KR101179625B1 - band sensor - Google Patents

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KR101179625B1
KR101179625B1 KR20100012128A KR20100012128A KR101179625B1 KR 101179625 B1 KR101179625 B1 KR 101179625B1 KR 20100012128 A KR20100012128 A KR 20100012128A KR 20100012128 A KR20100012128 A KR 20100012128A KR 101179625 B1 KR101179625 B1 KR 101179625B1
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South Korea
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connection terminals
bending sensor
plate
terminals
terminal
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KR20100012128A
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Korean (ko)
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KR20110092613A (en
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김상식
신재규
이원겸
장진혁
정성관
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한국과학기술원
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Abstract

The bending sensor may include a bend sensor body; And a judging circuit that can determine the degree of warpage of the warpage sensor main body from the change in the resistance value of the warpage sensor main body, wherein the warpage sensor main body includes a plurality of first connection terminals arranged at regular intervals. Tops having sex; And a lower plate having flexibility including a plurality of second connecting terminals implemented at positions each of which may be in contact with each of the plurality of first connecting terminals, wherein any one of the plurality of first connecting terminals is provided. Is connected to one of the plurality of second connecting terminals and is fixed to each other. When the bending sensor main body is not bent, each of the remaining connecting terminals of the plurality of first connecting terminals and the plurality of first connecting terminals is fixed. Each of the remaining connection terminals of the two connection terminals is in contact with each other, and at least one of the remaining connection terminals of the plurality of first connection terminals when the bending sensor main body is bent, among the remaining connection terminals of the plurality of second connection terminals. Not in contact with at least one.

Description

Bending sensor
An embodiment according to the concept of the present invention relates to a bending sensor, and more particularly, to a bending sensor that senses whether a bending occurs according to whether or not contact terminals are connected.
There are sensors using various methods to recognize deformation. However, for example, the sensor using the conductive ink may be recognized as deformed even though no deformation occurred due to the conductivity of the conductive ink. In addition, the sensor using the conductive ink has a disadvantage that the thickness is thick.
Therefore, the technical problem to be achieved by the present invention is to provide a bending sensor that senses the bending according to the contact of the connection terminals that can be sensed thinner and more accurate.
Bending sensor according to an embodiment of the present invention is a bending sensor body (bend sensor body); And
And a judging circuit for judging the bending degree of the bending sensor main body from the change in the resistance value of the bending sensor main body, wherein the bending sensor main body includes a plurality of first connection terminals arranged at regular intervals. A top plate having; And a lower plate having flexibility including a plurality of second connecting terminals implemented at positions each of which may be in contact with each of the plurality of first connecting terminals, wherein any one of the plurality of first connecting terminals is provided. Is connected to one of the plurality of second connecting terminals and is fixed to each other, and when the bending sensor main body is not bent, each of the remaining connecting terminals of the plurality of first connecting terminals and the plurality of Each of the remaining connection terminals of the two connection terminals is in contact with each other, and at least one of the remaining connection terminals of the plurality of first connection terminals when the bending sensor main body is bent, among the remaining connection terminals of the plurality of second connection terminals. Not in contact with at least one.
According to an embodiment, the bending sensor of the plurality of first connection terminals is the last terminal and each of the plurality of second connection terminals is a conductor.
In some embodiments, the last terminal and an input terminal of the determination circuit are electrically connected, and each of the plurality of second connection terminals is electrically connected to each other.
According to an embodiment, each of the connection terminals of any one of the plurality of first connection terminals and any one of the plurality of second connection terminals is a first connection terminal.
In some embodiments, resistance values between two adjacent terminals among the plurality of second connection terminals are the same.
The bending sensor according to an embodiment of the present invention is a flexible plate including a plurality of first conductive connection terminals disposed at regular intervals and in a position where each of the plurality of first conductive connection terminals may be in contact with each other. A bending sensor body including a lower plate having flexibility including a plurality of second conductive connection terminals implemented; And any one terminal of the plurality of first conductive connection terminals is connected to and fixed to any one of the plurality of second conductive connection terminals, and the plurality of first and second lower terminals are not bent. Each of the remaining connection terminals of the first connection terminals and each of the remaining connection terminals of the plurality of second connection terminals are in contact with each other, and at least among the remaining connection terminals of the plurality of first connection terminals when the upper plate and the lower plate are bent. One is not in contact with at least one of the remaining connection terminals of the plurality of second connection terminals.
In some embodiments, the bending sensor further includes a voltage supply for supplying a voltage signal having a constant voltage level to each of the plurality of first connection terminals.
In some embodiments, each of the lower plates may be electrically connected to each of the plurality of second connection terminals.
According to an embodiment, the determination circuit may include an analog-to-digital converter for converting the voltage signals into digital signals; And a processor configured to compare the digital signals and signals output from the memory to determine an upper portion of the upper plate and the lower plate.
Bending sensor according to an embodiment of the present invention is a bending sensor body (bend sensor body); And
A determination circuit capable of judging the degree of warpage of the warpage sensor body from a change in the resistance value of the warpage sensor body, wherein the warpage sensor body includes: a flexible upper plate including a conductive measurement terminal; And a fusible lower plate including N conductive terminals arranged at regular intervals, wherein the conductive measuring terminal contacts the (NM) th one of the N connection terminals as the bending sensor body is bent. In this case, the bending degree of the bending sensor is determined according to the resistance value between the first connection terminal and the (NM) th connection terminal among the N connection terminals.
The bending sensor according to an embodiment of the present invention has an effect of sensing thinner and more accurately by sensing the bending depending on whether the connection terminals are in contact.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In order to more fully understand the drawings recited in the detailed description of the present invention, a detailed description of each drawing is provided.
1 shows a block diagram of a bending sensor according to an embodiment of the present invention.
FIG. 2 shows a block diagram when the bending sensor main body of FIG. 1 is wheeled. FIG.
Figure 3 shows a block diagram of the bending sensor according to another embodiment of the present invention.
FIG. 4 shows a block diagram when the bending sensor main body of FIG. 3 is wheeled. FIG.
5 is a block diagram of a bending sensor according to another exemplary embodiment of the present invention.
6 is a block diagram of a bending sensor according to another exemplary embodiment of the present invention.
Specific structural and functional descriptions of embodiments according to the concepts of the present invention disclosed in this specification or application are merely illustrative for the purpose of illustrating embodiments in accordance with the concepts of the present invention, The examples may be embodied in various forms and should not be construed as limited to the embodiments set forth herein or in the application.
Embodiments in accordance with the concepts of the present invention can make various changes and have various forms, so that specific embodiments are illustrated in the drawings and described in detail in this specification or application. It is to be understood, however, that it is not intended to limit the embodiments according to the concepts of the present invention to the particular forms of disclosure, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.
Terms such as first and / or second may be used to describe various components, but the components should not be limited by the terms. The terms are intended to distinguish one element from another, for example, without departing from the scope of the invention in accordance with the concepts of the present invention, the first element may be termed the second element, The second component may also be referred to as a first component.
When a component is referred to as being "connected" or "connected" to another component, it may be directly connected to or connected to that other component, but it may be understood that other components may be present in between. Should be. On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between. Other expressions describing the relationship between components, such as "between" and "immediately between," or "neighboring to," and "directly neighboring to" should be interpreted as well.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, the terms "comprises ", or" having ", or the like, specify that there is a stated feature, number, step, operation, , Steps, operations, components, parts, or combinations thereof, as a matter of principle.
Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art, and are not construed in ideal or excessively formal meanings unless expressly defined herein. Do not.
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail with reference to the preferred embodiments of the present invention with reference to the accompanying drawings.
1 shows a block diagram of a bending sensor according to an embodiment of the present invention.
Referring to FIG. 1, the bending sensor 10-1 includes a bending sensor body 20 and a determination circuit 30. The determination circuit 30 may be implemented as a microprocessor.
The bending sensor 10-1 is a sensor which recognizes whether it bends from a change of the resistance value of the bending sensor main body 20. FIG.
The bending sensor main body 20 includes an upper plate 21 and a lower plate 23. The upper plate 21 and the lower plate 23 are soluble and may be implemented with, for example, a flexible PCB. The upper plate 21 includes a plurality of first connection terminals 25 disposed at regular intervals. The lower plate 23 includes a plurality of second connection terminals 27 implemented at positions where each of the lower plates 23 may be in contact with each of the plurality of first connection terminals 25.
Any one of the plurality of first connection terminals 25 is connected to and fixed to any one of the plurality of second connection terminals 27. For example, any one of the plurality of first connection terminals 25 is the first connection terminal 25-1 of the plurality of first connection terminals 25, and the plurality of second connection terminals. Any one of the connection terminals 27 may be the first connection terminal 27-1 of the plurality of second connection terminals 27.
Of the plurality of first connection terminals 25, the last terminal 25-n and the plurality of second connection terminals 27 are conductors.
 The last terminal 25-n of the plurality of first connection terminals 25 and the input terminal of the determination circuit 30 are electrically connected, and each of the plurality of second connection terminals 27 is electrically connected to each other. . Resistance values are the same between two adjacent terminals among the plurality of second connection terminals 27.
The determination circuit 30 can determine the degree of warpage of the warpage sensor main body 20 from the change in the resistance value of the warpage sensor main body 20. According to an exemplary embodiment, values for the current i output from the bending sensor main body 20 may be preset in the determination circuit 30 according to the degree of bending. For example, when the amount of current i is 10 mA, the bending sensor main body 20 may be set to 5 degrees, and when the amount of current i is 20 mA, it may be set to 10 degrees. The input terminal of the determination circuit 30 applies a DC signal having a constant level, for example, a DC voltage v or a DC current i, to the bending sensor main body 20.
When the bending sensor main body 20 is not bent, the last terminal 25-n of the plurality of first connection terminals 25 and the last terminal 27-n of the plurality of second connection terminals 27 are mutually opposite. Contact.
Therefore, when the bending sensor main body 20 is not bent and the voltage v is applied to the bending sensor main body 20, the last terminal 25-n and the plurality of first terminals of the plurality of first connection terminals 25 are applied. The current i flows through the last terminal 27-n of the two connection terminals 27.
For example, when the bending sensor main body 20 is not bent, if the resistance value is R between two adjacent terminals among the plurality of second connection terminals 27 and there are N resistance values in total, each resistance value is all Since it is the same, the total resistance is N * R.
Therefore, when the bending sensor main body 20 is not bent, the quantity of the electric current i becomes the value which divided | segmented the voltage V by the total resistance value N * R by Ohm's law.
 FIG. 2 shows a block diagram when the bending sensor main body of FIG. 1 is wheeled. FIG.
1 and 2, when the bending sensor main body 20 is bent, the last terminal 25-n of the plurality of first connection terminals 25 and the last terminal of the plurality of second connection terminals 27 are provided. 27-n are not in contact with each other.
When the bending sensor main body 20 is bent, the last terminal 25-n of the plurality of first connection terminals 25 is the previous terminal of the last terminal 27-n of the plurality of second connection terminals 27. (27- (n-1)).
Therefore, when the bending sensor main body 20 is bent, when the voltage v is applied to the bending sensor main body 20, the last terminal 25-n and the plurality of second terminals of the plurality of first connection terminals 25 are applied. The current i may flow through the previous terminal 27-(n-1) of the last terminal 27-n of the connection terminals 27.
For example, when the bending sensor main body 20 is bent, if the resistance value is R between two adjacent terminals among the plurality of second connection terminals 27 and there are a total of N resistance values, each resistance value is the same. Since the last terminal 27-n of the plurality of second connection terminals 27 is not in contact with any one of the plurality of first connection terminals 25, the total resistance is (N-1) * R. . Therefore, when the deflection sensor main body 20 is bent, the amount of current i becomes the value obtained by dividing the voltage V by the total resistance value ((N-1) * R) by Ohm's law.
The judging circuit 30 compares the amounts of the currents i, respectively, when the bending sensor main body 20 is not bent and when it is wheeled, that is, by measuring a change in the resistance value of the bending sensor main body 20. 20) can be determined whether the warpage.
According to an embodiment, the last terminal 25-n of the plurality of first connection terminals 25 may not be in contact with any of the plurality of second connection terminals 27.
Therefore, when the bending sensor main body 20 is bent, when the voltage v is applied to the bending sensor main body 20, the last terminal 25-n of the plurality of first connection terminals 25 may have a plurality of second values. Since no contact is made with any of the connection terminals 27, the current i does not flow.
The determination circuit 30 may determine that the bending sensor main body 20 is bent when the amount of current i output from the bending sensor main body 20 is zero.
As described with reference to FIG. 2, the last terminal 25-n of the plurality of first connection terminals 25 may be connected to any one of the plurality of second connection terminals 27 according to the degree of bending. . Therefore, it is possible to determine the curvature based on the current i output to the determination circuit 30.
Figure 3 shows a block diagram of the bending sensor according to another embodiment of the present invention.
Referring to FIG. 3, the bending sensor 10-2 includes a bending sensor body 40 and a determination circuit 50.
The bending sensor main body 40 includes an upper plate 41 and a lower plate 43.
The upper plate 41 and the lower plate 43 are soluble and may be implemented with, for example, a flexible PCB.
The upper plate 41 includes a plurality of first connection terminals 45 arranged at regular intervals.
The lower plate 43 includes a plurality of second connection terminals 47 implemented at positions where each of the lower plates 43 may be in contact with each of the plurality of first connection terminals 45.
One terminal 45-1 of the plurality of first connection terminals 45 is connected to and fixed to one connection terminal 47-1 of the plurality of second connection terminals 47.
Each of the plurality of first connection terminals 45 and the plurality of second connection terminals 47 is a conductor.
 Each of the plurality of first connection terminals 45 is electrically connected, and each of the plurality of second connection terminals 47 is electrically connected to the determination circuit 50.
According to an embodiment, the bending sensor 10-2 may further include a power supply 49.
The power supply 49 may supply a DC signal having a constant level, for example, a DC voltage v or a DC current i, to a position corresponding to each of the plurality of first connection terminals 45.
The determination circuit 50 may include an analog to digital converter 51, a processor 53, and a look up table 55.
The determination circuit 50 converts analog signals output from each of the plurality of second connection terminals 47 into digital signals to determine whether the bending sensor body 40 is bent according to the digital signals.
The analog-to-digital converter 51 converts analog signals output from each of the plurality of second connection terminals 47 into digital signals.
The processor 53 receives the digital signals and compares the data stored in the LUT 55 to determine whether the bending sensor body 40 is bent. The digital signals may be data having a pattern.
When the bending sensor main body 40 is not bent, each of the plurality of first connection terminals 45 and each of the plurality of second connection terminals 47 are in contact with each other.
Therefore, when a DC signal having a constant level is applied from the power supply 49, for example, the DC voltage v or the DC current i, analog signals output from each of the plurality of second connection terminals 47 are constant. Has
The analog-to-digital converter 51 includes all of the analog signals having a constant level and the digital signals having a high level, for example, each of the plurality of first connection terminals 45 and the plurality of second connection terminals 47. In this case, the signal is converted to 1111 and output to the processor 53.
The processor 53 compares the data stored in the LUT 55 and the converted digital signals to determine that the bending sensor body 40 is not bent. The LUT 55 stores data patterns having different values as the bending sensor 10-2 is bent.
When the processor 53 determines that the bending sensor body 40 is not bent, the processor 53 may control the input / output device 60, for example, the display output device.
FIG. 4 shows a block diagram when the bending sensor of FIG. 3 is wheeled. FIG.
Referring to FIGS. 3 and 4, when the plurality of first connecting terminals 45 and the plurality of second connecting terminals 47 are each four, when the bending sensor body 40 is bent, the plurality of first connecting terminals 45 and the plurality of second connecting terminals 47. The terminal 45-3 of the connection terminals 45 and the terminal 47-3 of the plurality of second connection terminals 47 do not contact each other.
Therefore, when a DC signal having a constant level, for example, DC voltage v or DC current i is applied from the power supply 49, the terminal 45-3 of any one of the plurality of first connection terminals 45 is applied. The analog signals output from each of the plurality of second connection terminals 47 except for one terminal 47-3 of the plurality of second connection terminals 47 that are not in contact with each other may have a constant level.
Analog signal output through any one terminal 47-3 of the plurality of second connection terminals 47 that are not in contact with any one terminal 45-3 of the plurality of first connection terminals 45. Has a value of zero.
Accordingly, the analog-to-digital converter 51 converts analog signals into digital signals, for example, 1101, and outputs the analog signals to the processor 53.
The processor 53 may determine that the bending sensor body 40 is bent by comparing the data stored in the LUT 55 and the converted digital signals.
The processor 53 may control the input / output device 60, for example, the display output device, when determining that the bending sensor main body 40 is bent.
5 is a block diagram of a bending sensor according to another exemplary embodiment of the present invention.
Referring to FIG. 5, the bending sensor 10-3 includes a bending sensor main body 60 and a determination circuit 70.
The bending sensor body 60 includes a top plate 61 including a conductive measurement terminal 67 and a flexible bottom plate 63 including N connecting terminals 69 that are conductive at regular intervals.
In some embodiments, the upper plate 61 may further include a support terminal 65. The support terminal 65 is connected to and fixed to the lower plate 61.
Any one of the conductive measurement terminal 67 and the N connection terminals 69 is electrically connected.
Resistance values between two adjacent terminals (eg, 69-1 and 69-2, or 69-2 and 69-3) among the N connection terminals 69 are the same.
The lower plate 63 may include a plurality of insulators 71-1, 71-2, and 71-n, each of which is positioned between each of the N connection terminals 69. The plurality of insulators 71-1, 71-2, and 71-n may increase the accuracy of the measurement of the conductive measurement terminal 67.
When the bending sensor main body 60 is not bent, the conductive measurement terminal 67 is in contact with the Nth connection terminal 69-n. The determination circuit 80 applies a voltage v having a constant level to the bending sensor main body 60. When the bending sensor main body 60 is not bent, the current i flows through the Nth connection terminal 69-n. For example, when the bending sensor main body 20 is not bent, if the resistance value is R between two adjacent terminals among the N connection terminals 69 and the total N resistance values are present, each resistance value is the same. The total resistance is N * R.
Therefore, when the bending sensor main body 20 is not bent, the quantity of the electric current i becomes the value which divided | segmented the voltage V by the total resistance value N * R by Ohm's law.
When the bending sensor main body 60 is bent, the conductive measuring terminal 67 may contact any one of the N connection terminals 69 according to the angle between the conductive measuring terminal 67 and the top plate 61.
For example, the N connection terminals 69 have an angle between the conductive measurement terminal 67 and the upper plate 61 when N is 5.
Figure 112010008836909-pat00001
When 1, the conductive measuring terminal 67 is in contact with the third connecting terminal 69-3, the angle between the conductive measuring terminal 67 and the top plate 61 is
Figure 112010008836909-pat00002
When 2, the conductive measuring terminal 67 is in contact with the fourth connecting terminal 69-4.
Therefore, as the angle between the conductive measurement terminal 67 and the upper plate 61 decreases, the resistance value in contact with the conductive measurement terminal 67 decreases.
The angle between the conductive measurement terminal 67 and the top plate 61
Figure 112010008836909-pat00003
When 1, the resistance value in contact with the conductive measurement terminal 67 is 3R, and the current i flowing through the bending sensor main body 60 is V / (3R).
The angle between the conductive measurement terminal 67 and the top plate 61
Figure 112010008836909-pat00004
When 2, the resistance value in contact with the conductive measurement terminal 67 is 4R, and the current i flowing through the bending sensor main body 60 becomes V / (4R).
Therefore, the judging circuit 80 can determine the bending degree of the bending sensor main body 60 by measuring the electric current i which flows through the bending sensor main body 60, ie, the change of the resistance value of the bending sensor main body 60. FIG. .
In FIG. 5, the determination circuit 80 may measure the current i to determine the degree of warpage of the bending sensor 10-3. However, according to an exemplary embodiment, the determination circuit 80 may change according to a change in the voltage v. The degree of warpage can be determined.
6 is a block diagram of a bending sensor according to another exemplary embodiment of the present invention.
The bending sensor can determine the bending degree of the bending sensor main body from the physical change of the upper board and the lower board.
For example, the angle when the bending sensor main body is not bent
Figure 112010008836909-pat00005
The angle when the deflection sensor is wheeled
Figure 112010008836909-pat00006
When the length of the top plate is L, the length difference between the top plate and the bottom plate is dL, the distance between the top plate and the bottom plate is t, and the radius of curvature is R, Equations 1 and 2 are derived as follows. .
[Equation 1]
Figure 112010008836909-pat00007
&Quot; (2) "
Figure 112010008836909-pat00008
When Equation 1 and Equation 2 are linked together, Equation 3 below is obtained.
&Quot; (3) "
Figure 112010008836909-pat00009
Therefore, it is possible to determine the degree of warpage of the upper plate and the lower plate from the equation (3).
Determination of the degree of warpage of the upper plate and the lower plate may be performed by a determination circuit (not shown).
Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.
10-1: bending sensor
20: bending sensor body
30: judgment circuit

Claims (12)

  1. A bend sensor body; And
    And a judging circuit capable of judging the degree of warpage of the warpage sensor main body from the change in the resistance value of the warpage sensor main body,
    The bending sensor main body,
    A top plate having flexibility including a plurality of first connection terminals disposed at regular intervals; And
    A lower plate having flexibility, each having a plurality of second connecting terminals embodied in a position that can be in contact with each of the plurality of first connecting terminals,
    Any one of the plurality of first connection terminals is connected to and fixed to one of the plurality of second connection terminals.
    When the bending sensor main body is not bent, each of the remaining connection terminals of the plurality of first connection terminals and each of the remaining connection terminals of the plurality of second connection terminals are in contact with each other,
    And at least one of the remaining connection terminals of the plurality of first connection terminals does not contact at least one of the remaining connection terminals of the plurality of second connection terminals when the bending sensor main body is bent.
  2. The bending sensor of claim 1, wherein a last terminal of the plurality of first connection terminals and each of the plurality of second connection terminals are conductors.
  3. The terminal of claim 2, wherein the last terminal and the input terminal of the determination circuit are electrically connected.
    And each of the plurality of second connection terminals is electrically connected to each other.
  4. The bending sensor of claim 1, wherein each one of the plurality of first connection terminals and one of the plurality of second connection terminals is a first connection terminal.
  5. The bending sensor of claim 1, wherein resistance values between two adjacent terminals among the plurality of second connection terminals are the same.
  6. A flexible upper plate including a plurality of first conductive connection terminals disposed at regular intervals;
    A bending sensor body including a lower plate having flexibility, each of which includes a plurality of second conductive connection terminals implemented at a position where each of the plurality of first conductive connection terminals may be in contact with each other;
    Any one of the plurality of first conductive connection terminals is connected to and fixed to any one of the plurality of second conductive connection terminals,
    When the upper plate and the lower plate are not bent, each of the remaining connection terminals of the plurality of first connection terminals and each of the remaining connection terminals of the plurality of second connection terminals are in contact with each other.
    And at least one of the remaining connection terminals of the plurality of first connection terminals does not contact at least one of the remaining connection terminals of the plurality of second connection terminals when the upper plate and the lower plate are bent.
  7. The method of claim 6, wherein the bending sensor,
    And a voltage supply for supplying a voltage signal having a constant voltage level to each of the plurality of first connection terminals.
  8. The bending sensor of claim 6, wherein each of the lower plates is electrically connected to each of the plurality of second connection terminals.
  9. The method of claim 6, wherein the bending sensor,
    Each of the plurality of second connection terminals receives voltage signals having different voltage levels according to whether the plurality of second connection terminals are connected to a connection terminal corresponding to each of the plurality of first connection terminals, respectively, so that the upper portion of the upper plate and the lower plate is separated. A bending sensor further comprising a judging circuit for judging.
  10. The method of claim 9, wherein the determination circuit,
    An analog to digital converter for converting the voltage signals into digital signals; And
    And a processor configured to compare the digital signals and signals output from the memory to determine an upper portion of the upper plate and the lower plate.
  11. The method of claim 10, wherein the processor,
    When the digital signals are at a high level, it is determined that the digital signals do not bend,
    And determine if any one of the digital signals is at a low level.
  12. A bend sensor body; And
    And a judging circuit capable of judging the degree of warpage of the warpage sensor main body from the change in the resistance value of the warpage sensor main body,
    The bending sensor main body,
    A flexible top plate comprising a conductive measurement terminal; And
    A fusible base comprising N conductive terminals conductively spaced at regular intervals,
    As the bending sensor main body is bent, when the conductive measurement terminal contacts the (NM) th connection terminal among the N connection terminals, between the first connection terminal and the (NM) th connection terminal among the N connection terminals. A bending sensor for determining the bending degree of the bending sensor according to the resistance value of.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021055927A1 (en) * 2019-09-20 2021-03-25 Tactual Labs Co. Multibend shape sensor
WO2021081274A1 (en) * 2019-10-23 2021-04-29 Tactual Labs Co. Higher dimension multibend shape sensor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5610528A (en) 1995-06-28 1997-03-11 International Business Machines Corporation Capacitive bend sensor
KR100500352B1 (en) 2004-09-25 2005-07-12 (주)지엠지 Measurement senser of the ground and structure, and measurement method and apparatus
JP2007292618A (en) 2006-04-25 2007-11-08 Hokkaido Univ Deformation measuring device and its manufacturing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5610528A (en) 1995-06-28 1997-03-11 International Business Machines Corporation Capacitive bend sensor
KR100500352B1 (en) 2004-09-25 2005-07-12 (주)지엠지 Measurement senser of the ground and structure, and measurement method and apparatus
JP2007292618A (en) 2006-04-25 2007-11-08 Hokkaido Univ Deformation measuring device and its manufacturing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021055927A1 (en) * 2019-09-20 2021-03-25 Tactual Labs Co. Multibend shape sensor
WO2021081274A1 (en) * 2019-10-23 2021-04-29 Tactual Labs Co. Higher dimension multibend shape sensor

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