2008-08-08 레이저 가공장치 Expired - Fee Related KR101193855B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007252094A JP5060893B2 (ja) 2007-09-27 2007-09-27 レーザ加工装置
JPJP-P-2007-00252094 2007-09-27

Publications (2)

Publication Number Publication Date
KR20090032955A KR20090032955A (ko) 2009-04-01
KR101193855B1 true KR101193855B1 (ko) 2012-10-25

Family

ID=40516055

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080077828A Expired - Fee Related KR101193855B1 (ko) 2007-09-27 2008-08-08 레이저 가공장치

Country Status (4)

Country Link
JP (1) JP5060893B2 (https=)
KR (1) KR101193855B1 (https=)
CN (1) CN101397185A (https=)
TW (1) TWI394629B (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5281544B2 (ja) * 2009-10-30 2013-09-04 三星ダイヤモンド工業株式会社 ブレイク装置
CN102738313B (zh) * 2011-04-01 2015-03-18 山东华光光电子有限公司 一种提高led芯片出光的芯片切割方法
CN102699528A (zh) * 2012-06-28 2012-10-03 镒生电线塑料(昆山)有限公司 镭射加工装置的改良结构
CN103060795B (zh) * 2012-11-22 2015-01-07 北京工业大学 一种熔覆层宽度实时可变的激光加工工作头
CN104071974B (zh) * 2014-06-20 2016-04-13 武汉先河激光技术有限公司 一种用于玻璃切割的激光设备及切割方法
CN106466763A (zh) * 2015-08-12 2017-03-01 苏州领创激光科技有限公司 具有多参数设定功能的激光切割机
CN106466764A (zh) * 2015-08-12 2017-03-01 苏州领创激光科技有限公司 具有实时调整工艺参数功能的激光切割头
KR102042659B1 (ko) * 2017-03-21 2019-11-08 (주)컨셉션 다중 레이저의 중첩을 이용한 레이저 고출력 변환장치
CN108692680B (zh) * 2018-08-13 2023-12-26 北京行易道科技有限公司 激光标定工装
CN109581667A (zh) * 2019-01-10 2019-04-05 延锋伟世通电子科技（上海）有限公司 一种用于车载抬头显示器的光学投影装置
DE102020123786A1 (de) * 2020-09-11 2022-03-17 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Trennen von Dünnstglas
RU209801U1 (ru) * 2021-11-29 2022-03-23 Валерий Иванович Ревенко Устройство лазерной резки образца из хрупкого неметаллического материала
CN114952013B (zh) * 2022-04-28 2024-06-18 维达力科技股份有限公司 3d玻璃盖板及其制备方法、电子产品
CN114952047A (zh) * 2022-06-15 2022-08-30 无锡镭科曼数控科技有限公司 一种大幅面激光切割机自动纠错机构
CN116551217B (zh) * 2023-07-10 2023-09-12 大量科技（涟水）有限公司 一种数控机床激光切割机
KR102949441B1 (ko) 2023-07-18 2026-04-08 미쓰비시덴키 가부시키가이샤 레이저 가공기
CN117161477B (zh) * 2023-10-31 2024-07-02 临沂友诚制锯技术服务有限公司 圆弧光路锯齿加工工艺
CN118023697B (zh) * 2024-04-12 2024-06-11 武汉市双桥科技有限公司 一种面向立体纸雕的激光雕刻方法及系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000084689A (ja) 1998-07-16 2000-03-28 Amada Eng Center Co Ltd レーザ加工装置
JP2002028798A (ja) * 2000-07-11 2002-01-29 Nippon Steel Chem Co Ltd レーザ加工装置及びレーザ加工方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01113192A (ja) * 1987-10-23 1989-05-01 Hitachi Ltd レーザ加工機用集光装置
JPH0428493A (ja) * 1990-05-22 1992-01-31 Nissan Motor Co Ltd レーザ光学系
JPH04210883A (ja) * 1990-12-18 1992-07-31 Toshiba Corp レーザ照射装置
JP2720811B2 (ja) * 1995-03-15 1998-03-04 住友電気工業株式会社 レーザ集光方法及び装置
JPH11285886A (ja) * 1998-03-31 1999-10-19 Shin Meiwa Ind Co Ltd レーザ加工装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000084689A (ja) 1998-07-16 2000-03-28 Amada Eng Center Co Ltd レーザ加工装置
JP2002028798A (ja) * 2000-07-11 2002-01-29 Nippon Steel Chem Co Ltd レーザ加工装置及びレーザ加工方法

Also Published As

Publication number Publication date
TWI394629B (zh) 2013-05-01
JP5060893B2 (ja) 2012-10-31
KR20090032955A (ko) 2009-04-01
TW200914188A (en) 2009-04-01
JP2009082927A (ja) 2009-04-23
CN101397185A (zh) 2009-04-01

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