KR101164739B1 - Method of producing etching material and the etching material - Google Patents

Abstract

An object of the present invention is to provide a method for producing an etching material and an etching material that can be excellently etched even in the case of a lead frame or a mask for forming a high-definition pattern.
In order to solve the above problems, the manufacturing method of the raw material for etching processing of the present invention contains C: ≤0.01%, Si: ≤0.5%, Mn: ≤1.0%, Ni: 30-50%, A method for producing a material for etching processing comprising an additional Fe and impurities and having a plate thickness of 0.02 to 0.15 mm, wherein a final pass of finish cold rolling is set to a reduction ratio of 10% or less, and the rolls of the finish rolling The grinding | polishing trace is formed in a direction, and it uses the roll whose roughness of the circumferential direction and the orthogonal direction was Ra: 0.10-0.25 micrometer, The rolling speed is performed at 1.2 m / s or more.

Description

Method for producing etching material and material for etching processing {Method of producing etching material and the etching material}

The present invention relates to a method for producing a material for etching processing capable of high-definition etching and a material for etching processing.

Background Art Conventionally, various mask materials, such as lead frame materials and shadow mask materials, have been known for use in high-definition etching processing on thin plates of Fe-Ni alloy.

By the way, when manufacturing the thin plate of Fe-Ni alloy, cold rolling is performed in a final process. As a problem which arises during this cold rolling, there exist a problem regarding a surface form, a problem regarding residual stress, and all affect high-definition etching characteristics. Therefore, in order to obtain desired etching characteristic, the board | substrate which performs high-definition etching has various proposals which adjust surface roughness or adjust residual stress.

For example, Japanese Patent Application Laid-open No. Hei 8-269742 (Patent Document 1) describes a Fe-Ni alloy having a Fe-Ni alloy capable of forming a fine etching pattern by setting the average value of residual stress from the surface to 50 N / mm 2 or less. The proposal is made. This technique prevents side etch and enables high-definition etching.

For example, Japanese Patent Laid-Open No. 6-122013 (Patent Literature 2), in the final cold rolling process, controls the generation of oil pits by rolling at a reduction ratio of 5% or more and managing the rolling oil concentration. There is proposed a method for producing a shadow mask or a steel plate for an aperture grill to obtain a desired surface roughness. This technique is to suppress residual stress.

Moreover, the applicant of this application also proposes the vapor deposition mask using laminated foil which bonded two metal plates in the intermediate | middle layer as Unexamined-Japanese-Patent No. 2004-39628 (patent document 3).

Japanese Patent Laid-Open No. 8-269742 Japanese Patent Laid-Open No. 6-122013 Japanese Patent Laid-Open No. 2004-39628

In applications where the above-mentioned high-definition etching is required, for example, the laminated foil shown in Patent Document 3 can be used for high-precision etching processing, but in the case of the material for etching processing of Patent Document 3, the plate thickness is 10. It is necessary to prepare a metal foil having a thickness of less than or equal to μm, and furthermore, it is necessary to make them laminated foil using a special crimping and rolling apparatus, which is a very expensive material.

On the other hand, the fine-processable Fe-Ni alloy shown by patent document 1 and patent document 2 is economical in the point which uses a single metal material.

In Patent Literature 1, as a factor influencing high-definition etching, in the case of normal cold rolling, the lubricating oil does not become completely uniform, and oil pits are formed on the material surface, or new generation due to the progress of plastic deformation. It is described that surface uniformity is not obtained, and the portion "WBL (Weak-Boundary-Layer)" which is inferior to adhesiveness with an organic film is easy to generate | occur | produce by surface expression etc. are described.

In addition, in the columns [0016] to [0018], it is described that it is effective to roughen the surface roughness in addition to the residual stress, but excessively roughening the surface roughness makes it more difficult to make high-definition etching. .

Moreover, in the method of adjusting the roughness of the surface of a raw material actively using the oil pit as described in patent document 2, an excessively deep oil pit may be formed. In addition, the high-definition etching processing becomes difficult due to the etching failure due to the oil pit.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for producing an etching processing material and an etching processing material which can be excellently etched even in the case of a lead frame or a mask for forming a high-definition pattern.

MEANS TO SOLVE THE PROBLEM The present inventor earnestly examined the various factors which affect etching processing, such as chemical composition, surface roughness, and residual stress, in order to be able to form highly precise etching processing.

As a result, it was found that the most influential effect on the high-definition etching process is the surface roughness. When the surface roughness is excessively lowered, the effect of the oil pit becomes stronger, and dimensional defects are likely to occur during etching, and when the surface roughness is excessively roughened, the high-definition etching process itself is found to be difficult.

Then, as a result of earnestly examining the manufacturing method of the material for etching processing which can give the optimum surface roughness, the generation of oil pits can be suppressed by adjusting the roughness of the roll during the finish cold rolling, and the optimum surface roughness It discovered that it could be set as the raw material for etching process which has.

In addition, it was found that it is effective to reduce the coefficient of friction between the raw material for etching processing and the roll by adjusting the rolling speed during finish rolling to reduce the residual stress.

That is, the present invention contains C: ≤0.01%, Si: ≤0.5%, Mn: ≤1.0%, Ni: 30-50% by mass, the balance contains Fe and impurities, the plate thickness is 0.02 ~ A method for producing a material for etching processing of 0.15 mm, wherein the final pass of cold rolling is set to a rolling reduction of 10% or less, and in the roll of the finish rolling, grinding marks are formed in the circumferential direction and perpendicular to the circumferential direction. It is a manufacturing method of the raw material for etching processing which carries out the rolling speed to 1.2 m / s or more using the roll which made Ra: 0.10-0.25 micrometers.

In addition, the present invention contains C: ≤0.01%, Si: ≤0.5%, Mn: ≤1.0%, Ni: 30-50% by mass, the balance contains Fe and impurities, the plate thickness is 0.02 ~ 0.15 mm of etching material, the etching material has a surface roughness measured in a direction perpendicular to the rolling direction of Ra: 0.08 to 0.20 µm, and a surface roughness measured in a rolling direction of Ra: 0.01 to 0.10 µm, and The surface roughness measured in the direction perpendicular to the rolling direction is a material for etching processing having a rough surface roughness exceeding 0.02 μm in Ra than the surface roughness measured in the rolling direction.

In the raw material for etching processing obtained by the method of the present invention, the etching processing of a high-definition pattern can be formed with high accuracy, and the dimensional defect during etching can also be suppressed.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a micrograph showing an example of the surface of an etching processing material having a surface to which anisotropic surface roughness is applied to which the manufacturing method of the present invention is applied.
Fig. 2 is a micrograph showing an example of the surface of a material for etching processing having a surface to which isotropic surface roughness is applied.
3 is a schematic diagram showing the surface measurement direction.

The reason for limitation prescribed | regulated by this invention is described below.

The chemical composition of the etching processing material of the present invention contains, by mass%, Fe: Fe: 0.01%, Si: 0.5%, Mn: 1.0%, Ni: 30-50%, and remainder containing Fe and impurities. The reason for using Ni alloy is as follows.

C: ≤0.01 mass%

C is an element which affects etching property. When C contains excessively, since etching property is inhibited, the upper limit of C was made into 0.01%.

Si: ≤0.5 mass%, Mn: ≤1.0 mass%

Si and Mn are usually contained in a small amount for the purpose of deoxidation, but when added excessively, segregation is likely to occur, so that Si: 0.5% or less and Mn: 1.0% or less. Preferable Si amount and Mn amount are Si: 0.1% or less and Mn: 0.5% or less.

Ni: 30-50 mass%

Ni is an element which has the effect | action which adjusts a thermal expansion coefficient in the case of using as a lead frame, for example, and has a big influence on low thermal expansion characteristics. If the content is less than 30% or more than 50%, the effect of lowering the coefficient of thermal expansion is lost, so the range of Ni is made 30 to 50%. Preferably it is 32 to 45%.

What constitutes other than the above is Fe and an impurity.

Next, plate | board thickness and surface roughness are demonstrated.

In the present invention, the plate thickness of 0.02 to 0.15 mm causes problems in handling when the thickness is less than 0.02 mm, and the amount of side etch increases during the etching process when the thickness exceeds 0.15 mm, for example, particularly high-definition etching. In the use which requires the formation of a high-definition etching pattern becomes difficult. Therefore, the plate | board thickness was limited to 0.02-0.15 mm. Moreover, the plate | board thickness favorable for high definition is the range of 0.02-0.10 mm, More preferably, it is the range of 0.02-0.06 mm.

In the present invention, the surface roughness measured in the direction perpendicular to the rolling direction of the etching processing material is Ra: 0.08 to 0.20 µm, and the surface roughness measured in the rolling direction is Ra: 0.01 to 0.10 µm.

When the high-definition etching pattern is formed on the material, if a lot of oil pits are formed on the surface of the material for etching processing, a difference occurs in the progress of the etching solution depending on the position at which the etching processing is performed. There is a possibility of adversely affecting the precision.

Therefore, by reducing the oil pits formed on the surface of the material for etching, it is expected to make the etching pattern higher.

Accordingly, in the present invention, roughness is intentionally different from each other in the rolling direction, the right angle direction, and the rolling direction of the etching processing material to suppress the occurrence of oil pits.

As a specific method, in order to roughen the roughness of the roll at the time of cold rolling slightly, and to make it easier for oil at the time of rolling out between the surface of a rolling material and a roll, the roll of finishing rolling forms a grinding mark in the circumferential direction, The occurrence of pits was suppressed. In other words, the oil pits are intentionally made during rolling to suppress the occurrence of oil pits.

As a result, the roughness of the surface when measured at a right angle with the rolling direction after rolling becomes rough, but generation | occurrence | production of an oil pit is suppressed.

In order to obtain the said effect, the etching raw material of this invention makes Ra: 0.08-0.20 micrometer the surface roughness measured in the direction orthogonal to a rolling direction.

However, when the surface roughness measured in the direction perpendicular to the rolling direction becomes rougher than 0.20 µm in Ra, high-definition etching becomes difficult due to the rough surface.

On the other hand, if the surface roughness is excessively lowered, the effect of suppressing the occurrence of the oil pit is not obtained, and the etching defect due to the oil pit tends to be easy, so that the surface roughness measured in the direction perpendicular to the rolling direction A minimum is made into 0.08 micrometer or more in Ra.

In addition, in the present invention, as described above, the surface roughness measured in the direction perpendicular to the rolling direction is raised to suppress the occurrence of oil pits, while smoothing the surface roughness in the rolling direction slightly, thereby realizing a high-definition etching process. .

The surface roughness of the rolling direction required for that is Ra: 0.01-0.10 micrometer.

In the present invention, the surface roughness measured in the direction perpendicular to the rolling direction is required to be higher than the surface roughness measured in the rolling direction. In order to reliably suppress the occurrence of the oil pits, the surface roughness measured in the direction perpendicular to the rolling direction is measured. One surface roughness is more than 0.02 micrometer in Ra than the surface roughness measured in the rolling direction, and rough surface roughness is needed.

What is necessary is just to apply the following manufacturing methods to make the surface roughness of an etching process material into the said range.

The most important process in this invention is a finishing rolling process. Until the finishing rolling process, a conventional method for producing a Fe-Ni alloy can be applied as it is.

For example, a process such as vacuum melting, hot forging, hot rolling, and cold rolling may be used, and if necessary, 1200 ° C. at the stage before cold rolling. What is necessary is just to perform an annealing at 800-950 degreeC once or more in order to reduce the hardness of a cold rolled material in the homogenization heat processing to a grade and a cold rolling process.

And in finish rolling of cold rolling, the rolling reduction rate of a final pass shall be 10% or less.

The reduction ratio of the final pass of the finish rolling to 10% or less is caused by a large amount of deformation remaining in the material for etching processing when the reduction ratio in the final stage of cold rolling exceeds 10%. This is because the risk of deformation of an etching processing material increases.

In addition, when the reduction ratio is excessively small, it is difficult to adjust the surface roughness described above, so the lower limit of the finish rolling may be 2%.

In the present invention, the surface roughness of the roll is adjusted to adjust the roughness of the surface of the raw material for etching processing.

In the present invention, in the final pass of finish rolling, it is necessary to use a roll having a roughness Ra of 0.10 to 0.25 µm in the direction perpendicular to the circumferential direction of the roll (rotational direction of the roll).

The first reason for the roughness in the circumferential direction and the perpendicular direction of the roll to Ra: 0.10 to 0.25 µm is the adjustment of the surface roughness of the material for etching processing, and the second reason is that the oil during rolling escapes between the surface of the rolling material and the roll. It is for suppressing generation | occurrence | production of an oil pit by giving roughness which makes it easy to a roll.

Therefore, a grinding mark is formed in the roll surface of this invention in the circumferential direction of a roll. To form the polishing trace, a polishing paper having a roughness in which the roughness in the circumferential direction and the perpendicular direction of the roll can be set to Ra: 0.10 to 0.25 µm is prepared, the abrasive paper is pressed firmly while rolling the roll, What is necessary is just to form a grinding | polishing trace by forming in the circumferential direction of a roll.

And in this invention, in order to reduce residual stress, the rolling speed was prescribed | regulated to 1.2 m / s or more. If the rolling speed is less than 1.2 m / s, the coefficient of friction between the roll and the material for etching processing is high, and residual stress cannot be reduced. Therefore, rolling speed shall be 1.2 m / s or more. Preferred rolling speeds are at least 1.5 m / s.

The upper limit of the rolling speed is not particularly defined, but if the speed is too high, thermal expansion of the roll occurs under the influence of the heat of processing, and the shape becomes unstable. For that reason, within 10 m / s is sufficient.

In the present invention, the strain removal annealing may be performed for the purpose of removing the strain remaining in the raw material for etching after finish rolling, and the strain removal annealing is sufficient if the temperature range is about 400 to 700 ° C.

When the strain removal annealing is performed after the finish rolling, after etching is performed on the material for etching, it is possible to more reliably suppress the defect due to the residual stress, which is more preferable.

The direction perpendicular to the rolling direction, the rolling direction, the circumferential direction of the roll, and the circumferential direction of the roll are as shown schematically in FIG. 3, and are represented by (A) in the raw material 1 for etching processing. The direction is a direction perpendicular to the rolling direction, and the direction shown by (B) is the rolling direction.

In addition, the direction shown by (C) in the roll 2 is a direction perpendicular to the circumferential direction of a roll, and the direction shown by (D) is the circumferential direction of a roll.

Example

The present invention will be described in more detail with reference to the following examples.

In the present Example, the Fe-Ni alloy which exists in the range of 32-45 mass% whose Ni content is the most preferable range was used.

The said Fe-Ni alloy was cold-rolled after the normal process of finishing it with thickness 2-3mm by vacuum melting-hot forging-homogenization heat processing-hot rolling.

Table 1 shows the chemical composition of the Fe-Ni alloy used in the present invention.

The Fe-Ni alloy sheet material after hot rolling was cold rolled. Annealing was performed twice during cold rolling to obtain a Fe-Ni alloy cold rolling material before finish rolling. In addition, the annealing temperature in cold rolling was made into continuous annealing at about 900 degreeC, and the thickness of the Fe-Ni alloy cold-rolled material before final rolling final pass was 0.054 mm.

After finishing rolling, the rolling reduction was 7.4%, the rolling speed was 1.3 m / s so that the sheet thickness was 0.050 mm, and the roll used for the final pass used a roll having five roughness variations. To prepare an etching processing material. In addition, conditions A-D are the raw materials for etching processes manufactured in the scope of the present invention, and conditions E and F are intentionally the comparative example which finished to the smooth surface.

In addition, the provision of the roughness to a roll used the abrasive paper so that a grinding mark may be formed in the circumferential direction, rotating a roll.

Table 2 shows the roughness in the circumferential direction and the perpendicular direction of the roll, and the surface roughness of the raw material for etching after finishing rolling.

In addition, the measurement of surface roughness Ra is measured according to the measuring method shown by JISB0601 and JISB0651. In addition, the surface roughness of the raw material for etching processing was selected at random from three places, and the roughness of the rolling direction, the perpendicular direction, and the rolling direction was measured.

After finish rolling, the strain removal annealing was performed at about 700 ° C., and the presence or absence of oil pits was examined on the surface of the raw material for etching processing.

Attempts were made to quantitatively assess the presence or absence of oil pits by means of image analysis or the like, but the identification was not good. Therefore, the occurrence of oil pits was confirmed by photographic determination by a 200 times photomicrograph.

An evaluation result is shown in Table 3, and the optical micrograph of the surface of the etching process material manufactured on condition A is shown in FIG. 1, and the optical micrograph of the surface of the etching process material manufactured on condition E is shown in FIG. In addition, the part shown by the white circle in a figure is a characteristic oil pit.

As shown in Table 3, it turns out that the raw material for an etching process to which the method of this invention is applied can suppress the generation | occurrence | production of an oil pit very much.

In addition, as shown in FIG. 1 and FIG. 2, it can be confirmed that the oil pit of several micrometers-about 20 micrometers is disperse | distributed and formed in the surface of the etching process material of condition E (FIG. 2). On the other hand, it turns out that the oil pit of several micrometers is slightly formed in the surface of the metal mask material of condition A (FIG. 1) of this invention.

Next, using the roll same as condition B, the rolling speed was changed to 1.0 m / s, 1.3 m / s, 1.7 m / s, and residual stress was measured.

After the residual stress produced the cutting sample of width 30mm and length 150mm from the material for etching processing of thickness 0.050mm after finish rolling, and removes only one side by 0.016mm which becomes about 1/3 of plate | board thickness by etching, The curvature amount when the cutting sample was suspended on the vertical upper half was measured and evaluated.

The etching liquid was sprayed with the etching liquid of 50 degreeC of liquid temperature using the ferric chloride aqueous solution, and the test piece was corroded. The residual stress generated in the surface layer is likely to be only a few micrometers of the surface layer in the plate thickness direction, but in order to sufficiently ignore the influence of the surface layer, etching is performed to about 1/3 of the plate thickness.

By using this evaluation method, it can be judged that the compressive residual stress of the surface layer is reduced, so that the curvature amount when hanging after etching is small. The results are shown in Table 4. In addition, the surface roughness of the raw material for etching processing was the same as that shown in Table 2.

In this residual stress test, it was judged that the effect of high-definition etching had little effect as long as the amount of warpage was within the range of 15 mm in accordance with the rule of thumb.

From the result of Table 4, when the rolling speed was the range of the present invention, the result was that the amount of warpage was small.

From the above result, the etching material of this invention was able to solve both the problem regarding the surface form which affects high-definition etching characteristic, and the problem regarding residual stress. Therefore, it can be said that it is most suitable for the lead frame and mask use which form a high definition pattern.

Since the present invention can affect the dimensional characteristics after etching, can suppress the occurrence of oil pits, and can also reduce the residual stress at the same time, it can be expected to be applied to applications requiring high-definition etching characteristics. .

1 Etching material
2 roll

Claims (2)

The mass% contains 0 <C≤0.01%, 0 <Si≤0.5%, 0 <Mn≤1.0%, 30≤Ni≤50%, the balance contains Fe and impurities, and the plate thickness is 0.02-0.15 mm As a method for producing a raw material for etching etching, the final pass of the finish cold rolling is a reduction ratio of 10% or less, and the polishing roll is formed on the roll of the finish rolling, and roughness perpendicular to the circumferential direction is obtained. A method for producing an etching-processing material, characterized in that the rolling speed is set to 1.2 m / s or more using a roll of Ra: 0.10 to 0.25 µm. The mass% contains 0 <C≤0.01%, 0 <Si≤0.5%, 0 <Mn≤1.0%, 30≤Ni≤50%, the balance contains Fe and impurities, and the plate thickness is 0.02-0.15 mm As the material for etching etching, the material for etching processing has a surface roughness measured in a direction perpendicular to the rolling direction of Ra: 0.08 to 0.20 µm, a surface roughness measured in a rolling direction of Ra: 0.01 to 0.10 µm, and further rolled. The surface roughness measured in the direction perpendicular to the direction has a rough surface roughness exceeding 0.02 μm in Ra than the surface roughness measured in the rolling direction.

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