KR101153246B1 - Substrate inspection method - Google Patents

Abstract

Substrate inspection method of the present invention, the step of manually controlling the substrate inspection apparatus; Inspecting a defect of the substrate through a manually controlled substrate inspection apparatus; Storing information about the inspection conditions or defects when a defect in the substrate is found. The remote board inspection system of the present invention includes a board inspection device located inside a clean room; And an input / output unit communicable with the substrate inspection apparatus so that the inspector can input and output information from outside the clean room.

Description

Substrate Inspection Method {SUBSTRATE INSPECTION METHOD}

The present invention relates to a substrate inspection method for inspecting a defect of a substrate of a liquid crystal display device.

Defects, such as a stain and a foreign material, may exist in the board | substrate of a liquid crystal display device. The inspector is visually inspecting to detect such defects.

One of the inspection methods is a method of determining by comparing the intensity of the reflected light or the difference in the reflection angle by irradiating light to the substrate.

In performing such a method, the inspector may feel a flare phenomenon such as when directly or specularly reflecting a high-brightness light source such as the sun or a vehicle headlight at night. The flare phenomenon is an instantaneous desensitization phenomenon when a high brightness light source is directly observed by the eye. Flare phenomenon increases the eye fatigue and adversely affects the inspection of the substrate because the contrast needs to be applied to the glare. Due to this problem, a method of detecting defects based on an image of a substrate photographed by a camera is required rather than a method of directly inspecting by an inspector.

On the other hand, when the board inspection is performed under different inspection conditions for each inspector, the read rate and the determination rate for each inspector may be different for the same defect. Therefore, there is a need for a method for securing a constant inspection quality regardless of the inspector.

On the other hand, when the inspector performs the inspection work in the clean room there is a problem that may adversely affect the quality of the substrate while foreign matter is introduced or generated by the inspector.

Because of the flare phenomenon, there is a need for a method of detecting defects indirectly based on an image of a substrate photographed by a camera, rather than a visual inspection by a inspector.

In addition, even if the defect is detected indirectly, there is a need for a configuration capable of automatically forming inspection conditions so that defects on the substrate can be easily detected.

In addition, a configuration for securing a certain inspection quality is required regardless of the inspector.

In addition, there is a need for a configuration that allows the inspector to inspect the substrate outside the clean room.

Technical problems of the present invention are not limited to the above-mentioned technical problems, and other technical problems that are not mentioned will be clearly understood by those skilled in the art from the following description.

Substrate inspection method of the present invention for solving the above problems, manual control of the substrate inspection apparatus; Inspecting a defect of a substrate through the manually controlled substrate inspection apparatus; Storing the information about the defect or the inspection conditions when the defect of the substrate is found.

The inspection condition may include at least one of a substrate type, a light source type, a light source mode (converged light or scattered light), a light source color, an illumination position, an illumination angle, a substrate stage position, a substrate stage angle, a camera position, and a camera angle. Can be.

In addition, the information on the defect may include a defect type or a defect position.

The method may further include calculating statistical information on the inspection condition or the defect based on the stored inspection condition or the defect information.

The statistical information may include a defect occurrence frequency for at least one of the substrate type, the defect position, and the defect type.

In addition, the statistical information may include a selection frequency for the inspection condition.

The method may further include setting a standard inspection condition based on the selection frequency for the inspection condition.

The method may further include inputting an inspection range of the substrate based on the defect occurrence frequency.

The step of inputting the inspection range of the substrate may include setting a specific standard deviation on a standard distribution of the frequency of occurrence of defects for at least one of the defect location, substrate type, and defect type, and determining the standard deviation according to the set standard deviation. It may include the step of selecting the range to be the inspection range.

The method may further include setting a standard inspection condition based on a selection frequency for an inspection condition corresponding to the input inspection range.

The setting of the standard inspection condition may include setting an average value as a standard inspection condition on a standard distribution of the selection frequency for the inspection condition.

The setting of the standard test condition may include setting a specific standard deviation on a standard distribution of the selection frequency for the test condition, and setting at least one standard test condition in a test condition range determined according to the set standard deviation. It may include the step of selecting.

The method may further include automatically controlling the substrate inspection apparatus according to the set standard inspection condition.

The method may further include additionally storing an inspection condition or defect information when a defect of a substrate is found through the automatically controlled substrate inspection apparatus.

The method may further include updating the statistical information by reflecting the additionally stored test condition or defect information.

In addition, after additionally storing the inspection condition or defect information, the method may further include a step of asking whether to proceed with the additional board inspection by manual control.

The method may further include storing additional inspection conditions or additional defect information when a defect is found through the manually inspected substrate inspection apparatus when the additional substrate inspection by the manual control is performed.

Remote substrate inspection system of the present invention for solving the above problems, the substrate inspection apparatus located in the clean room; And an input / output unit communicable with the board inspection apparatus so that an inspector can input and output information from outside the clean room.

The apparatus may further include a storage unit that stores inspection conditions or defect information when a defect of a substrate is found through the manually controlled substrate inspection apparatus.

The apparatus may output statistical information on the inspection condition or the defect through the input / output unit based on the inspection condition or the defect information stored in the storage unit.

In addition, a standard inspection condition based on a selection frequency of the inspection condition may be input through the input / output unit.

In addition, the inspection range of the substrate set based on the frequency of defect occurrence may be input through the input / output unit.

In addition, a standard inspection condition may be input based on a selection frequency of an inspection condition corresponding to the input inspection range through the input / output unit.

The apparatus may further include a controller for automatically controlling the substrate inspection apparatus according to the input standard inspection condition.

The controller may control at least one of a substrate type, a light source type, a light source mode (converged light or scattered light), a light source color, an illumination position, an illumination angle, a substrate stage position, a substrate stage angle, a camera position, and a camera angle. have.

It does not need to find the optimum angle of incidence or inspection angle of light by adjusting lighting unit or substrate stage according to each substrate type (inspection layer, etc.). There is an effect that can secure the image of the substrate taken under the optimal inspection conditions.

In addition, the statistical information of the inspection conditions can be formed through such a configuration, and by selecting the inspection conditions based on the statistical information, the occurrence frequency of defects according to the inspection range of the substrate can be grasped. In addition, since the inspection range can be limited at an appropriate level with respect to the identified inspection range, inspection time and inspection manpower can be reduced.

In addition, by the configuration of controlling the substrate inspection device remotely from the outside of the clean room, there is an effect that the introduction of foreign matters or occurrence phenomenon by the inspector at the source.

The technical effects of the present invention are not limited to the above-mentioned effects, and other technical effects not mentioned will be clearly understood by those skilled in the art from the following description.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present embodiment is not limited to the embodiments disclosed below, but can be implemented in various forms, and only this embodiment makes the disclosure of the present invention complete, and the scope of the invention to those skilled in the art. It is provided for complete information. Shapes of the elements in the drawings may be exaggerated parts for a more clear description, elements denoted by the same reference numerals in the drawings means the same element.

1 is a schematic configuration diagram of a substrate inspection system according to the present embodiment.

As shown in FIG. 1, the substrate inspection system according to the present embodiment includes a main body 100, a main lighting unit 200, a substrate stage unit 300, a rear lighting unit 400, a camera unit 500, and a clean room. 600, a data storage unit 700, and a remote inspection unit 800.

Hereinafter, the term substrate inspection apparatus is used as a concept including a main body 100, a main lighting unit 200, a substrate stage unit 300, a rear lighting unit 400, and a camera unit 500.

The main body 100 may be provided in a frame structure, and the lighting unit 200 may be installed inside.

The main lighting unit 200 includes a light source unit 210, a reflection unit 220, a light collecting unit 230, a scattering unit 240, and an illumination unit driving unit 250. The light source unit 210 generates light irradiated onto the substrate S. The reflector 220 reflects the light emitted from the light source 210 to the light condenser 230. The condenser 230 serves to focus light reflected through the reflector 220. The scattering unit 240 serves to scatter or pass the light focused through the condenser 230 depending on whether power is applied. The scattering unit 240 may include a liquid crystal scattering plate, and may be switched to a transparent and opaque state according to whether a voltage is applied. Accordingly, the light passing through the liquid crystal scattering plate can be converted into scattered light or convergent light.

The light source unit 210 may adjust the irradiation angle of light by the light source unit driver 213. Inside the light source unit 210, color filters of various colors may be embedded. Accordingly, by placing a color filter of the color required for the inspection of a specific layer in the light source it can be irradiated with a light of a specific color. In addition, the brightness of the light source may be adjusted to implement illuminance for inspection of a specific layer.

The light source unit 210 may include a first light source unit 211 and a second light source unit 212. A metal halide lamp may be used for the first light source unit 211, and a sodium lamp may be used for the second light source unit 212.

 In addition, the reflector 220 may adjust the reflection angle by the reflector driver 221. In addition, the light collecting unit 230 and the scattering unit 240 is adjustable in angle by the light collecting unit driver 231.

In addition, the lighting unit driver 250 may move the lighting unit in the front and rear direction or adjust the angle as a whole.

The configuration of the lighting unit driver 250 as described above is just one example and is not necessarily an essential configuration, and may be added as needed and may be provided in various configurations performing the same function.

The substrate stage unit 300 includes a substrate stage 310 and a substrate stage driver 320. The substrate stage 310 may have a substrate S positioned on an upper surface thereof, and may allow the substrate S to slide parallel to the substrate surface. The substrate stage driver 320 may be provided to rotate the substrate stage 310, and may be provided to be movable in the front, rear, left, and right directions with respect to the bottom surface. That is, the substrate stage 310 is movable in the X-axis and Y-axis directions with respect to the bottom of the main body, and can be lifted in the Z-axis direction. In addition, it may be provided to be able to rotate in the X-axis direction (θX) and Z-axis direction (θZ).

The rear lighting unit 400 is located at the rear of the substrate stage unit 300 and serves to irradiate the transmitted light from the rear of the substrate. The rear light source unit 410 is a portion that generates the transmission light from the rear with respect to the substrate, and the rear light unit driving unit 420 moves the rear light source unit 410 back and forth so as to change the distance between the rear light source unit 410 and the substrate. Retreat.

The camera unit 500 includes a camera 510, a camera support 520, and an auxiliary light 530. The camera 510 may photograph the specific portion of the substrate S at a high magnification so that the inspector may enlarge the view.

The camera support unit 520 may be provided to support the camera 510 to be moved forward, backward, leftward, or leftward with respect to the bottom surface. In addition, the multi-joint may be provided so that the image can be taken at various angles with respect to the substrate (S).

Since the defect may be repeatedly positioned at a specific position of the substrate depending on the type of the defect, the camera 510 may be positioned to capture an image at a specific position in the inspection step of the specific layer by setting.

Auxiliary light 530 may be used as a general three-wavelength fluorescent lamp to replace the function that the inspector illuminates the existing handy light in the case of proximity inspection.

This configuration has the advantage of observing the substrate from various angles, similar to the case in which the inspector directly inspects the substrate. Thus, there is an advantageous effect in the detection of defects found only at certain positions and angles.

The substrate inspection apparatus is located inside the clean room 600. The inspector may control the substrate inspection apparatus remotely from the outside of the clean room 600. When the inspector inspects the substrate in the clean room, foreign matter may be introduced or generated by the inspector. However, through the above configuration, there is an effect of preventing the introduction or occurrence of foreign substances by the inspector.

The data storage unit 700 may include an inspection condition storage unit 701 and an image storage unit 703. In fact, the inspection condition is stored so that the image is taken under conditions similar to the environment in which the inspector inspects the substrate. Inspection conditions include: 1) type of substrate (inspection layer, etc.), 2) type of light source, mode (converged light or scattered light) or color to be used for the main inspection or subsidiary inspection, depending on the type of substrate and the inspection object layer, 3 4) Appropriate angle of incidence according to substrate type (inspection layer, etc.) 4) Appropriate angle or position of substrate stage in accordance with substrate type (inspection layer, etc.) Camera position and angle.

layer Main inspection Secondary inspection Type of light source mode color Type of light source mode color Glass plate Metal halides Convergence White Transparent electrode Metal halides Convergence
or scattered light White Backlight BM
(Black Matrix) Metal halides Convergence White Backlight Red salt Scattered light Metal halides Convergence White,
green Backlight Green Metal halides Convergence White
green salt Scattered light Backlight Blue
Metal halides Convergence White
green salt Scattered light Backlight OC
(Overcoating) salt Scattered light Metal halides Convergence White,
green Backlight CS General fluorescent lamp Final inspection before return to substrate bonding process salt Scattered light Metal halides Convergence White,
green Backlight
General fluorescent lamp

Table 1 is a table showing suitable lighting conditions according to the layer of the substrate.

As shown in Table 1, it can be seen that a relatively suitable condition for detecting a defect of a substrate differs depending on whether the substrate is a layer type, a main inspection, or a secondary inspection. Accordingly, it is preferable to set the type, mode and color of the required light source differently.

Specifically, in the case of inspecting the black matrix (BM) layer, the inspection may be performed while changing the position or angle of the light source 210 or the reflector 220. In addition, the inspection may be performed while rotating the substrate stage 310 in the vertical direction or moving in the horizontal direction. Accordingly, the conditions of various incident angles and inspection angles can be realized, and the substrate image can be observed under these various conditions. The inspection angle refers to the angle formed by the light reflected from the substrate surface and the inspector's eye when the inspector inspects with the naked eye. In the case of the BM layer, since the range of the incident angle and the inspection angle of light is wide, rotating the reflector may be advantageous to the inspection speed. In the case of the BM layer, the inspection is often performed when the light reflected by the substrate is not close to the eye (relatively dark light). In addition, spots can be inspected at a relatively wide range of angles.

In the case of inspecting the RGB layer, the entire surface of the substrate may be divided into three stages of top, bottom, top and bottom. In this case, the substrate stage can be inspected while moving in the vertical direction or in the horizontal direction. In the case of the RGB layer, inspection is often performed when the reflected light is close to the eye (relatively bright light). In addition, defects can be inspected while maintaining relatively the same angle. In other words, the same incident angle and inspection angle are maintained with respect to the entire surface of the substrate. Therefore, it is preferable to slide the substrate stage 310 up and down.

When examining the CS (column space) layer, an auxiliary light (flashlight) can be used. At this time, it is desirable for the inspector to inspect the substrate in close proximity. The diffused light of the metal halide lamp is used to enter the substrate at a high angle, and the inspection angle is maintained almost perpendicular to the substrate. That is, it can be seen that the proper incidence angle and inspection angle exist in a narrow range.

Inspector information input may include the name, age, physical condition (height or vision) of the examiner, because there are individual differences in the defect detection method of the substrate, and subjective or objective inspection conditions may be different.

That is, when the inspector visually inspects the substrate, the angle of incidence of the light on the substrate and the reflection angle toward the eye of the inspector (inspection angle) vary according to the angle of the illumination unit and the substrate stage unit and the height of the inspector. In this case, if the body information of the inspector is input, the position / angle of the corresponding camera unit, the lighting unit, and the position / angle of the substrate stage unit can be controlled, thereby obtaining a substrate image similar to visual inspection.

In addition, the image storage unit 703 may store an image of the substrate photographed by the camera 510.

The remote inspection unit 800 includes a test image display unit 801 and an inspector interface 802. The inspection image display unit 801 corresponds to a display unit on which an image of a substrate photographed by the camera 510 is displayed. The inspector may enter an inspection condition through the inspector interface 802. The remote inspection unit 800 is located outside the clean room, thereby preventing the introduction or occurrence of foreign substances by the inspector.

2 is a configuration diagram schematically showing a configuration of a control unit of a remote board inspection system according to the present embodiment.

As shown in FIG. 2, the control unit 900 automatically controls the inspection environment according to the inspection conditions set and stored in the data storage unit 700. The control target includes 1) operation of the first light source unit 211 or the second light source unit 212, color and angle control, 2) angle control of the reflector 220, 3) voltage on the liquid crystal scattering plate of the scattering unit 240. Control whether it is applied (scattering mode or convergence mode), 4) control of the forward and backward movement distance or angle of the lighting unit driver 250 (this configuration may be unnecessary depending on various embodiments), 5) substrate stage 310 Control of the vertical, horizontal, left and right sliding distance of the substrate S, 6) the angle control of the substrate S and the position control of the substrate S by the substrate stage driver 320 (moves back and forth, left and right directions relative to the bottom of the body) ), 7) operation control and rearward position control of the rear lighting unit 400, 8) operation control of the camera 510, 9) front / left / right position control of the camera support 520 and position / of the camera 510 Angle control, 10) control of display of photographed images through the inspection image display unit 801 and the inspector interface 802; It may include.

The data storage unit 700 may include an inspection condition storage unit 701 and an image storage unit 703.

3 is a flowchart showing a substrate inspection method according to the present embodiment.

As shown in Figure 3, it is first determined whether to proceed with the standardization test conditions (S01). If the test condition is to be standardized, the inspector may select it through the inspector interface 802.

When the inspector selects the standardization of the inspection conditions, the inspector can manually control the substrate inspection apparatus (S03), and the state in which the defect of the substrate is easily formed is formed. In this case, there may be a method in which the inspector manually inputs control information in the inspector interface 802. In addition, the substrate inspection apparatus may be operated by operating a joystick or the like of the inspector interface 802 in real time while the inspector views the substrate image appearing on the inspection image display unit 801.

In this state, the inspector may photograph an image of the substrate and display the image of the substrate on the inspection image display unit 801 (S05).

In operation S07, a determination may be made as to whether there is a defect in the displayed substrate range. It is possible to determine whether there is a defect while viewing the screen displayed in real time.

If it is determined that there is a defect, information about the inspection condition at that time may be stored in the inspection condition storage unit 701 (S09). The photographed substrate image may be stored (S11), which may be stored in the image storage unit 703. If there is no defect, the process may proceed to step S15 to perform another kind of inspection.

Inspection conditions that can be stored include: 1) the type of substrate (inspection layer, etc.), 2) the type of light source to be used for the main or secondary inspection, and mode (converged light or Scattered light) or color, 3) the predetermined angle of incidence according to the type of substrate (inspection layer, etc.), 4) the angle or position of the predetermined substrate stage in accordance with the type of substrate (inspection layer, etc.), 5) the type of substrate ( The position and angle of a predetermined camera according to the inspection target layer).

Next, the inspector inputs the type of the substrate, the type of the defect, or the position of the defect (S13).

Next, a step S15 of determining whether an inspection is required for another inspection range is performed. If the inspector determines that it is necessary, the process proceeds to step S03. If the inspector determines that it is not necessary, the process proceeds to step S17 of calculating statistical information and standardizing the inspection condition. The step S17 will be described in detail with reference to FIG. 4. If the step S17 is passed, the procedure may be terminated.

On the other hand, if the standardization of the inspection conditions has already been carried out in step S01 select not to proceed to the standardization step, and if a plurality of existing standardized inspection conditions are stored may select a particular standard inspection condition from among them (S51) .

In addition, the substrate inspection apparatus may be automatically controlled according to the selected inspection condition (S53). Accordingly, the substrate image may be displayed in real time through the inspection image display unit 801, or the substrate image may be continuously photographed with respect to the plurality of areas, stored in the image storage unit 703, and subsequently displayed at once. S55).

Conventionally, the inspection was performed by finding the optimum angle of incidence or inspection angle of the light while adjusting the illumination unit or the substrate stage according to the type of the substrate (inspection layer, etc.), but inputting one inspection condition through the above configuration. And through the storage there is an effect that can automatically secure the substrate image taken under the optimum inspection conditions.

Then, the substrate is inspected for defects while viewing the displayed substrate image (S57). If a defect is found, the inspector inputs a defect, and the inspection condition at this time may be stored (S59), and the substrate image at this time may be stored (S61).

In addition, the inspector may input and store the type or location of the defect (S63). Through the inputted information, the statistical information and the standardized information created in step S17 may be updated (S65). If the type of defect or the location of the defect is found to be more concentrated in a specific position, the inspection condition standardization information can be corrected / supplemented to reflect the data in the statistical information so that the position can be concentrated. Alternatively, the imaging range may be changed if the frequency of defects on the outer portion of the imaging area increases.

After the step S65, a step of selecting whether to perform another inspection may be performed (S67). If you choose to check, you can proceed to step S51. If there is nothing to check, the procedure is terminated. Alternatively, before or after step S67, the inspector may select whether to perform a manual inspection. This is to investigate in detail the defective part of the board which is not detected properly under the preset inspection condition. Through such a configuration, it is possible to increase the probability of defect detection.

 4 is a flowchart showing the progress of the inspection condition standardization step based on the statistical information.

5 is a diagram illustrating a process of determining a substrate inspection range based on statistical information when a specific substrate type is selected.

6 is a diagram illustrating a process of determining a standard inspection condition of a substrate inspection apparatus based on statistical information when a substrate inspection range is determined.

As shown in Fig. 4, the steps of normalizing the three conditions such as 1) substrate type, 2) defect type, and 3) defect location are shown.

Regardless of these three conditions, whenever a defect is found, statistical data on stored test conditions can be accumulated, and these accumulated statistics can be used as a standard test condition.

In other words, the information stored when a defect is found is the type of board, the type of defect, the location of the defect, the inspection conditions, etc. Among these information, the inspection conditions that are frequently duplicated are listed in order, and the inspection conditions of an appropriate level or more are standard inspection conditions. You can also decide.

For three conditions, such as 1) substrate type, 2) defect type, and 3) defect location, only the specific substrate type (for example, BM (Black Matrix) layer) is selected, and the defect location or defect type is not selected. Explain the case.

As shown in Figure 5, the table of (a) is the horizontal and vertical display of the substrate in the X-axis and Y-axis and each cell may be an area photographed by the camera. Each cell may represent a location of the substrate. The numerical value written in each cell is a statistical value of defect counts found through steps S01 to S15 for the selected substrate type.

Substrate inspection by camera photography may be uniformly performed on all the areas of a board | substrate. However, limiting the inspection range to exclude the statistically negligible possibility can significantly reduce the inspection range and significantly increase the inspection efficiency.

The area indicated by A in (c) is the appropriate determination of the standard deviation σ for the number of defects, and the range according to the standard deviation σ on the standard distribution for the number of defects.

As shown in Figure 6, (a) shows the selection frequency for the angle of the illumination unit and the camera selected by the inspector when a defect is found for a particular cell in the inspection range A region. For each statistic, the standard deviation σ for the selection frequency is appropriately determined, and the range according to the standard deviation σ on the standard distribution for the selection frequency is indicated by B and C in (c). Standard inspection conditions can be determined with the most appropriate values in the range of B, C, etc., or standard inspection conditions can be determined by selecting several angles.

For example, the angle of the illumination unit and the camera is shown, and the standard inspection conditions can be determined by similarly approaching the angle of the substrate stage, the type or mode of the light source, and the position of the camera.

As a result, a standard lighting condition, a standard camera condition, a standard substrate stage condition, etc. for a specific substrate type may be allocated and stored for each cell of the table of FIG. 5, and these may be gathered into one standard inspection condition.

1 is a schematic configuration diagram of a remote board inspection system according to the present embodiment.

2 is a configuration diagram schematically showing a configuration of a control unit of a remote board inspection system according to the present embodiment.

3 is a flowchart showing a substrate inspection method according to the present embodiment.

4 is a flowchart showing the progress of the inspection condition standardization step based on the statistical information.

5 is a diagram illustrating a process of determining a substrate inspection range based on statistical information when a specific substrate type is selected.

6 is a diagram illustrating a process of determining a standard inspection condition of a substrate inspection apparatus based on statistical information when a substrate inspection range is determined.

Claims (25)

(a) the main body,    A substrate stage unit located inside the main body and capable of adjusting an angle of a liquid crystal display substrate loaded on an upper surface thereof;    An illumination unit including a light source unit capable of selecting at least one of a plurality of light sources with respect to the liquid crystal display substrate loaded on the substrate stage unit;    An illumination unit driver for adjusting a position of the illumination unit with respect to a liquid crystal display substrate or an angle of light irradiated by the illumination unit;    A camera unit including a camera for securing an image of the liquid crystal display substrate loaded on the substrate stage unit, and a camera support for adjusting a position or angle of the camera; Providing an inspection apparatus for a liquid crystal display substrate including a data storage unit for storing an image and an inspection condition secured by the camera unit; (b) inspecting the liquid crystal display substrate by controlling the inspection apparatus for the liquid crystal display substrate; (c) storing the inspection conditions of the inspection apparatus for the liquid crystal display substrate in step (b); (d) automatically controlling the inspection apparatus for the liquid crystal display substrate according to the stored inspection conditions to inspect another liquid crystal display substrate; And said inspection conditions include a kind of liquid crystal display substrate, a kind of said light source, an angle of said light source and a liquid crystal display substrate, and an angle of said camera and a liquid crystal display substrate. The method of claim 1, The liquid crystal display substrate may include at least one of a glass plate, a black matrix (BM) layer, a red, green, blue (RGB) layer, and a column space (CS) layer. The method of claim 1, The type of the light source may include at least one of a metal halide lamp, a sodium lamp, and a fluorescent lamp. The method of claim 1, The light source unit includes a color filter to irradiate light of a plurality of colors, and the inspection condition comprises a color of light irradiated by the light source unit. The method of claim 1, The lighting unit includes a condenser for focusing light to irradiate converging light and a scattering part for scattering light to irradiate scattered light, and the inspection condition is a mode to be used among converged light and scattered light irradiated by the lighting unit. Method of inspecting a liquid crystal display substrate comprising information on. The method of claim 1, The inspection apparatus for a liquid crystal display substrate further includes a rear lighting unit to irradiate light from a rear surface of the liquid crystal display substrate loaded on the substrate stage unit, and the inspection condition further includes information on whether the rear lighting unit is used. Inspection method of a liquid crystal display substrate. The method of claim 1, The step (c) further includes the step of storing the information on the defect found in the step (b), wherein the information on the defect includes the type of defect or the location of the defect. The method of claim 7, wherein Calculating statistical information on the inspection condition or the defect on the basis of the stored inspection condition or the information on the defect, wherein the statistical information includes at least one of a type, a defect position, and a defect type of the liquid crystal display substrate; Method of inspecting a liquid crystal display substrate comprising a frequency of defect generation for. The method of claim 8, The statistical information includes a selection frequency for the inspection condition, and further comprising the step of setting a standard inspection condition based on the selection frequency for the inspection condition. The method of claim 8, And inputting an inspection range of the liquid crystal display substrate based on the defect occurrence frequency. The method of claim 10, The step of inputting an inspection range of the liquid crystal display substrate may include setting a specific standard deviation on a standard distribution of the frequency of occurrence of defects for at least one of the defect position, the type of liquid crystal display substrate, and the type of defect, and the set standard deviation. And selecting a range determined according to the inspection range. The method of claim 10, And setting a standard inspection condition based on a selection frequency for an inspection condition corresponding to the input inspection range. The method of claim 9 or 12, And setting the standard inspection condition comprises setting an average value as a standard inspection condition on a standard distribution of a selection frequency for the inspection condition. The method of claim 9 or 12, The setting of the standard inspection condition may include setting a specific standard deviation on a standard distribution of the selection frequency for the inspection condition, and selecting at least one standard inspection condition from a range of inspection conditions determined according to the set standard deviation. Inspection method of a liquid crystal display substrate comprising the step. The method of claim 9 or 12, And automatically storing the inspection condition or defect information when a defect of the liquid crystal display substrate is found by automatically controlling the inspection apparatus for the liquid crystal display substrate according to the set standard inspection condition. The method of claim 15, And updating the statistical information to reflect the additionally stored inspection condition or defect information. The method of claim 15, And after the additionally storing the inspection condition or the defect information, asking whether to perform an additional substrate inspection by manual control. The method of claim 17, And storing additional inspection conditions or additional defect information when a defect is found through the liquid crystal display substrate inspection apparatus which is manually controlled when the additional substrate inspection by the manual control is performed. Inspection method. delete delete delete delete delete delete delete

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