KR101144587B1 - 리프트핀 홀더 - Google Patents
리프트핀 홀더 Download PDFInfo
- Publication number
- KR101144587B1 KR101144587B1 KR1020040090650A KR20040090650A KR101144587B1 KR 101144587 B1 KR101144587 B1 KR 101144587B1 KR 1020040090650 A KR1020040090650 A KR 1020040090650A KR 20040090650 A KR20040090650 A KR 20040090650A KR 101144587 B1 KR101144587 B1 KR 101144587B1
- Authority
- KR
- South Korea
- Prior art keywords
- lift pin
- susceptor
- hole
- lift
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (12)
- 기판을 지지하는 리프트 핀이 승하강하는 관통홀;상기 관통홀의 내벽에 위치하는 다수의 결합홈; 및상기 다수의 결합홈 각각에 삽입되고 상기 리프트 핀과 회전에 의해 점 접촉하는 구형의 볼;을 포함하는 리프트 핀 홀더에 있어서,상기 다수의 결합홈 각각에는 단지 하나의 상기 구형의 볼이 삽입되고, 상기 다수의 결합홈 각각의 내부는 상기 구형의 볼과 동일한 구형으로 형성되는 것을 특징으로 하는 리프트 핀 홀더.
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 제1항에 있어서,상기 다수의 결합홈은 동일 평면 상에 서로 동일한 간격으로 배치되는 것을 특징으로 하는 리프트 핀 홀더.
- 제1항에 있어서,상기 구형의 볼은 상기 다수의 삽입홈 각각에 삽입된 삽입부와 상기 관통홀의 내벽에서 돌출되는 돌출부를 포함하는 것을 특징으로 하는 리프트 핀 홀더.
- 제1항에 있어서,상기 다수의 결합홈은 서로 대칭적으로 4 개가 설치되는 것을 특징으로 하는 리프트 핀 홀더.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020040090650A KR101144587B1 (ko) | 2004-11-09 | 2004-11-09 | 리프트핀 홀더 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020040090650A KR101144587B1 (ko) | 2004-11-09 | 2004-11-09 | 리프트핀 홀더 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20060041445A KR20060041445A (ko) | 2006-05-12 |
| KR101144587B1 true KR101144587B1 (ko) | 2012-05-14 |
Family
ID=37147995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020040090650A Expired - Fee Related KR101144587B1 (ko) | 2004-11-09 | 2004-11-09 | 리프트핀 홀더 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR101144587B1 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11282738B2 (en) | 2019-12-16 | 2022-03-22 | Samsung Electronics Co., Ltd. | Lift pin module |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101332294B1 (ko) * | 2006-12-27 | 2013-11-22 | 주성엔지니어링(주) | 기판지지핀 어셈블리 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6165909A (ja) * | 1984-09-07 | 1986-04-04 | Nippon Seiko Kk | プラスチツク製リニアすべり軸受 |
| JPS6412929U (ko) | 1988-07-14 | 1989-01-24 | ||
| JP2004063865A (ja) * | 2002-07-30 | 2004-02-26 | Shin Etsu Handotai Co Ltd | サセプタ、気相成長装置およびエピタキシャルウェーハの製造方法 |
| KR20050081839A (ko) * | 2004-02-12 | 2005-08-19 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 지지 부재 |
-
2004
- 2004-11-09 KR KR1020040090650A patent/KR101144587B1/ko not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6165909A (ja) * | 1984-09-07 | 1986-04-04 | Nippon Seiko Kk | プラスチツク製リニアすべり軸受 |
| JPS6412929U (ko) | 1988-07-14 | 1989-01-24 | ||
| JP2004063865A (ja) * | 2002-07-30 | 2004-02-26 | Shin Etsu Handotai Co Ltd | サセプタ、気相成長装置およびエピタキシャルウェーハの製造方法 |
| KR20050081839A (ko) * | 2004-02-12 | 2005-08-19 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 지지 부재 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11282738B2 (en) | 2019-12-16 | 2022-03-22 | Samsung Electronics Co., Ltd. | Lift pin module |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060041445A (ko) | 2006-05-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20220091614A (ko) | 기판 프로세싱 툴을 위한 페데스탈 키네마틱 마운트 (pedestal kinematic mount) 로의 캐리어 링 (carrier ring) | |
| KR101130969B1 (ko) | 기판 지지부재와 이를 포함하는 기판 가열 장치 | |
| KR101218570B1 (ko) | 리프트핀 어셈블리 | |
| KR101433864B1 (ko) | 기판 승강 장치 | |
| KR101144587B1 (ko) | 리프트핀 홀더 | |
| KR101240391B1 (ko) | 리프트핀 어셈블리 | |
| KR102215641B1 (ko) | 리프트 핀 어셈블리 및 이를 구비하는 기판 처리 장치 | |
| KR100862912B1 (ko) | 기판 처리 장치 | |
| JP2024012159A (ja) | フォーカスリング、これを含む基板処理装置、及びこれを利用する半導体素子の製造方法 | |
| KR102904705B1 (ko) | 포커스 링, 이를 포함하는 기판 처리 장치 및 이를 이용한 기판 처리 방법 | |
| KR20120129861A (ko) | 리프트핀 어셈블리 | |
| KR101196197B1 (ko) | 기판 지지부재, 이를 포함하는 증착 장치 및 이를 이용한기판의 이송 방법 | |
| KR101215893B1 (ko) | 승강부재를 포함하는 기판지지장치 | |
| KR101933562B1 (ko) | 지지 기판 유닛 | |
| KR101433865B1 (ko) | 고정식 리프트 핀을 가지는 기판 처리 장치 및 이를 이용한기판의 로딩 및 언로딩 방법 | |
| KR100504541B1 (ko) | 화학기상 증착장비 및 이의 제조방법 | |
| KR101207771B1 (ko) | 마찰력을 감소시킨 리프트 핀 홀더 | |
| KR101024355B1 (ko) | 노즐 및 이를 갖는 기판 처리 장치 | |
| JP2021077734A (ja) | チャックピン、基板処理装置、基板処理システム | |
| KR101381207B1 (ko) | 가동부재를 가지는 기판지지핀 홀더 및 이를 포함하는기판처리장치 | |
| KR102485430B1 (ko) | 코팅 취약부 개선을 위한 정전척 및 정전척의 제조 방법 | |
| KR101232754B1 (ko) | 기판지지대 및 이를 구비한 기판처리장치 | |
| KR20090022039A (ko) | 박막처리장치 | |
| KR100962427B1 (ko) | 액정표시장치의 기판 리프팅 바 | |
| KR101126735B1 (ko) | 웨이퍼 카세트 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| A201 | Request for examination | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
Fee payment year number: 1 St.27 status event code: A-2-2-U10-U11-oth-PR1002 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R11-asn-PN2301 St.27 status event code: A-5-5-R10-R13-asn-PN2301 |
|
| PR1001 | Payment of annual fee |
Fee payment year number: 4 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
| FPAY | Annual fee payment |
Payment date: 20160502 Year of fee payment: 5 |
|
| PR1001 | Payment of annual fee |
Fee payment year number: 5 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
| PR1001 | Payment of annual fee |
Fee payment year number: 6 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| FPAY | Annual fee payment |
Payment date: 20180403 Year of fee payment: 7 |
|
| PR1001 | Payment of annual fee |
Fee payment year number: 7 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
| FPAY | Annual fee payment |
Payment date: 20190328 Year of fee payment: 8 |
|
| PR1001 | Payment of annual fee |
Fee payment year number: 8 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PR1001 | Payment of annual fee |
Fee payment year number: 9 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
| PR1001 | Payment of annual fee |
Fee payment year number: 10 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
| PR1001 | Payment of annual fee |
Fee payment year number: 11 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PR1001 | Payment of annual fee |
Fee payment year number: 12 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
| PC1903 | Unpaid annual fee |
Not in force date: 20240504 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE St.27 status event code: A-4-4-U10-U13-oth-PC1903 |
|
| P14-X000 | Amendment of ip right document requested |
St.27 status event code: A-5-5-P10-P14-nap-X000 |
|
| R15-X000 | Change to inventor requested |
St.27 status event code: A-5-5-R10-R15-oth-X000 |
|
| PC1903 | Unpaid annual fee |
Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20240504 St.27 status event code: N-4-6-H10-H13-oth-PC1903 |
|
| P15-X000 | Request for amendment of ip right document rejected |
St.27 status event code: A-5-5-P10-P15-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |