KR101145152B1 - Probe for ultrasonic diagnostic apparatus and manufacturing method thereof - Google Patents

Probe for ultrasonic diagnostic apparatus and manufacturing method thereof Download PDF

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Publication number
KR101145152B1
KR101145152B1 KR1020090103771A KR20090103771A KR101145152B1 KR 101145152 B1 KR101145152 B1 KR 101145152B1 KR 1020090103771 A KR1020090103771 A KR 1020090103771A KR 20090103771 A KR20090103771 A KR 20090103771A KR 101145152 B1 KR101145152 B1 KR 101145152B1
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KR
South Korea
Prior art keywords
piezoelectric body
acoustic matching
matching layer
connector
connection part
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KR1020090103771A
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Korean (ko)
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KR20110047019A (en
Inventor
이성재
박정림
김재익
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삼성메디슨 주식회사
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    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/42Details of probe positioning or probe attachment to the patient
    • A61B8/4272Details of probe positioning or probe attachment to the patient involving the acoustic interface between the transducer and the tissue
    • A61B8/4281Details of probe positioning or probe attachment to the patient involving the acoustic interface between the transducer and the tissue characterised by sound-transmitting media or devices for coupling the transducer to the tissue
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezo-electric effect or with electrostriction
    • B06B1/0607Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezo-electric effect or with electrostriction using multiple elements
    • B06B1/0622Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezo-electric effect or with electrostriction using multiple elements on one surface
    • GPHYSICS
    • G10MUSICAL INSTRUMENTS; ACOUSTICS
    • G10KSOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/004Mounting transducers, e.g. provided with mechanical moving or orienting device
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49005Acoustic transducer

Abstract

Disclosed are a probe for an ultrasonic diagnostic apparatus and a method of manufacturing the same. The disclosed invention comprises: an acoustic matching layer having a mounting groove; A piezoelectric body mounted on the mounting groove; A first connection part interconnected with the acoustic matching layer; And a second connection portion interconnected with the piezoelectric body.
According to the present invention, the connecting operation of the piezoelectric body and the first and second connectors can be performed quickly and easily in one bonding operation, so that the manufacturing time is reduced and the manufacturing is easy.
Figure R1020090103771
Ultrasound, Probe, PC

Description

Probe for ultrasonic diagnostic apparatus and manufacturing method thereof {PROBE FOR ULTRASONIC DIAGNOSTIC APPARATUS AND MANUFACTURING METHOD THEREOF}

The present invention relates to a probe, and more particularly, to a probe for an ultrasound diagnostic apparatus for generating an image inside an object using ultrasound and a method of manufacturing the same.

The ultrasonic diagnostic apparatus is a device that irradiates an ultrasonic signal from a body surface of a subject toward a desired part of the body, and acquires an image of soft tissue tomography or blood flow in a non-invasive manner using the information of the reflected ultrasonic signal (ultrasound echo signal). . Compared with other imaging devices such as X-ray diagnostics, computerized tomography scanners, magnetic resonance images (MRIs) and nuclear medical diagnostics, these devices are compact, inexpensive, real-time displayable, and X-ray There is no exposure to the back and has a high safety advantage, it is widely used for the diagnosis of heart, abdomen, urinary and obstetrics and gynecology.

In particular, the ultrasound diagnosis apparatus includes a probe for transmitting an ultrasound signal to the object to obtain an ultrasound image of the object, and for receiving an ultrasound echo signal reflected from the object.

The probe may include a transducer, a case having an open top, a cover coupled to the top of the open case and in direct contact with the surface of the object.

The transducer may include a piezoelectric layer that converts an electrical signal and an acoustic signal while the piezoelectric material is vibrated, and an acoustic that reduces a difference in acoustic impedance between the piezoelectric layer and the object so that ultrasonic waves generated in the piezoelectric layer may be transmitted to the object as much as possible. A matching layer, a lens layer for focusing the ultrasonic waves traveling in front of the piezoelectric layer at a specific point, and a sound absorbing layer for preventing the ultrasonic waves from traveling to the rear of the piezoelectric layer to prevent image distortion.

The piezoelectric layer includes a piezoelectric body and an electrode, and the electrodes are provided at the top and bottom of the piezoelectric body, respectively. And a printed circuit board (PCB) is bonded to the piezoelectric layer. In the printed circuit board, a wiring electrode connected to the electrode of the piezoelectric body is formed to serve as a signal transmission of the piezoelectric body. The printed circuit board and the piezoelectric layer are connected to each other by connecting the wiring electrode of the printed circuit board and the electrode of the piezoelectric layer.

According to the probe as described above, the connection work for connecting the wiring electrode of the printed circuit board and the electrode of the piezoelectric layer takes a lot of hands, thereby increasing the manufacturing time, and the connection work is performed by hand, so that the durability There is a problem that the performance is degraded due to nonuniformity. Therefore, there is a need for improvement.

The present invention has been made to improve the above problems, and is easy to manufacture and improved probe structure for ultrasonic diagnostic apparatus to prevent performance degradation due to poor bonding between the piezoelectric layer and the printed circuit board and its manufacturing method. The purpose is to provide.

Probe for ultrasonic diagnostic apparatus according to an aspect of the present invention comprises: an acoustic matching layer having a mounting groove; A piezoelectric body mounted on the mounting groove; A first connection part interconnected with the acoustic matching layer; And a second connection part interconnected with the piezoelectric body.

The mounting groove may include a contact portion formed in parallel with the piezoelectric body and in contact with the piezoelectric body; And an extension part extending from the contact part toward the first connection part and interconnected with the first connection part.

Further, the first connection portion is preferably interconnected only with the extension portion.

In addition, the first connection portion is interconnected only with the extension portion, and the second connection portion is preferably disposed in contact with the other side of the piezoelectric material in contact with the acoustic matching layer.

In addition, the first connector is preferably disposed so as not to overlap with the piezoelectric body.

In addition, the mounting groove is preferably formed in a "c" shape.

The first connector may be interconnected with the acoustic matching layer, and the second connector may be interconnected with the piezoelectric body.

In addition, the first connector and the second connector is preferably a flexible printed circuit board (flexible printed circuit board).

In addition, according to another aspect of the present invention, a method of manufacturing a probe for an ultrasound diagnostic apparatus includes: stacking a first connector on a second connector; Stacking a piezoelectric part on a second connection part positioned between the first connection part among the second connection parts; Stacking an acoustic matching layer on the piezoelectric body and the first connection portion such that the piezoelectric material is inserted into the mounting groove; And interconnecting the piezoelectric body and the second connection part, the piezoelectric material and the acoustic matching layer, and the acoustic matching layer and the first connection part in one bonding operation.

Further, in the step of interconnecting in one bonding operation, it is preferable that the first connecting portion be interconnected only with the acoustic matching layer.

According to the probe for an ultrasonic diagnostic apparatus of the present invention and a method of manufacturing the same, elements such as soldering or welding can be removed, and the connecting operation of the piezoelectric body and the first and second connectors can be performed quickly and easily in one bonding operation. Can reduce manufacturing time and facilitate manufacturing.

In addition, the present invention has a structure that can be connected to the piezoelectric body and the first and second connection portion in a state where the position of the first and second connection portion is stably positioned, thereby improving the durability and uniformity of the connection site As a result, performance degradation due to a poor bonding between the piezoelectric body and the first and second connectors may be prevented.

Further, in the present invention, since the first connecting portion is not directly installed on the piezoelectric body and is connected through the acoustic matching layer, the first connecting portion is not disposed between the sound absorbing layer and the piezoelectric body, thereby improving the performance of the piezoelectric body and reducing the impedance influence. In addition, it is possible to reduce the length of the first connection portion to reduce the manufacturing cost.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of a probe for an ultrasound diagnostic apparatus according to the present invention and a method of manufacturing the same. For convenience of explanation, the thicknesses of the lines and the sizes of the components shown in the drawings may be exaggerated for clarity and convenience of explanation. In addition, the terms described below are defined in consideration of the functions of the present invention, which may vary depending on the intention or custom of the user, the operator. Therefore, the definitions of these terms should be made based on the contents throughout the specification.

1 is a perspective view showing the configuration of an ultrasonic diagnostic probe according to an embodiment of the present invention, Figure 2 is an exploded perspective view showing the configuration of the ultrasonic diagnostic probe shown in Figure 1, Figure 3 is in Figure 1 Sectional view showing the configuration of the probe for the ultrasonic diagnostic apparatus shown.

1 to 3, the ultrasound diagnostic probe 100 according to an embodiment of the present invention includes a sound absorbing layer 110, a piezoelectric body 120, an acoustic matching layer 130, and a first connection part. 140 and the second connector 150.

The sound absorbing layer 110 is disposed behind the piezoelectric body 120. The sound absorbing layer 110 reduces the pulse width of the ultrasonic wave by suppressing free vibration of the piezoelectric body 120 and prevents the ultrasonic wave from propagating unnecessarily to the rear of the piezoelectric layer to prevent image distortion. The sound absorbing layer 110 may be formed of a material including a rubber to which an epoxy resin, tungsten powder, or the like is added.

The piezoelectric body 120 is disposed in front of the suction layer 110. The piezoelectric body 120 generates an ultrasonic wave using a resonance phenomenon, and a PZNT single crystal made of a solid solution of lead zirconate titanate (PZT) ceramic, zinc niobate and lead titanate, and PZMT single crystal made of a solid solution of magnesium niobate and lead titanate Or the like.

An electrode (not shown) is formed on the piezoelectric body 120 as described above. According to the present embodiment, the electrodes are formed on one side and the other side of the piezoelectric body 120, that is, the front and the rear of the piezoelectric body 120, respectively. Such an electrode may be formed of a highly conductive metal such as gold, silver or copper.

As described above, any one of the electrodes formed on one side and the other side of the piezoelectric body 120 corresponds to the positive electrode (or signal electrode) of the piezoelectric body 120 and the other corresponds to the negative electrode (or ground electrode) of the piezoelectric body 120. do. The electrode is formed so that the anode and the cathode are separated from each other. In the present exemplary embodiment, the electrode formed on one side of the piezoelectric body 120 is a negative electrode, and the electrode formed on the other side of the piezoelectric body 120 corresponds to a positive electrode.

The acoustic matching layer 130 is disposed in front of the sound absorbing layer 110. The acoustic matching layer 130 matches the acoustic impedance of the piezoelectric body and the acoustic impedance of the object so that an ultrasonic signal generated from the piezoelectric body 120 is efficiently transmitted to the object. The piezoelectric body 120 ) Is provided to have an intermediate value between the acoustic impedance of the object and the acoustic impedance of the object. The acoustic matching layer 130 may be formed of glass or resin material.

In the present exemplary embodiment, the acoustic matching layer 130 includes a first acoustic matching layer 132 and a second acoustic matching layer 134 having different materials so that the acoustic impedance varies from the piezoelectric body 120 toward the object. Illustrated as

The acoustic matching layer 130 includes a mounting groove 135. In the present embodiment, the mounting groove 135 is illustrated as being formed in the second acoustic matching layer 134. The mounting groove 135 is formed in a shape of “c” opened toward the sound absorbing layer 110. According to the present embodiment, the piezoelectric body 120 is mounted on the mounting groove 135. The mounting groove 135 includes a contact portion 136 and an extension 138.

The contact portion 136 is formed in parallel with the piezoelectric body 120 to be in contact with the piezoelectric body 120. The contact part 136 is disposed in front of the piezoelectric body 120 to be in contact with one side of the piezoelectric body 120.

The extension part 138 extends from the contact part 136 toward the first connection part 140. According to the present embodiment, the extension part 138 extends from both ends of the contact part 136 toward the first connection part 140. The extension part 138 is disposed on the side of the piezoelectric body 120 and is spaced apart from the piezoelectric body 120.

The mounting groove 135 including the contact portion 136 and the extension 138 as described above forms a "c" shape which is opened toward the sound absorbing layer 110, and the piezoelectric body 120 mounted on the mounting groove 135. ) Is surrounded by the upper portion and both sides, that is, three sides by the contact portion 136 and the extension portion 138.

The acoustic matching layer 130 is electrically connected to the piezoelectric body 120 by being interconnected with the piezoelectric body 120.

As an example, the acoustic matching layer 130 includes an electrode (not shown). Preferably, the electrode is formed in the second acoustic matching layer 134, and more specifically formed in the mounting groove 135, of the mounting groove 135 including the contact portion 136 and the extension 138 It is formed throughout.

As described above, the electrodes formed on the acoustic matching layer 130 are electrically connected to the electrodes formed on one side of the piezoelectric body 120. Accordingly, the acoustic matching layer 130 is connected to the piezoelectric body 120 via electrodes electrically connected to each other. Interconnected with Such an electrode is formed of a highly conductive metal such as gold, silver or copper and may be formed by a method such as deposition, sputtering, plating or spraying.

As another example, the acoustic matching layer 130 is directly connected to the piezoelectric body 120. That is, the acoustic matching layer 130 is formed of a conductive material such as gold, silver, or copper and is electrically connected directly to the piezoelectric body 120.

The acoustic matching layer 130 is electrically connected to an electrode formed on one side of the piezoelectric body 120, and thus the acoustic matching layer 130 is interconnected with the piezoelectric body 120.

The acoustic matching layer 130 formed of the conductive material as described above may be manufactured such that the whole including the first acoustic matching layer 132 and the second acoustic matching layer 134 is formed of a conductive material, or the piezoelectric body 120. Only the second acoustic matching layer 134, which is connected to the second acoustic matching layer 134, may be formed of a conductive material. As described above, the acoustic matching layer 130 made of a conductive material may be electrically connected to an electrode formed on one side of the piezoelectric body 120, even if the electrode is not formed separately.

The first connector 140 is interconnected with the acoustic matching layer 130. In the present embodiment, the first connector 140 is illustrated as being a flexible printed circuit board (FPCB), but the present invention is not limited thereto. The first connection unit 140 of the present invention may include any configuration capable of supplying other signals or electricity, including a printed circuit board (PCB).

A wiring electrode (not shown) is formed in the first connector 140. The wiring electrode is formed on a surface in contact with the acoustic matching layer 130 and electrically connected to the acoustic matching layer 130.

The first connectors 140 are disposed at both sides of the acoustic matching layer 130 where the extension 138 is located. Each of the first connectors 140 is in contact with the extension 138 in a form inserted into a space between the extension 138 and the sound absorbing layer 110.

As such, each of the first connectors 140 in contact with the extension part 138 is interconnected with the extension part 138 via a wiring electrode electrically connected to the extension part 138.

According to the present exemplary embodiment, the first connector 140 is disposed so as not to overlap the piezoelectric body 120 and is only interconnected with the extension 138. Here, the interconnection of the first connector 140 only with the extension 138 means that the first connector 140 is interconnected with the extension 138 to be interconnected only with the acoustic matching layer 130. However, this does not mean that the first connector 140 is not interconnected with another portion of the acoustic matching layer 130, for example, the contact unit 136.

The first connector 140 is interconnected with the acoustic matching layer 130 through the extension 138, and is interconnected with only one side of the piezoelectric body 120 through the contact 136 of the acoustic matching layer 130. The other side of the piezoelectric body 120 is not interconnected.

The second connector 150 is interconnected with the piezoelectric body 120. In the present embodiment, the second connector 150 is illustrated as being a flexible printed circuit board (FPCB), but the present invention is not limited thereto. The second connector 150 of the present invention may include any configuration capable of supplying other signals or electricity, including a printed circuit board (PCB).

A wiring electrode (not shown) is formed on the second connector 150. The wiring electrode is formed on a surface in contact with the other side of the piezoelectric body 120 to be electrically connected to the electrode formed on the other side of the piezoelectric body 120.

According to the present exemplary embodiment, the second connector 150 is stacked in front of the sound absorbing layer 110 and disposed in contact with the other side of the piezoelectric body 120. The second connector 150 is connected to the other side of the piezoelectric body 120 through the electrical connection between the wiring electrode and the electrode formed on the other side of the piezoelectric body 120.

On the other hand, although not shown, the ultrasonic diagnostic apparatus probe of the present embodiment may be further provided with a lens layer (not shown) disposed in front of the acoustic matching layer 130 to focus the ultrasonic signal traveling forward to a specific point. have.

 4 is a flowchart illustrating a method of manufacturing a probe for an ultrasound diagnostic apparatus, according to an exemplary embodiment.

Hereinafter, a method of manufacturing a probe for an ultrasonic diagnostic apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 to 4.

In order to manufacture the probe for the ultrasound diagnostic apparatus of the present embodiment, the first connector 140 is laminated on the second connector 150 (S10).

In this case, each of the first connectors 140 is stacked in front of the second connector 150, that is, on the side where the wiring electrode of the second connector 150 is formed, and the wiring electrodes of the second connector 150 are connected to the first connector. The stack 140 is spaced apart from each other so as to be exposed between the 140 and the first connector 140. Preferably, each of the first connectors 140 is spaced apart by a distance corresponding to the distance between the extension portion 138 and the extension portion 138 of the mounting groove 135 provided in the acoustic matching layer 130.

The first connector 140 and the second connector 150 stacked as described above are laminated on the sound absorbing layer 110. The first connector 140 and the second connector 150 may be stacked on the sound absorbing layer 110 in a stacked state, or the first connector 140 after the second connector 150 is stacked on the sound absorbing layer 110. ) May be stacked on the sound absorbing layer 110 in the form of being stacked on the second connector 150.

Then, the piezoelectric body 120 is stacked on the second connection part 150 positioned between the first connection part 140 among the second connection parts 150 (S20). That is, the piezoelectric body 120 is stacked in front of the second connector 150, and the piezoelectric body 120 is laminated on the second connector 150 exposed between the first connector 140 and the first connector 140.

Accordingly, the second connector 150 may be electrically connected to an electrode formed on one side of the piezoelectric body 120 to be interconnected with the piezoelectric body 120, and the first connector 140 is disposed not to overlap with the piezoelectric body 120. .

In addition, the acoustic matching layer 130 is stacked on the piezoelectric body 120 and the first connector 140 so that the piezoelectric body 120 is inserted into the mounting groove 135 (S30).

When the acoustic matching layer 130 is stacked on the piezoelectric body 120 and the first connection part 140, one side of the piezoelectric body 120 is in contact with the contact part 136 of the mounting groove 135, and the first connection part 140. ) Is disposed so as not to overlap with the piezoelectric body 120 to contact the extension 138 of the mounting groove 135.

Accordingly, the piezoelectric member 120 may have an electrode formed at one side thereof electrically connected to the contact portion 136 to be interconnected with the acoustic matching layer 130, and the first connection portion 140 may extend through the wiring electrode 138. ) May be electrically connected to the acoustic matching layer 130.

By the interconnection of the piezoelectric body 120 and the acoustic matching layer 130 and the interconnection of the first connector 140 and the acoustic matching layer 130, the piezoelectric body 120 may be interconnected with the first connector 140. Can be.

Then, the stacked piezoelectric body 120, the acoustic matching layer 130, the first connecting portion 140, and the second connecting portion 150, that is, one side of the piezoelectric body 120, the acoustic matching layer 130, and the piezoelectric body 120. The other side and the second connector 150, the acoustic matching layer 130 and the first connector 140 are interconnected in one bonding operation (S50). At this time, the first connection unit 140 is preferably interconnected only with the acoustic matching layer 130. Such bonding can be done using a conductive or nonconductive adhesive.

Meanwhile, in the present exemplary embodiment, the first connector 140 is laminated on the second connector 150, the piezoelectric member 120 is laminated on the second connector 150, and then the piezoelectric member 120 and the first connector 140 are laminated. Although illustrated as stacking the acoustic matching layer 130, the present invention is not necessarily to be carried out in the above-described order, the order may be changed or may be carried out at the same time.

According to the manufacturing method of the ultrasonic diagnostic apparatus probe of the present embodiment as described above, the piezoelectric layer of the wiring electrodes of the first and second connectors 140 and 150 in a state where the positions of the first and second connectors 140 and 150 are not stable. Instead of the complicated and laborious connection work of directly connecting the electrodes of the 120, the stacked piezoelectric body 120, the acoustic matching layer 130, the first connector 140 and the second connector 150 are The first and second connectors 140 and 150 can be interconnected to the piezoelectric body 120 only by a simple connecting operation of interconnecting in one bonding operation.

In the ultrasonic diagnostic apparatus probe 100 of the present embodiment, which may be manufactured according to the manufacturing method as described above, the piezoelectric member 120 and the first and second connectors 140 and 150 may be quickly connected in one bonding operation. It can be easily performed, which reduces the manufacturing time and facilitates the manufacture.

In addition, the probe for the ultrasonic diagnostic apparatus of the present embodiment may be connected to the piezoelectric member 120 and the first and second connectors 140 and 150 while the first and second connectors 140 and 150 are stably positioned. By adopting a structure to improve the durability and uniformity of the connection portion, it is possible to prevent performance degradation due to poor bonding between the piezoelectric body 120 and the first and second connection portions 140 and 150.

In addition, in the present invention, since the first connector 140 is connected directly through the acoustic matching layer 130 without being directly installed on the piezoelectric body 120, the first connector 140 is connected between the sound absorbing layer 110 and the piezoelectric body 120. By not being disposed in, the performance of the piezoelectric body 120 is improved, the impedance influence is reduced, and the length of the first connector 140 can be reduced, thereby reducing manufacturing costs.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and those skilled in the art to which the art belongs can make various modifications and other equivalent embodiments therefrom. I will understand. Therefore, the true technical protection scope of the present invention will be defined by the claims below.

1 is a perspective view showing the configuration of a probe for an ultrasonic diagnostic apparatus according to an embodiment of the present invention.

2 is an exploded perspective view showing the configuration of the probe for ultrasonic diagnostic apparatus shown in FIG.

3 is a cross-sectional view showing the configuration of the probe for ultrasonic diagnostic apparatus shown in FIG.

4 is a flowchart illustrating a method of manufacturing a probe for an ultrasound diagnostic apparatus, according to an exemplary embodiment.

Explanation of symbols on the main parts of the drawings

100: probe for ultrasonic diagnostic apparatus 110: sound absorption layer

120: piezoelectric 130: acoustic matching layer

135: mounting groove 140: first connection portion

150: second connection portion

Claims (10)

  1. An acoustic matching layer having a mounting groove;
    A piezoelectric body mounted on the mounting groove;
    A first connection part interconnected with the acoustic matching layer; And
    A second connection part interconnected with the piezoelectric body,
    The first connector is provided between the second connector and the acoustic matching layer,
    The mounting groove includes an extension part provided on at least one side of both ends, and a contact part provided inward of the mounting groove part from the extension part, wherein the piezoelectric body is coupled to the inside of the extension part of the mounting groove part. Probe for ultrasound diagnostics.
  2. The method of claim 1,
    The contact portion is formed in parallel with the piezoelectric body to contact the piezoelectric body,
    And the extension part extends from the contact part toward the first connection part to be interconnected with the first connection part.
  3. 3. The method of claim 2,
    And the first connection part is interconnected only with the extension part.
  4. 3. The method of claim 2,
    And the first connection part is interconnected only with the extension part, and the second connection part is arranged to be in contact with the other side of the piezoelectric material in contact with the acoustic matching layer.
  5. 5. The method of claim 4,
    And the first connection part is disposed so as not to overlap with the piezoelectric body.
  6. 6. The method according to any one of claims 1 to 5,
    The mounting groove portion is an ultrasound diagnostic device probe, characterized in that formed in the "c" shape.
  7. delete
  8. 6. The method according to any one of claims 1 to 5,
    And the first connector and the second connector are flexible printed circuit boards.
  9. Stacking the first connector on the second connector;
    Stacking a piezoelectric part on a second connection part positioned between the first connection part among the second connection parts;
    Stacking an acoustic matching layer on the piezoelectric body and the first connection part such that the piezoelectric material is inserted into the extension part of the mounting groove; And
    Interconnecting the piezoelectric body and the second connection part, the piezoelectric material and the acoustic matching layer, and the acoustic matching layer and the first connection part in one bonding operation,
    And the first connection part is interconnected with the acoustic matching layer.
  10. The method of claim 9, wherein the interconnecting in one bonding operation comprises:
    And the first connector is interconnected only with the acoustic matching layer.
KR1020090103771A 2009-10-29 2009-10-29 Probe for ultrasonic diagnostic apparatus and manufacturing method thereof KR101145152B1 (en)

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KR1020090103771A KR101145152B1 (en) 2009-10-29 2009-10-29 Probe for ultrasonic diagnostic apparatus and manufacturing method thereof
EP10187084.8A EP2316343B1 (en) 2009-10-29 2010-10-11 Probe for ultrasonic diagnostic apparatus and method of manufacturing the same
JP2010229963A JP5828627B2 (en) 2009-10-29 2010-10-12 Probe for ultrasonic diagnostic apparatus and manufacturing method thereof
US12/912,656 US9414809B2 (en) 2009-10-29 2010-10-26 Probe for ultrasonic diagnostic apparatus and method of manufacturing the same

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KR101354603B1 (en) 2012-01-02 2014-01-23 삼성메디슨 주식회사 Ultrasound Probe and Manufacturing Method thereof
KR101299517B1 (en) * 2012-01-04 2013-09-10 (주)엘라켐 An polymer material based flexible phased array ultrasonic transducer for ultrasonic nondestructive testing of material with uneven surface
KR101354604B1 (en) * 2012-01-16 2014-01-23 삼성메디슨 주식회사 Ultrasound Probe and Manufacturing Method thereof
KR101403905B1 (en) * 2012-01-19 2014-06-11 삼성메디슨 주식회사 Probe for ultrasonic diagnostic apparatus and method of manufacturing the same
KR101435011B1 (en) * 2012-02-20 2014-08-27 삼성메디슨 주식회사 Ultrasound Probe and Manufacturing Method thereof
KR101387176B1 (en) * 2012-02-24 2014-04-21 경북대학교 산학협력단 The method to cast the backer for 2D array ultrasonic transducers
KR20150006519A (en) * 2013-07-08 2015-01-19 삼성메디슨 주식회사 Ultrasound Probe and Manufacturing Method thereof
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US20110105906A1 (en) 2011-05-05
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US9414809B2 (en) 2016-08-16
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