KR101088902B1 - Led lamp assembly - Google Patents

Abstract

PURPOSE: An LED lamp assembly structure is provided to reduce fraction defective by preventing the sanction of outer force to a connection site with a main board by being bent a soft board according to the working direction of a worker. CONSTITUTION: A plurality of LED modules is installed to be separated each other according to a longitudinal direction in a main board. A heat radiation member releases a heat which is generated in the LED modules to outside. A transmission cover(40) covers the top of the main board. The transmission cover protects the LED module. The transmission cover is installed in the heat radiation member. A side cap(50) respectively finishes and fixes both ends of the transmission cover and the heat radiation member. The side cap comprises a current source terminal(54). A hard and soft board is installed between the current source terminal and the main board.

Description

LED lamp assembly {LED lamp assembly}

The present invention relates to an LED lamp assembly structure, and more particularly, to an LED lamp assembly structure provided with a connection member for easily connecting the power supply terminal for supplying power and the circuit board on which the LED module is installed.

The lamp is a tool that enables the user to identify an object in the dark by converting electrical energy into light energy by receiving power.

These lamps are used in various forms, the first developed incandescent bulbs are not used even though they can be produced inexpensively because more heat is generated than light.

It is a fluorescent lamp that improves these disadvantages, which has the advantage of saving energy because the ratio of converting electrical energy to light energy is larger than a light bulb, but it takes a long time to turn on and its life is short. Fluorescent materials are applied to convert ultraviolet light into visible light to emit light, but a new medium is required due to the high price of fluorescent materials.

In order to cope with this, a lamp using a light emitting diode is used. Recently, a fluorescent lamp type LED lighting device that can replace the existing fluorescent lamp is disclosed.

Fluorescent lamp type LED lighting fixtures are configured by installing a light source unit including an LED in a casing having terminals on both sides corresponding to the conventional fluorescent frame structure, the LED is arranged on a long circuit board at predetermined intervals It is mounted and done.

Conventional fluorescent type LED lighting fixtures are provided with a rigid connection board between the power supply terminal and the circuit board to transfer the power supplied from the outside to a plurality of LED mounted circuit board. At this time, the connecting board is soldered to the circuit board, the soldering part is damaged by the impact during the assembly of the LED lighting fixture has a disadvantage that the defect occurs.

The present invention is to improve the above problems, a rigid circuit board and a flexible circuit board is provided so that the impact is not applied to the connection portion between the circuit board and the side cap mounted circuit board and a plurality of LEDs are mounted. It is an object of the present invention to provide an LED lamp assembly structure provided with a coupled connecting substrate.

LED lamp assembly according to the present invention for achieving the above object is a main board and a plurality of LED modules are installed on the upper surface and spaced apart from each other along the longitudinal direction, the lower surface of the main board, is generated in the LED modules A heat dissipation member for dissipating the heat to the outside, a flood cover installed on the heat dissipation member so as to cover the upper portion of the main board to protect the LED module, and the light generated by the LED module to transmit the light; Fixing both ends of the heat dissipation member and the floodlight cover, respectively, and a plurality of side caps formed with a power terminal to receive power from the outside, and to transfer the power supplied from the power terminal to the main board The rigid circuit boards and the rigid circuit boards are provided between the power supply terminal and the main board. And the electrically equipped with a contest genital plate provided in the flexible circuit board interconnect.

The flexible board part is provided with an auxiliary terminal connected to the power terminal, is provided on the first rigid substrate and the upper surface of the first rigid substrate, the first conductive pattern is provided on the surface, the second hard It is installed to penetrate the first substrate and the second rigid substrate so as to be in contact with each side of the auxiliary terminal and the first conductive pattern so as to transfer the rigid substrate and the power transmitted through the auxiliary terminal to the first conductive pattern. A first conductive pin and one end thereof are installed between the first and second rigid substrates, and the other end thereof is electrically connected to the main substrate, and a second conductive pattern is provided on the surface thereof. The first and second rigid substrates and the second conductive pattern so as to be in contact with the other side of the first conductive pattern and the second conductive pattern so that the power transferred through the first conductive pattern is transferred to the main substrate through the second conductive pattern. Flexible board That a second conductive pin to be installed through being preferred.

The flexible substrate portion is provided on the upper or lower surface of the other end portion opposite to one end of the flexible substrate on which the first and second rigid substrates are installed, and a third conductive pattern is electrically connected to the main substrate on the surface thereof. And the third and third rigid substrates and the flexible substrate and the third conductive patterns so as to be in contact with the second and third conductive patterns so as to transfer power transferred through the second conductive patterns to the third conductive patterns. A third conductive pin is further provided to penetrate the hard substrate.

The LED lamp assembly structure according to the present invention connects the power terminal and the main board through a rigid board formed by the rigid circuit board and the flexible circuit board electrically connected to each other, so that the operator can work by holding the rigid board. The workability is improved, and the flexible circuit board is bent according to the worker's working direction during the assembly process, thereby preventing the external force from being applied to the connection part with the main board, thereby reducing the defective rate.

1 is a perspective view of the LED lamp assembly according to the invention,
Figure 2 is an exploded perspective view of the LED lamp assembly of Figure 1,
3 is a cross-sectional view of the flexible substrate of the LED lamp assembly structure of FIG.

Hereinafter, with reference to the accompanying drawings will be described in more detail LED lamp assembly structure according to the present invention.

1 to 3 show an LED lamp assembly 10 according to the present invention.

Referring to the drawings, the LED lamp assembly structure 10 is the main substrate 20, the heat dissipation member 30 is provided on the lower surface of the main substrate 20, and the floodlight cover 40 is installed on the top of the heat dissipation member 30. And a plurality of side caps 50 provided with a power supply terminal 54 so as to finish fixing both ends of the heat dissipation member 30 and the floodlight cover 40 to receive power from the outside, and the power supply terminal 54. And a flexible substrate portion 60 installed between the main substrate 20 and the main substrate 20.

The main substrate 20 extends in the longitudinal direction, and although not shown in the figure, a conductive pattern is formed on the surface thereof. In the conductive pattern of the main board 20, a plurality of LED modules 21 are mounted at positions spaced apart from each other along the longitudinal direction of the main board 20.

Main board 20 is maintained in a certain form, it is preferably formed of a heat-resistant and rigid synthetic resin or metal material such as paper panels, glass epoxy to prevent the shape is deformed by the heat generated by the LED module Do.

The heat dissipation member 30 is formed to extend to a length corresponding to the main substrate 20, and the substrate slot 31 is formed on the upper surface so as to be slidably inserted into the main substrate 20. The main substrate 20 is inserted into the substrate slot 31 and installed on the top surface of the heat dissipation member 30.

On the lower surface of the heat dissipation member 30, a plurality of heat dissipation protrusions 32 protrude downward to improve the contact area with the outside air.

Meanwhile, in the illustrated example, the heat dissipation protrusion 32 extends in a direction parallel to the longitudinal direction of the heat dissipation member 30, but the heat dissipation protrusion 32 is not limited to the illustrated example, but the heat dissipation member 30 is not limited thereto. It may extend in a direction orthogonal to the longitudinal direction of the).

Cover slots 33 are formed on both sides of the heat dissipation member 30 in the longitudinal direction so that the coupling protrusions (not shown) of the floodlight cover 40 to be described later are slidably inserted. The engaging projection of the floodlight cover 40 is inserted into the cover slot 33 is constrained to the heat radiation member 30 of the floodlight cover 40.

In addition, a fastening hole 34 is formed at the front and rear ends of the heat dissipation member 30 to which the fastening bolt 11 is inserted and fastened so that the side cap 50 can be fixed by the fastening bolt 11. . At this time, although not shown in the drawings, the internal thread surface of the fastening hole 34 is formed with a female thread so that the fastening bolt 11 can be fastened.

The heat dissipation member 30 configured as mentioned above is preferably formed of an aluminum material having excellent heat transfer rate so as to easily dissipate heat of the LED module 21 transferred through the main substrate 20 to the outside.

The floodlight cover 40 extends to a length corresponding to the heat dissipation member 30 and is formed in a cylindrical shape having an inner space. The lower end of the floodlight cover 40 is preferably formed to be separated so that the heat dissipation member 30 can be coupled.

The floodlight cover 40 has coupling protrusions (not shown) which protrude inwards to be inserted into the cover slot 33 at a lower end thereof, that is, at a portion separated from each other. Although not shown in the drawings, the coupling protrusion is preferably extended to a length corresponding to the floodlight cover 40 so as to expand the contact area with the cover slot 33.

Transmissive cover 40 is preferably formed of a synthetic resin material having a light-transmitting, such as transparent acrylic so that the light generated from the LED module 21 can be transmitted to the outside.

The floodlight cover 40 configured as described above has a main substrate 20 inside the floodlight cover 40 when the coupling projection of the floodlight cover 40 is inserted into the cover slot 33 and coupled to the heat dissipation member 30. Located in the space is installed to protect the LED module 21.

The side cap 50 is formed in a cylindrical shape provided with an insertion space 51 having an inner diameter corresponding to the outer diameter of the transparent cover to fix the heat dissipation member 30 and both ends of the transparent cover, respectively. The side cap 50 is a rear surface facing the heat dissipation member 30 and the transparent cover is open, the front surface is preferably formed to be closed.

In the center of the other side of the side cap 50, two through-holes 52 are formed at positions spaced apart from each other so that the power supply terminal 54 to be described later can be installed therethrough. Fastening bolts (2) to the lower side of the side cap 50 to be inserted through the threaded portion of the fastening bolt 11 so that the side cap 50 is fixed to the heat dissipation member 30 by the fastening bolt 11 ( An insertion hole 53 formed in a size corresponding to the screw portion of 11) is formed.

The power supply terminal 54 protrudes from the main body 55 installed on the inner wall surface of the front surface of the side cap 50 and the main body 55 at the corresponding position of the through hole 52 of the side cap 50, respectively. The terminal pin 56 is formed.

Although not shown in the drawing, the terminal pins 56 extend a predetermined length so that a terminal of a conventional fluorescent lamp can be inserted and inserted into a socket of a lamp unit which is supplied with power. The terminal pin 56 is provided with an insertion groove (not shown) so that the auxiliary terminal 61a of the flexible substrate 60 to be described below is inserted and coupled thereto.

Although not shown in the drawings, a caulking protrusion protrudes from the inner circumferential surface of the insertion groove so that the auxiliary terminal 61a of the flexible substrate 60 may be fitted to the insertion groove of the terminal pin 56. The power supply terminal 54 configured as mentioned above is preferably formed of aluminum or copper material so that power can be easily transmitted from the outside.

On the other hand, when described in detail the flexible substrate unit 60 according to the present invention.

The flexible board part 60 is installed between the power supply terminal 54 and the main board 20 so as to transfer power supplied from the power supply terminal 54 to the main board 20, and the first hard board 61, A second hard substrate 62, a first conductive pin 63, a flexible substrate 64, a second conductive pin 65, a third hard substrate 66, and a third conductive pin 67 are provided.

The first rigid substrate 61 is formed in a rectangular plate shape having a width corresponding to the inner diameter of the side cap 50 so as to be fitted into the insertion space 51 of the side cap 50. On the lower surface of the first rigid substrate 61, two auxiliary terminals 61a are inserted and inserted into the insertion grooves of the terminal pins 56.

The auxiliary terminal 61a is formed in a round bar shape so as to be inserted into an insertion groove of the terminal pin, and the two auxiliary terminals 61a are easily spaced apart from the terminal pins 56 so as to be inserted into the terminal pins 56, respectively. The first hard substrate 61 is spaced apart from each other at a distance corresponding to In addition, the auxiliary terminal 61a is preferably formed of aluminum or copper so that power can be easily transmitted from the power supply terminal 54.

At this time, the first rigid substrate 61 is formed of a heat resistant and rigid synthetic resin material such as paper panels and glass epoxy so as to maintain a certain shape and to prevent the shape from being deformed by heat. Although not shown in the drawings, a plurality of through holes are formed at the front and the rear of the first and second conductive pins 63 and 65, respectively, so that the first and second conductive pins 63 and 65 can be penetrated therethrough. The hole is preferably formed at a position corresponding to the end of the auxiliary terminal 61a.

The second rigid substrate 62 is formed to have a size corresponding to that of the first rigid substrate 61 and is provided on the upper surface of the first rigid substrate 61, and the first conductive pattern 62a is provided on the upper surface of the second rigid substrate 62. The second rigid substrate 62 may be formed of the same material as the first rigid substrate 61 so as to maintain a constant shape and prevent deformation of the shape by heat. The first conductive pattern 62a is a copper foil, and serves to transfer current delivered to the main substrate 20.

Although not shown in the drawing, the second rigid substrate 62 has a through hole formed at a position corresponding to the through holes of the first rigid substrate 61, and the front through hole is formed in the first conductive pattern 62a. It is preferably formed at the corresponding position.

The first conductive pin 63 is formed in an annular bar shape and is inserted into the front through-holes of the first and second rigid substrates 61 and 62. At this time, the first conductive pin 63 is preferably provided so that both ends are in contact with one side of the auxiliary terminal 61a and the first conductive pattern 62a, respectively.

Power supplied from the outside through the power terminal 54 is transferred to the first conductive pin 63 transferred through the auxiliary terminal 61a, and the first conductive pin 63 transfers the power to the first conductive pattern 62a. ).

The flexible board 64 is disposed between the first hard board 61 and the second hard board 62 at the rear side of the first hard board 61 and extends in the longitudinal direction, and is formed on the surface thereof. The two conductive patterns 64a are provided.

 The flexible substrate 64 is formed of a flexible film such as polyester or polyimide having a thickness of about 30 μm so as to be bent according to the installation positions of the first and second rigid substrates 61 and 62 with respect to the side cap 50. It is. The second conductive pattern 64a is a copper foil, and serves to transfer power transmitted through the second conductive pin 65 to be described later to the main substrate 20.

 At this time, the thickness of the second conductive pattern 64a is preferably formed to be 80 μm or less. As the thickness of the second conductive pattern 64a becomes thicker, the mold holding force that maintains the bent shape of the flexible substrate 64 increases, and when the second conductive pattern 64a exceeds 80 μm, the flexible substrate 64 It is not easy to bend the spring back phenomenon due to the elastic force of the second conductive pattern (64a) has caused a problem that the flexible substrate 64 can not maintain the initial deformation state. Therefore, the second conductive pattern 64a is preferably formed to have a thickness of 80 μm or less.

Although not illustrated in the drawing, the flexible substrate 64 has a through hole formed at a position corresponding to the rear through hole of the first rigid substrate 61 so that the second conductive pin 65 can be inserted therein. In this case, the through hole of the flexible substrate 64 is preferably formed at a position corresponding to the second conductive pattern 64a.

In addition, a through hole is formed at the other end of the flexible substrate 64 adjacent to the main substrate 20 so that the third conductive pin 67 to be described later may be inserted therethrough.

The second conductive pin 65 is formed in an annular bar shape and is inserted into the front through hole of the first hard substrate 61 and the through hole of the flexible substrate 64. In this case, the second conductive pins 65 may be installed to contact the other side of the first conductive pattern 62a and the second conductive pattern 64a, respectively. Power transmitted through the first conductive pattern 62a is transferred to the second conductive pattern 64a of the flexible substrate 64 through the second conductive pin 65.

The third rigid substrate 66 is provided on an upper surface of the other end portion opposite to one end of the flexible substrate 64 on which the first and second rigid substrates 61 and 62 are installed, and the third conductive pattern 66a is formed on the surface thereof. Is formed. The third rigid substrate 66 is preferably formed to have a size corresponding to the width of the main substrate 20 so as to be inserted into the substrate slot 31 and electrically connected to the end of the main substrate 20.

The third rigid substrate 66 is formed of a heat resistant and rigid synthetic resin material such as a paper panel and glass epoxy so as to maintain a constant shape and to prevent deformation of the shape by heat. The third conductive pattern 66a is copper foil, and transfers power transmitted through the second conductive pattern 64a to the main substrate 20.

Although not shown in the drawing, the third rigid substrate 66 has a through hole formed at a position corresponding to the through hole formed at the other end of the flexible substrate 64 so that the third conductive pin 67 can be inserted therein. The through hole may be formed at a position corresponding to the third conductive pattern 66a.

The third conductive pin 67 is formed in an annular bar shape, and is inserted into the through hole formed at the other end of the flexible substrate 64 and the through hole of the third rigid substrate 66. In this case, it is preferable that the third conductive pin 67 is provided to contact the second conductive pattern 64a and the third conductive pattern 66a, respectively. Power transmitted through the second conductive pattern 64a is transferred to the third conductive pattern 66a through the third conductive pin 67.

The flexible substrate part 60 further includes an auxiliary substrate 68 installed at the other end of the flexible substrate 64 so as to increase the fixing force of the flexible substrate 64 to the third rigid substrate 66. The auxiliary substrate 68 is formed to have a size corresponding to the third rigid substrate 66, and is preferably formed of the same material as the third rigid substrate 66 so as to have a predetermined strength and heat resistance.

The power supplied from the outside through the power terminal 54 is supplied to the auxiliary terminal 61a, and the power supplied to the auxiliary terminal 61a is formed of the second hard substrate 62 through the first conductive pin 63. 1 is transferred to the conductive pattern 62a. The power delivered to the first conductive pattern 62a is transferred to the second conductive pattern 64a of the flexible substrate 64 through the second conductive pin 65, and the power delivered to the second conductive pattern 64a is transferred to the second conductive pattern 64a. The third conductive pin 67 is transferred to the third conductive pattern 66a of the third rigid substrate 66.

In the LED lamp assembly structure 10 according to the present invention configured as described above, the flexible flexible substrate 64 is bent in accordance with the working direction of the operator during assembly of the power supply terminal 54 and the auxiliary terminal 61a. The external rigidity is prevented from being applied to the connection portion between the three hard boards 66 and the main board 20, and the first hard board 61 having the auxiliary terminal 61a is formed of a hard material so that the operator can easily grip the There is an advantage that the workability can be improved by working.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art.

Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

10: LED lamp assembly
20: main board
30: heat dissipation member
40: floodlight cover
50: side cap
60: flexible substrate part
61: first rigid substrate
62: second rigid substrate
63: first conductive pin
64: flexible substrate
65: second conductive pin
66: third rigid substrate
67: third conductive pin

Claims (3)

A main board having a plurality of LED modules spaced apart from each other along a longitudinal direction on an upper surface thereof;
A heat dissipation member installed on a lower surface of the main substrate to discharge heat generated from the LED modules to the outside;
A floodlight cover disposed on the heat dissipation member so as to cover an upper portion of the main substrate to protect the LED module, and a light cover configured to transmit light generated by the LED module;
A plurality of side caps formed at both ends of the heat dissipation member and the floodlight cover, each of which has a power terminal configured to receive power from the outside;
A flexible circuit board installed between the power terminal and the main board so as to transfer the power supplied from the power terminal to the main board, and electrically connecting the rigid circuit boards and the rigid circuit boards. LED lamp assembly structure comprising a; provided a flexible substrate portion. The method of claim 1,
The flexible substrate portion
An auxiliary terminal connected to the power terminal, the first hard substrate being rigid;
A second rigid substrate disposed on an upper surface of the first rigid substrate, provided with a first conductive pattern on the surface thereof, and a rigid second rigid substrate;
A first conductive pin installed to penetrate the first and second rigid substrates so as to be in contact with one side of the auxiliary terminal and the first conductive pattern so as to transfer the power transferred through the auxiliary terminal to the first conductive pattern; and;
One end is installed between the first and second rigid substrates, the other end is electrically connected to the main substrate, and a second conductive pattern is provided on the surface of the flexible substrate;
The first and second rigid substrates so as to be in contact with the other side of the first conductive pattern and the second conductive pattern so that the power transferred through the first conductive pattern is transferred to the main substrate through the second conductive pattern. And a second conductive pin installed to penetrate through the flexible substrate. The method of claim 2,
The flexible substrate portion
A third conductive pattern is formed on an upper surface or a lower surface of the other end portion opposite to one end of the flexible substrate on which the first and second rigid substrates are installed, and a third conductive pattern is formed on the surface thereof so as to be electrically connected to the main substrate. A third hard substrate;
A third conductive pin penetrating the flexible substrate and the third rigid substrate so as to be in contact with the second and third conductive patterns so as to transfer power transmitted through the second conductive pattern to the third conductive pattern; LED lamp assembly, characterized in that it further comprises.

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